Datasheet EF6805U3 Datasheet (SGS Thomson Microelectronics)

8-BIT MICROCOMPUTER UNIT
HARDWAR E FEATU RES DESCRIPTI O N
.32 TTL/CMOSCOMPATIBLE I/O LINES
.24 BIDIRECTIONAL (8 lines are LED compati-
ble)
.8 INPUT-ONLY
.3776 BYTES OF USER ROM
.SELF-CHECK MODE
.ZERO-CROSSINGDETECT/INTERRUPT
.INTERNAL 8-BIT TIMER WITH 7-BIT SOFT-
WARE PROGRAMMABLE PRESCALER AND CLOCKSOURCE
The EF6805U3 Microcomputer Unit (MCU) is a member of the 6805 Family of low-costsingle-chip Microcomputers. The 8-bit microcomputer contains a CPU, on-chip CLOCK, ROM, RAM, I/O, and TI­MER.It is designed for the userwho needs an eco­nomical microcomputer withtheproven capabilities of the 6800-based instruction set. A comparison of thekey featuresofseveral members ofthe 6805Fa­mily of Microcomputers is shown at the end of this data sheet.The following are someof the hardware and softwarehighlights of the EF6805U3 MCU.
.5V SINGLE SUPPLY
SOFTWARE FEATURES
.10 POWERFUL ADDRESSINGMODES
.BYTE EFFICIENT INSTRUCTION SET WITH
TRUE BIT MANIPULATION, BIT TEST, AND BRANCHINSTRUCTIONS
.SINGLE INSTRUCTION MEMORY EXA-
MINE/CHANGE
.POWERFUL INDEXED ADDRESSING FOR
TABLES
.FULL SET OF CONDITIONALBRANCHES
.MEMORYUSABLE AS REGISTER/FLAGS
.COMPLETE DEVELOPMENT SYSTEM SUP-
PORTON INICE
USER SELECTAB LE OPTIONS
PIN CONNECTIONS
.8 BIDIRECTIONAL I/O LINES WITH TTL OR
TTL/CMOSINTERFACE OPTION
.8 BIDIRECTIONALI/O LINES WITHTTL ORO-
PEN-DRAIN INTERFACEOPTION
.CRYSTALOR LOW-COST RESISTOR OSCIL-
LATOROPTION
.LOWVOLTAGE INHIBIT OPTION
.VECTORED INTERRUPTS : TIMER, SOFT-
WARE, AND EXTERNAL
.USER CALLABLE SELF-CHECK SUBROU-
TINES
EF6805U3
1
P
(PDIP40)
FN
(PLCC44)
March1989
1/31
EF6805U3
Figure 1 : EF6805U3 HMOS Microcomputer BlockDiagram.
ABSOLUTEMAXIMUM RATINGS
Symbol Parameter Value Unit
V
CC
V
in
Supply Voltage – 0.3 to + 7.0 V Input Voltage (except TIMER in self-check mode and
– 0.3 to + 7.0 V
open-drain inputs)
V
in
T
A
T
stg
T
This device contains circuitry to protect the inputs against damage due to high static voltages or electrical fields, however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation it is recommended that Vinand V hanced if unused inputs except EXTAL are tied to an appropriate logic voltage level (e.g., either VSSor VCC).
Input Voltage (open-drain pins, TIMER pin in self-check mode) – 0.3 to + 15.0 V Operating Temperature Range
(T
to TH)
L
VSuffix TSuffix
0to+70
–40to+85
– 40 to + 105 Storage Temperature Range – 55 to + 150 °C Junction Temperature
j
Plastic Package PLCC
be constrained to the range VSS(Vinor V
out
150 150
. Reliability of operation is en-
out)VCC
°C
°C
THERMALDATA
θ
JA
Thermal Resistance
Plastic PLCC
50 80
°C/W
2/31
EF6805U3
POW ER CO NSIDE R ATIONS
Theaverage chip-junctiontemperature,TJ, inCcan be obtainedfrom : TJ=TA+(PD.JA) (1) Where : TA= AmbientTemperature, C JA=Package ThermalResistance,Junction-to-Am­bient,C/W PD=P
INT+PPORT
P
INT=ICCxVCC
P
= Port Power Dissipation, Watts - User De-
PORT
, Watts - Chip Internal Power
termined For most applications P
glected. P
maybecomesignificant if thedevice
PORT
PORTPINT
and can be ne-
is configured to drive Darlington bases or sink LED loads.
An approximate relationship between PDandTJ(if P
is neglected) is :
PORT
PD=K+(TJ+273C) (2) Solving equations 1 and2 forK gives : K=PD.(TA+273C) + JA.P
2
(3)
D
Where K is a constant pertaining to the particular part.K can be determined from equation 3 bymea­suring PD(atequilibrium) for a known TA. Usingthis valueof K the values of PDandTJcanbe obtained by solving equations (1) and (2) iteratively for any valueof TA.
ELECTRICAL CHARACTERISTICS(VCC= + 5.25Vdc ± 0.5Vdc, VSS= 0Vdc, TA=TLto THunless otherwise noted)
Symbol Parameter Min. Typ. Max. Unit
V
IH
V
IH
V
IL
V
IRES +
V
IRES –
V
INT
P
D
C
in
V
LVR
VL
I
in
* Due to internal biasing this input (when unused) floats to approximately 2.2V.
Input High Voltage
RESET (4.75 V
(VCC< 4.75)
INT (4.75 V
(VCC< 4.75)
All Other (except timer)
CC
5.75)
CC
5.75)
4.0 – 0.5
V
CC
4.0
V
– 0.5
CC
2.0
Input High Voltage Timer
Timer Mode Self-check Mode
2.0
9.0 10.0
Input Low Voltage
RESET INT All Other
V
SS
V
SS
V
SS
RESET Hystereris Voltages (see figures 10, 11 and 12)
”Out of Reset” ”Into Reset”
INT Zero Crossing Input Voltage, Through a
2.1
0.8
24V
Capacitor Power Dissipation - (no port loading, VCC= 5.75V)
TA=0°C
TA=–40°C
520 580
Input Capacitance
EXTAL All Other
25
10 Low Voltage Recover 4.75 V Low Voltage Inhibit 2.75 3.75 4.70 V
VI
Input Current
TIMER (V INT (Vin= 2.4V to VCC) EXTAL (V
= 0.4V)
in
= 2.4V to VCC- crystal option)
in
20
(Vin= 0.4V - crystal option)
RESET (Vin= 0.8V) - External Capacitor Charging
– 40.0
Current
V V V V V
V
CC
15.0
0.8
1.5
0.8
4.0
2.0
740 800
20 50 10
– 1600
–40
CC CC CC CC CC
+ 1.0
V
V
V
V
ac p-p
mW
pF
µA
3/31
EF6805U3
SWITCHING CHARACTERISTICS
(VCC= + 5.25Vdc ± 0.5Vdc, VSS= 0Vdc, TA=TLto THunless otherwise noted)
Symbol Parameter Min. Typ. Max. Unit
f
osc
t
cyc
t
WL,tWH
t
RWL
f
INT
PORT ELECTRICAL CHARACTERISTICS
(VCC= + 5.25Vdc ± 0.5Vdc, VSS= 0Vdc, TA=TLto THunless otherwise noted) PORT A WITH CMOS DRIVEENABLED
Symbol Parameter Min. Typ. Max. Unit
V
OL
V
OH
V
IH
V
IL
I
IH
I
IL
Oscillator Frequency 0.4 4.2 MHz Cycle Time (4/f INT, INT2, and TIMER Pulse Width (see interrupt
) 0.95 10 µs
osc
t
+ 250 ns
cyc
section) RESET Pulse Width t
+ 250 ns
cyc
INT Zero-crossing Detection Input Frequency 0.03 1 kHz External Clock Input Duty Cycle (EXTAL) 40 50 60 % Crystal Oscillator Start-up Time* 100 ms
Output Low Voltage (I
= 1.6mA) 0.4 V
Load
Output High Voltage
I
= – 100µ A
Load
I
=– 10µA
Load
Input High Voltage (I Input Low Voltage (I
= – 300µA max.) 2.0 V
Loa d
= – 500µA max.) V
Load
2.4
VCC– 1.0
SS
CC
0.8 V High Z State Input Current (Vin= 2.0V to VCC) – 300 µA High Z State Input Current (Vin= 0.4V) – 500 µA
V
V
PORT B
Symbol Parameter Min. Typ. Max. Unit
V
OL
V
OH
I
OH
V
IH
V
IL
I
TSI
Output Low Voltage
I
= 3.2mA
Loa d
I
= 10mA (sink)
Loa d
Output High Voltage I
=– 200µA 2.4 V
Load
0.4
1.0
Darlington Current Drive (source) VO= 1.5V – 1.0 – 10 mA Input High Voltage 2.0 V Input Low Voltage V
SS
CC
0.8 V High Z State Input Current < 2 10 µA
PORT C AND PORT A WITH CMOS DRIVE DISABLED
Symbol Parameter Min. Typ. Max. Unit
V
OL
V
OH
V
IH
V
IL
I
TSI
Output Low Voltage I Output High Voltage I Input High Voltage 2.0 V Input Low Voltage V
= 1.6mA 0.4 V
Load
= – 100µA 2.4 V
Load
CC
SS
0.8 V High Z State Input Current < 2 10 µs
V
V
V
4/31
EF6805U3
Figure 2 : TTL Equivalent Test Load (port B). Figure3 :CMOS Equivalent Test Load (port A).
Figure 4 : TTL Equivalent Test Load (port A
andC).
SIGNAL DESCRIPTION
The input and output signals for theMCU,shown in figure 1, are described in the following paragraphs.
VCCANDVSS-Power is supplied to the MCU using thesetwopins. VCCispower and VSSis the ground connection.
INT - This pin provides the capability for asynchro­nously applying an external interrupt to the MCU. Refer to Interrupts Section for additional informa­tion.
XTALAND EXTAL - These pins provide controlin­put for theon-chip clockoscillator circuit. A crystal, a resistor, or an external signal, depending on user selectable manufacturing mask option, can be connected to these pins to provide a system clock withvariousdegreesof stability/costtradeoffs.Lead
Figure 5 : Open-drain Equivalent Test Load (port C).
length and stray capacitance on these two pins should be minimized. Refer to InternalClock Gen­erator Options Section for recommendations about these inputs.
NOTE : Pin 7 in DIL package/pin 8 in PLCC package is connected to internal protection.
TIMER- The pinallowsan externalinputto be used to control the internal timer circuitry and also to ini­tiatetheselftestprogram. Referto TimerSection for additional information about the timer circuitry.
RESET - This pin allows resetting of the MCU at times other than the automatic resetting capability already in the MCU. The MCUcan be resetby pul­ling RESET low. Refer to Resets Section for addi­tionalinformation.
5/31
EF6805U3
INPUT/OUTPUTLINES(PA0-PA7, PB0-PB7,PC0­PC7, PD0-PD7) - These32 liens arearranged into four 8-bit ports (A, B, C, and D). Ports A, B, and C areprogrammable as eitherinputs oroutputs under software control of the data direction registers (DDRs).Port D is for digital input only and bit 6 may be used for a second interrupt INT2. Refer to In­put/OutputSectionand Interrupts Section for addi­tional information.
MEMORY-TheMCUiscapable ofaddressing4096 bytes of memory and I/O registers with its program counter. The EF6805U3 MCU has implemented 4090 of these bytes. This consists of : 3776 user ROM bytes, 192 self-check ROM bytes, 112 user RAM bytes, 7 portI/O bytes, 2 timerregisters, and a miscellaneous register ; see figure 6 for the Ad­dress map. The user ROM has been split into two areas. The main user ROM area is from $080 to $F37. The last 8 userROM locationsat the bottom of memory are for the interrupt vectors.
Figure 6 : EF6805U3 MCU Address Map.
TheMCUreservesthefirst-16memorylocationsfor I/O features, of which 10 have been implemented. These locations are used for the ports, the port DDRs,the timer and the INT2miscellaneous regis­ter, and the 112 RAM bytes, 31 bytes are shared with the stack area. The stack must be used with carewhen data shares thestack area. Thesharedstackareaisusedduringtheprocessing of an interrupt or subroutine calls to save the contents of the CPUstate. The register contents are pushed onto the stack in the order shown in figure
7. Since the stack pointer decrements during pushes, the low order byte (PCL) of the program counter is stackedfirst, then the high order fourbits (PCH)are stacked.This ensures that the program counter is loaded correctly during pulls from the stack since the stack pointer increments when it pulls data from the stack. A subroutine call results in only the program counter (PCL, PCH) contents beingpushed onto thestack ;theremaining CPUre­gistersare not pushed.
* Caution : Data direction registers (DDRs) are write only, they read as $FF.
6/31
EF6805U3
Figure 6 : Interrupt Stacking Order.
CENTRAL P ROC ESSIN G U NI T
The CPU of theEF6805 Family is implemented in­dependently from the I/O or memory configuration.
Figure 8 : Programming Model.
Consequently, it can be treated as an independent central processor communicating with I/O and me­mory via internal address, data, and control buses.
REGISTERS
The 6805 FamilyCPUhasfiveregistersavailable to the programmer. Theyareshowninfigure8 andare explained in the following paragraphs.
ACCUMULATOR(A)-Theaccumulatoris ageneral purpose 8-bitregisterusedto holdoperandsandre­sults of arithmetic calculations or data manupula­tions.
INDEX REGISTER(X) - The index register is an 8­bit register usedfor the indexed addressing mode. It contains an 6-bit value that may be added to an instruction value tocreate aneffectiveaddress. The indexregister can also be used for data manipula­tions using the read-modify-write instructions. The Index Register may also be used as a temporary storagearea.
PROGRAMCOUNTER (PC) - The Program Coun­ter is a 12 bit registerthat contains th address of the next instructionto be executed.
STACK POINTER(SP) - The stackpointer is a 12­bitregisterthatcontains the address of thenextfree location on the stack. During an MCU reset or the resetstackpointer(RSP)instruction, thestackpoin­ter is set to location$07F. The stackpointer is then decremented as data is pushed onto the stack and incremented asdata is then pulled from the stack. The seven most significant bits of the stack pointer are permanently set to 0000011. Subroutines and
interrupts maybe nested down tolocation $061(31 bytes maximum) which allows the programmer to use up to 15 levelsof subroutine calls (less if inter­rupts are allowed).
CONDITIONCODE REGISTER(CC) - The condi­tioncoderegisterisa5-bitregisterin whichfoourbits areusedto indicate theresultsof the instructionjust executed. Thesebitscan be individually tested by a program andspecificactiontakenasaresult oftheir state. Each bit is explained in the following para­graphs.
7/31
EF6805U3
HalfCarry(H) -Setduring ADDandADCoperations to indicate that a carry occurred betweenbits3 and
4. Interrupt(I) - Whenthisbitis set, the timeran exter-
nalinterrupts(INTandINT2)are masked(disabled). Ifaninterruptoccurswhile thisbitisset,the interrupt is latchedandis processed as soonas the interrupt bitis cleared.
Negative (N) - When set, this bit indicatesthat the resultof the last arithmetic,logical, or data manipu­lationwasnegative (bit7intheresultisalogical ”1”).
Zero (Z) - When set,this bit indicates thatthe result of the last arithmetic, logical, or data manipulation waszero.
Carry/Borrow (C) - When set, this bit indicates that a carry or borrow ou of the Arithmetic Logic Unit (ALU)occurred during thelast arithmetic operation. Thisbitisalso affected during bit test and branch in­structions plus shifts and rotates.
TIM ER
The timercircuitry for theEF6805U3is shown infig­ure 10. The timer contains a single 8-bit software programmable counter with a 7-bit software selec­table prescaler. The counter may be preset under program control and decrements toward zero. When the counterdecrements to zero, the timerin­terrupt request bit, i.e., bit 7 of the timer control re­gister(TCR),is set. Thenif the timer interrupt is not masked, i.e.,bit 6 of the TCR and the I bit in the conditioncoderegister arebothcleared, the proces­sorreceivesaninterrupt.Aftercompletionofthecur­rentinstruction,the processor proceeds tostore the appropriate registers on the stack,and thenfetches the timer interrupt vector from locations $FF8 and $FF9 inorder to begin servicing the interrupt.
Thecountercontinuestocountafterit reaches zero, allowing the softwaretodetermine the number ofin­ternalor external input clocks since the timer inter­rupt request bit was set.The counter may be read at any time by the processor without disturbing the count. The contents of the counter become stable priortothereadportionofacycleanddonotchange during the read. The timer interrupt request bit re­mains setuntil cleared by the software. If awrite oc­cursbeforethe timerinterrup issericed, theinterrupt is lost.TCR7 may also be used as a scanned status bitin a non-interrupt mode of operation (TCR6 = 1).
The prescaler is a 7-bit divider which is usedto ex­tend the maximum length of the timer. Bit 0, bit 1, andbit 2 of theTCR areprogrammed to choosethe appropriate prescaler outptu which is used as the counter input. The processor cannot writ eijto or
read from the prescaler ; however, its contentsare cleared to all zeros by the write operation into TCR when bit 3 of thewritten data equals one, which al­lows for truncation-free counting.
The timerinput canbe configured for threedifferent operating modes, plus a disable mode, depending on the value writtento the TCR4 and TCR5 control bits. For further information seefigure 9.
Timer Input Mode 1 - If TCR5 adn TCR4 are both programmed to a zero, the inpt to thetimer is from an internal clock and the external TIMER inputisdi­sabled.The internal clock mode canbe used for pe­riodic interrupt generation, as well as a referene in frequency and event measurement. The internal clockis the instruction cycle clock.
Timer Input Mode 2 - With TCR5 = 0 and TCR4 = 1, theinternalclockandtheTIMERinputpinareAN­Ded toform the timerinput signal. Thismodecanbe usedtomeasure externalpulse widths.Theexternal timer input pulse simply turns on the internal clock for the duration of the pulse widths.
TimerInputMode3 - IfTCR5=1andTCR4=0,then all inputs tothe timer are disabled.
Timer InputMode4-If TCR5= 1 and TCR4=1,the internal clock input to the timer is disabled and the TIMERinput pinbecomes theinput to thetimer.The external TIMER pin can, in this mode, be used to count external events as well as external frequen­cies for generating periodic interrupts. TCR7 - TimerInterruptRequest Bit :
76543210
TCR7TCR6 TCR5 TCR4 TCR3 TCR2 TCR1 TCR0$009
* Write only (read as zero).
1 - Set when TDR goes to zero, or under pro­gramcontrol 0 - Clearedon external Reset,Power-On-Re­set,or under ProgramControl.
TCR6 - Timer Interrupt Mask Bit :
1 - Timer Interrupt masked (disabled) Set on external Reset, Power-On-Reset, or under Program Control 0 - Clearedunder Program Control.
TCR5 - External or Internal ClockSource Bit:
1 - External Clock Source. Set on externalRe­set, Power-On-Reset, or under Program Control 0 - Clearedunder Program Control.
TCR4 - External Enable Bit :
1 - Enable external TIMERpin.Set on external Reset, Poxer-On-Reset, or under Program
8/31
EF6805U3
Control. 0 - Clearedunder Program Control.
TCR3 - Timer prescaler reset bit : Aread of TCR3
TCR5 TCR4 Result
0 0
1 1
0
Internal Clock to Timer
1
AND of Internal Clock and TIMER Pin to Timer
0
Input to timer disabled.
1
TIMER Pin to Timer
always indicates a zero.
1 - Set on externalReset, Power-On-Reset or under Program Control. 0 - Clearedunder Program Control
Figure 10 : Timer Block Diagram.
TCR2 , TCR1, and TCR0 - Prescaler address bits : 1 - All set on external Reset, Power-On-Reset or under Program Control. 0 - Cleared under Program Control.
Figure9 : Timer Control Register (TCR).
TCR2 TCR1 TCR0 Result
0
0
0
1
0
0
0
1
0
1
1
0
TCR2 TCR1 TCR0 Result
+1 +2 +4 +8
0
1
0
1
1
1
1
1
0 1 0 1
+16 +32 +64
+128
Notes : 1. Prescaler and8-bit counter are clockedon thefailingedgeof the internal clock (AS)or external input.
SELF-CHECK - The self-check capability of the EF6805U3 MCU provides an internal check to de­termineifthepart isfunctional.Connect theMCU as shownin figure 11 and monitorthe output of Port C bit 3 for an oscillation of approximately 7Hz. A 10­volt level(through a 10k resistor) on thetimer input, pin 8 and pressing then releasing the RESET but­ton, energizes the ROM-based self-check feature. The self-check program exercices the RAM, ROM, TIMER, interrupts, and I/O ports.
Several of the self-checksubroutines can be called by a user program with a JSR or BSR instruction. TheyaretheRAM,ROM.Thetimerroutinemayalso be called ifthe timer input is the internal2 clock.
2. Counter is written toduring dat strobe(DS) and counts down continuously.
To call those subroutines in customer application, please contact your local SGS-THOMSON Micro­electronics sales office in order to obtain the complete description of the self-check program and the entrance/exit conditions.
RAMSELF-CHECKSUBROUTINE- TheRAM self­checkis calledat location $F84 andreturnswiththe Z bit clear if any error is detected ; otherwise the Z bit is set.The RAM test causes each byte to count from0 upto 0 again with a check after each count.
The RAM test must be called with the stack pointer at $07F and A= 0. Whenrun,thetest checks every RAM cell except for $07F and $07E which are as­sumedto containthe return address.
9/31
EF6805U3
The A and X registersandallRAM locations except $07F and $07E are modified.
ROM CHECKSUM SUBROUTINE - The ROM self­check is called at location $F95. The A register should be cleared before calling the routine. If any error is detected, it returns with the Z bit cleared ;
Figure 11 : Self-check Connections.
otherwise Z= 1, X = 0 on return,and A is zero if the testpasses. RAM location $040to $043 is overwrit­ten.The checksumisthecomplement of theexecu­tionOR ofthe contents of the user ROM.
* This connection depends on clock oscillator user selectable mask option. Use jumper if the RC mask option is selected.
LED MEANINGS
PC0 PC1 PC2 PC3
1
0
1
0
Bad I/O
0
0
1
0
Bad Timer
1
1
0
0
Bad RAM
0
1
0
0
Bad ROM
0
0
0
0
Bad Interrupts or RequestFlag
All Flashing Good Device
10/31
Remarks
(1 : LED ON ; 0 : LED OFF)
EF6805U3
TIMER SELF-CHECK SUBROUTINE - The timer self-checkiscalledatlocation $F6Dandreturnswith the Z bit cleared if any error was found ; otherwise Z=1.
In order to work correctly as a user subroutine, the internal 2 clock mustbe the clockingsourceandin­terrupts must be disabled. Also,on exit, the clock is runningandtheinterruptmaskisnotsetsothecaller mustprotect from interrupts if necessary.
The Aand X register contentsare lost.This routine sets the prescaler for divide-by-128 and the timer data register iscleared. TheXregister isconfigured to count down the same as thetimer data register. The tworegisters are then compared every128 cy­cles until they both count down to zero. Any mis­matchduringthe countdownisconsideredasaner­ror. The A and X registers are cleared on exitfrom the routine.
Figure 12 : TypicalReset SchmittTrigger Hysteresis.
RESET
The MCU can be reset three ways: by initial powe­rup, by the external reset input (RESET) and by an optional internal low-voltage detect circuit. The RE­SETinput consistsmainlyofa Schmitttriggerwhich senses the RESET line logic level. A typicalreset Schmitt trigger hysteresis curve is shown in figure
12. The Schmitt trigger provides an internal reset voltageifit sensesa logicalzeroontheRESET pin. Power-On Reset (POR) - Aninternal reset is gene­rated upon powerup that allows the internal clock generator to stabilize. A delay of t
milliseconds
RHL
is required before allowing the RESET input to go high. Refer to the power and reset timing diagram of figure 13. Connecting a capacitor to the RESET input (as illustrated in figure 14) typically provides sufficient delay.During powerup,the Schmitt trigger switcheson (removes reset) when RESET risesto V
.
IRES+
Figure 13 : Power and Reset Timing.
11/31
EF6805U3
Figure 14 : RESET Configuration.
ExternalReset Input - TheMCU willbereset if a lo­gicalzero is applied to the RESETinput fora period longerthanone machinecycle(t of reset, the Schmitttrigger switchesoffat V
).Underthistype
cyc
IRES-
to
provide an internal reset voltage. Low-Voltage Inhibit (LVI)-The optional low-voltage
detectioncircuitcausesa reset of theMCUif the po­wer supply voltage falls below a certain level (V
LVI
Theonly requirement isthatVCCremainsat orbelow the V
threshold for one t
LVI
minimum. In typical
cyc
applications, the VCCbus filter capacitor will elimi­nate negative-going voltage glitches of less than onet
. The output from thelow-voltage detectoris
cyc
connecteddirectly totheinternalresetcircuitry.Ital­so forces the RESET pin low via a strongdischarge devicethrough a resistor.The internal reset will be removed once thepowersupply voltagerisesabove a recoverylevel (V
), at which time a normal po-
LVR
wer-on-reset occurs.
INTERNA L C LO C K GENERATOR O PTIO N S
Theinternalclockgeneratorcircuitisdesignedtore­quirea minimum of externalcomponents. Acrystal, a resistor, a jumper wire, or an external signal may be usedtogenerate a systemclock withvarioussta­bility/costtradeoffs. Theoscillatorfrequency isinter­nallydivided by four to produce the internal system clocks.A manufacturing mask option is usedto se­lect crystalor resistor operation.
The differentconnection methods are shown in fig­ure 15. Crystal specifications and suggested PC board layouts are given in figure 16. A resistor se­lectiongraph is given in figure 17.
The crystal oscillator start-up time is a function of manyvariables: crystalparameters (especially RS), oscillator load capacitances, IC parameters, am­bient temperature, and supply voltage. To ensure
).
rapid oscillator start up, neither the crystal charac­teristics nor the load capacitances should exceed recommendations.
When utilizing the on-board oscillator, the MCU shouldremain ina resetcondition (reset pin voltage belowV
) untilthe oscillator hasstabilizedat its
IRES+
operating frequency. Several factorsareinvolved in calculating the external reset capacitor required to satisfythis condition ; the oscillatorstart-up voltage, theoscillatorstabilization time,theminimumV and the reset charging current specification.
OnceVCCminimum isreached,the externalRESET capacitor willbeginto chargeataratedependent on thecapacitorvalue.Thechargingcurrent issupplied from VCCthrougha large resistor, so itappears al­most like a constant current source until the reset voltage rises above V
. Therefore, the RESET
IRES+
pin will charge at approximately : (V
IRES+
).C
ext=IRES.tRHL
Assumingthe external capacitor is initially dischar­ged.
IRES+
,
12/31
Figure 15 : Clock Generator Options.
EF6805U3
Note : The recommended CL value with a 4.0 MHz crystal is 27pF, maximum, including system distributed capacitance. There is an inter­nal capacitance of approximately 25pF on the XTAL pin. For crystal frequencies other than 4MHz, the total capacitance on each pin should be scaled as the inverse of the frquency ratio. For example, with a 2MHz crystal, use approximately 50pF on EXTAL and approxi­mately 25pF on XTAL. The exact value depends on the Motional-Arm parameters of the crystal used.
Figure 16 : CrystalMotional ARM parameters and Suggested PC Board layout.
13/31
EF6805U3
Figure 17 : TypicalFrequency Selection for resistor(oscillator option).
INTERRU PT S
The microcomputers can be interrupted four diffe­rentways: through the external interrupt (INT)input pin, the internal timerinterrupt request, theexternal portDbit6(INT2) inputpin,orthesoftwareinterrupt instruction (SWI). When any interrupt occurs : the current instruction (including SWI) is completed, processing is suspended, the present CPU state is pushed onto the stack, the interrupt bit (I) in the condition code registeris set,the address of the in­terrupt routine is obtained from the appropriate in­terrupt vector address, and the interrupt routine is executed. Stacking the CPU register, setting the I bit, and vectorfetching require a total of 11 t
cyc
pe­riodsfor completion. A flowchart of the interrupt se­quence isshown in figure 18. Theinterrupt service routine must end with a return from interrupt (RTI)
instructionwhichallowsthe MCUtoresume proces­sing of the program prior to the interrupt (by uns­tacking the previous CPU state). Unlike RESET, hardware interrupts do not cause the current in­structionexecution to be halted, but are considered pending until the current instruction execution is complete.
When the current instruction is complete, the pro­cessor checks all pending hardware interrupts and if unmasked, proceeds with interrupt processing ; otherwise thenextinstruction is fetchedand execu­ted.Note thatmasked interrupts arelatchedforlater interrupt service.
If both anexternal interrupt and atimerinterrupt are pending at the end of an instruction execution, the external interrupt is serviced first. The SWI is exe­cuted as any other instruction.
14/31
Figure 18 : RESET and interrupt Processing Flowchard.
EF6805U3
NOTE
ThetimerandINT2interrupts sharethesamevector address. The interrupt routine must determine the sourceby examiningtheinterrupt request bits(TCR b7 and MR b7). Both TCR b7 and MR b7 can only be written to zero by software.
The external interrupt, INT and INT2, are synchro­nizedand then latched onthe falling edge of the in­put signal. The INT2 interrupt has an interrupt re­questbit (bit 7) and a maskbit (bit 6) located in the miscellaneous register (MR). The INT2 interrupt is inhibited when the mask bit is set. The INT2 is al­waysreadasadigital inputon portD.The INT2 and timerinterruprequests bits, if set,causetheMCUto
process an interruptwhen the conditioncode I bitis clear.
A sinuoidalinputsignal (f
maximum)canbe used
INT
to generate an external interruptfor use as a zero­crossingdetector.This allows applications such as servicingtime-of-day routines and engaging/disen­gagingac powercontrol devices. Off-chipfull wave rectificationprovidesaninterrupt at everyzerocros­singofthe acsignal andthereby provides a 2f clock. Seefigure 19.
NOTE
The INT (pin 3) is internally biasedat approximately
2.2Vdue to the internalzero-crossing detection.
15/31
EF6805U3
A softwareinterrupt (SWI) is an executable instruc­tion whichis executed regardless of thestate of the I bit in the condition code register. SWIs areusually
Figure 19 : TypicalInterrupt Circuits.
used as break-points for debugging or a system calls.
INPUT/OUTPUT CIRCUITRY
There are 32 input/output pins. TheINT pin may be polledwith branchinstructions toprovide anadditio­nal input pin. All pins on ports A,B, and C are pro­grammable as either inputs or outputs under soft­warecontrol of the corresponding data direction re­gister (DDR). See below I/O port control registers configuration. The port I/O programming is ac­complished by writing the corresponding bit in the portDDR to a logic one foroutputor a logiczerofor input.On reset allthe DDRs are initialized to a logic zero state,placing the portsin the input mode. The portoutput registers are not initialized on reset and should be initializedbysoftwarebeforechanging the DDRs from input to output. A read operation on a portprogrammed asanoutput willreadthecontents of the output latch regardless of the logic levels at the output pin, due to outputloading. Referto figure
20.
PORT DATA REGISTER
70
PortA Addr= $000 PortB Addr= $001 PortC Addr = $002 PortD Addr = $003
PORT DAT A DIREC TIO N REGISTER (DDR )
70
(1) Writeonly ; readsas all“1s” (2) 1 = Output.0 =input Clearedto 0 by Reset (3) Port A Addr = $004
PortB Addr =$005 PortC Addr= $006
16/31
Figure 20: Typical Port I/O Circuitry.
EF6805U3
Data
Direction
Regis t er
Bit
1 1 0
Latche d
Output
Data
Bit
0 1
X
Output
State
0 1
High-Z**
Input
to
MCU
0 1
Pin
All input/output lines areTTL compatible as both in­putsand outputs. PortAlinesareCMOScompatible asoutputs(maskoption)whileport B,C,andDlines areCMOScompatible asinputs.PortD linesarein­put only ; thus, there is no corresponding DDR. When programmed as outputs,port B is capable of sinking10 milliamperes and sourcing 1milliampere on each pin.
The address map (figure 6) gives the addresses of data registers and data direction registers. Figure 21 provides some examples of port connections.
CAUTION
The corresponding DDRs for ports A, B, and C are write-only registers (registers at$004, $005, $006).
* DDRis a write-only register and reads as all ”1s”. ** Ports B and C are three-state ports.
Port A has optional internal pull-up devices to provide CMOS data drive capability. See Electrical Characteristic tables for complete in­formation.
A read operation on these registers is undefined. Since BSET and BCLR are read-modify-write in function, they cannotbeusedto setor clearasingle DDRbit (all ”unaffected” bitswould be set). It is re­commended thatall DDR bits in a port be writtenu­sing a single-store instruction.
The latched output data bit(see figure 20) must al­waysbe written.Therefore, any writeto aportwrites all of its data bits even though the portDDR isset to input. This may be used to initialize the data re­gister and avoid undefined outputs ; however, care mustbeexercised whenusing read-modify-write in­structions, since the data read corresponds to the pin level if the DDR is an input (zero) and corre­sponds to the latched output data when the DDR is anoutput (one).
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EF6805U3
Figure 21: Typical Port Connections.
18/31
EF6805U3
SOFTWARE
BIT MANIPULATION
The EF6805U3 MCU has the abilityto set or clear any single random access memory or input/output bit (except the data direction register, see Caution below), with a singleinstruction (BSET, BCLR).Any bit in page zero including ROM, except the DDRs, can be tested, using the BRSET and BRCLR ins­tructions, and the program branches as a resultof itsstate.The carrybit equals the value ofthe bit ref­erenced by BRSET or BRCLR. A rotate instruction may then be usedto accumulate serial input data in a RAM location or register. The capability to work withany bit in RAM,ROM, or I/O allows the user to haveindividual flags in RAMorto handle I/O bitsas controllines.
The codingexample in figure 21 illustrates the use­fulness of thebitmanipulation andtest instructions.
Figure 21 : Bit Manipulation Example.
AssumethattheMCUis tocommunicatewithanex­ternal serial device.
The external device has a data readysignal, a data outputline, and a clock line to clockdata one bit at a time. LSB first, out of the device.The MCU waits until the data is ready, clocks the external device, picksup the data in the carryflag (C bit), clears the clock line, and finally accumulates thedata bit in a RAM location.
Caution
The corresponding DDRs for ports A, B, and C are write-only registers (registers at $004, $005, and $006). A read operation on these registers is undefined. Since BSET and BCLR are read­modify-write functions, they cannot be used to set or clear a DDR bit (all ”unaffected” bits would be set). It is recommended that all DDR bits in a port be written using a single-store instruction.
AD D RESSING MO DES
The EF6805P2 MCU has 10 addressing modes which are explained briefly in the following para­graphs.For additional details and graphical illustra­tions,refer to the6805 Family User’s Manual.
The term ”effective address” (EA) is used in descri­bing the address modes. EA is defined as the ad­dress from which the argument for an instruction is fetched or stored.
IMMEDIATE - In the immediate addressing mode, theoperand iscontainedin thebyteimmediatelyfol­lowing the opcode. The immediate addressing mode is used to access constants which do not change during program execution (e.g;, a constant used to initializea loopcounter).
DIRECT - In the direct addressing mode,the effec­tiveaddress oftheargument is contained in asingle bytefollowing the opcode byte.Directaddresing al-
lows the user to directly address the lowest 256 bytes in memory with a single 2-byte instruction. Thisincludestheon-chipRAM andI/Oregisters and 128 bytes of ROM. Direct addressing is an effective use of both memory and time.
EXTENDED -Intheextendedaddressingmode,the effectiveaddressoftheargumentiscontained in the two bytes following the opcode. Instructions using extended addressing arecapable of referencing ar­guments anywhere in memory with a single 3-byte instruction.WhenusingtheMotorolaassembler,the programmerneed notspecifywhetheraninstruction usesdirect or extendedaddressing. Theassembler automatically selects the shortest for of the instruc­tion.
RELATIVE - The relative addressing mode is only used in branch instructions. In relative addressing, thecontentsofthe8-bitsignedbytefollowing theop­code(the offset)isaddedtothe PCif and only if the
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EF6805U3
branch condition is true. Otherwise, control pro­ceeds to the next instruction. The span of relative addressing is from- 126 to + 129 from the opcode address.Theprogrammer neednotworryaboutcal­culatingthe correct offset when using the Motorola assemblersince it calculates the proper offset and checksto seeif it is within the span of thebranch.
INDEXED, NO OFFSET - In the indexed, no offset addressing mode,the effectiveaddressof theargu­ment is contained in the 8-bit index register. Thus, this addressing mode canaccess the first256 me­morylocations. These instructionsareonlyonebyte long. This mode is often used to move a pointer through a tableor toholdthe address of afrequently referenced RAM or I/Olocation.
INDEXED,8-BIT OFFSET- In theindexed,8-bitoff­set addressing mode, the effective address is the sum of the contents of the unsigned 8-bit index re­gisterand the unsigned byte following the opcode. This addressing mode is useful in selecting the kth element in ann element table. With this 2-byte ins­truction,k would typically be in X with the address of the beginning of the table in the instruction. As such,tablesmaybeginanywhere withinthefirst256 addressablelocationsandcouldextendasfaras lo­cation510($1FEis thelastlocationatwhichtheins­tructionmay begin).
INDEXED, 16-BIT OFFSET - In the indexed, 16-bit offsetaddressing mode,the effectiveaddress is the sum of the contents of the unsigned 8-bit index re­gisterand the two unsignedbytes following the op­code.Thisaddressing mode can be used in a man­ner similar to indexed, 8-bit offset, except that this 3-byte instruction allows tables to be anywhere in memory. As with direct and extended addressing, the Motorola assembler determines the shortest form of indexed addressing.
BIT SET/CLEAR - In the bit set/clear addressing mode,the bit to be set or cleared is part of the op­code, and the byte following the opcode specifies thedirect address of the byte in whichthe specified bitis to be set or cleared. Thus,any read/write bit in thefirst256 locations ofmemory, including I/O, can beselectivelyset or cleared witha single 2-byteins­truction.
Caution
The corresponding DDRs for ports A, B, and C are write-only registers (registers at $004, $005, and $006). A read operation on these registers is undefined. Since BSET and BCLR are read­modify-write functions, they cannot be used to set or clear a DDR bit (all ”unaffected” bits would
be set). It is recommended that all DDR bits in a port be written using a single-store instruction.
BITTEST AND BRANCH - The bit test and branch addressing mode is a combination of directaddres­sing and relative addressing. The bit and condition (setor clear) whichis to be testedis includedin the opcode, and the address of the byte to be tested is in the single byte immediately following the opcode byte. The signed relative 8-bit offset is in the third byteandisaddedtothevalueofthe PCifthebranch conditionistrue.Thissingle3-byte instructionallows theprogram tobranchbased on thecondition ofany readablebitinthe first256locationsofmemory.The spanof branching isfrom- 125to+130fromtheop­code address. The state of the tested bit is also transferred to thecarry bit of the conditioncode re­gister.
Caution
The corresponding DDRs for ports A, B, and C are write-only registers (registers at $004, $005, and $006). A read operation on these registers is undefined. Since BSET and BCLR are read­modify-write functions, they cannot be used to set or clear a DDR bit (all ”unaffected” bits would be set). It is recommended that all DDR bits in a port be written using a single-store instruction.
INHERENT - In the inherent addressing mode, all theinformationnecessary to executetheinstruction is contained in the opcode. Operations specifying only the index register or accumulator, as well as controlinstruction with no other arguments, are in­cluded inthismode. Theseinstructions areone byte long.
INSTRUCTION SET
The EF6805U3 MCU has a setof 59 basic instruc­tions,whichwhen combined with the10addressing modes produce 207 usable opcodes. They can be divided into five different types : register/memory, read-modify-write, branch, bit manipulation, and control. The following paragraphs briefly explain eachtype.Alltheinstructionswithin agiven typeare presented in individual tables.
REGISTER/MEMORY INSTRUCTIONS - Most of these instructions use two operands. One operand is either the accumulator or the index register. The other operand is obtained from memory using one of the addressing modes. The jump unconditional (JMP) and jump to subroutine (JSR) instructions haveno register operands. Refer to table 1.
READ-MODIFY-WRITE MODIFICATIONS-These instructions read a memory location or a register,
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EF6805U3
modifyortestitscontents,andwrite themodifiedva­lue back to memory or to the register. The test for negative or zero (TST) instruction is included in read-modify-write instructions through it does not perform thewrite. Rfer to table 2.
Caution
The corresponding DDRs for ports A, B, and C are write-only registers (registers at $004, $005, and $006). A read operation on these registers is undefined. Since BSET and BCLR are read­modify-write functions, they cannot be used to set or clear a DDR bit (all ”unaffected” bits would be set). It is recommended that all DDR bits in a port be written using a single-store instruction.
BRANCH INSTRUCTIONS - The branch instruc­tionscausea branch from the program when a cer­tain condition is met. Refer to table 3.
BITMANIPULATIONINSTRUCTIONS-Theseins­tructionsareused on any bit in the first256bytes of
thememory. Onegroup eithersets or clears.The o­ther group performsthe bit test branch operations. Refer to table 4.
Caution
The corresponding DDRs for ports A, B, and C are write-only registers (registers at $004, $005, and $006). A read operation on these registers is undefined. Since BSET and BCLR are read­modify-write functions, they cannot be used to set or clear a DDR bit (all ”unaffected” bits would be set). It is recommended that all DDR bits in a port be written using a single-store instruction.
CONTROL INSTRUCTIONS - The controlinstruc­tions control the MCU operations during program execution. Refer to table 5.
ALPHABETICAL LISTING - The complete instruc­tionset is given in alphabetical order in table 6.
OPCODEMAP SUMMARY - Table 7 is an opcode map for the instructions used on the MCU.
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EF6805U3
Table 1 : Register/Memory Instructions.
22/31
Table 2 : Read-Modify-Write Instructions.
EF6805U3
23/31
EF6805U3
Table 3 : Branch Instructions.
Relative Addressing Mode
Function Mnemonic
Branch Always BRA 20 2 4 Branch Never BRN 21 2 4 Branch IFF Higher BHI 22 2 4 Branch IFF Lower or Same BLS 23 2 4 Branch IFF Carry Clear BCC 24 2 4 (branch IFF higher or same) (BHS) 24 2 4 Branch IFF Carry Set BCS 25 2 4 (branch IFF lower) (BLO) 25 2 4 Branch IFF Not Equal BNE 26 2 4 Branch IFF Equal BEQ 27 2 4 Branch IFF Half Carry Clear BHCC 28 2 4 Branch IFF Half Carry Set BHCS 29 2 4 Branch IFF Plus BPL 2A 2 4 Branch IFF Minus BMI 2B 2 4 Branch IFF interrupt mask bit is clear. BMC 2C 2 4 Branch IFF interrupt mask bit is set. BMS 2D 2 4 Branch IFF interrupt line is low. BIL 2E 2 4 Branch IFF interrupt line is high. BIH 2F 2 4 Branch to Subroutine BSR AD 2 8
Op
Code
#
Bytes
#
Cycles
Table 4 : Bit Manipulation Instructions.
Addressing Mo d es
Function Mnemonic
Branch IFF Bit n is set BRSET n (n = 07) 2 n3 10 Branch IFF Bit n is clear BRCLR n (n = 07) Set Bit n BSET n (n = 07) Clear Bit n BCLR n (n =07)
Bit Set/clear Bit T est an d Branch
Op
Code#Bytes#CyclesOpCode#Bytes#Cycles
01 + 2 n 310 10 + 2 n 27 11 + 2 n 27
24/31
EF6805U3
Table 5 : Control Instructions.
Inherent
Function Mnemonic
Op
Code
Transfer A to X TAX 97 1 2 Transfer X to A TXA 9F 1 2 Set Carry Bit SEC 99 1 2 Clear Carry Bit CLC 98 1 2 Set Interrupt Mask Bit SEI 9B 1 2 Clear Interrupt Mask Bit CLI 9A 1 2 Software Interrupt SWI 83 1 11 Return from Subroutine RTS 81 1 6 Return from Interrupt RTI 80 1 9 Reset Stack Pointer RSP 9C 1 2 No-operation NOP 9D 1 2
Table6 : Instruction Set.
Addressing Modes Condition Code
Mnem Inherent Immediate Direct Extended Relative
ADC X X X X X X ∧∧∧ ADD X X X X X X ∧∧∧ AND X X X X X X ●●∧∧ ASL X X X X ●●∧∧∧ ASR X X X X ●● ∧∧∧ BCC X ●●●●● BCLR X ●●●●● BCS X ●●●●● BEQ X ●●●●● BHCC X ●●●●● BHCS X ●●●●● BHI X ●●●●● BHS X ●●●●● BIH X ●●●●● BIL X ●●●●● BIT X X X X X X ●●∧∧ BLO X ●●●●● BLS X ●●●●● BMC X ●●●●● BMI X ●●●●● BMS X ●●●●● BNE X ●●●●● BPL X ●●●●● BRA X ●●●●● BRN X ●●●●● BRCLR X ●●●● BRSET X ●●●● BSET X ●●●●● BSR X ●●●●● CLL X ●●●● 0
Indexed
(no offset)
Indexed
(8 Bits)
Indexed
(16 Bits)
Bit
Set/Clear
Bit
Test &
Branch
#
Bytes
HINZC
Cycles
#
25/31
EF6805U3
Table6 : Instruction Set (continued).
Addressing Modes Condition Code
Mnem Inherent Immediate Direct Extended Relative
Indexed
(no offset)
Indexed
(8 Bits)
Indexed
(16 Bits)
Bit
Set/clear
CLI X 0 ●●● CLR X X X X ●● 01 CMP X X X X X X ●●∧∧∧ COM X X X X ●● ∧∧1 CPX X X X X X X ●●∧∧∧ DEC X X X X ●●∧∧ EOR X X X X X X ●●∧∧ INC X X X X ●●∧∧ JMP X X X X X ●●●●● JSR X X X X X ●●●●● LDA XXX XXX ●●∧∧ LDX XXX XXX ●●∧∧ LSL X X X X ●●∧∧∧ LSR X X X X ●● 0 ∧∧ NEQ X X X X ●●∧∧∧ NOP X ●●●●● ORA X X X X X X ●●∧∧ ROL X X X X ●●∧∧∧ RSP X ●●●●● RTI X ????? RTS X ●●●●● SBC XXX XXX ●●∧∧∧ SEC X ●●●● 1 SEI X 1 ●●● STA XX XXX ●●∧∧ STX XX XXX ●●∧∧ SUB XXX XXX ●●∧∧∧ SWI X 1 ●●● TAX X ●●●●● TST X X X X ●● ∧∧ TXA X ●●●●●
Condition Code Symbols : H Half Carry (from bit3) I Interrupt Mask N Negative (sign bit)
Z C ^ Test and Set if True, Cleared Otherwise
Not Affected
Bit
Test &
Branch
HINZC
26/31
EF6805U3
HMOS 6805 FAMILY
Features EF 6 805P2 EF680 5P6 EF 6805R2 EF 6805R 3 EF68 05U2 EF 6805 U3
Technology HMOS HMOS HMOS HMOS HMOS HMOS Number of Pins 28 28 40 40 40 40 On-chip RAM (bytes) 64 64 64 112 64 112 On-chip User ROM (bytes) 1100 1796 2048 3776 2048 3776 External Bus None None None None None None Bidirectional I/O Lines 20 20 24 24 24 24 Unidirectional I/O Lines None None 6 Inputs 6 Inputs 8 Inputs 8 Inputs
Other I/O Features Timer Timer Timer, A/D Timer, A/D Timer Timer
External Interrupt Inputs 1 1 2 2 2 2
STOP and WAIT No No No No No No
27/31
EF6805U3
Table 7 : 6805 HMOS Family Opcode MAP.
28/31
PACKAGE MECHANICAL DATA
40 Pin Plastic Dual In Line Package (PDIP)
EF6805U3
Dim. mm inches
Min Typ Max Min Typ Max
A 2.2 4.8 0.086 0.189
A1 0.51 1.77 0.010 0.069
B 0.38 0.58 0.015 0.023
B1 0.97 1.52 0.055 0.065
C 0.2 0.3 0.008 0.009 D 50.30 52.221.980 20.56
D1------
E 16.3 0.641 E1 12.9 0.508 K1–––––– K2––––––
L 3.18 4.44 1.25 0.174
e1 2.54 0.10
Number of Pins
N40
44 Pin Plastic Quad Package (PLCC)
Dim. mm inches
Min Typ Max Min Typ Max
A 4.2 5.08 0.165 0.200 A1 0.64 0.020 A3 2.29 3.30 0.090 0.130
B 0.331 - ---­B1 0.661 - ----
D 17.40 17.650.685 0.695 D1 16.51 16.660.650 0.656 D3 12.70 0.500
E 17.40 17.650.685 0.695 E1 16.51 16.660.650 0.656 E3 12.70 0.500 K1------
e 1.27 0.050
Number of Pins
N44 ND 11
29/31
EF6805U3
ORDERING INFORMATION
The information required when ordering a custom MCU is listed below. The ROM program may be transmitted toSGS-THOMSONonEPROM(s)oran EFDOS/MDOS* disk file.
To initiate a ROM patternfor theMCU, it isneces­sary to firstcontactyour local SGS-THOMSON re­presentative or distributor.
EPROMs
One2716 or2732typeEPROMs, programmed with the customer program (positive logic sense for ad-
XXX = Customer ID)
dress and data), may be submitted for pattern ge­neration.
After the EPROM is marked, it should be placed in conductive IC carriersand securely packed. Do not use styrofoam.
VERIFICA TION MEDI A
All original pattern media (EPROMsor floppydisk) arefiled for contractualpurposes and are not retur­ned. A computer listing of the ROMcode willbe ge­neratedand returned along withalistingverification form. The listingshould be thoroughly checked and the verification form completed, signed, and retur­ned to SGS-THOMSON. The signed verification formconstitutesthecontractualagreement for crea­tion of thecustomermask. If desired, SGS-THOM-
SON will program on blank EPROM from the data file used to create the custom mask and aid in the verification process.
ROM VERIFICATION UNITS (RVUs) Ten MCUs containing thecustomer’sROM pattern
will be sent for program verification. Theseunitswill havebeen made usingthe custom mask but are for the purposeof ROMverification only. Forexpedien­cy theyare usuallyunmarked, packaged inceramic, and tested only at room temperature and 5 volts. TheseRVUs are included in the maskchange and are not production parts. The RVUs are thus not guaranteed by SGS THOMSON. Quality Assu­rance,and shouldbe discarded after verificationis completed.
FLEXIB LE DIS KS
The diskmediasubmitted mustbesingle-sided, EF­DOS/MDOS*compatiblefloppies.
The customer must write the binary file name and company name on the disk with a felt-tip-pen. The minimum EFDOS/MDOS* system files, as well as the absolutebinaryobject file(Filename .LO type of file)from the 6805 crossassembler,must be on the disk.Anobjectfilemadefroma memorydump using the ROLLOUTcommand isalso acceptable. Consi­der submitting a source listing as well as the follo­wingfiles:filename.LX(DEVICE/EXORciser loada­ble format)and filename .SA (ASCII Source Code). Thesefileswillofcoursebekeptconfidential andare used1) tospeeduptheprocess in-house ifany pro­blems arise, and 2) to speed up the user-to-factory interface if the user finds any software errors and needs assistance quickly from SGS-THOMSON factoryrepresentatives.
EFDOSis SGS-THOMSON DiskOperating System available on development systems such as DE­VICE...
MDOS* is MOTOROLA’s Disk Operating System available on development systems such as EXOR­ciser... * Requires prior factory approval.
Whenever ordering a custom MCU isrequired, please contactyourlocal SGS-THOMSON representative or SGS-THOMSONdistributor and/or complete and send the attached ”MCU customerordering sheet” to your localSGS-THOMSON Microelectronics representative.
30/31
ORDER C ODES
EF6805U3
EF6805U3 P V
Device
Package
Screen level
Oper. temp.
The tablebelow horizontally showsall available suffixcombinations for package, operating temperature and screening level. Otherpossibilities on request.
Device Package Oper. Temp. Screenin g Lev el
C J P E FN L* V T Std D G/ B B/B
EF6805U3 X XXXXXX
Examples : EF6805U3P, EF6805U3FN, EF6805U3PV, EF6805U3FNV
Package : C : Ceramic DIL, J:Cerdip DIL, P:Plastic DIL, E:LCCC, FN : PLCC Oper. temp. : L* : 0°Cto+70°C, V:–40°Cto+85°C,T:–40°C to + 105°C, *:may be omitted. Screening level : Std : (no-end suffix), D:NFC 96883 level D,
EXORciser is a registered trademark of MOTOROLA Inc.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publicationare subject to change without notice. This publication supersedes and replacesall information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without the express writtenapproval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All rights reserved.
Purchase of I2C Components by SGS-THOMSON Microelectronics conveys a license under the Philips I2C Patent. Rights to use these
components in an I2C system is granted provided that the system conforms to the I2C Standard Specification as defined by Philips.
SGS-THOMSON Microelectronics Group of Companies
Australia- Brazil- France - Germany - HongKong - Italy - Japan - Korea - Malaysia- Malta- Morocco The Netherlands - Singapore - Spain
Sweden- Switzerland - Taiwan- Thailand - UnitedKingdom - U.S.A.
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