SGS Thomson Microelectronics BYW80FP-200 Datasheet

®
BYW80F/FP-200
HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODES
MAIN PRODUCTS CHARACTERISTICS
I
F(AV)
V
RRM
20 A
200 V
Tj (max) 150°C
(max) 0.85 V
V
F
trr (max) 35 ns
FEATURES
Very low forward losses
Negligible switching losses
High surge current capability
Insulated packages:
ISOWATT220AC / TO-220FPAC: Insulation voltage = 2000 V DC Capacitance = 12 pF
DESCRIPTION
Single chip rectifier suited for Switch Mode Power SuppliesandhighfrequencyDC to DCconverters.
Packaged in TO-220AC, ISOWATT220AC and TO-220FPAC this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications.
K
TO-220AC
BYW80-200
A
ISOWATT220AC
BYW80F-200
TO-220FPAC
BYW80FP-200
A
K
A
K
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
Repetitive peak reverse voltage RMS forward current Average forward current
δ = 0.5
TO-220AC Tc=120°C ISOWATT220AC
Tc=95°C
200 V
20 A 10 A
10
TO-220FPAC
I
FSM
Surge non repetitive forward current
tp=10ms
100 A
sinusoidal
Tstg
Tj
January 2002 - Ed: 3G
Storage and junction temperature range Maximum operating temperature range
- 65 to + 150 °C + 150 °C
1/7
BYW80F/FP-200
THERMAL RESISTANCE
Symbol Parameter Value Unit
Rth (j-c)
Junction to case
TO-220AC ISOWATT220AC / TO-220FPAC
2.5 °C/W
4.7
ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS
Symbol Test Conditions Min. Typ. Max. Unit
*
I
R
V
F**
Pulse test:*tp=5ms,duty cycle<2%
= 25°C VR=V
T
j
= 100°C
T
j
Tj= 125°C IF=7A T
= 125°C IF=15A
j
T
= 25°C IF=15A
j
** tp = 380 µs, duty cycle<2%
RRM
10 µA
1mA
0.85 V
1.05
1.15
To evaluate the conduction losses use the following equation : P=0.65xI
F(AV)
+ 0.027 x I
F2(RMS)
RECOVERY CHARACTERISTICS
Symbol Test Conditions Min. Typ. Max. Unit
trr T
= 25°C IF= 0.5A
j
Irr = 0.25A 25 ns
IR=1A I
=1A
F
dIF/dt = -50A/µs35
VR= 30V
tfr T
V
FP
=25°CI
j
=1A
F
VFR=1.1xV
tr=10ns 15 ns
F
Tj= 25°C IF=1A tr=10ns 2 V
2/7
BYW80F/FP-200
Fig. 1: Average forward power dissipation versus
average forward current
P
F(av)(W)
14
12
=0.05
=0.1
=0.2
=0.5
=1
10
8
6
T
4
2
0
01234567891011121314
I
F(av)(A)
=tp/T
tp
Fig. 3: Forward voltage drop versus forward cur­rent (maximum values)
VFM(V)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1 1 10 100
Tj=125 C
o
IFM(A)
Fig. 2: Peak current versus form factor
I
M(A)
200
=tp/T
T
I
M
tp
175 150 125 100
75 50
P=10W
P=5W
P=15W
25
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Fig. 4: Relative variation of thermal impedance junctionto case versuspulse duration (TO-220AC)
K
1.0
Zth(j-c) (tp. )
K=
Rth(j-c)
0.5
0.2
0.1
=0.5
=0.2
=0.1
Single pulse
tp(s)
1.0E-03 1.0E-02 1.0E-01
=tp/T
T
tp
1.0E+00
Fig. 5: Relative variation of thermal impedance junction to case versus pulse duration. (ISOWATT220AC / TO-220FPAC)
K
1
Zth(j-c) (tp. )
K=
Rth(j-c)
0.8
=0.5
0.6
0.4
=0.1
0.2
0
1.0E-03 1.0E-02 1.0E-01
=0.2
Single pulse
tp(s)
T
=tp/T
tp
1.0E+00 1.0E+01
Fig. 6: Non repetitive surge peak forward current versus overload duration (TO-220AC)
I
M(A)
100
90 80 70 60 50 40 30
IM
20 10
0
0.001 0.01 0.1 1
t =0.5
t(s)
o
Tc=25 C
Tc=75 C
o
Tc=120 C
o
3/7
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