The NCV7723B is a six channel half−bridge driver with protection
features designed specifically for automotive and industrial motion
control applications. The product has independent controls and
diagnostics, and the drivers can be operated in forward, reverse, brake,
and high impedance states. The device is controlled via a 16 bit SPI
interface and is daisy chain compatible. Outputs 1 and 2 can be
controlled through an external PWM signal.
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Features
• Low Quiescent Current Sleep Mode
• High−Side and Low−Side Drivers
Connected in Half−Bridge Configurations
• Integrated Freewheeling Protection (LS and HS)
• 500 mA Typical, 1.1 A Peak Current
DS(on)
= 0.8 W (Typ)
• R
• OUT1 and OUT2 External PWM Control
• 5 MHz SPI Communication
• 16 Bit Frame Error Detection
• Daisy Chain Compatible with Multiple of 8 bit Devices
• Compliance with 3.3 V and 5 V Systems
• Undervoltage and Overvoltage Lockout
• Per Channel Fault Reporting
• Overcurrent Protection
• Overtemperature Protection
• Underload Detection (HS and LS)
• Exposed Pad Package
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• This is a Pb−Free Device
MARKING
DIAGRAM
NCV7723B
AWLYWWG
SSOP24 NB EP
CASE 940AK
NCV7723B = Specific Device Code
A= Assembly Location
WL= Wafer Lot
Y= Year
WW= Work Week
G= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 23 of
this data sheet.
PIN FUNCTION DESCRIPTION The pin−out for the Half−Bridge Driver in SSOP24 NB EP package is shown in the table below.
Pin#
SSOP24
1GND Ground. Must be connected to other GND pins externally.
2OUT1 Half−bridge output 1
3OUT5 Half−bridge output 5
4NC No Connection. This pin should be isolated from any traces or via on the PCB board.
5SI 16 bit serial communication input. 3.3 V / 5 V (TTL) Compatible − internally pulled down.
6VCC Power supply input for Logic.
7SO 16 bit serial communication output. 3.3 V / 5 V Compliant
8
9NC No Connection. This pin should be isolated from any traces or via on the PCB board.
10OUT6 Half−bridge output 6
11OUT4 Half−bridge output 4
12GND Ground. Must be connected to other GND pins externally.
13GND Ground. Must be connected to other GND pins externally.
14OUT3 Half−bridge output 3
15NC No Connection. This pin should be isolated from any traces or via on the PCB board.
16VS2 Power Supply input for outputs 3, 4, and 6. This pin must be connected to VS1 externally.
17PWM1 External PWM input for output 1. 3.3 V / 5 V (TTL) Compatible − internally pulled down. Connect to ground or
18PWM2 External PWM input for output 2. 3.3 V / 5 V (TTL) Compatible − internally pulled down. Connect to ground or
19
20SCLK Serial communication clock input. 3.3 V / 5 V (TTL) Compatible − internally pulled down.
21VS1 Power Supply input for outputs 1, 2, and 5. This pin must be connected to VS2 externally.
22NC No Connection. This pin should be isolated from any traces or via on the PCB board.
23OUT2 Half−bridge output 2
24GND Ground. Must be connected to other GND pins externally.
EPADExposed Pad Connect to GND or leave unconnected.
SymbolDescription
EN Enable − active high; wakes the device from sleep mode. 3.3 V / 5 V (TTL) Compatible − internally pulled down.
leave floating if unused.
leave floating if unused.
CSB Chip select bar − active low; enables serial communication operation. 3.3 V / 5 V (TTL) Compatible − internally
pulled up.
MAXIMUM RATINGS (Voltages are with respect to GND)
Rating
VSx Pin Voltage(VS1, VS2)
(DC)
(AC), t < 500 ms, Ivsx > −2 A
Pin Voltage(Vcc, SI, SCLK, CSB, SO, EN, PWM1, PWM2)VioMax−0.3 to 5.5V
OUTx Pin Voltage
(DC)
(AC)
(AC), t < 500 ms, IOUTx > −1.1 A
(AC), t < 500 ms, IOUTx < 1 A
OUTx Pin Current (OUT1, ..., OUT6)IoutxImax−2.0 to 2.0A
Junction Temperature RangeT
Storage Temperature RangeTstr−55 to 150°C
Peak Reflow Soldering Temperature: Pb−free 60 to 150 seconds at 217°C(Note 1)260°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SymbolValueUnit
VsxdcMax
VSxac
VoutxDc
VoutxAc
J
−0.3 to 45
−1.0
−0.3 to 45
−0.3 to 45
−1.0
1.0
−40 to 150°C
V
V
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NCV7723B
ATTRIBUTES
CharacteristicSymbolValueUnit
Short Circuit Reliability CharacterizationAECQ10xGrade A
2. Based on JESD51−7, 1.6 mm thick FR4, 2S2P PCB with 600 mm2 2 oz. copper and 18 thermal vias to 80x80 mm 1 oz. internal spreader
planes. Simulated with each channel dissipating 0.2 W.
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolMinMaxUnit
Digital Supply Input VoltageVCCOp3.155.25V
Battery Supply Input Voltage (VS1 = VS2)VSxOp5.532V
DC Output CurrentIxOp−0.5A
Junction TemperatureTjOp−40125°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
≤ 150°C, 5.5 V ≤ VSx ≤ 40 V, 3.15 V ≤ VCC ≤ 5.25 V, EN = VCC, unless otherwise specified.)
J
Characteristic
Sleep Mode
SymbolConditionsMinTypMaxUnit
IqVSx85 VS1 = VS2 = 13.2 V, V
−40°C to 85°C
CC
= 0 V
IvsOp EN = VCC, 5.5V < VSx < 32 V
Active Mode
No Load,All Outputs Off
CSB = VCC, EN = SI = SCLK = 0 V
Sleep Mode
Active Mode
IqV
CC
IVCCOp
EN = CSB = V
−40°C to 85°C
, SI = SCLK = 0 V
CC
No Load, All Outputs Off
IqTot Sleep Mode, −40°C to 85°C
I(VS1) + I(VS2) + I(VCC)
VS1 = VS2 = 13.2 V, No Load
increasing−2.702.90V
CC
VSx increasing
VSx decreasing
(source)RDSonHS Iout = −500 mA, Vs = 13.2 V
DS(on)
(sink)RDSonLS Iout = 500 mA, Vs = 13.2 V
DS(on)
IsrcLkg13.2
IsrcLkg28
V
= 3.15 V
CC
V
= 3.15 V
CC
V
= 5 V, OUT (1−6) = 0 V, EN = 0/5 V
CC
VSx = 13.2 V
VSx = 28 V
−1.02.5
−
0.51.0mA
−
1.0
2.5
−
1.5
3.0
−2.05.0
3.5
4.1
4.3
4.5
4.7
3.7
32
29.53633.54037.5
−0.81.8
−0.81.8
−1.0
−2.0−−
−
−
mA
mA
mA
mA
V
V
W
W
mA
mA
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NCV7723B
ELECTRICAL CHARACTERISTICS
(−40°C ≤ T
DRIVER OUTPUT CHARACTERISTICS
Sink Leakage Current
Overcurrent Shutdown Threshold (Source)IsdSrc V
Overcurrent Shutdown Threshold (Sink)IsdSnk V
Over Current Delay TimerTdOc102550
Underload Detection Threshold (Low Side)IuldLS
Underload Detection Threshold (High Side)
Underload Detection Delay TimeTdUld V
Body Diode Forward VoltageIbdFwd If = 500 mA−0.91.3V
DRIVER OUTPUT SWITCHING CHARACTERISTICS
High Side Turn On Time
High Side Turn Off TimeThsOff
Low Side Turn On TimeTlsOn
Low Side Turn Off TimeTlsOff
High Side Rise TimeThsTr
High Side Fall TimeThsTf
Low Side Rise TimeTlsTr
Low Side Fall TimeTlsTf
High Side Off to Low Side On
Non−Overlap Time
Low Side Off to High Side On
Non−Overlap Time
PWM High to High Side On TimeThsOnPWM
PWM Low to High Side Off TimeThsOffPWM
PWM High to Low Side On TimeTlsOnPWM
PWM Low to Low Side Off TimeTlsOffPWM
THERMAL RESPONSE
Thermal Warning
Thermal Warning HysteresisTwHy (Note 3)−20−°C
Thermal ShutdownTs d (Note 3)150175200°C
Thermal Shutdown HysteresisTsdHy (Note 3)−20−°C
LOGIC INPUTS − EN, SI, SCLK, CSB, PWM1, PWM2
Input ThresholdHigh
Input Hysteresis − SI, SCLK, CSB, PWM1,
PWM2
Input Hysteresis − ENVthENHys150400800mV
Pull−down Resistance − EN, SI, SCLK,
PWM1, PWM2
Pull−up Resistance − CSBRpuCSB CSB = 0 V50125250
Input CapacitanceCinx (Note 3)−−15pF
≤ 150°C, 5.5 V ≤ VSx ≤ 40 V, 3.15 V ≤ VCC ≤ 5.25 V, EN = VCC, unless otherwise specified.) (continued)
J
CharacteristicUnitMaxTypMinConditionsSymbol
IsnkLkg13.2
IsnkLkg28
IuldHS
ThsOn
ThsOffLsOn
TlsOffHsOn
OUT (1−6) = VSx = 13.2 V
OUT (1−6) = VSx = 28 V
= 5 V, VSx = 13.2 V−2.0−1.5−1.1A
CC
= 5 V, VSx = 13.2 V1.11.52.0A
CC
V
= 5 V, VSx = 13.2 V
CC
V
= 5 V, VSx = 13.2 V−7.5−2.5−mA
CC
= 5 V, VSx = 13.2 V200350600
CC
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
load
load
load
load
load
load
load
load
load
load
load
load
load
load
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
−
−
−2.57.5
−120165
−2045
−120165
−3575
103050
103050
103050
103050
5−−
5−−
−120165
−2045
−120165
−3575
V
= 5 V, EN = 0/5 V
CC
Twr (Note 3)120140170°C
Low
VthInH
VthInL
2.0
−
VthInHys50150300mV
Rpdx EN = SI = SCLK = V
CC
50125200
−
1.0
−
2.0
mA
mA
ms
mA
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
−
−
0.6
−
V
V
kW
kW
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NCV7723B
ELECTRICAL CHARACTERISTICS
(−40°C ≤ T
LOGIC OUTPUT − SO
Output High
Output LowVsoL ISINK = 1.6 mA−−0.4V
Tri−state LeakageItriStLkg CSB = 5 V−5−5
Tri−state Output CapacitanceItriStCout CSB = VCC, 0 V < V
SERIAL PERIPHERAL INTERFACE
SCLK Frequency
SCLK Clock PeriodTpClk V
SCLK High TimeTclkH185−−ns
SCLK Low TimeTclkL285−−ns
SCLK Setup TimeTclkSup3, 485−−ns
SI Setup TimeTsiSup11
SI Hold TimeTsiH12
CSB Setup TimeTcsbSup5, 6
CSB High TimeTcsbH (Note 4)7
SO enable after CSB falling edgeTenSo8
SO disable after CSB rising edgeTdisSo9
SO Rise/Fall TimeTsoR/F Cload = 40 pF (Note 3)−−1025ns
SO Valid TimeTsoV Cload = 40 pF (Note 3)
EN Low Valid TimeTenL V
EN High to SPI ValidTenHspiV−
SRR Delay Between Consecutive FramesTsrr (Note 5)−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Not production tested.
4. This is the minimum time the user must wait between SPI commands.
5. This is the minimum time the user must wait between consecutive SRR requests.
≤ 150°C, 5.5 V ≤ VSx ≤ 40 V, 3.15 V ≤ VCC ≤ 5.25 V, EN = VCC, unless otherwise specified.) (continued)
J
CharacteristicUnitMaxTypMinConditionsSymbol
VsoH ISOURCE = −1 mAV
< 5.25 V (Note 3)−−15pF
CC
CC
0.6
–
Fclk−−−5.0MHz
= 5 V
CC
V
= 3.3 V−
CC
200
500
50
50
100
5.0
−
−
10
−
SCLK ↑ to SO 50%
= 5 V; EN H → L 50% to
CC
OUTx turning off 50%
−
10
−
150
−−V
mA
−
−
−
ns
−
−−ns
−−ns
−−ns
−−
ms
−200ns
−200ns
50100ns
−−
−100
−−
ms
ms
ms
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NCV7723B
CHARACTERISTIC TIMING DIAGRAMS
TlsTr
TlsOff
90%
LS Turn OFF
HS Turn ON
CSB
LS Turn On
10%
TlsOffHsOn
90%
10%
ThsTr
90%
ThsOn
TlsTf
90%
TlsOn
HS Turn Off
CSB
10%
ThsOffLsOn
90%
10%
ThsTf
90%
ThsOff
Figure 4. Detailed Driver Timing
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