Datasheet SM05, SM12, SM15, SM24, SM36 Datasheet (Semtech) [ru]

PROTECTION PRODUCTS

SM05 through SM36

TVS Diode Array

Description

The SM series of transient voltage suppressors (TVS)
are designed to protect components which are
connected to data and transmission lines from voltage
surges caused by electrostatic discharge (ESD),
electrical fast transients (EFT), and lightning.

TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The dual-junction common-anode design
allows the user to protect one bidirectional data line or
two unidirectional lines. The low profile SOT23
package allows flexibility in the design of “crowded”
circuit boards.

The SM series will meet the surge requirements of IEC
61000-4-2 (Formerly IEC 801-2), Level 4, “Human
Body Model” for air and contact discharge.

Features

 300 watts peak pulse power (t
 Transient protection for data & power lines to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)

 Protects one bidirectional line or two unidirectional

lines

 Working Voltages: 5V, 12V, 15V, 24 and 36V
 Low clamping voltage
 Solid-state silicon avalanche technology

= 8/20µs)

p

Mechanical Characteristics

 JEDEC SOT23 package
 Molding compound flammability rating: UL 94V-0
 Marking : Marking Code
 Packaging : Tape and Reel per EIA 481

Applications

 Cellular Handsets and Accessories
 Portable Electronics
 Industrial Controls
 Set-Top Box
 Servers, Notebook, and Desktop PC

Circuit Diagram Schematic & PIN Configuration

SOT23 (Top View)

Revision 07/12/04

1

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PROTECTION PRODUCTS

Absolute Maximum Rating

SM05 through SM36

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Electrical Characteristics

50MS

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I

RB

R

C

PP

j

j

V

MWR

t

p

t

p

V

R

Am1=6 V

t

I

,A1=

PP

sµ02/8=

sµ02/8=71A

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dna3ot1niP

θ

AJ

L

J

GTS

C°52=T,V5=02Aµ

zHM1=f,V0=

003sttaW

655W/C°

).ces01(062C°

521+ot55-C°

051+ot55-C°

5V

8.9V

053Fp

004Fp

3ot2niP

V

R

zHM1=f,V0=

21MS

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MWR

I

RB

R

C

PP

j

j

V

MWR

t

p

t

p

V

R

Am1=3.31V

t

C°52=T,V21=1Aµ

I

,A1=

PP

sµ02/8=

sµ02/8=21A

2ot1niP

zHM1=f,V0=

dna3ot1niP

21V

91V

021Fp

051Fp

3ot2niP

V

R

zHM1=f,V0=

2 2004 Semtech Corp.

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Electrical Characteristics (Continued)

51MS

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SM05 through SM36

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MWR

I

RB

R

C

PP

j

j

V

MWR

I

PP

t

p

V

R

V

R

Am1=7.61V

t

C°52=T,V51=1Aµ

t,A1=

p

sµ02/8=42V

sµ02/8=01A

2ot1niP

zHM1=f,V0=

3ot2dna3ot1niP

zHM1=f,V0=

51V

57Fp

001Fp

42MS

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I

RB

R

C

V

MWR

I

PP

Am1=7.62V

t

C°52=T,V42=1Aµ

t,A1=

p

sµ02/8=34V

42V

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PP

j

j

t

p

V

R

V

R

sµ02/8=5A

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05Fp

zHM1=f,V0=

3ot2dna3ot1niP

06Fp

zHM1=f,V0=

63MS

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R

C

PP

j

j

V

MWR

I

PP

t

p

V

R

V

R

Am1=04V

t

C°52=T,V63=1Aµ

t,A1=

p

sµ02/8=06V

sµ02/8=4A

2ot1niP

zHM1=f,V0=

3ot2dna3ot1niP

zHM1=f,V0=

3 2004 Semtech Corp.

63V

04Fp

54Fp

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PROTECTION PRODUCTS

Typical Characteristics

SM05 through SM36

Non-Repetitive Peak Pulse Power vs. Pulse Time

10

(kW)

pk

1

0.1

Peak Pulse Power - P

0.01

0.1 1 10 100 1000

Pulse Duration - t

(µs)

p

Pulse Waveform

110

100

90

80

70

PP

60

50

Percen t of I

40

30

20

10

0

0 5 10 15 20 25 30

-t

e

Time (µs)

td = IPP/2

Waveform

Parameters:

tr = 8µs

td = 20µs

Power Derating Curve

110

100

90

PP

80

70

60

50

40

30

% of Rated Power or I

20

10

0

0 25 50 75 100 125 150

Ambient Temperature - T

A

(oC)

ESD Pulse Waveform (Per IEC 61000-4-2)

IEC 61000-4-2 Discharge Parameters

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4 2004 Semtech Corp.

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www.semtech.com

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Applications Information

SM05 through SM36

Device Connection Options

The SM series is designed to protect one bidirectional
or two unidirectional data or I/O lines operating at 5 to
36 volts. Connection options are as follows:

zz

z Bidirectional: Pin 1 is connected to the data line

zz

and pin 2 is connected to ground (Since the device
is symmetrical, these connections may be re­versed). The ground connection should be made
directly to a ground plane. The path length should
be kept as short as possible to minimize parasitic
inductance. Pin 3 is not connected.

zz

Unidirectional: Data lines are connected to pin 1

z

zz

and pin 2. Pin 3 is connected to ground. For best
results, this pin should be connected directly to a
ground plane on the board. The path length should
be kept as short as possible to minimize parasitic
inductance.

Circuit Board Layout Recommendations for Suppres­sion of ESD.

Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):

z Place the TVS near the input terminals or connec-

tors to restrict transient coupling.

z Minimize the path length between the TVS and the

protected line.

z Minimize all conductive loops including power and

ground loops.

z The ESD transient return path to ground should be

kept as short as possible.

z Never run critical signals near board edges.
z Use ground planes whenever possible.

Device Schematic & Pin Configuration

RS-232 Transceiver Protection Example

Matte Tin Lead Finish

Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com­pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.

5 2004 Semtech Corp.

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Outline Drawing - SOT23

SM05 through SM36

D

A

e1

3

B

E

E1

12

bxN

e

A

bbb C A B

A2

3X

A1

C

NOTES:

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

1.

2.

DATUMS AND TO BE DETERMINED AT DATUM PLANE

DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS

3.
OR GATE BURRS.

-A-

-B-

SEATING

aaa C

SEATING PLANE

-H-

PLANE

C

GAUGE
PLANE

0.25

H

DETAIL A

SIDE VIEW

DIMENSIONS

INCHES

DIM

MIN

.035

A

.000

A1
A2 .035 .037 0.950.88.040 1.02

b

c

0

L

L1

.012

c

.003

.114

D

.093

E

.082

E1 .051 1.30

e

.075

e1 .037

.015 .020 0.500.40.024 0.60

L

.022

L1

N3 3
0

aaa

.004 0.10

bbb .008 0.20

-

-

-

-

-

MAXNOM

.044
.004

.020
.007

.104
.055.047

MILLIMETERS
MIN

NOM

MAX

-

0.89

0.01

0.30

0.08

2.10

-

-

-

2.90

2.37

1.90 BSC

0.95 BSC

(0.55)

-

1.12

0.10

0.51

0.18

3.042.80.110 .120

2.64

1.401.20

8°0°8°0°

SEE DETAIL A

Land Pattern - SOT23

Z

NOTES:

1.

2.

X

Y

C

G

Y

E

E1

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.

REFERENCE IPC-SM-782A.

DIM

(.087)

C
E .037 0.95

E1 .075 1.90

G

.031

X

.039

Y

.055

Z

.141

MILLIMETERSINCHES

DIMENSIONS

(2.20)

0.80

1.00

1.40

3.60

6 2004 Semtech Corp.

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Marking Codes

SM05 through SM36

rebmuNtraP

50MS50M

21MS21M

51MS51M

42MS42M

63MS63M

edoC

Ordering Information

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CT.50MSbPnS000,3hcnI7

CT.21MSbPnS000,3hcnI7

CT.51MSbPnS000,3hcnI7

CT.42MSbPnS000,3hcnI7

gnikraM

repytQ

leeR

eziSleeR

CT.63MSbPnS000,3hcnI7

TCT.50MSeerFbP000,3hcnI7

TCT.21MSeerFbP000,3hcnI7

TCT.51MSeerFbP000,3hcnI7

TCT.42MSeerFbP000,3hcnI7

TCT.63MSeerFbP000,3hcnI7

Contact Information

Semtech Corporation

Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: [phone] FAX [phone]

7 2004 Semtech Corp.

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