M24256, M24128
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The memory behaves as a slave device in the I2C
protocol, with all memory operations synchronized
by the serial clock. Read and Write operations are
initiated by a START condition, gene rated by the
bus master. The START condition is followed by a
Device Select Code and RW
bit (as described in
Table 3), terminated by an acknowledge bit.
When writing data to the memory, the mem ory in-
serts an acknowledge bit during the 9
th
bit time,
following the bus master’s 8-bit transmission.
When data is read by the bus master, the bus
master acknowledges the receipt of the data byte
in the same way. Data transfers are terminated by
a STOP condition after an Ack for WRITE, and after a NoAck for READ.
Power On Reset: V
CC
Lock-Out Write Protect
In order to prevent data corruption and inadvertent
write operations during power up, a Power On Reset (POR) circuit is included. The internal reset is
held active until the V
CC
voltage has reached the
POR threshold value, and all operations are disabled – the device will not respond to any command. In the same way, when V
CC
drops from the
operating voltage, below the POR threshold value,
all operations are disabled and the device will not
respond to any com ma nd. A s table a nd v alid V
CC
must be applied before applying any logic signal.
SIGNAL DESCRIPTION
Serial Clock (SCL)
The SCL input pin is used to strobe all data in and
out of the memory. In applications where this line
is used by slaves to synchronize the bus to a slower clock, the master must have an open drain output, and a pull-up resistor must be connected from
the SCL line to V
CC
. (Figure 3 indicates how the
value of the pull-up res istor c an be calculated). In
most applications, though, this method of synchronization is not employed, and so the pull-up resis-
Figure 2A. DIP Connections
Note: 1. NC = Not Connected
SDAV
SS
SCL
WCNC
NC V
CC
NC
AI01883
M24256
M24128
1
2
3
4
8
7
6
5
Figure 2B. SO C on ne ct i on s
Note: 1. NC = Not Connected
1
AI01884
2
3
4
8
7
6
5
SDAV
SS
SCL
WCNC
NC V
CC
NC
M24256
M24128
Table 2. Absolute Maximum Ratings
1
Note: 1. Exc ept for the rating “Operating Temperature Ra nge”, stres ses above those listed in the Table “Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only, and operation of the device at these or any other conditions
above those indi cated in t he Operating sect i ons of thi s specifi cation i s not impl i ed. Exposure to Absolute M aximum Rating c onditions for extended periods may affect device reliability. Refer also to the ST SURE Program and other relevant quality documents.
2. MIL -STD-883C, 3015.7 (1 00 pF, 1500 Ω)
Symbol Parameter Value Unit
T
A
Ambient Operating Temperature –40 to 125 °C
T
STG
Storage Temperature –65 to 150 °C
T
LEAD
Lead Temperature during Soldering
PSDIP8: 10 sec
SO8: 40 sec
260
215
°C
V
IO
Input or Output range –0.6 to 6.5 V
V
CC
Supply Voltage –0.3 to 6.5 V
V
ESD
Electrostatic Discharge Voltage (Human Body model)
2
4000 V