SGS Thomson Microelectronics L6374FP, L6374DP Datasheet
INDUSTRIAL QUAD LINE DRIVER
FOUR INDEPENDENT LINE DRIVERS WITH
100 mAUP TO35VOUTPUTS
INPUT SIGNALS BETWEEN -7V AND +35V,
WITHPRESETTABLETHRESHOLD
PUSH-PULL OUTPUTS WITH THREE STATE
CONTROL AND TRUE ZERO CURRENT BETWEENV
CURRENT LIMITING ON EACH OUTPUT EFFECTIVE IN THE FULL ”GROUND TO V
OUTPUTVOLTAGERANGE
OUTPUT VOLTAGE CLAMP TO V
GROUND
OVERTEMPERATURE AND UNDERVOLTAGE PROTECTIONS
DIAGNOSTIC FOR OVERTEMPERATURE,
UNDERVOLTAGEAND OVERCURRENT
PRESETTABLE DELAY FOR OVERCURRENTDIAGNOSTIC
HIGH SPEED OPERATION: UP TO 300kHz
WITH 35VSWING
ANDGROUND
S
S
S AND TO
ADVANCE DATA
”
POWERDIP 16+2+2 SO 16+2+2
ORDERING NUMBER: L6374DP (POWERDIP16+2+2)
L6374FP (SO16+2+2)
DESCRIPTION
The L6374 is especiallydesignedto be used as a
line driver in industrial control systems based on
the 24V signal levels (IEC1131, 24VDC).
L6374
BLOCK DIAGRAM
December 1994
This is advanced information on a new product now in development orundergoing evaluation.Details are subject to change without notice.
1/13
L6374
ABSOLUTE MAXIMUM RATINGS
Symbol Pin Parameter Value Unit
S 1 Supply Voltage(t
V
Supply Voltage(DC) 40 V
ilog 12, 13 Logic Input Voltage (DC) -0.3 to 7 V
V
ilog Logic Input forced current, per pin ±1mA
I
i7, 8,
I
i ChannelInput Voltage - 7 to35 V
V
out 3, 4,
I
9, 10
17, 18
out OutputVoltage (forced, not resulting from an inductive
V
Channel Input Current (forced) ±2mA
Output Current (forced, apart from inductive load) ±100 mA
Output Current (forced, apart from inductive load)
same t
< 10ms
W
kick)
I
set 11 Setting pin forced current ±1mA
set Setting pin forced voltage -0.3 to 5 V
V
diag 14 External voltage -0.3 to 35 V
V
diag Externallyforced current -10 to 10 mA
I
C3 13 Voltage on the delay capacitor, externally forced -0.3 to 4.5 V
V
op Ambient temperature, operating range -25 to 85 °C
T
j Junction temperature, operatingrange (see
T
Overtemperature Protection)
T
stg Storage temperature -55 to 150 °C
< 10ms) 50 V
W
±1A
-0.3 to VS +0.3 V
-25 to 125 °C
PIN CONNECTION (Top view)
2/13
ELECTRICALCHARACTERISTICS (VS = 24V; Tj = -25 to 125°C; unless otherwise specified.)
DC OPERATION
Symbol Pin Parameter Test Condition Min. Typ. Max. Unit
S 1 Supply Voltage 10.8 35 V
V
sh UV UpperThreshold 9 10.8 V
V
ys1 UV Hysteresis 250 450 650 mV
H
qsc Quiescent Current Outputs Open 3 5 mA
I
ref 11 Input Comparators Reference
V
Voltage
I
ref
Sink/Source Current on
Reference Pin
th 7, 8,
V
il Input Low Level V
V
ih Input High Level V
V
i Input Voltage(Operative Range) -7 35 V
V
bias Input Bias Current 0 < Vi <VS -1 1 µA
I
ys2 Input ComparatorsHysteresis See Analog Inputs Sections 100 200 350 mV
H
h OVT Upper Threshold 170 °C
T
T OVT Hysteresis 20 °C
H
sc 3, 4,
I
on Internal Voltage Drop @ Rated
V
17,18
Comparator Threshold with
9, 10
External Bias
Current Limit Vi =-7toVS;Vout = 0 to VS; 110 200 300 mA
Current
I
lkg
in 12 Push-Pull Mode Request -0.2 0.8 V
V
Output 3-State Leakage Current V
3-State Mode Request 2 5.5 V
in Input Current V
I
dlkg 14 Diagnostic OutputLeakage Diagnostic Off; V
I
diag Diagnostic OutputVoltage Drop I
V
Reference pin Floating 1.05 1.25 1.35 V
V
= 0V -30 -20 -10 µA
ref
=5V 10 20 30 µA
V
ref
VS = 9 to 12V -0.2 2.0 V
S = 12 to 35V -0.2 5.0 V
V
Externally Biased -7 V
REF
REF
-0.2
Pin V
Floating -7 0.8 V
REF
Externally Biased V
REF
REF
35 V
+0.2
Pin V
i = -7V -1 -0.5 -0.1 mA
V
Iout = ±100mA; Sourced @ High
Floating 2 35 V
REF
400 600 mV
Output, Sunk @ Low Output
T
= 125°C
j
Same, T
out
i
diag
=25°C 250 400 mV
j
= 0 to V
S
-25 25 µA
=0V 10 25 µA
= 24V 5 µA
diag
=5mA 200 500 mV
L6374
V
AC OPERATION (VS = 10.8 to 35V; Tj = -25 to 125°C; I
= 100mA; unless otherwise specified; see
out
switchingwaveforms diagrams)
Symbol Pin Parameter Test Condition Min. Typ. Max. Unit
dr 7to4
t
8to3
df Delay Time on Falling Edge Rl to ground 500 1000 ns
t
r 3,4,
t
9to18
10to17
17, 18
f Fall Time Rl to ground 150 300 ns
t
Delay Time on Rising Edge R
l to ground 1000 1500 ns
to V
R
l
S
to V
R
l
S
500 1000 ns
1000 1500 ns
Rise Time Rl to ground 120 250 ns
to V
R
l
S
to V
R
l
S
120 250 ns
150 300 ns
3/13
L6374
THERMAL DATA
Symbol Parameter DIP20 SO20 Unit
th j-pin Thermal Resistance, Junction to Pin 12 17 °C/W
R
th j-amb1 Thermal Resistance, Junction to Ambient (see Thermal
R
R
th j-amb2 Thermal Resistance, Junction to Ambient (see Thermal
Characteristics)
Characteristics)
40 65 °C/W
50 80 °C/W
THERMAL CHARACTERISTICS
R
th j-pins
POWERDIP. The thermalresistanceis referred
to the thermalpath from thedissipatingregion
on the top surface of the siliconchip, to the
points alongthe four central pins of the package, at a distanceof 1.5 mm awayfrom the
stand-offs.
SO. Similarly, the referencepoint is the knee
on the four central pins, where the pins areupwardly bent and the solderingjoint with the
PCB footprintcan be made.
R
th j-amb1
If a dissipatingsurface, thick at least 35 µm,
and with a surfacesimilar or bigger thanthe
one shown, iscreated making use of the
printed circuit.
Figure1: Printed Heatsink
Such heatsinkingsurface isconsidered on the
bottom side of an horizontalPCB (worst case).
R
th j-amb2
If the power dissipatingpins (the four central
ones), as well as the others, have aminimum
thermalconnection with the externalworld
(very thin strips only) so thatthe dissipation
takesplace through still air and through the
PCB itself.
It is the same situationof pointabove, without
any heatsinkingsurface createdon purposeon
the board.
Additionaldata for the PowerDip package can be
foundin:
ApplicationNote 9030:
Thermal Characteristicsof the PowerDip
20,24PackagesSolderedon 1,2,3 oz.
CopperPCB
4/13
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