SGS Thomson Microelectronics L293DD, L293D Datasheet

PUSH-PULLFOUR CHANNEL DRIVER WITH DIODES

600mA OUTPUT CURRENT CAPABILITY
PER CHANNEL

1.2A PEAK OUTPUT CURRENT (non repeti­tive) PER CHANNEL

ENABLEFACILITY
OVERTEMPERATUREPROTECTION
LOGICAL ”0” INPUT VOLTAGE UP TO 1.5 V

(HIGH NOISE IMMUNITY)
INTERNALCLAMPDIODES

L293D

L293DD

SO(12+4+4) Powerdip (12+2+2)

DESCRIPTION

The Device is a monolithic integrated high volt­age, high current four channel driver designed to
accept standard DTL or TTL logic levels and drive
inductive loads (such as relays solenoides, DC
and stepping motors) and switching power tran­sistors.

To simplify use as two bridges each pair of chan­nels is equippedwith an enable input. A separate
supply input is provided for the logic, allowing op­eration at a lower voltage and internal clamp di­odes are included.

This device is suitable for use in switching appli­cations at frequenciesup to 5 kHz.

BLOCK DIAGRAM

ORDERING NUMBERS:

L293DD L293D

The L293D is assembled in a 16 lead plastic
packaage which has 4 center pins connected to­getherand usedfor heatsinking

The L293DD is assembled in a 20 lead surface
mount which has 8 center pins connected to­getherand usedfor heatsinking.

June 1996

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L293D - L293DD

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

V

S

V

SS

V

i

V

en

I

o

P

tot

T

stg,Tj

PIN CONNECTIONS (Top view)

Supply Voltage 36 V
Logic Supply Voltage 36 V
Input Voltage 7 V
Enable Voltage 7 V
Peak Output Current (100µs non repetitive) 1.2 A
Total Power Dissipation at T

=90°C4W

pins

Storage and Junction Temperature – 40 to 150

C

°

SO(12+4+4)

Powerdip(12+2+2)

THERMAL DATA

Symbol Decription DIP SO Unit

R

th j-pins

R

th j-amb

R

th j-case

(*) With 6sq. cm on board heatsink.

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Thermal Resistance Junction-pins max. – 14
Thermal Resistance junction-ambient max. 80 50 (*)
Thermal Resistance Junction-case max. 14 –

C/W

°

C/W

°

L293D - L293DD

ELECTRICAL CHARACTERISTICS

(for each channel, V

=24V, VSS= 5 V, T

S

=25°C, unless

amb

otherwise specified)

Symbol Parameter Test Conditions Min. Typ. Max. Unit

V

S

V

SS

I

S

I

SS

V

IL

V

IH

I

IL

I

IH

V

en L

V

en H

I

en L

I

en H

V

CE(sat)H

V

CE(sat)L

V

F

t

r

t

f

t

on

t

off

(*) See fig. 1.

Supply Voltage (pin 10) V

SS

Logic Supply Voltage (pin 20) 4.5 36 V
Total Quiescent Supply Current

(pin 10)

Total Quiescent Logic Supply
Current (pin 20)

Input Low Voltage (pin2, 9, 12,

Vi=L; IO=0; Ven=H 2 6 mA

=H; IO=0; Ven= H 16 24 mA

V

i

=L 4 mA

V

en

Vi=L; IO=0; Ven= H 44 60 mA

=H; IO=0; Ven= H 16 22 mA

V

i

= L 16 24 mA

V

en

– 0.3 1.5 V

19)
Input High Voltage (pin 2, 9,

12, 19)
Low Voltage Input Current(pin

7 V 2.3 V

V

≤

SS

> 7 V 2.3 7 V

V

SS

VIL= 1.5 V – 10 µA

2, 9, 12, 19)
High Voltage Input Current (pin

2.3 V ≤ VIH≤ VSS– 0.6 V 30 100 µA

2, 9, 12, 19)
Enable Low Voltage

– 0.3 1.5 V

(pin 1, 11)
Enable High Voltage

(pin 1, 11)
Low Voltage Enable Current

VSS≤ 7 V 2.3 V

> 7 V 2.3 7 V

V

SS

V

= 1.5 V – 30 – 100 µA

en L

(pin 1, 11)
High Voltage Enable Current

2.3 V ≤ V

≤ VSS– 0.6V ± 10 µA

en H

(pin 1, 11)
Source Output Saturation

IO= – 0.6A 1.4 1.8 V

Voltage (pins 3, 8, 13, 18)
Sink Output Saturation Voltage

IO= + 0.6 A 1.2 1.8 V

(pins 3, 8, 13, 18)
Clamp Diode Forward Voltage IO= 600nA 1.3 V
Rise Time (*) 0.1 to 0.9 V
Fall Time (*) 0.9 to 0.1 V

O
O

Turn-on Delay (*) 0.5 Vito 0.5 V
Turn-off Delay (*) 0.5 Vito 0.5 V

O
O

250 ns
250 ns
750 ns
200 ns

36 V

SS

SS

V

V

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L293D - L293DD

TRUTH TABLE(one channel)

Input Enable (*) Output

H

L

H

L

Z = High output impedance
(*) Relative to the considered channel

Figure 2:

Junctionto ambient thermal resistance vs. area on board heatsink(SO12+4+4package)

H
H

L
L

Figure1:

H

L
Z
Z

SwitchingTimes

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POWERDIP16PACKAGE MECHANICAL DATA

L293D - L293DD

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

a1 0.51 0.020

B 0.85 1.40 0.033 0.055

b 0.50 0.020

b1 0.38 0.50 0.015 0.020

D 20.0 0.787

E 8.80 0.346

e 2.54 0.100

e3 17.78 0.700

F 7.10 0.280

I 5.10 0.201

L 3.30 0.130

Z 1.27 0.050

mm inch

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L293D - L293DD

SO20 PACKAGEMECHANICAL DATA

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A 2.65 0.104
a1 0.1 0.2 0.004 0.008
a2 2.45 0.096

b 0.35 0.49 0.014 0.019
b1 0.23 0.32 0.009 0.013

C 0.5 0.020
c1 45 1.772

D 1 12.6 0.039 0.496

E 10 10.65 0.394 0.419

e 1.27 0.050
e3 11.43 0.450

F 1 7.4 0.039 0.291

G 8.8 9.15 0.346 0.360

L 0.5 1.27 0.020 0.050

M 0.75 0.030

mm inch

S8°(max.)

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L293D - L293DD

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are notauthorized foruse as criticalcomponentsin lifesupportdevicesor systemswithout express
written approval of SGS-THOMSON Microelectronics.

 1996SGS-THOMSON Microelectronics – Printedin Italy – All Rights Reserved

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