SGS Thomson Microelectronics M41T56SH6TR, M41T56MH6TR, M41T56M6TR Datasheet

1/23November 2002
M41T56
512 bit (64 bit x 8) SERIAL ACCESS TIMEKEEPER® SRAM
FEATURES SUMMARY
5V ±10% SUPPL Y VO L TAG E
HOURS, DAY, DATE, MONT H , YEAR S, and CENTURY
YEAR 2000 COMPLIANT
SOFTWARE CLOCK CALIBRATION
AUTOMATIC POWER-FAIL DETECT and
SWITCH CIRCUITRY
I
2
C BUS C O MPATI BLE
56 BYTES OF GENERAL PURPOSE RAM
ULTRA-LOW BATTER Y SUPPLY CURRENT
OF 450nA
LOW OPERATING CURRENT OF 300µA
OPERATING TEMPER ATURE OF –40 to 85°C
AUTOMATIC LEAP YEAR COMPENSATION
SPECIAL SOFT WARE PROGRAM MABLE
OUTPUT
PACKA GING OP TIONS IN CLUDE :
– 28-LEAD SOIC and SNAPHA T
®
TOP
(to be Ordered Separately)
–SO8
Figure 1. 8-pi n S OI C Package
Figure 2. 28-pi n S O I C Package
8
1
SO8 (M)
150mil Width
28
1
SOH28 (MH)
SNAPHAT (SH)
Battery & Crystal
M41T56
2/23
TABLE OF CONTENTS
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Logic Diagram ( Fig u r e 3.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Signal Names (Table 1.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8-pin SOIC Connections (Figure 4.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
28-pin SOIC Connection s (Figure 5.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram (Fi g ure 6 .) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute Maximum Rati ng s (Table 2.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Operating and AC Measurement Conditions (Table 3.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
AC Measurement I/O Waveform (Figure 7.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Capacitance (Table 4.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
DC Characteristi cs (Table 5.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Crystal Electrical Characteristics (Table 6.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2-Wire Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Serial Bus Data Transfer Sequence (Figure 8.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Acknowledge Sequence (Figure 9.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bus Timing Requirements Sequence (Figure 10.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
AC Characteristics (Table 7.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
READ Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
WRITE Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Slave Address Location (Figure 11.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
READ Mode Sequence (Figure 12.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Alternative READ Mode Sequence (Figure 13.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
WRITE Mode Sequence (Figure 14.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Data Retention Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Down/Up Mode AC Waveforms (Figure 15.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Down/Up Mode AC Characteristics (Table 8.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Down/Up Trip Points DC Char ac te r i stics (Table 9.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
CLOCK OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Register Map (Table 10.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Clock Calibratio n. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5
Output Driver Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5
Initial Power- o n Defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Crystal Accuracy Across Temperature (Figure 16.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Clock Calibratio n (Figure 17.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
SNAPHAT Battery/Crystal Table (Table 12.). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3/23
M41T56
SUMMARY DESCRIPTION
The M41T56 TIMEKEEPER
®
is a low power, 512­bit static CMOS RAM organized as 64 words by 8 bits. A built-in 32,768 Hz oscillator (external crystal controlled) and the first 8 bytes of the RAM are used for the clock/calendar function and are con­figured in binary coded decimal (BCD) format. Ad­dresses and data are transferred serially via a two­line, bi-directional bus. The built-in address regis­ter is incremented automatically after each WRITE or READ data byte.
The M41T56 clock has a built-in power sense cir­cuit which detects power failures and automatical­ly switches to the battery supply during power failures. The energy needed to sustain the RAM and clock operations can be supplied from a small lithium co in cel l.
Typical data retention time is in excess of 10 years with a 50mAh, 3V lithium cell. The M41T56 is sup­plied in an 8-lead P lastic SOIC package or a 28­lead SNAPHAT
®
package.
The 28-pin, 330mil SOIC provides sockets with gold plated contacts at both ends for direct con­nection to a separate SNAPHAT housing cont ain­ing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process. Inser­tion of the SNAPHAT housing after reflow pre­vents potential battery and c rystal dam age d ue t o the high temperatures required for device surface­mounting. The SNAPHAT housing is keyed to pre­vent reverse insertion. The SOIC and battery/crys­tal packages are shipped separately in plastic anti­static tubes or in Tape & Reel form.
For the 28-lead SOIC, the battery/crystal package (e.g., SNAPHAT) part number is “M4Txx­BR12SH” (see Table 12, page 17).
Caution: Do not place the SNAPHAT battery/crys­tal package “M4Txx-BR12SH” i n condu ctive foam as this will drain the lithium button-cell battery.
Figure 3. Logic Diagram Table 1. Signal Names
AI02304B
OSCI
V
CC
M41T56
V
SS
SCL
OSCO
SDA
FT/OUT
V
BAT
OSCI Oscillator Input OCSO Oscillator Output
FT/OUT
Frequency Test / Output Driver
(Open Drain) SDA Serial Data Address Input / Output SCL Serial Clock V
BAT
Battery Supply Voltage V
CC
Supply Voltage V
SS
Ground
M41T56
4/23
Figure 4. 8-pi n S OI C Co nn e ct io ns Figure 5. 28-pi n S O I C C onnections
Figure 6. Block Diagram
1
SDAV
SS
SCL
FT/OUTOSCO
OSCI V
CC
V
BAT
AI02306B
M41T56
2 3 4
8 7 6 5
AI03607
8
2 3 4 5 6 7
9 10 11 12 13 14
22 21 20 19 18 17 16 15
28 27 26 25 24 23
1
NC
V
SS
NC
NC
NC V
CC
M41T56
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC SDA
NC SCL NC
NC NC NC
NC FT/OUT NC
NC
AI02566
SECONDS
OSCILLATOR
32.768 kHz
VOLTAGE
SENSE
and
SWITCH
CIRCUITRY
SERIAL
BUS
INTERFACE
DIVIDER
CONTROL
LOGIC
ADDRESS
REGISTER
MINUTES
CENTURY/HOURS
DAY
DATE
MONTH
YEAR
CONTROL
RAM
(56 x 8)
OSCI
OSCO
FT/OUT
V
CC
V
SS
V
BAT
SCL
SDA
1 Hz
5/23
M41T56
MAXIMUM RATING
Stressing the device above the rating listed in t he “Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the dev ice at these or any other conditions above those indicat­ed in the Operating sections of this specification is
not implied. Exposure to Absol ute Maxim um Rat­ing conditions for extended periods may affect de­vice reliability. Refer also to the STMicroelectronics SURE Program and oth er rel­evant quality documents.
Table 2. Absolute Maximum Ratings
Note: 1. Reflow at peak temperature of 215°C to 225°C for < 60 seconds (total thermal budget not to exceed 180°C for between 90 and 120
seconds).
CAUTION: Nega tive undershoot s below –0.3V are not allowed on any pi n while in the Bat tery Back-up mode. CAUTION: Do NOT wav e s older SOI C t o avoid da m ag i ng SNAP HAT so c kets.
Symbol Parameter Value Unit
T
A
Ambient Operating Temperature –40 to 85 °C
T
STG
Storage Temperature (VCC Off, Oscillator Off)
SNAPHAT –40 to 85
°C
SOIC –55 to 125
T
SLD
(1)
Lead Solder Temperature for 10 seconds 260 °C
V
IO
Input or Output Voltages –0.3 to 7 V
V
CC
Supply Voltage –0.3 to 7 V
I
O
Output Current 20 mA
P
D
Power Dissipation 0.25 W
M41T56
6/23
DC AND AC PARAMETERS
This section summarizes the operat ing and mea­surement conditions, as well as the DC and AC characteristics of the device. The parameters in the following DC and AC Characteristic tables are derived from tests performed under the M easure-
ment Conditions listed i n the relevant tables. De­signers should check that the operating conditions in their projects match the measurement condi­tions when using the quoted parameters.
Table 3. Operating and AC Measurement Conditions
Note: Output Hi-Z is def i ned as the point where data is no longer driven.
Figure 7. AC Measurement I/O Waveform
Table 4. Capacitance
Note: 1. Eff ective capacitance measured with powe r supply at 5V; sam p l ed, not 100% tested.
2. At 25°C, f = 1M Hz.
3. Outputs desele ct ed.
Parameter Value Unit
Supply Voltage (V
CC
)
4.5 to 5.5 V
Ambient Operating Temperature (T
A
)
–40 to 85 °C
Load Capacitance (C
L
)
100 pF Input Rise and Fall Times 5ns Input Pulse Voltages 0 to 3 V Input and Output Timing Ref. Voltages 1.5 V
AI02568
0.8V
CC
0.2V
CC
0.7V
CC
0.3V
CC
Symbol
Parameter
(1,2)
Min Max Unit
C
IN
Input Capacitance (SCL) 7 pF
C
OUT
(3)
Output Capacitance (SDA, FT/OUT) 10 pF
t
LP
Low-pass filter input time constant (SDA and SCL) 0.25 1 µs
7/23
M41T56
Table 5. DC Characteristics
Note: 1. Val i d for Ambient Operating Temperature: TA = –40 to 85°C ; VCC = 4.5 to 5.5V (except where noted).
2. STMicroelectronics rec ommends the R AYOVAC BR1225 or BR1632 (or eq ui valent) as the ba tt ery supply.
Table 6. Crystal Electrical Characteristics
Note: 1. These values are externally supplied if using the SO8 package. STMicroelectronics recommends the KDS DT-38: 1TA/
1TC252E1 27, Tunin g Fo rk T ype (thr u- hole ) or t he D MX- 26 S: 1T JS1 25FH2A 2 12, ( SMD) qu artz cry stal for i ndus tri al temper at ure operation s. KDS can be contacted at kouhou@kdsj.co.jp or htt p://www.kdsj.co.jp for furt her informat i on on this crystal ty pe.
2. Load capacitors are integrated within the M41T56. Circuit board layout considerations for the 32.768 kHz crystal of minimum trace lengths an d i solation from RF generating sig nal s should be taken into accoun t.
3. All SNAPHAT battery/cry stal tops meet these specifica tions.
Symbol Parameter
Test Condition
(1)
Min Typ Max Unit
I
LI
Input Leakage Current
0V V
IN
V
CC
±1 µA
I
LO
Output Leakage Current
0V ≤ V
OUT
V
CC
±1 µA
I
CC1
Supply Current Switch Frequency = 100kHz 300 µA
I
CC2
Supply Current (Standby)
SCL, SDA = V
CC
– 0.3V
100 µA
V
IL
Input Low Voltage –0.3 1.5 V
V
IH
Input High Voltage 3
V
CC
+ 0.8
V
V
OL
Output Low Voltage
I
OL
= 5mA, VCC = 4.5V
0.4 V
V
BAT
(2)
Battery Supply Voltage 2.5 3 3.5 V
I
BAT
Battery Supply Current
T
A
= 25°C, VCC = 0V,
Oscillator ON, V
BAT
= 3V
450 550 nA
Symbol
Parameter
(1,2,3)
Min Typ Max Unit
f
O
Resonant Frequency 32.768 kHz
R
S
Series Resistance 60 k
C
L
Load Capacitance 12.5 pF
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