SGS Thomson Microelectronics M28W160BT, M28W160BB Datasheet

16 Mbit (1Mb x16, Boot Block) Low Voltage Flash Memory

■ SUPPLY VOLTAGE

= 2.7V to 3.6V: for Program, Erase and

–V

Read –V –V

■ ACCESS TIME

– 2.7V to 3.6V: 90ns – 2.7V to 3.6V: 100ns

■ PROGRAMMING TIME:

– 10µ s typical – Double Word Programming Option

■ PROGRAM/ERASE CONTROLLER (P/E.C.)

■ COMMON FLASH INTERFACE

– 64 bit Security Code

■ MEMORY BLOCKS

– Parameter Blocks (Top or Bottom location) – Main Blocks

■ BLOCK PROTECTION on TWO PARAMET ER

BLOCKS –WP

■ AUTOMATIC STAND-BY MODE

■ PROGRAM and ERASE SUSPEND

■ 100,000 PROGRAM/ERASE CYCL ES per

BLOCK

■ 20 YEARS of DATA RETENTION

– Defectivity below 1ppm/year

■ ELECTRONIC SIGNATURE

– Manufacturer Code: 20h – Top Device Code, M28W160BT: 90h – Bottom Device Code, M28W160BB: 91h

= 1.65V or 2.7V: Input/Output option

DDQ

= 12V: o ptional Supply Voltage for fast

Program

for Block Protection

M28W16 0BT

M28W160BB

TSOP48 (N)

12 x 20mm

Figure 1. Logic Diagram

DDQVPP

A0-A19

M28W160BT M28W160BB

µBGA

µBGA46 (GB)

8 x 6 solder balls

DQ0-DQ15

AI02628

1/39May 2000

M28W160BT, M28W160BB

Figure 2. µBG A Co nn e ct i ons (Top view through package)

87654321

DDQ

Figure 3. TSOP Connection s

A15 A14 A13 A12 A11 A10 DQ14

WP A19 A18 A17

A8 NC NC

12 13

24 25

M28W160BT M28W160BB

DQ15

37 36

AI02630

A8A11A13

DQ7V

DQ13

RP A18

DQ11

DQ12

DQ4

WP A19

DQ2

A7V

A5A17WA10A14

DQ0DQ9DQ3DQ6

DQ1DQ10V

A1A3A6A9A12A15

A0EDQ8DQ5DQ14A16

AI02629

Table 1. Signal Names

A16 V

DDQ

DQ15 DQ7

DQ6 DQ13 DQ5 DQ12 DQ4 V

DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G V

E A0

A0-A19 Address Inputs DQ0-DQ7 Data Input/Output, Command Inputs DQ8-DQ15 Data Input/Output E G W RP WP V

DDQ

Chip Enable Output Enable Write Enable Reset Write Protect Supply Voltage Power Supply for

Input/Output Buffers Optional Supply Voltage for

Fast Program & Erase Ground

NC Not Connected Internally

2/39

M28W160BT, M28W160BB

Table 2. Absolute Maximum Ratings

Symbol Parameter Value Unit

BIAS

STG

, V

DDQ

Note: 1. Except for the ratin g " Operating Temperature Range", stresses abo ve those listed in the T able "Abs ol ute Maximum Ratings" may

cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indi cated in the Operating sections of this s pecification is not impli ed. Exposure to Absolute M aximum Rating conditions for extended per iods may aff ect device reliabilit y. Refer also to the STMicroel ectronics SURE Program an d other relevan t qual ity docum en ts .

2. Depends on range.

Ambient Operating Temperature

Temperature Under Bias –40 to 125 °C Storage Temperature –55 to 155 °C Input or Output Voltage Supply Voltage –0.6 to 4.1 V Program Voltage –0.6 to 13 V

DESCRIPTION

The M28W160B is a 16 Mbit non-volatile Flash memory that can be erased electrically at the block level and programmed i n-system on a Word-byWord basis. The device is of fered in the TS OP48

(10 x 20mm) and the µ BGA46, 0.75 mm ball pitch packages. When shipped, all bits of the M28W160B are in the ‘1’ state.

The array matrix organisation allows each block to be erased and reprogrammed without affecting other blocks. Each block can be programmed and erased over 100,000 cycles. V

DDQ

the I/O pin down t o 1.65V. An optional 12 V V power supply is provided to speed up the program phase at customer production line environment. An internal Command Interface (C.I.) decodes the instructions to access/modify the memory content. The Program/Erase Controller (P /E.C.) automatically executes the algorithms taking care of the timings necessary for program and erase operations. Verification is performed too, unburdening the microcontroller, while the Status Register tracks the status of th e operation.

The following instructions are executed by the M28W160B: Read Array , Read Electronic Signature, Read Status Register, Clear Status Register, Program, Double Word Program, Block Erase, Program/Erase Suspend, Program/Erase Resume and CFI Query.

(1)

(2)

allows to driv e

–40 to 85 °C

–0.6 to V

DDQ

+0.6

Organisation

The M28W160B is organised as 1 Mbit by 16 bits. A0-A19 are the address l ines; DQ0 -DQ15 are the Data Input/Output. Memory control is provided by Chip Enable E W

inputs. The Program and Erase operations are

, Output Enable G and Write Enable

managed automatically by the P/E.C. Block protection against Program or E rase provides additional data security.

The upper two (or lower two) parameter blocks can be protected to secure the code content of the memory . WP

controls protection and unprotection

operations.

Memory Blocks

The device features an asymmetrical blocked architecture. The M28W160B has an array of 39 blocks: 8 Parameter Blocks of 4 KWord and 31 Main Blocks of 32 KWord. M28W 160BT has the Parameter Blocks at the top of the memory address space while the M28W160BB locates the Parameter Blocks starting from the bottom. The memory maps are shown in Tables 3 and 4.

The two upper parameter block c an be protected from accidental programming or erasure using

. Each block can be erased separately. Erase

WP can be suspended in order to perform either read or program in any other b lock and then resum ed. Program can be s uspended to read data in any other block and then resumed.

3/39

M28W160BT, M28W160BB

Table 3. Top Boot Block Addresses, M28W160BT

38 4 FF000-FFFFF 37 4 FE000-FEFFF 36 4 FD000-FDFFF 35 4 FC000-FCFFF 34 4 FB000-FBFFF 33 4 FA000-FAFFF 32 4 F9000-F9FFF 31 4 F8000-F8FFF 30 32 F0000-F7FFF 29 32 E8000-EFFFF 28 32 E0000-E7FFF 27 32 D8000-DFFFF 26 32 D0000-D7FFF 25 32 C8000-CFFFF 24 32 C0000-C7FFF 23 32 B8000-BFFFF 22 32 B0000-B7FFF 21 32 A8000-AFFFF 20 32 A0000-A7FFF 19 32 98000-9FFFF 18 32 90000-97FFF 17 32 88000-8FFFF 16 32 80000-87FFF 15 32 78000-7FFFF 14 32 70000-77FFF 13 32 68000-6FFFF 12 32 60000-67FFF 11 32 58000-5FFFF 10 32 50000-57FFF

9 32 48000-4FFFF 8 32 40000-47FFF 7 32 38000-3FFFF 6 32 30000-37FFF 5 32 28000-2FFFF 4 32 20000-27FFF 3 32 18000-1FFFF 2 32 10000-17FFF 1 32 08000-0FFFF 0 32 00000-07FFF

Size

(KWord)

Address Range

Table 4. Bottom Boot Block Addresses, M28W160BB

38 32 F8000-FFFFF 37 32 F0000-F7FFF 36 32 E8000-EFFFF 35 32 E0000-E7FFF 34 32 D8000-DFFFF 33 32 D0000-D7FFF 32 32 C8000-CFFFF 31 32 C0000-C7FFF 30 32 B8000-BFFFF 29 32 B0000-B7FFF 28 32 A8000-AFFFF 27 32 A0000-A7FFF 26 32 98000-9FFFF 25 32 90000-97FFF 24 32 88000-8FFFF 23 32 80000-87FFF 22 32 78000-7FFFF 21 32 70000-77FFF 20 32 68000-6FFFF 19 32 60000-67FFF 18 32 58000-5FFFF 17 32 50000-57FFF 16 32 48000-4FFFF 15 32 40000-47FFF 14 32 38000-3FFFF 13 32 30000-37FFF 12 32 28000-2FFFF 11 32 20000-27FFF 10 32 18000-1FFFF

9 32 10000-17FFF 8 32 08000-0FFFF 7 4 07000-07FFF 6 4 06000-06FFF 5 4 05000-05FFF 4 4 04000-04FFF 3 4 03000-03FFF 2 4 02000-02FFF 1 4 01000-01FFF 0 4 00000-00FFF

Size

(KWord)

Address Range

4/39

M28W160BT, M28W160BB

SIGNAL DESCRIPTIONS

See Figure 1 and Table 1. Address Inputs (A0-A19). The address signals

are inputs driven with CMOS vol tage level s. They are latched during a write operation.

Data Input/Output (DQ0-DQ15). The data inputs, a word to be programmed or a comm and to the C.I., are latched on the Chip Enable E Enable W

rising edge, whichever occurs first. The

or Write

data output from the memory Array, the Electronic Signature or Status Register is valid when Chip Enable E

and Output Enable G are active. The

output is high impedance when the ch ip is deselected, the outputs are disabled or RP

is tied to VIL.

Commands are issued on DQ0-DQ7.

Chip Enable (E

). The Chip Enable input acti-

vates the memory control logic, input buffers, decoders and sense amplifiers. E

at VIH deselects the memory and red uces the power consumption to the stand-by level. E

can also be used to control writing to the command register and to the memory array, while W

Output Enable (G

remains at VIL.

). The Output Enable controls

the data Input/Output buffers.

Write Enable (W

). This input controls writing to

the Command Register, Input Address and Dat a latches.

Write Protect (WP

). Write Protect is an input to

protect or unprotect the two lockable parameter blocks. When WP

is at VIL, the locka ble bl ocks are protected. Program or erase operations are not achievable. When WP

is at VIH, the lockable blocks are unprotected and they can be programmed or erased (refer to Table 9).

Reset Input (RP

ware reset of the memory. When RP

). The RP input provides hard-

is at VIL, the memory is in reset mode : the outputs are put to High-Z and the current consumption is minimised. When RP

is at VIH, the device is in norm al operation. Exiting reset mode the device enters read array mode.

Supply Voltage (2.7V to 3.6V). VDD pro-

vides the power supply to the internal core of the memory device. It is the main power supply for all operations (Read, Program and Erase). It ranges from 2.7V to 3.6V.

Supply Voltage (1.65V to VDD). V

DDQ

provides the power supply to the I/O pins and enables all Outputs to be powered independently from V

. V

can be tied to VDD or it can use a

DDQ

separate supply. It can be powered either from

1.65V to 2.2V or from 2.7V to 3.6V.

Program Supply Voltage (12V). VPP is

both a control input and a power supply pin. T he two functions are selected by the voltage range applied to the pin.

is kept in a low voltage range (0V to 3.6V)

If V

is seen as a control input. In this case a volt-

age lower than V against program or erase, whi le V ables these functions. V

gives an absolute protection

PPLK

value is only sampled

> V

PP1

en-

at the beginning of a program or erase; a cha nge in its value after the operation has been started does not have any effect and program or erase are carried on regu larl y.

is used in the range 11.4V to 12.6V acts as

If V

a power supply pin. In this condition V

value must be stable until P/E algorithm is completed (see Table 22 and 23).

Ground. VSS is the reference for all the volt-

age measurements.

5/39

M28W160BT, M28W160BB

DEVICE OPERATIONS

Four control pins rule the hardware access t o the Flash memory: E

, G, W, RP. The following operations can be performed using the appropriate bus cycles: Read, Write the Command of an Instruction, Output Disable, Stand-by, Reset (see Table

5). Read. Read operations are used to output the

contents of the Memory Array, the Electronic Signature, the Status Register and the CFI. Both Chip Enable (E

) and Output Enabl e (G) must be at V in order to perform the read operation. The Chip Enable input should be used to enable the device. Output Enable shoul d be used to gate data onto the output indepe ndently of the device s election. The data read depend on the previous command written to the memory (see instructions RD, RSIG, RSR, RCFI). Read Array is the default state of the device when exiting Reset or after power-up.

Write. Write operations are used to give Commands to the memory or to latch Input Data to be programmed. A write operation is initiated when Chip Enable E Output Enable G

Table 5. User Bus Operations

Operation E G W RP WP

Read Write Output Disable Stand-by Reset X X X

Note: 1. X = VIL or VIH, V

and Write Enable W are at VIL with

at VIH. Comm ands, Inp ut Data

(1)

= 12V ± 5%.

PPH

and Addresses are latched on the rising edge of W or E, whichever occur first.

Output Disa bl e . The data outputs are high impedance when the Output Enable G

Stand-by. Stand-by disables most of the internal circuitry allowing a substantial reduction of the current consumption. The memory is in stand-by when Chip Enable E read mode. The power consumption is reduced to the stand-by level and the o utputs are set to high impedance, independently from the Output Enable

or Write Enable W inputs. If E switches to V during program or erase operation, the device enters in stand-by when finished.

Reset. During Reset mode all internal circuits are switched off, the memory is deselected and the outputs are put in high impedance. The memory is in Reset mode when RP sumption is reduced to the Stand-by level, independently from the Chip Enabl e E

or Write Enable W inputs. If RP is pulled to V

G during a Program or Erase, this operation is aborted and the memory content is no longer valid as it has been compromised by the aborted operation.

is at VIH.

is at VIH and the device is in

is at VIL. The power con-

, Output En able

X Don’t Care Data Output

X X Don’t Care Hi-Z X Don’t Care Hi-Z X Don’t Care Hi-Z

or V

PPH

DQ0-DQ15

Data Input

Table 6. Read Electronic Signature (RSIG Instruction)

Code Device E

Manufact. Code

M28W160BT

Device Code

M28W160BB

Note: 1. RP = VIH.

6/39

G W A0 A1-A7 A8-A19 DQ0-DQ7 DQ8-DQ15

V V V

V V

Don’t Care 20h 00h

Don’t Care 90h 00h

Don’t Care 91h 00h

M28W160BT, M28W160BB

INSTRUCTIONS AND COMMANDS

Eleven instructions are available (see Tables 7 and 8) to perform Read Memory Array, Read Status Register, Read Electronic Signature, CFI Query, Erase, Program, Dou ble Word Program, Clear Status Register, Program/Erase Suspend and Program/Erase Resume. Status Register output may be read at any time, during programming or erase, to monitor the progress of the operation.

An internal Command Interface (C.I.) decodes the instructions while an internal Program/Erase Controller (P/E.C.) handles all timing and verifies the correct execution of the Program and Erase instructions. P/E.C. provides a Status Register whose bits indicate operation and exit status of the internal algorithms.

The Command Interface is reset to Read Array when power is first applied, when exiting from Reset or whenever V

is lower than V

LKO

. Command sequence must be followed exactly. Any invalid combination of commands will reset the device to Read Array.

Read (RD)

The Read instruction consists of one write cycle (refer to Device Operations section) giving the command FFh. Next read operations will read the addressed location and output the data. When a device reset occurs, the memo ry is in Read Array as default.

Read Status Register (RSR)

The Status Register indicates when a program or erase operation is complete and the success or failure of operation itself. Issue a Read Status Register Instruction (70h) to rea d the S tatu s Register content.

The Read Status Register instruction may be issued at any time, also when a Program/Erase operation is ongoing. The following Read operations output the content of the Status Register. The Status Register is latched on the falling edge of E G

signals, and can be read until E or G returns to

. Eithe r E or G must be t oggled to updat e the

latched data. Additionally, any read attempt during program or erase operation will autom atically ou tput the content of the Status Register.

Read Electronic Signature (RSIG)

The Read Electronic Signature instruction consists of one write cycle (refer to Device Operations

section) giving the command 90h. A subsequent read will output the Manufacturer or the Device Code (Electronic Signature) depending on the levels of A0 (see Tables 6). The Electronic Signature can be read from the memory allowing programming equipment or applications to automatically match their interface to the characteristics of M28W160B. The Manufacturer Code is output when the address lines A 0 is at V Code is output when A0 is at V must be kept to V

, other addresses are ignored.

, the Device

. Address A1-A7

The codes are output on DQ0-DQ7 with DQ8DQ15 at 00h.

CFI Query (RCFI)

The Common Flash Interface Query mode is entered by writing 98h. Next read operations will read the CFI data. The CFI data structure contains also a security area; in this section, a 64 bit unique security number is written, starting at address 80h. This area can be accessed only in read mode by the final use and there are no ways of chang ing the code after it has been written by ST. Write a read instruction to return to Read mode (refer to the Common Flash Interface section).

Table 7. Commands

Hex Code Command

00h, 01h, 60h,

2Fh, C0h

10h Alternative Program Set-up 20h Erase Set-up 30h Double Word Program Set-up 40h Program Set-up 50h Clear Status Register 70h Read Status Register

90h or 98h

B0h Program/Erase Suspend

D0h

FFh Read Array

Invalid/Reserved

Read Electronic Signature, or CFI Query

Program/Erase Resume, or Erase Confirm

7/39

M28W160BT, M28W160BB

Table 8. Instructions

Mne-

monic

RSR

RSIG

RCFI CFI Qu ery 1+ Wri te 55h

EE Erase 2 Write X 20h Write

PG Progra m 2 Write X

DPG

CLRS

PES

PER

Note: 1. X = Don’t Care.

Instruction Cycles

Read Memory Array

Read Status Register

Read Electronic Signature

Double Word

(4)

Program Clear Status

Erase Suspend

Program/ Erase Resume

2. The first cyc le of the RD, RSR, RSIG o r RCFI in st ruction is followed by read oper ations to read me m ory array, Status Register or Electronic Signature codes. Any number of Read cycle can occur after one command cycle.

3. Signature address bit A0=V kept to V

4. Address 1 and Address 2 must be consecuti ve Addresses differing only for address bit A0.

. Other address bits are i gnored.

Operat.

1+ Write X FFh

1+ Write X 70h

1+ Write X

3 Write X 30h Write Address 1

1Write X 50h

1Write X B0h

1Write X D0h

1st Cycle 2nd Cy cle 3nd Cy cle

(1)

Addr.

will output Manufacturer code. Address bit A0=V

Data Operat. Addr. Data Operat. Addr. Data

Read

90h or

98h

98h or

90h

40h or

10h

(2)

Read

Write Address

(2)

Address

Signature

Address

CFI

Address

Bloc k

Address

Data

Status

Signatur e

(3)

Query

D0h

Data Input

will output Device code. Address A7-A1 must be

Write Address 2

Data

Input

Erase (EE)

Block erasure sets all the bits within the selected block to ’1’. One block at a time can be erased. It is not necessary to program the block with 00h as the P/E.C. will do it automatically before erasing. This instruction uses two write cycles. The first command written is the Erase Set up command 20h. The second command is the Erase Confirm command D0h. An address within the block to be erased is given and latched in to the mem ory during the input of t he second com mand. If the s econd command given is not an erase conf irm, the status register bits b4 and b5 are set and the instruction aborts.

Read operations output the status register after erasure has started.

8/39

Status Register bit b7 returns ’0’ while the erasure is in progress and ’1’ when it has completed. After completion the Status Register bit b5 returns ’1’ if there has been a n Erase Failure. S tatus register bit b1 returns ’1’ if the user is attempt ing to program a protected blo ck. S tat us Regi s ter bit b3 returns a ’1’ if V

is below V

Erase aborts if RP

turns to VIL. As da ta integ rity

PPLK

cannot be guaranteed when the erase operation is aborted, the erase must be repeated. A Clear Status Register instruction must be issued to reset b1, b3, b4 and b5 of th e Status Register. During the execution of the erase by t he P /E.C., the memory accepts only the RSR (Read Status Register) and PES (Program/Erase Suspend) instructions.

Table 9. Memory Blocks Protection Truth Table

VPP

(1,3)

(2,4)

(1,4)

M28W160BT, M28W160BB

Lockable Blocks Other Blocks

or V

Note: 1. Notes:1. X ’ = Don’t Care

2. RP

3. V

4. V

5. V

(5)

PPH

(5)

PPH

is the Reset/Power Down.

is the program or erase supply volta ge.

are logic high and low levels.

IH/VIL

must be also gr eater than the Program V ol t age Lock-Out V

Table 10. Status Register Bits

Mnemonic Bit Name

P/ECS 7 P/E.C. Status

Erase

ESS 6

ES 5 Erase Status

PS 4

VPPS 3

PSS 2

BPS 1

Suspend Status

Program Status

Status

Program Suspend Status

Block Protection Status

X Protected Protected X Protected Protected

Logic

Level

Definition Note

Protected Unprotected

Unprotected Unprotected

PPLK

’1’ Ready Indicates the P/E.C. status, check during

Program or Erase, and on completion before

’0’ Busy

’1’ Suspended

In progress or

’0’

Completed

checking bits b4 or b5 for Program or Erase Success

On an Erase Suspend instruction P/ECS and ESS bits are set to ’1’. ESS bit remains ’1’ until an Erase Resume instruction is given.

’1’ Erase Error ES bit is set to ’1’ if P/E.C. has applied the

maximum number of erase pulses to the block

’0’ Erase Success ’1’ Program Error

’0’ Program Success

’1’

Invalid, Abort VPPS bit is set if the VPP voltage is below V

without achieving an erase verify. PS bit set to ’1’ if the P/E.C. has failed to program

a word.

when a Program or Erase instruction is executed.

is sampled only at the beginning of the

’0’

’1’ Suspended

In Progress or

’0’

Completed

Erase/Program operation. On a Program Suspend instruction P/ECS and

PSS bits are set to ’1’. PSS remains ’1’ until a Program Resume Instruction is given

Program/Erase on

’1’

protected Block, Abort

No operation to

’0’

protected blocks

BPS bit is set to ’1’ if a Program or Erase operation has been attempted on a protected block

PPLK

0 Reserved

Note: Logic level ’1’ is High, ’0’ is Low.

9/39

M28W160BT, M28W160BB

Program (PG)

The memory array can be programmed word-byword. This instruction uses two write cycles. The first command written is the Program Set-up command 40h (or 10h). A second write operation latches the Address and the Data to be written and starts the P/E.C.

Read operations output the Status Register content after the programming has started. The Status

Register bit b7 returns ’0’ while t he programming is in progress and ’1’ when it has completed. After completion the Status register bit b4 returns ’1’ if there has been a Program Failure. Status register bit b1 returns ’1’ if the user is attempt ing to program a protected blo ck. S tatu s Regi s ter bit b3 returns a ’1’ if V aborts if RP

is below V

. Programming

PPLK

goes to VIL. As data integrity cannot be guaranteed when the program operation is aborted, the memory location must be erased and reprogrammed. A Clear Status Register instruction must be issued to reset b4, b3 and b1 of the Status Register.

During the execution of the program by the P/E.C., the memory accepts only the RSR (Read Status Register) and PES (Program/Erase Suspe nd) instructions.

Doubl e Word Prog ram (DPG)

This feature is offered to improve the programming throughput, writing a page of two adjacent words in parallel.The two words m ust differ only for the address A0. Programm ing should not b e att emp ted when V

is not at V

also be executed if V

. The operation can

PPH

is below V

PPH

but result could be uncertain. This instruction uses three write cycles. The first c ommand written is the Double Word Program Set-Up command 30h. A second write operation latc hes the Address and the Data of the first w ord to be wri tten, the third write operation latches the Address and the Data of the second word to be written and starts the P/E.C. Read operations output the Status Register content after the programming has started. The Status Register bit b7 returns ’0’ while t he programming is in progress and ’1’ when it has completed. After completion the Status register bit b4 returns ’1’ if there has been a Program Failure. Status register bit b1 returns ’1’ if the user is attempt ing to program a protected blo ck. S tatu s Regi s ter bit b3 returns a ’1’ if V aborts if RP

goes to VIL. As data integrity cannot

is below V

. Programming

PPLK

be guaranteed when the program operation is aborted, the memory location must be erased and

reprogrammed. A Clear Status Register instruction must be issued to reset b4, b3 and b1 of the Status Register.

During the execution of the program by the P/E.C., the memory accepts only the RSR (Read Status Register) and PES (Program/Erase Suspe nd) instructions.

Clear Status Register (CLRS)

The Clear Status Register uses a single write operation which clears bits b1, b3, b4 and b5 to ‘0’. Its use is necessary before any new operation when an error has been detected.

The Clear Status Register is executed w riting the command 50h.

Program/Erase Suspend (PES)

Program/Erase suspend is accepted only during the Program Erase instruction execu tion. When a Program/Erase Suspend command is written to the C.I., the P/E.C. freezes the Program/Erase operation. Program/Erase Res ume (P ER) cont inues the Program/Erase operation. Program/Erase Suspend consists of writing the command B0h without any specific address.

The Status Register bit b2 is set to ‘1’ (within 5µs) when the program has been sus pended . b2 is set to ‘0’ in case the program is completed or in progress. The Status Register bit b6 is set to ‘1’ (within 30µs) when the erase has been sus pended. b6 is s et t o ‘0’ in cas e th e e rase is com plet ed or in progress. The valid commands while erase is suspended are Program/Erase Resume, Program, Read Array, Read Status Register, Read Identifier, CFI Query. While program is suspended the same command set is valid except for program instruction. During program/erase suspend mode, the chip can be placed in a pseudo-stand-by mode by taking E sumption. Program/Erase is aborted if RP

to VIH. This reduces active current con-

turns to

Program/Erase Resume (PER)

If a Program/Erase Suspend instruction was previously executed, the program/erase operation may be resumed by issuing the command D0h. The status register bit b2/b6 is cleared when program/ erase resumes. Read operations output the status register after the program/erase is resumed.

The suggested flow charts for programs that use the programming, erasure and program/erase suspend/resume features of the memories are shown from Figures 10, 11, 12, 13 and 14.

10/39

M28W160BT, M28W160BB

Table 11. Program, Erase Times and Program /Eras e Endur ance Cycles

= 0 to 70°C or –40 to 85°C; VDD = 2.7V to 3.6V)

Parameter Test Conditions

Word Program

Double Word Program

Main Block Program

Parameter Block Program

Main Block Erase

Parameter Block Erase

= 12V ±5%

= V

Program/Erase Cycles (per Block) 100,000 cycles

Note: TA = 25 °C.

Min

M28W160B

Typ

(1)

Max

Unit

10 200 µs 10 200 µs

0.16 5 sec

0.32 5 sec

0.02 4 sec

0.04 4 sec 110 sec 110 sec

0.8 10 sec

11/39

M28W160BT, M28W160BB

BLOCK PROTECTION

Two parameter blocks (#0 and #1) can be protected against Program or Erase to ensure extra data security. Unprotected blocks can be programmed or erased.

tied to VIL protects the two lockable b locks.

WP V

below V

protects all the blo cks. A ny pro-

PPLK

gram or erase operation on protected blocks is aborted. The Status Register tracks when the event occurs.

Table 9 defines the protection methods.

POWER CONSUMPTION

The M28W160B puts itself in one o f four different modes depending on the statu s of the c ontrol signals: Active Power, Automatic Stand-by, Stand-by and Reset define decreasing levels of current consumption. These allow the memory power to be minimised, in turn decreasing the overall system power consumption. As different recovery time are linked to the different modes, please refer to the AC timing table to design your system.

Active Power

When E

is at VIL and RP is at VIH, the device is in active mode. Refer to DC Characteristics to get the values of the current supply consumption.

Automatic Stand-by

Automatic Stand-by provides a low power consumption state during read mode. Following a read operation, after a del ay c lose to the memory access time, the device enters Automatic Standby: the Supply Current is reduced to I

CC1

values. The device keeps the last output data s table, till a new location is accessed.

Stand-by or Reset

Refer to the Device Operations section.

Power Up

The Supply voltage V voltage V

can be applied in any order. The

and the Program S upply

memory Command Interface is reset on power up to Read Memory Array, but a negative transition of Chip Enable E

or a change of the addresses is required to ensure valid data outputs. Care must be taken to avoid w rites to t he memory when V above V ther E

. Writes can be inhibited by drivin g ei-

LKO

or W to VIH. The memory is disabled if RP

is at VIL.

Supply Rails

Normal precautions must be taken for supply voltage decoupling, each device in a system should have the V

0.1µF capacitor close to the V

and VPP rails decoupled with a

and VPP pins.

The PCB trace widths should be sufficient to carry the required V

program and erase currents.

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