The M27C4002 is a 4 Mbit EPROM offered in the
two ranges UV (ultra violet erase) and OTP (one
time programmable). It is ideally suited for microprocessorsystemsrequiringlargeprogramsandis
organisedas 262,144words of 16 bits.
The FDIP40W(window ceramicfrit-seal package)
and the JLCC44W (J-lead chip carrierpackages)
have transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit
pattern. A new pattern can then be written to the
deviceby followingthe programmingprocedure.
Forapplicationswherethe contentisprogrammed
only one time and erasure is not required, the
M27C4002 is offered in PDIP40, PLCC44 and
TSOP40(10 x 20 mm) packages.
The operating modesof the M27C4002are listed
in the OperatingModes table. A single power supplyis requiredin thereadmode. Allinputs are TTL
levels except for V
and 12V on A9for Electronic
pp
Signature.
Read Mode
The M27C4002 has two control functions,both of
which must be logically active in order to obtain
data at the outputs. Chip Enable (E) is the power
control and should be used for device selection.
OutputEnable(G) is the outputcontrol and should
be used to gate data to the output pins, independent of device selection. Assuming that the
addresses are stable, the address access time
)isequalto thedelayfrom Etooutput(t
(t
AVQV
Datais availableat theoutputaftera delayof t
ELQV
GLQV
from the falling edge of G, assuming that E has
been low andthe addresseshave beenstable for
at least t
AVQV-tGLQV
.
StandbyMode
The M27C4002 has a standby mode which reducesthesupplycurrentfrom50mAto100µA.The
M27C4002 is placed in the standby mode by applyinga CMOShigh signalto theE input. Whenin
thestandbymode,theoutputsare in a highimpedance state,independentof theG input.
).
2/16
M27C4002
Table2. Absolute MaximumRatings
(1)
SymbolParameterValueUnit
T
A
T
BIAS
T
STG
V
IO
V
CC
V
A9
V
PP
Notes: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in theTable ”AbsoluteMaximum Ratings”
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC
3. Depends on range.
Ambient Operating Temperature
Temperature Under Bias–50 to125
Storage Temperature–65 to150
(2)
Input or Output Voltages (except A9)–2 to7V
Supply Voltage–2 to7V
(2)
A9 Voltage–2 to13.5V
Program Supply Voltage–2 to14V
may cause permanentdamage to thedevice. Theseare stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operatingsections of this specification is not implied.Exposure to Absolute Maximum
Rating conditions for extendedperiods may affectdevice reliability.Refer also to the STMicroelectronicsSURE Programand other
relevant quality documents.
voltage on Output is V
+0.5Vwith possible overshoot to VCC+2V for a period less than20ns.
CC
(3)
–40 to125
C
°
C
°
C
°
Table3. OperatingModes
ModeEGA9V
ReadV
Output DisableV
ProgramV
VerifyV
Program InhibitV
StandbyV
Electronic SignatureV
Note:X =VIHor VIL,VID= 12V ± 0.5V
IL
IL
PulseV
IL
IH
IH
IH
IL
PP
V
IL
V
IH
IH
V
IL
V
IH
XXV
V
IL
XV
XV
CC
CC
or V
or V
SS
SS
XVPPData In
XVPPData Out
XVPPHi-Z
or V
CC
SS
V
ID
V
CC
Q0 - Q15
Data Out
Hi-Z
Hi-Z
Codes
Table4. ElectronicSignature
IdentifierA0Q7Q6Q5Q4Q3Q2Q1Q0Hex Data
Manufacturer’s CodeV
Device CodeV
Note: Outputs Q8-Q15 areset to ’0’.
IL
IH
00100000 20h
01000100 44h
Two Line Output Control
BecauseEPROMsareusuallyusedinlargermemory arrays, the product features a 2 line control
functionwhich accommodatesthe use of multiple
memory connection. The two line control function
allows:
a. the lowest possible memory power dissipation,
b. complete assurancethat output bus contention
will not occur.
Forthemostefficientuse ofthesetwocontrollines,
E should be decoded and used as the primary
deviceselectingfunction,while G shouldbe made
a common connection to all devices in the array
and connected to the READ line from the system
controlbus. This ensuresthat all deselectedmemory devices are in their low power standby mode
and that the output pins areonly active when data
is requiredfrom a particular memory device.
3/16
M27C4002
Table5. AC MeasurementConditions
High SpeedStandard
Input Rise and Fall Times
Input Pulse Voltages0 to 3V0.4Vto 2.4V
Input and Output Timing Ref. Voltages1.5V0.8V and 2V
Figure3. ACTestingInput Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
0.4V
2.0V
0.8V
AI01822
10ns
≤
Figure4. ACTestingLoad Circuit
1.3V
1N914
3.3kΩ
DEVICE
UNDER
TEST
C
CL= 30pF for High Speed
CL= 100pF for Standard
CLincludes JIG capacitance
L
≤
20ns
OUT
AI01823B
Table6. Capacitance
SymbolParameterTest ConditionMinMaxUnit
C
IN
C
OUT
Note: 1. Sampled only,not 100% tested.
SystemConsiderations
The power switching characteristicsof Advanced
CMOS EPROMsrequire careful decoupling of the
devices. The supply current, I
ments that are of interest to the system designer:
the standby currentlevel, the active current level,
and transientcurrent peaks that are produced by
thefalling and rising edgesof E. Themagnitudeof
the transient current peaks is dependent on the
output capacitive and inductiveloading of the device.
(1)
(TA=25°C, f = 1MHz )
Input CapacitanceVIN=0V6pF
Output CapacitanceV
=0V12pF
OUT
control and by properly selected decoupling capacitors. Itis recommendedthat a 0.1µF ceramic
capacitor be used on every device between V
, has three seg-
CC
andVSS. Thisshouldbea highfrequencycapacitor
of low inherent inductance and should be placed
as close to the device as possible. In addition, a
4.7µF bulk electrolytic capacitor should be used
betweenV
andVSSfor everyeight devices. The
CC
bulk capacitor should be located near the power
supply connection point.The purpose of the bulk
capacitoris to overcome the voltage drop caused
by the inductive effectsof PCBtraces.
The associated transient voltage peaks can be
suppressed by complying with the two line output
4/16
CC
M27C4002
Table7. Read Mode DC Characteristics
(1)
(TA=0 to 70 °C or –40 to 85 °C;VCC=5V±5% or 5V± 10%;VPP=VCC)
SymbolParameterTest ConditionMinMaxUnit
I
LI
I
LO
I
CC
I
CC1
I
CC2
I
PP
V
IL
V
IH
V
OL
V
OH
Notes: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after V
2. Maximum DC voltage on Output is VCC+0.5V.
Input Leakage Current0V ≤ VIN≤ V
Output LeakageCurrent0V≤V
E=V
= 0mA, f = 10MHz
I
Supply Current
OUT
E=V
I
= 0mA, f = 5MHz
OUT
Supply Current (Standby)TTLE = V
≤
OUT
,G=VIL,
IL
,G=VIL,
IL
IH
CC
V
CC
Supply Current (Standby)CMOSE > VCC–0.2V100
Program CurrentVPP=V
CC
Input Low Voltage–0.30.8V
(2)
Input High Voltage2VCC+1V
Output LowVoltageIOL= 2.1mA0.4V
Output HighVoltageTTLIOH= –400µA2.4V
Output High Voltage CMOSI
= –100µAV
OH
CC
– 0.7VV
PP.
±10µA
10
±
70mA
50mA
1mA
10µA
A
µ
A
µ
Table8A. Read ModeAC Characteristics
(1)
(TA=0 to 70 °C or –40 to 85 °C;VCC=5V±5% or 5V± 10%;VPP=VCC)
SymbolAltParameter
Test
Condition
-45
(3)
MinMaxMinMaxMinMaxMinMax
t
AVQV
t
ELQV
t
GLQV
(2)
t
EHQZ
(2)
t
GHQZ
t
AXQX
Notes: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after V
2. Sampled only, not 100% tested.
3. In case of 70ns speed see High Speed AC Measurement conditions.
Address Valid to
t
ACC
Output Valid
Chip Enable Low
t
CE
to Output Valid
Output Enable
t
OE
Low to Output Valid
Chip Enable High
t
DF
to Output Hi-Z
Output Enable
t
DF
High to Output Hi-Z
Address Transition
t
OH
to Output Transition
E=VIL,
G=V
G=V
E=V
G=V
E=V
E=VIL,
G=V
IL
IL
IL
IL
IL
IL
45608090ns
45608090ns
25304040ns
030030030030ns
030030030030ns
0000ns
-60
(3)
M27C4002
-80-90
PP.
Unit
5/16
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