SGS Thomson Microelectronics M29W017D Datasheet

FEATURES SUMMARY
–V
2.7V to 3.6V for Program, Erase and
CC =
Read
ACCESS TIME: 70, 90ns
PROGRAMMING TIME
– 10µs per Byte typical
32 UNIFORM 64 KByte MEMORY BLOCKS
PROGRAM/ERA SE CON T ROL LER
– Embedded Byte Program algorithms
ERASE SUSPEND and RESUME MODES
– Read and Program another Block during
Erase Suspend
UNLOCK BYPASS PROGRAM COMMAND
– Faster Production/Batch Programm ing
TEMPORARY BLOCK UNPROTECTION
MODE
COMMON FLASH INTERFACE
– 64 bit Security Code
LOW POWER CONSUMPTION
– Standby and Automatic Standby
100,000 PROGRAM/ER ASE CYCL ES per
BLOCK
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h – Device Code: C8h
M29W017D
16 Mbit (2Mb x8, Uniform Block)
3V Supply Fl ash Me m ory
PRELIMINARY DATA
Figure 1. Packages
TSOP40 (N)
10 x 20mm
FBGA
TFBGA48 (ZA) 6 x 8 ball array
April 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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M29W017D
TABLE OF CONTENTS
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. TFBGA Connections (Top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 16. Block Addresses, M29W017D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Address Inputs (A0-A20). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data Inputs/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write Enable (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Reset/Block Temporary Unprotect (RP).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Ready/Busy Output (RB). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
V
Supply Voltage (2.7V to 3.6V).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
V
Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SS
BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Automatic Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Special Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Protection and Blocks Unprotection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 2. Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read/Reset Command.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Auto Select Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1
Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Unlock Bypass Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Unlock Bypass Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Unlock Bypass Reset Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Chip Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Block Erase Command.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Erase Suspend Comma nd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Erase Resume Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Read CFI Query Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Block Protect and Chip Unprotect Commands.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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M29W017D
Table 3. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. Program, Erase Times and Program, Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . . 14
STATUS REGISTER. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Erase Timer Bit (DQ3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
Alternative Toggle Bit (DQ2).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 5. Status Register Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 6. Data Polling Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6
Figure 7. Data Toggle Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 6. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 8
Table 7. Operating and AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 8. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Figure 9. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 8. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 9. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 10. Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 10. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 11. Write AC Waveforms, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 11. Write AC Characteristics, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 12. Write AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 12. Write AC Characteristics, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 13. Reset/Block Temporary Unprotect AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 13. Reset/Block Temporary Unprotect AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
TSOP40 – 40 lead Plastic Thin Small Outline, 10 x 20mm, Package Outline . . . . . . . . . . . . . . . . 24
TSOP40 – 40 lead Plastic Thin Small Outline, 10 x 20mm, Package Mecha nical Data . . . . . . . . 24
TFBGA48 8x9mm – 6x8 active ball array – 0.80mm pitch, Bottom View Packag e Outline . . . . . . 25
TFBGA48 8x9mm – 6x8 active ball array – 0.80mm pitch, Package Mec hanical Data . . . . . . . . . 25
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 14. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 15. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
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M29W017D
APPENDIX A. BLOCK ADDRESS TABLE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 16. Block Addresses, M29W017D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
APPENDIX B. COMMON FLASH INTERFACE (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 17. Query Structure Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Table 18. CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Table 19. CFI Query System Interface Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 20. Device Geometry Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Table 21. Primary Algorithm-Specific Extended Query Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 22. Security Code Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
APPENDIX C. BLOCK PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Programmer Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
In-System Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 23. Programmer Technique Bus Operations, BYTE = V
Figure 14. Programmer Equipment Block Protect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 15. Programmer Equipment Chip Unprotect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Figure 16. In-System Equipment Block Protect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 17. In-System Equipment Chip Unprotect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
or VIL . . . . . . . . . . . . . . . . . . . . . 31
IH
4/36
SUMMARY DESCRIPTION
The M29W017D is a 16 Mbit (2Mb x8) non-volatile memory that can be read, erased and repro­grammed. These operations can be performed us­ing a single low voltage (2.7 to 3 .6V) supply. On power-up the memory defaults to its Read mode where it can be read in the same way as a ROM or EPROM.
The memory is divided into 32 blocks of 64KBytes (see Table 16, Block Addresses) that can be erased independently so it is pos sible to pres erve valid data while old data is erased. Each block can be protected independently to prev ent accidental Program or Erase commands from modifying the memory. Program and Erase com m ands are wri t­ten to the Command Interface of t he memory. An
process of programming or erasing the memory by taking care of all of the special operations that are required to update the memory contents. The end of a program or erase op eration can be de tected and any error conditions identified. The command set required to control the memory is consistent with JEDEC standards.
Chip Enable, Output Enable and Write Enable sig­nals control the bus operation of the memory. They allow simple conne ction to most m icropro­cessors, often without additional logic.
The memory is offer ed in TSOP40 (10 x 20mm) and TFBGA48 (0.8mm pitch) pac kages. The memory is
supplied with all the bi ts erased (se t t o ’ 1’).
on-chip Program/Erase Controller simplifies the
Figure 2. Logi c D iag ram Table 1. Si gn a l Nam es
A0-A20 Address Inputs
M29W017D
A0-A20
W
RP
V
CC
21
E
G
M29W017D
V
SS
8
DQ0-DQ7
RB
AI04186
DQ0-DQ7 Data Inputs/Outputs E G W RP RB V
CC
V
SS
NC Not Connected Internally
Chip Enable Output Enable Write Enable Reset/Block Temporary Unprotect Ready/Busy Output Supply Voltage Ground
5/36
M29W017D
Figure 3. TSOP Connections
A16 A15 A14 A13 A12
1
40
A17 V
SS
A20 A19 A10
A11 DQ7
31 30
21
DQ6 DQ5 DQ4 V
CC
V
CC
NC DQ3 DQ2 DQ1 DQ0 G V
SS E A0
A9 A8
W RP NC
RB
A18
A7 A6 A5 A4 A3 A2 A1
10 11
20
M29W017D
AI04187
6/36
Figure 4. TFBGA Connections (Top view through package)
M29W017D
654321
A
B
C
D
E
F
G
H
A3
A4
A2
A1
A0
E
G
V
SS
A7
A18
A6
A5 NC
DQ0
NC
NC
DQ1
RB
NC
NC
DQ2
DQ3
V
CC
NC
W
RP
NC
NC
DQ5
NC
V
CC
DQ4
A9
A8
A11
A12
A19
A10
DQ6
DQ7
A14
A13
A15
A16
A17
NC
A20
V
SS
AI04188
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M29W017D
Figure 5. Block Addresses
M29W017D
Block Addresses
1FFFFFh
1F0000h
1EFFFFh
1E0000h
1DFFFFh
1D0000h
1CFFFFh
02FFFFh
020000h
01FFFFh
010000h
00FFFFh
000000h
64 KByte
64 KByte
64 KByte
Total of 32
64 KByte Blocks
64 KByte
64 KByte
64 KByte
AI05429
8/36
SIGNAL DESCRIPTIONS
See Figure 2, Logic Diagram, and Table 1, Sign al Names, for a brief overview of the signals connect­ed to this device.
Address Inputs (A0-A20). The Address Inputs select the cells i n the memory array to a ccess dur­ing Bus Read operations. During Bus Write opera­tions they control the commands sent to the Command Interface of the internal state machine.
Data Inputs/Outputs (DQ0-DQ7). The Data I/O outputs the data stored at the selected address during a Bus Read operation. During Bus Write operations they represent the commands sent to the Command Interface of the internal state ma­chine.
Chip Enable (E
). The Chip Enable, E, activates
the memory, allowing Bus Read and Bus Write op­erations to be performed. When Chip Enable is High, V
Output Enable (G
, all other pins are ignored.
IH
). The Output Enable, G, con-
trols the Bus Read operation of the memory.
Write Enable (W
). The Write Enable, W, controls
the Bus Write operation of the memory’s Com­mand Interf a c e.
Reset/Block Temporary Unprotect (RP). The Reset/Block Temporary Unprotect pin can be used to apply a Hardware Reset to the memory or to temporarily unprotect all Blocks that hav e b een protected.
A Hardware Reset is achieved by holding Reset/ Block Temporary Unprotect Low, V
. After Reset/Block Temporary Unprotect
t
PLPX
goes High, V
, the memory will be ready for Bus
IH
Read and Bus Write operations after t t
, whichever occurs last. See the Ready/Busy
RHEL
, for at least
IL
PHEL
or
Output section, Table 13 and Figure 13, Reset/ Temporary Unprotect AC Characteristics for more details.
Holding RP
at VID will temporarily unprotect the protected Blocks in the memory. Program and Erase operations on all blocks will be possible.
M29W017D
The transition from V t
PHPHH
.
Ready/Busy Output (RB
is an open-drain output that can be used to identify when the device is performing a Program or Erase operation. During Program or Erase operations Ready/Busy is Low, V pedance during Read mode, Auto Select mode and Erase Suspend mode.
After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy be­comes high-impedance. See Tabl e 13 and Figure 13, Reset/Temporary Unprotect AC Characteris­tics .
The use of an open-drain output allows the Ready/ Busy pins from several memories to be connected to a single pull-up resistor. A Low will then indicate that one, or more, of the memories is busy.
Supply Voltage (2.7V to 3.6V). VCC pro-
V
CC
vides the power supply for all operations (Read, Program and Erase).
The Command Interface is disabled when the V Supply Voltage is less than the L ockout Voltage, V
. This prevents Bus Write operations from ac-
LKO
cidentally damaging the data during power up, power down and power surges. If the Program/ Erase Controller is programming or erasing during this time then the operation aborts and the memo­ry contents being altered will be invalid.
A 0.1µF capacitor should be connected between the V
Supply Voltage pin and the VSS Ground
CC
pin to decouple the current surges from the power supply. See Figure 10, AC Measurement Load Cir­cuit. T he PCB track widths must be sufficient to carry the currents required during program and erase operations, I
Ground. VSS is the reference for all voltage
V
SS
measurements.
to VID must be slower than
IH
). The Ready/Busy pin
. Ready/Busy is high-im-
OL
.
CC3
CC
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M29W017D
BUS OPERATIONS
There are five standard bus operations that control the device. These are Bus Read, Bus Wri te, Out­put Disable, Standby and Automatic Standby. See Tables 2, Bus Operations, for a summary. Typical­ly glitches of less than 5ns on Chip Enable or Write Enable are ignored by t he mem ory and do not a f­fect bus operations.
Bus Read. Bus Read operations read from the memory cells, or specific registers in the Com­mand Interface. A valid Bus Read operation in­volves setting the desired address on the Address Inputs, applying a Low sig nal, V and Output Enable and keeping Write Enable High, V
. The Data Inputs/Outputs will output the
IH
value, see Figure 10, Read Mode AC Waveforms, and Table 10, Read AC Characteristics, for details of when the output becomes valid.
Bus Write. Bus Write operations write to the Command Interface. A valid Bus Write operation begins by setting the desire d address on t he Ad­dress Inputs. The Address Inputs are latched by the Command Interface on the falling edge of Chip Enable or Write Enable, whichever occurs last. The Data Inputs/Outputs a re latched by the Com­mand Interface on the rising edge of Chip Enable or Write Enable, whichever occurs first. Output En­able must remain High, V
IH
Write operation. See Figures 11 and 12, Write AC Waveforms, and Tables 11 and 12, Write AC Characteristics, for details of the timing require­ments.
Output Disa bl e . The Data Inputs/Outputs are in the high impedance s tate when Output Enable is High, V
.
IH
Standby. When Chip Enable is High, V memory enters Standby mode and the Data In­puts/Outputs pins are placed in the high-imped-
, to Chip Enable
IL
, during the whole Bus
, the
IH
ance state. To reduce the S upply Current to the Standby Supply Current, I be held within V
± 0.2V. For the Standby current
CC
, Chip Enable should
CC2
level see Table 9, DC Characteristics. During program or erase operations the memory
will continue to use the Program/Erase Supply Current, I
, for Program or Erase operations un-
CC3
til the operation completes. Automatic Standby. If CMOS levels (V
± 0.2V)
CC
are used to drive the bus and the bus is inactive for 300ns or more the memory enters Automatic Standby where the internal Supply Current is re­duced to the Standby Supply Current, I
CC2
. The Data Inputs/Outputs will still output data if a Bus Read operation is in progress.
Special Bus Operations
Additional bus operations can be performed to read the Electronic Signature and also to apply and remove Block Protec tio n. These bus opera­tions are intended for use by programming equip­ment and are not usually used in applications. They require V
to be applied to some pins.
ID
Electronic Signature. The memory has two codes, the manufacturer code and the device code, that can be read to identify the memory. These codes can be read by applying t he signals listed in Tables 2, Bus Operations.
Block Protection and Blocks Unprotection.
Each block can be separately protected against accidental Program or Erase. Protected blocks can be unprotected to allow data to be changed.
There are two methods available for protecting and unprotecting the blocks, one for use on pro­gramming equipment and the other for in-system use. Block Protect and Chip Unprot ec t operat ions are described in Appendix C.
Table 2. Bus Operations
Operation E G W
Bus Read Bus Write Output Disable X Standby Read Manufacturer
Code
Read Device Code
Note: X = VIL or VIH.
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V
IL
V
IL
V
IH
V
IL
V
IL
Address Inputs
A0-A20
V
IL
V
IH
V
IH
X X X Hi-Z
V
IL
V
IL
V
Cell Address Data Output
IH
V
Command Address Data Input
IL
V
X Hi-Z
IH
A0 = VIL, A1 = VIL, A9 = VID,
V
IH
Others V A0 = VIH, A1 = VIL,
V
IH
A9 = V
or V
IL
IH
, Others VIL or V
ID
IH
Data Inputs/Outputs
DQ7-DQ0
C8h
20h
COMMAND INTERFACE
All Bus Write operations t o the me mory are in ter­preted by the Command Interface. Commands consist of one or more sequential Bus Write oper­ations. Failure to observe a valid sequence of Bus Write operations will result in the memory return­ing to Read mode. The long command sequences are imposed to maximize data security.
Refer to Table 3, Commands, in conjunc tion with the following text descriptions.
Read/Reset Command. The Read/Reset com­mand returns the memory to its Read mode where it behaves like a ROM or EPROM, unless other­wise stated. It also resets t he errors in the S tatus Register. Either one or three Bus Write operations can be used to issue the Read/Reset command.
The Read/Reset Command can be issued, be­tween Bus Write cycles before the start of a pro­gram or erase operation, to return the device to read mode. Once the program or erase operation has started the Read/Reset command is no longer accepted. The Read/Reset command will not abort an Erase operation when issued while in Erase Suspend.
Auto Select Command. The Auto Select com­mand is used to read the Manufacturer Code, the Device Code and the Block Protection Status. Three consecutive Bus Write operations are re­quired to issue the Auto Select command. Once the Auto Select comma nd is issued the memory remains in Auto Select mode until a Read/Reset command is issued. Read CFI Query and Read/ Reset commands are accepted in Auto Select mode, all other commands are ignored.
From the Auto Select mode the Manufacturer Code can be read using a Bus Read operation with A0 = V may be set to either V
and A1 = VIL. The other address bits
IL
or VIH. The Manufa cturer
IL
Code for STMicroelectronics is 20h. The Device Code can be read using a B us Read
operation with A0 = V address bits may be set to e ither V
and A1 = VIL. The other
IH
or VIH. The
IL
Device Code for the M29W017D is C8h. The Bl ock Protection Status of each block can be
read using a Bus Read operation with A0 = V A1 = V
, and A 16 -A 20 spec ify i n g t he address of
IH
IL
the bl ock. The oth er addr ess bit s may b e set t o ei­ther V
or VIH. If t h e ad dr ess ed b loc k is pro tec te d
IL
then 01h is output on Data Inputs/Outputs DQ0­DQ7, otherwise 00h is output.
Program Command. The Program command can be used to program a value to one address in the memory array at a time. The command re­quires four Bus Write operations, the final write op­eration latches the address and data in the internal state machine and starts the Program/Erase Con­troller.
M29W017D
If the address falls in a pro tected block then the Program command is ignored, the data remains unchanged. The Status Register is never read and no error condition is given.
During the program operat ion the memo ry will ig­nore all commands. I t is n ot poss ible t o iss ue any command to abort or pause the operation. Typical program times are given in Table 4. Bus Read op­erations during the program o peration will output the Status Register on the Data Inputs/Outputs. See the section on the S tatus Register for more details.
After the program operation has completed the memory will return to the Read mode, unle ss an error has occurred. When an error occurs the memory will continue to output the Status Regis­ter. A Read/Reset command must be issued to re­set the error condition and return to Read mode.
Note that the Program command cannot change a
bit set at ’0’ bac k to ’1’. One of the E rase Com­mands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’.
Unlock Bypass Command. The Unlock Bypass command is used in conjunction with the Unlock Bypass Program command to program the memo­ry. When the cycle time to the device is long (as with some EPROM programmers) considerable time saving can be made by using these com­mands. Three Bus Write operations are requ ired to issue the Unlock Bypass command.
Once the Unlock Bypas s command has bee n is­sued the memory will only accept the Unloc k By­pass Program command and the Unlock Bypass Reset command. The memory can be read as if in Read mode.
Unlock Bypass Program Command. The Un­lock Bypass Prog ra m command can be u sed to program one address in the memory array at a time. The command requires two Bus Write oper­ations, the final write operation latches the ad­dress and data in the internal state machine and starts the Program/Erase Controller.
The Program operation using the Unlock Bypass
,
Program command behaves identically to the Pro­gram operation using the Program command. A protected block cannot be programmed; the oper­ation cannot be aborted and the Status Register is read. Errors must be reset using the Read/Re set command, which l eaves the d evice in Unlo ck By­pass Mode. See the Program command for details on the behavior.
Unlock Bypass Reset Command. The Unlock Bypass Reset command can be used to return t o Read/Reset mode from Unlock Bypass Mode. Two Bus Write operations are required to issue the Unlock Bypass Reset command. Read/Reset
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