SGS Thomson Microelectronics M29W040 Datasheet

Low Voltage Single Supply Flash Memory
M29W040is replacedby the M29W040B
2.7Vto 3.6V SUPPLYVOLTAGEfor PROGRAM,ERASE and READ OPERATIONS
FASTACCESSTIME:100ns BYTEPROGRAMMINGTIME: 12µs typical ERASETIME – Block:1.5 sec typical – Chip: 2.5 sec typical PROGRAM/ERASECONTROLLER(P/E.C.) – ProgramByte-by-Byte – Data Polling and Togglebits Protocolfor
P/E.C.Status MEMORYERASEin BLOCKS – 8 UniformBlocksof 64 KBytes each – BlockProtection – MultiblockErase ERASESUSPENDand RESUME MODES LOWPOWER CONSUMPTION – Readmode: 8mAtypical (at 12MHz) – Stand-bymode: 20µAtypical – AutomaticStand-by mode POWERDOWN SOFTWARECOMMAND – Power-downmode: 1µAtypical 100,000PROGRAM/ERASECYCLES per
BLOCK 20YEARSDATARETENTION – Defectivitybelow 1ppm/year ELECTRONICSIGNATURE – ManufacturerCode: 20h – DeviceCode: E3h
Table1. SignalNames
M29W040
4 Mbit(512Kb x8, Uniform Block)
NOT FOR NEW DESIGN
PLCC32 (K) TSOP32 (N)
TSOP32 (NZ)
8 x 14mm
Figure 1. LogicDiagram
V
CC
19
A0-A18
W
E
M29W040
8 x 20mm
8
DQ0-DQ7
A0-A18 Address Inputs DQ0-DQ7 Data Input / Outputs E Chip Enable G Output Enable W Write Enable V
CC
V
SS
November 1999 1/31
This is information ona product still in productionbutnot recommendedfor new designs.
Supply Voltage Ground
V
SS
AI02074
M29W040
Figure 2A. LCC Pin Connections
CC
A18
32
DQ3
V
DQ4
W
DQ5
A7 A6 A5 A4 A3 A2 A1 A0
DQ0
A16
A12
A15
1
9
M29W040
DQ1
DQ2
V
17
SS
A17
25
DQ6
A14 A13 A8 A9 A11 G A10 E DQ7
AI02075
Figure 2B. TSOP Pin Connections
A11 G
A13 A14 A17
V
CC
A18 A16 A15 A12
1 A9 A8
W
8
M29W040
(Normal)
9
A7 A6 A5 A4 A3
16 17
32
25 24
AI02076
A10 E DQ7 DQ6 DQ5 DQ4 DQ3 V
SS
DQ2 DQ1 DQ0 A0 A1 A2
Figure 2C. TSOP Reverse Pin Connections DESCRIPTION
The M29W040is a non-volatilememory that may be erased electrically at the block level, and pro­grammed Byte-by-Byte.
The interface is directly compatible with most mi­croprocessors. PLCC32,TSOP32(8x 20mm)and TSOP32(8 x 14mm)packagesare available.Both normal and reverse pin outs are available for the TSOP32(8 x 20mm) package.
Organisation
TheFlashMemoryorganisationis512Kx8 bitswith Address lines A0-A18 and Data Inputs/Outputs DQ0-DQ7. Memory control is provided by Chip Enable,Output EnableandWrite Enable Inputs.
Erase and Program are performed through the internal Program/EraseController(P/E.C.).
DataOutputsbits DQ7 and DQ6 provide pollingor togglesignals duringAutomaticProgram or Erase to indicate the Ready/Busy state of the internal Program/EraseController.
MemoryBlocks
Erasure of the memory is in blocks. There are 8 uniform blocks of 64 Kbytes each in the memory
A10
DQ7 DQ6 DQ5 DQ4 DQ3 V
SS
DQ2 DQ1 DQ0
A0 A1 A2
1
E
8 9
16 17
M29W040
(Reverse)
32
25 24
AI02077
A11G A9 A8 A13 A14 A17 W V
CC
A18 A16 A15 A12 A7 A6 A5 A4A3
address space. Each block can be programmed and erased over 100,000 cycles. Each uniform
2/31
M29W040
Table2. AbsoluteMaximum Ratings
Symbol Parameter Value Unit
T
A
T
BIAS
T
STG
(2)
V
IO
V
CC
(2)
V
A9
Notes:
1. Except for the rating ”Operating TemperatureRange”, stresses above those listed in theTable ”Absolute Maximum Ratings” may cause permanent damage to the device. These are stressratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.Refer also to the STMicroelectronicsSURE Program and other relevant quality documents.
2. Minimum Voltage may undershoot to–2V during transition and for less than 20ns.
3. Depends on range.
Ambient Operating Temperature TemperatureUnder Bias –50 to 125 °C Storage Temperature –65 to 150 Input or OutputVoltages –0.6 to 5 V Supply Voltage –0.6 to 5 V A9 Voltage –0.6 to 13.5 V
block may separately be protected and unpro­tected against program and erase. Block erasure may be suspended, while data is read from other blocks of the memory,and then resumed.
Bus Operations
Seven operationscan be performed by the appro­priate bus cycles, Read Array, Read Electronic Signature,OutputDisable, Standby,ProtectBlock, Unprotect Block, and Write the Command of an Instruction.
Command Interface
Command Bytes can be written to a Command Interface(C.I.) latch to perform Reading (from the Array or Electronic Signature), Erasure or Pro­gramming. For added data protection, command executionstarts after 4 or 6 commandcycles. The first, second, fourth and fifth cycles are used to input a code sequenceto the CommandInterface (C.I.).Thissequenceis equal for allP/E.C. instruc­tions. Command itself and its confirmation - if it applies - are given on the third and fourth or sixth cycles.
Instructions
Eight instructions are defined to perform Reset, Read Electronic Signature, Auto Program, Block Auto Erase, Chip Auto Erase, Block Erase Sus­pend, BlockErase Resumeand Power Down. The internalProgram/EraseController(P/E.C.)handles
(1)
(3)
–40 to 85
instructionsandprovidesDataPolling,Toggle,and Statusdata to indicatecompletionof Programand EraseOperations.
Instructionsare composed of up to six cycles.The firsttwocycles input a code sequenceto theCom­mand Interface which is common to all P/E.C. instructions (see Table 7 for Command Descrip­tions). The third cycleinputs the instruction set up command instruction to the Command Interface. SubsequentcyclesoutputSignature,BlockProtec­tion or the addressed data for Read operations. For addeddataprotection,the instructionsfor pro­gram,and blockor chiperase require further com­mandinputs. Fora Programinstruction,the fourth commandcycleinputsthe addressand data to be programmed. For an Erase instruction (block or chip),the fourthand fifthcyclesinputa furthercode sequence before the Erase confirm command on the sixth cycle. Byte programming takes typically 12µs while erase is performed in typically1.5 sec­ond.
Erasureof a memory block may be suspended,in order to read data from another block, and then resumed.Data Polling,Toggleand Errordata may be read at any time,includingduring the program­ming or erase cycles, to monitor the progress of the operation.When poweris firstapplied or ifV fallsbelow V
,thecommandinterfaceis resetto
LKO
ReadArray.
all timingandverificationof theProgramandErase
C
°
C
°
CC
3/31
M29W040
Table3. Operations
Operation E G W DQ0 - DQ7
Read V Write V Output Disable V Standby V
Note:
X=V
or V
IL
IH
Table4. ElectronicSignature
IL
IL
IL
IH
V
IL
V
IH
V
IH
V
IH
V
IL
V
IH
X X Hi-Z
Data Output
Data Input
Hi-Z
Code E G W A0 A1 A6 A9
Manufact. Code V Device Code V
IL
IL
V
IL
V
IL
V
IH
V
IH
V
IL
V
IH
V
IL
V
IL
Table5. BlockProtectionStatus
Code E G W A0 A1 A6 A16 A17 A18
Protected Block V Unprotected Block V
Note: SA = Address of block being checked
DEVICEOPERATION Signal Descriptions AddressInputs (A0-A18). Theaddress inputs for
the memoryarrayare latchedduring awrite opera­tion. The A9 address input is used also for the Electronic Signature read and BlockProtect veri­fication. When A9 is raised to V Manufacturer Code, Read Device Code or Verify BlockProtectionisenableddependingon thecom­binationof levelson A0, A1 and A6. WhenA0, A1 and A6areLow,the ElectronicSignatureManufac­turer codeis read,when A0is Highand A1 and A6 are Low,the Device code is read, and when A1 is High and A0 and A6 are low, the Block Protection Status with protect/unprotectalgorithm is read for the blockaddressedbyA16, A17, A18.
Data Input/Outputs(DQ0-DQ7).Thedata inputis a byteto be programmedor a commandwrittento the C.I. Both are latched when ChipEnable E and WriteEnable W areactive.The dataoutput isfrom the memory Array, the Electronic Signature, the Data Polling bit (DQ7), the Toggle Bit (DQ6), the Error bit (DQ5) or the Erase Timer bit (DQ3). Ou­puts are valid when Chip Enable E and Output EnableG are active.The outputis highimpedance
V
V
V
V
IL
IL
IH
IL
V
V
IL
IL
V
IH
IL
V
IH
IL
V
V
IH
IL
when the chip is deselected or the outputs are disabled.
Chip Enable (E). The Chip Enable activates the memorycontrol logic, input buffers, decoders and senseamplifiers.EHighdeselectsthememoryand reduces the power consumption to the standby
, either a Read
ID
level. E can also be used to control writing to the command registerand tothe memoryarray,while W remains at a low level. Addresses are then latchedon thefallingedgeofEwhiledataislatched on the rising edge of E. The Chip Enable must be forcedto V
OutputEnable (G). The OutputEnable gates the outputs through the data buffers during a read operation. G must be forced to V BlockProtect and Block Unprotectoperations.
WriteEnable(W).This inputcontrolswritingto the CommandRegisterandAddressandDatalatches. Addressesare latchedon thefallingedgeofW, and DataInputs are latched on the rising edgeof W.
V
CC
operations(Read, Program and Erase).
V
SS
measurements.
Other
Addresses
V V
V
IL
IL
ID
V
ID
Don’t Care 20h Don’t Care E3h
Other
Addresses
DQ0 - DQ7
DQ0 - DQ7
SA SA SA Don’t Care 01h SA SA SA Don’t Care 00h
during Block Unprotectoperations.
ID
level during
ID
Supply Voltage. The power supply for all
Ground. VSSis the reference for all voltage
4/31
M29W040
Table6. Instructions
(1)
Mne. Instr. Cyc. 1st Cyc. 2nd Cyc. 3rd Cyc. 4th Cyc. 5th Cyc. 6th Cyc. 7th Cyc.
RST
Read Array/
(3,9)
Reset
Addr.
1+
Data F0h
Addr.
3+
(2,6)
(2,6)
X
Read Memory Array until a new write cycle is initiated.
5555h 2AAAh 5555h
Read Memory Array until a new write cycle is initiated.
Data AAh 55h F0h
(2,6)
Addr.
5555h 2AAAh 5555h
Data AAh 55h 90h
(2,6)
Addr.
5555h 2AAAh 5555h
Read Electronic Signature until a new write cycle is initiated. See Note 4.
Read Block Protection untila new write cycle is initiated. See Note 5.
RSIG
RBP
Read
(3)
Electronic Signature
Read Block
(3)
Protection
3+
3+
Data AAh 55h 90h
Program
Address
Program
Data
Read Data Pollingor Toggle Bit until Program completes.
Block
Address
Additional
Block
PG Program 4
BE Block Erase 6
(2,6)
Addr.
5555h 2AAAh 5555h
Data AAh 55h A0h
(2,6)
Addr.
5555h 2AAAh 5555h 5555h 2AAAh
(7)
Data AAh 55h 80h AAh 55h 30h 30h
(2,6)
CE Chip Erase 6
Addr.
5555h 2AAAh 5555h 5555h 2AAAh 5555h
Data AAh 55h 80h AAh 55h 10h
(2,6)
ES
Erase Suspend
Addr.
1
X
Read until Togglestops, then read all the data needed from any uniform block(s) not being erased then Resume Erase.
Data B0h
(2,6)
ER
Erase Resume
Addr.
1
X
Read Data Pollingor ToggleBit until Erase completes or Erase is suspended another time
Data 30h
(2,6)
PD
(10)
Power Down
Addr.
1
5555h
Puts the memory in Power Down mode where power consumption is reduced to typically less than 1µA
Data 20h
Notes:
1. Command not interpreted in this table will default to read array mode.
2. X = Don’tCare.
3. The first cycle ofthe RST,RBP or RSIG instruction is followed by read operations to read memory array,Status Register or Electronic Signature codes. Any number of read cycles can occur after one command cycle.
4. Signature Addressbits A0,A1, A6 at V Device code.
5. Protection Address: A0, A6 at V Block Protectionstatus.
6. Address bits A15-A18are don’tcare for coded address inputs.
7. Optional, additional blocks addresses must be enteredwithin a 80µs delay afterlast write entry, timeout status can be verified through DQ3 value. When full command is entered, read Data Polling or Toggle bit until Erase is completed or suspended.
8. Read Data Polling or Togglebit until Erase completes.
9. Await time of 5µs is necessary after a Reset command, if the memory is in a Block Erase or Power Down status, before starting any operation.
10. Writing an RST command to theP/E.C. is mandatory prior to any new operation when the memory is in Power Down mode.
will output Manufacturer code (20h). Addressbits A0 at VIHandA1, A6 atVILwill output
IL
,A1atVIHand A16,A17, A18 within the uniform block tobe checked,will output the
IL
Note 8
5/31
M29W040
MemoryBlocks
The memoryblocks of the M29W040are shownin Figure3. Thememory array is dividedin 8 uniform blocks of 64 Kbytes. Each block can be erased separately or any combination of blocks can be erased simultaneously.The BlockEraseoperation ismanagedautomaticallyby theP/E.C.Theopera­tion can be suspended in order to read from any other block, and thenresumed.
Block Protectionprovides additionaldata security. Each uniformblock can be separatelyprotectedor unprotectedagainst ProgramorErase.BringingA9 and G to V G and E to V
initiatesprotection,whilebringing A9,
ID
cancels the protection. The block
ID
affected during protection is addressed by the in­puts on A16, A17, and A18. Unprotect operation affectsall blocks.
Operations
Operationsare defined as specific bus cyclesand signals which allow Memory Read, Command Write,Output Disable, Standby,Read Status Bits, Block Protect/Unprotect, Block Protection Check and ElectronicSignatureRead.Theyare shownin Tables 3, 4, 5.
Read. Read operations are used to output the contents of the Memory Array,the Status Register or the Electronic Signature. Both Chip Enable E and OutputEnable G must be low in order to read the output of the memory. The Chip Enable input alsoprovidespowercontroland shouldbe usedfor deviceselection.OutputEnable shouldbe usedto gatedataontothe outputindependentof thedevice selection.The data read dependson the previous commandwritten to the memory (see instructions RST and RSIG, and StatusBits).
Write.Writeoperationsare usedtogiveInstruction Commandsto thememoryor to latchinput data to be programmed.Awrite operationis initiatedwhen Chip Enable E is Low and Write Enable W is Low with OutputEnableG High.Addressesare latched
onthefallingedge ofWor Ewhicheveroccurslast. CommandsandInputDataarelatchedon therising edge of W or E whicheveroccurs first.
OutputDisable. Thedataoutputsare highimped­ance whenthe OutputEnable G is High withWrite EnableW High.
Standby. The memory is in standby when Chip Enable E is High and Program/Erase Controller P/E.C. is Idle. The power consumptionis reduced to the standby level and the outputs are high im­pedance, independent of the Output Enable G or WriteEnable W inputs.
AutomaticStandby. After 150ns of inactivity and when CMOS levels are driving the addresses,the chip automaticallyenters a pseudo standbymode where consumption is reduced to the CMOS standby value, while outputs are still driving the bus.
Power Down. When the PD command is written to the P/E.C. the memory enters a power down statuswhere the power consumptionis reducedto
(typicallyless than 1.0µA).
I
CC6
Electronic Signature. Two codes identifying the manufacturer andthe devicecanbe read fromthe memory,themanufacturer’scodefor STMicroelec­tronics is 20h, and the device code is E3h for the M29W040. These codes allow programming equipment or applicationsto automatically match theirinterfaceto thecharacteristicsof theparticular manufacturer’s product. TheElectronicSignature is output by a Read operation when the voltage applied to A9 is at V
and address inputs A1 and
ID
A6 are at Low. The manufacturer code is output when the Address input A0 is Low and the device codewhen thisinputis High.Other Addressinputs are ignored. The codes are outputon DQ0-DQ7. This is shown in Table4.
The ElectronicSignature can alsobe read, without raisingA9 to V
by givingthe memory the instruc-
ID
tion RSIG (see below).
6/31
Figure 3. MemoryMap and Block AddressTable
M29W040
A18
AI01362B
A17
1
1 64K Bytes Block
1
1
0
0
001
000
A16
1
1
0
0
1
1
1
0
1
0
1
0
Block Protection. Each uniform block can be separately protected against Program or Erase. Block Protectionprovides additionaldata security, as it disablesall programoreraseoperations.This mode is activated when both A9 and G are set to
and the block address is applied on A16-A18.
V
ID
Block Protection is programmed using a Presto F programlike algorithm.Protectionisinitiatedon the edgeofWfallingtoV the edge of W rising to V
.Thenafteradelayof 100µs,
IL
ends the protection
IH
operation.Protectionverify is achievedby bringing G, E andA6 to V
while W is at VIHand A9 at VID.
IL
Undertheseconditions,readingthedataoutputwill yield 01h if the block defined by the inputs on A16-A18 is protected. Any attempt to program or erase a protected block will be ignored by the device.
Any protected block can be unprotected to allow updating of bit contents. All blocks must be pro­tected before an unprotect operation. Block Un­protect is activatedwhen A9, G and E are at V
ID
The addressesinputs A6,A12, A16 mustbe main­tainedatV
.BlockUnprotectis performedthrough
IH
a Presto F Erase like algorithm. Unprotect is initi­ated by the edgeof W falling to V of 10ms, the edge of W rising to V
. After a delay
IL
will end the
IH
unprotection operation. Unprotect verify is achieved by bringing G and E to V
while A6 and
IL
64K Bytes Block
64K Bytes Block
64K Bytes Block
64K Bytes Block
TOP
ADDRESS
7FFFFh
6FFFFh
5FFFFh
4FFFFh
3FFFFh
2FFFFh
1FFFFh
0FFFFh
BOTTOM
ADDRESS
70000h
60000h
50000h
40000h
30000h
20000h
10000h
00000h
Table7. Commands
Hex Code Command
10h Chip Erase Confirm 20h Power Down 30h Block Erase Resume/Confirm 50h Reserved 80h Set-up Erase
Read Electronic Signature/ Block Protection Status
and A9 at VID. In these conditions,
IH
.
90h
A0h Program B0h Erase Suspend
F0h Read Array/Reset
W are at V reading the output data will yield 00h if the block defined by the inputs on A16-A18has been suc­cessfullyunprotected.AllcombinationsofA16-A18 mustbe addressedin orderto ensurethatallof the 8 uniform blocks have been unprotected. Block ProtectionStatus is shownin Table5.
7/31
M29W040
Table8. Status Register
DQ Name Logic Level Definition Note
’1’ Erase Complete
Data
7
Polling
’0’ Erase on going DQ Program Complete DQ Program on going
Indicates the P/E.C. status, check during Program or Erase, and on completion before checking bits DQ5 for Program or Erase Success.
’-1-0-1-0-1-0-1-’ Erase or Program ongoing Successive read output complementary
6 ToggleBit
5 ErrorBit
4
Erase
3
TimeBit
2 Reserved 1 Reserved 0 Reserved
Note:
Logic level ’1’ is High, ’0’ is Low.-0-1-0-0-0-1-1-1-0- represent bitvalue in successive Read operations.
’-0-0-0-0-0-0-0-’
’-1-1-1-1-1-1-1-’
’1’ Program or Erase Error
’0’ Program or Erase on going
’1’
’0’
’1’ Erase TimeoutPeriod Expired P/E.C. Erase operation has started. Only
’0’
Instructionsand Commands
The Command Interface (C.I.) latches commands written to the memory. Instructions are made up from one or more commands to perform Read Array/Reset, Read Electronic Signature, Power Down, Block Erase, Chip Erase, Program, Block Erase Suspend and Erase Resume. Commands are made of address and data sequences. Ad­dresses are latched on the falling edge of W or E and data is latched on the rising of W or E. The instructionsrequire from 1 to 6 cycles, the first or first three of which are always write operations used toinitiatethecommand.Theyarefollowed by either further write cyclesto confirmthe first com­mand orexecutethecommandimmediately.Com­mand sequencing must be followed exactly. Any invalid combination of commands will reset the device to Read Array. The increased number of cycles has been chosen to assure maximum data security.Commands are initialised by two preced­ingcoded cycleswhich unlocktheCommandInter­face.In addition,forErase,command confirmation is again preceededby the two codedcycles.
P/E.C. statusis indicatedduringcommandexecu­tionby DataPolling onDQ7, detectionof Toggleon
Program (’0’ on DQ6) Complete
Erase or Program (’1’ on DQ6) Complete
Erase Timeout Period on going
DQ6, or Error on DQ5 and Erase TimerDQ3 bits. Any read attempt during Program or Erase com­mandexecutionwillautomaticallyoutputthosefour bits.TheP/E.C. automaticallysetsbitsDQ3,DQ5, DQ6 and DQ7. Other bits (DQ0, DQ1, DQ2 and DQ4) are reserved for future use and should be masked.
Data Polling bit (DQ7). When Programmingop­erations are in progress, this bit outputs the com­plement of the bit being programmed on DQ7. DuringErase operation,it outputsa ’0’. After com­pletionof the operation,DQ7 will output the bit last programmed or a ’1’ after erasing. Data Polling is valid only effective duringP/E.C. operation,that is after the fourth W pulse for programming or after the sixth W pulse for Erase. It mustbe performed at theaddressbeing programmedor at an address within the block being erased. If the byte to be programmedbelongsto aprotectedblock thecom­mand is ignored. If all the blocks selected for era­sure are protected, DQ7 will set to ’0’ for about 100µs, and then return to previous addressed memory data. See Figure 9 for the Data Polling flowchartandFigure10 for the Data Polling wave­forms.
data on DQ6 while Programming or Erase operations are going on. DQ6 remain at constant level when P/E.C. operations are completed or Erase Suspend is acknowledged.
This bit is set to ’1’ if P/E.C. has exceded the specified time limits.
possible command entry is Erase Suspend (ES). An additionalblock to be erased in parallel can be entered to the P/E.C.
8/31
M29W040
Table9. ACMeasurement Conditions
Input Rise and Fall Times
10ns
Figure5. AC TestingLoad Circuit
0.8V
Input Pulse Voltages 0 to 3V Input and Output Timing Ref. Voltages 1.5V
Figure 4. AC TestingInputOutput Waveform
3V
1.5V
0V
AI01417
Table10. Capacitance
(1)
(TA=25°C, f = 1 MHz)
DEVICE UNDER
TEST
CLincludes JIG capacitance
1N914
3.3k
CL= 30pF or 100pF
Symbol Parameter Test Condition Min Max Unit
C
IN
C
OUT
Note:
1. Sampled only,not 100% tested.
Input Capacitance VIN=0V 6 pF Output Capacitance V
=0V 12 pF
OUT
OUT
AI01968
Table11. DC Characteristics
=0 to 70°C, –20 to 85°C or –40 to85°C; VCC= 2.7V to 3.6V)
(T
A
Symbol Parameter Test Condition Min Max Unit
V
I I I
I I
I
V
V
I
LI
I
LO
CC1
CC2
CC3
CC4
CC5
CC6
V V
OL
OH
V
I
ID
LKO
Input Leakage Current 0V VIN≤ V Output LeakageCurrent 0V V
OUT
V
CC
CC
Supply Current (Read) E= VIL,G=VIH, f = 6MHz 20 mA Supply Current (Standby) TTL E = V Supply Current (Standby) CMOS E = V
Supply Current (Program or Erase)
Byte Program,
Block Erase
IH
0.2V 50
±
CC
Supply Current Chip Erase in progress 40 mA Power Down Current E = V Input Low Voltage –0.5 0.8 V
IL
Input High Voltage 0.7 V
IH
0.2V 5
±
CC
CC
Output Low Voltage IOL= 2mA 0.45 V
I
= –100µAV
Output High Voltage CMOS
A9 Voltage (Electronic Signature) 11.5 12.5 V
ID
A9 Current (Electronic Signature) A9 = V
OH
= –2.0mA 0.85 V
I
OH
ID
Supply Voltage (Erase and Program lock-out)
–0.4 V
CC
CC
1.9 2.2 V
±1 µA ±1 µA
0.2 mA
20 mA
VCC+ 0.5 V
50 µA
A
µ
A
µ
V
9/31
M29W040
Table12A. Read AC Characteristics
=0 to 70°C, –20 to 85°C or –40 to85°C)
(T
A
Symbol Alt Parameter Test Condition
t
t
AVAV
t
AVQVtACC
(1)
t
ELQX
(2)
t
ELQV
(1)
t
GLQX
(2)
t
GLQV
t
EHQX
(1)
t
EHQZ
t
GHQX
(1)
t
GHQZ
t
AXQX
Notes: 1. Sampled only,not 100% tested.
2. G may be delayed by up to t
Address Validto Next Address Valid E = VIL,G=V
RC
Address Validto Output Valid E = VIL,G=V
tLZChip Enable Low toOutput Transition G = V
t
Chip Enable Low to Output Valid G = V
CE
Output Enable Low to Output
t
OLZ
Transition
t
Output Enable Low to OutputValid E = V
OE
Chip Enable High to Output
t
OH
Transition
E=V
G=V
tHZChip Enable High to Output Hi-Z G = V
Output Enable High to Output
t
OH
Transition
E=V
tDFOutput Enable High to Output Hi-Z E = V
Address Transition to Output
t
OH
Transition
ELQV-tGLQV
afterthe falling edge of E without increasing t
E=V
IL
IL
IL
IL
IL
IL
IL
IL
IL
,G=V
M29W040
-100 -120
= 3.3V±0.3V
V
CC
C
= 30pF
L
= 3.3V±0.3V
V
CC
Unit
Min Max Min Max
100 120 ns
IL
IL
100 120 ns
00ns
100 120 ns
00ns
40 50 ns
00ns
20 30 ns
00ns
20 30 ns
00ns
IL
.
ELQV
Toggle bit (DQ6). When Programmingoperations are in progress, successiveattempts to read DQ6 will output complementary data. DQ6 will toggle following toggling of either G or E when G is low. The operation is completed when two successive reads yield the same output data. The next read will output the bit last programmed or a ’1’ after erasing. Thetogglebit is validonlyeffectiveduring P/E.C. operations, that is after the fourth W pulse for programming or after the sixth W pulse for Erase. If the byte to be programmed belongs to a protectedblockthe commandwill beignored.If the blocksselectedfor erasureare protected,DQ6will toggle for about 100µs and then return back to Read. See Figure 11 for ToggleBit flowchart and Figure 12 for ToggleBit waveforms.
Error bit (DQ5). This bit is set to ’1’ by the P/E.C when there is a failure ofbyte programming,block erase, or chip erase that results in invalid data being programmedin thememory block.In caseof error in block erase or byte program, the block in which the error occured or to which the pro-
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grammedbyte belongs,must be discarded. Other blocksmaystillbeused.Errorbitresetsafter Reset (RST) instruction. In case of success, the error bit will set to ’0’ during Program or Erase and to valid data afterwrite operation is completed.
Erase Timer bit (DQ3). Thisbit is set to ’0’by the P/E.C. when the last Block Erase command has been entered to the Command Interface and it is awaiting the Erase start. When the erase timeout period is finished, after 80 to 120µs, DQ3 returns backto ’1’.
Coded Cycles. The two coded cycles unlock the Command Interface. They are followed by a com­mand input or a comand confirmation.The coded cycles consist of writing the data AAh at address 5555hduringthefirstcycleanddata55hat address 2AAAh during the second cycle. Addresses are latched on the fallingedge of W or E while data is latched on the rising edge of W or E. The coded cycles happen on first and second cycles of the commandwrite or on the fourth and fifth cycles.
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