Transil diodes provide high overvoltage protection
by clamping action. Their instantaneous response
to transient overvoltages makes them particularly suited to protect voltage sensitive devices
such as MOS Technology and low voltage supplied IC’s.
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25°C)
SymbolParameterValueUnit
R6
TM
P
I
FSM
T
T
PP
P
stg
T
L
Peak pulse power dissipation (see note 1)Tj initial = T
Power dissipation on infinite heatsinkT
Non repetitive surge peak forward current
for unidirectional types
Storage temperature range
Maximum junction temperature
j
Maximum lead temperature for soldering during 10s at 5mm
= 75°C
amb
tp = 10ms
Tj initial = T
amb
amb
5000W
6.5W
500A
-65to+175
175
230°C
from case
Note 1 :For a surge greater than the maximum values, the diode will fail in short-circuit.
THERMAL RESISTANCES
SymbolParameterValueUnit
R
th (j-l)
R
th (j-a)
February 2003- Ed : 4A
Junction to leads
Junction to ambient on printed circuit.L
lead
=10mm
15°C/W
65°C/W
°C
°C
1/5
BZW50-10,B/180,B
ELECTRICAL CHARACTERISTICS (T
SymbolParameter
V
V
V
I
I
αT
RM
BR
CL
RM
PP
V
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ V
Peak pulse current
Voltage temperature coefficient
Forward voltage drop
Fig. 1: Peak pulse power dissipation versus initial
junction temperature (printed circuit board).
t
Fig. 2 : Peak pulse power versus exponential pulse duration.
Pp (W)
p
1E7
1E6
1E5
1E4
1E3
1E2
0.0010.010.1110100
BZW50-10,B/180,B
Tj initial = 25øC
tp (ms ) EXPO.
°
Fig. 3 :Clamping voltage versus peak pulse current.
Exponential waveformt
=20µs________
p
= 1 ms—————-
t
p
= 10 ms...............
t
p
Note : The curves of the figure 3 are specified for a junction temperature of 25°C before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
∆V
= αT* (T
BR
-25) * VBR(25°C).
amb
For intermediate voltages, extrapolate the given results.
3/5
BZW50-10,B/180,B
Fig. 4a : Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 5 : Peak forward voltage drop versus peak
forward current (typical values for unidirectional
types).
Note : Multiply by 2 for units with VBR> 220V.
Fig. 4b : Capacitance versus reverse applied
voltage for bidirectional types (typical values).
Fig. 6 : Transient thermal impedance junction-ambient versus pulse duration (For FR4 PC
Board with L
= 10mm).
lead
Fig. 7 : Relative variation of leakage current
versus junction temperature.
4/5
ORDER CODE
5000W
BZW50-10,B/180,B
BZW 5010 B RL-
PACKAGING:
' ' = Ammopack tape
'RL' = Tape & reel
STAND-OFFVOLTAGE
MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only).
PACKAGE MECHANICAL DATA
R6 (Plastic)
B
∅D
∅C
AB
REF.
MillimetersInches
Min.Typ. Max. Min.Typ. Max.
A8.69.10.3380.358
B25.41
∅ C8.69.10.3380.358
∅ D1.21.30.0470.051
No suffix: unidirectional
DIMENSIONS
BIDIRECTIONAL
Packaging : standard packaging is tape and reel.
Weight = 2.048 g.
Informationfurnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
useof such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics