SGS Thomson Microelectronics SM15T27A, SM15T27CA, SM15T30A, SM15T30CA, SM15T33A Datasheet

...
SM1 5T 6V8A / 220A
FEATURES
PEAKPULSEPOWER: 1500 W (10/1000µs) BREAKDOWNVOLTAGERANGE :
From6.8 V to220 V UNI AND BIDIRECTIONALTYPES LOW CLAMPINGFACTOR FASTRESPONSETIME UL RECOGNIZED
DESCRIPTION
Transildiodes provide high overvoltageprotection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC’s.
ABSOLUTE MAXIMUMRATINGS(T
amb
=25°C)
SM1 5T 6V8C A/22 0CA
TRANSIL
SMC
TM
Symbol Parameter Value Unit
P
PP
P Powerdissipationon infiniteheatsink T
I
FSM
T
stg
T
j
T
L
Note 1 : For a surge greater than the maximum values,the diode will fail in short-circuit.
Peak pulsepower dissipation (seenote1) Tjinitial= T
amb
Non repetitivesurge peak forward currentforunidirectionaltypes
tp= 10ms Tjinitial= T
amb
=50°C 6.5 W
amb
Storagetemperaturerange Maximumjunction temperature
Maximumlead temperaturefor solderingduring10 s. 260 °C
1500 W
200 A
- 65 to +175 150
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
R
th (j-l)
th (j-a)
Junctiontoleads 15 °C/W
Junctiontoambienton printedcircuiton recommendedpad
75 °C/W
layout
°C °C
August 1999 Ed : 2A
1/5
SM15Txx
ELECTRICAL CHARACTERISTICS
=25°C)
(T
amb
Symbol Parameter
V
RM
V
BR
V
CL
I
RM
I
PP
Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current
αT Voltage temperature coefficient
V
F
Uni
directional
SM15T6V8A MDE SM15T7V5A MDG SM15T10A MDP SM15T12A MDT SM15T15A MDX SM15T18A MEE SM15T22A MEK SM15T24A MEM SM15T27A MEP SM15T30A MER SM15T33A MET SM15T36A MEV SM15T39A MEX SM15T68A MFP SM15T100A MFX SM15T150A MGK SM15T200A MGV SM15T220A MGX
Forward Voltage drop
Types
Mar-
kingBidirectional
SM15T6V8CA BDE SM15T7V5CA BDG
SM15T10CA NDP SM15T12CA BDT SM15T15CA BDX SM15T18CA BEE SM15T22CA BEK SM15T24CA BEM SM15T27CA BEP SM15T30CA BER SM15T33CA BET SM15T36CA BEV SM15T39CA BEX
SM15T68CA BFP SM15T100CA BFX SM15T150CA BGK SM15T200CA BGV SM15T220CA
Mar-
king
BGX 5 188 209 220 231 1 328 4.6 388 26 10.8 625
I
I
F
VV
CLVBR
I
I
RM
PP
V
F
V
I
RM@VRM
V
BR
@I
R
V
RM
VCL@IPPVCL@IPPαTC
max min nom max max max max typ
note2 10/1000µs 8/20µs note3 note4
µAVVVVmAVAVA10
1000
5.8 6.45 6.8 7.14 10 10.5 143 13.4 746 5.7 9500
500
6.4 7.13 7.5 7.88 10 11.3 132 14.5 690 6.1 8500
10
8.55 9.5 10 10.5 1 14.5 103 18.6 538 7.3 7000
5
10.2 11.4 12 12.6 1 16.7 90 21.7 461 7.8 6000
5
12.8 14.3 15 15.8 1 21.2 71 27.2 368 8.4 5000
5
15.3 17.1 18 18.9 1 25.2 59.5 32.5 308 8.8 4300
5
18.8 20.9 22 23.1 1 30.6 49 39.3 254 9.2 3700
5
20.5 22.8 24 25.2 1 33.2 45 42.8 234 9.4 3500
5
23.1 25.7 27 28.4 1 37.5 40 48.3 207 9.6 3200
5
25.6 28.5 30 31.5 1 41.5 36 53.5 187 9.7 2900
5
28.2 31.4 33 34.7 1 45.7 33 59.0 169 9.8 2700
5
30.8 34.2 36 37.8 1 49.9 30 64.3 156 9.9 2500
5
33.3 37.1 39 41.0 1 53.9 28 69.7 143 10.0 2400
5
58.1 64.6 68 71.4 1 92 16.3 121 83 10.4 1550
5
85.5 95.0 100 105 1 137 11 178 56 10.6 1150
5
128 143 150 158 1 207 7.2 265 38 10.8 850
5
171 190 200 210 1 274 5.5 353 28 10.8 675
-4
/°CpF
%I
PP
100
50
0
Note 2 : Pulse test:tp<50 ms. Note 3 : VBR=αT*(T Note 4 : VR= 0 V, F = 1 MHz.For bidirectional types,
capacitancevalue is dividedby 2.
10 s
PULSE WAVEFORM10/1000 s
1000 s
- 25)*VBR(25°C).
amb
2/5
Fig. 1: Peak pulse powerdissipation versus initial junctiontemperature(printed circuit board).
t
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