Semiconductor NCV7723B User Manual

Hex Half-Bridge Driver
NCV7723B
The NCV7723B is a six channel half−bridge driver with protection features designed specifically for automotive and industrial motion control applications. The product has independent controls and diagnostics, and the drivers can be operated in forward, reverse, brake, and high impedance states. The device is controlled via a 16 bit SPI interface and is daisy chain compatible. Outputs 1 and 2 can be controlled through an external PWM signal.
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Features
Low Quiescent Current Sleep Mode
HighSide and LowSide Drivers
Connected in HalfBridge Configurations
Integrated Freewheeling Protection (LS and HS)
500 mA Typical, 1.1 A Peak Current
DS(on)
= 0.8 W (Typ)
R
OUT1 and OUT2 External PWM Control
5 MHz SPI Communication
16 Bit Frame Error Detection
Daisy Chain Compatible with Multiple of 8 bit Devices
Compliance with 3.3 V and 5 V Systems
Undervoltage and Overvoltage Lockout
Per Channel Fault Reporting
Overcurrent Protection
Overtemperature Protection
Underload Detection (HS and LS)
Exposed Pad Package
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP Capable
This is a PbFree Device
MARKING DIAGRAM
NCV7723B
AWLYWWG
SSOP24 NB EP
CASE 940AK
NCV7723B = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = PbFree Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 23 of this data sheet.
Typical Applications
Automotive
Industrial
DC Motor Management for HVAC Application
© Semiconductor Components Industries, LLC, 2018
February, 2020 − Rev. 1
1 Publication Order Number:
NCV7723B/D
NCV7723B
13.2 V
10 mF 0.1 mF
Voltage
Regulator
Watchdog
VS1
VS2
VCC
0.1 mF
EN
PWM1
PWM2
NCV7723B
Power On
Reset
Control
Logic
Protection:
Under Load
Over Temperature
Undervoltage
Overvoltage Over Current
Highside
Driver
Lowside
Driver
HS
LS
HS
LS
HS
LS
HS
LS
Highside
Driver
Lowside
Driver
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
uC
SO
SI
SCLK
CSB
16Bit
Serial
Data
Interface
GND
Figure 1. Typical Application
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NCV7723B
VS1
EN
VCC
SO
SCLK
CSB
PWM1
PWM2
VS
ENABLE
POR
SI
VS1, VS2
Overvoltage
BIAS
SPI and 16 Bit Logic Control
Lockout
Fault
Reporting
VS1
VS1
VS2
VS2
Charge
Pump
Control
Logic
Fault
DRIVE1
Wave Shaping
Wave Shaping
VS
HS+ LS Under Load
Overcurrent
Thermal Warning &
Shutdown
DRIVE 2
DRIVE 3
DRIVE 4
VS
High Side
Driver
OUT1
Low Side
Driver
OUT2
OUT3
OUT4
Undervoltage
Lockout
GND
GND
OUT1
OUT5
NC
VCC
SO
EN
NC
OUT6
OUT4
GND
SI
GND
GND
GND
Figure 2. Block Diagram
1
2
3
4
5
6
7
8
9
10
11
12 13
EPAD
VS2
24
23
22
21
20
19
18
17
16
15
14
VS1
VS2
GND
OUT2
NC
VS1
SCLK
CSB
PWM2
PWM1
VS2
NC
OUT3
GND
DRIVE 5
DRIVE 6
OUT5
OUT6
Figure 3. Pinout – SSOP24 NB EP
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NCV7723B
PIN FUNCTION DESCRIPTION The pinout for the HalfBridge Driver in SSOP24 NB EP package is shown in the table below.
Pin#
SSOP24
1 GND Ground. Must be connected to other GND pins externally.
2 OUT1 Halfbridge output 1
3 OUT5 Halfbridge output 5
4 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
5 SI 16 bit serial communication input. 3.3 V / 5 V (TTL) Compatible internally pulled down.
6 VCC Power supply input for Logic.
7 SO 16 bit serial communication output. 3.3 V / 5 V Compliant
8
9 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
10 OUT6 Halfbridge output 6
11 OUT4 Halfbridge output 4
12 GND Ground. Must be connected to other GND pins externally.
13 GND Ground. Must be connected to other GND pins externally.
14 OUT3 Halfbridge output 3
15 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
16 VS2 Power Supply input for outputs 3, 4, and 6. This pin must be connected to VS1 externally.
17 PWM1 External PWM input for output 1. 3.3 V / 5 V (TTL) Compatible internally pulled down. Connect to ground or
18 PWM2 External PWM input for output 2. 3.3 V / 5 V (TTL) Compatible internally pulled down. Connect to ground or
19
20 SCLK Serial communication clock input. 3.3 V / 5 V (TTL) Compatible internally pulled down.
21 VS1 Power Supply input for outputs 1, 2, and 5. This pin must be connected to VS2 externally.
22 NC No Connection. This pin should be isolated from any traces or via on the PCB board.
23 OUT2 Halfbridge output 2
24 GND Ground. Must be connected to other GND pins externally.
EPAD Exposed Pad Connect to GND or leave unconnected.
Symbol Description
EN Enable active high; wakes the device from sleep mode. 3.3 V / 5 V (TTL) Compatible internally pulled down.
leave floating if unused.
leave floating if unused.
CSB Chip select bar active low; enables serial communication operation. 3.3 V / 5 V (TTL) Compatible internally
pulled up.
MAXIMUM RATINGS (Voltages are with respect to GND)
Rating
VSx Pin Voltage (VS1, VS2)
(DC) (AC), t < 500 ms, Ivsx > 2 A
Pin Voltage (Vcc, SI, SCLK, CSB, SO, EN, PWM1, PWM2) VioMax 0.3 to 5.5 V
OUTx Pin Voltage
(DC) (AC) (AC), t < 500 ms, IOUTx > 1.1 A (AC), t < 500 ms, IOUTx < 1 A
OUTx Pin Current (OUT1, ..., OUT6) IoutxImax 2.0 to 2.0 A
Junction Temperature Range T
Storage Temperature Range Tstr 55 to 150 °C
Peak Reflow Soldering Temperature: Pb−free 60 to 150 seconds at 217°C (Note 1) 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Symbol Value Unit
VsxdcMax
VSxac
VoutxDc VoutxAc
J
0.3 to 45
1.0
0.3 to 45
0.3 to 45
1.0
1.0
40 to 150 °C
V
V
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NCV7723B
ATTRIBUTES
Characteristic Symbol Value Unit
Short Circuit Reliability Characterization AECQ10x Grade A
ESD Capability
Human Body Model per AECQ100002 VSx, OUTx
All Other Pins
Charged Device Model per AECQ100011
Moisture Sensitivity Level MSL MSL2
Package Thermal Resistance – Stillair
Junction–to–Ambient (Note 2) Junction–to–Board (Note 2)
2. Based on JESD51−7, 1.6 mm thick FR4, 2S2P PCB with 600 mm2 2 oz. copper and 18 thermal vias to 80x80 mm 1 oz. internal spreader
planes. Simulated with each channel dissipating 0.2 W.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Max Unit
Digital Supply Input Voltage VCCOp 3.15 5.25 V
Battery Supply Input Voltage (VS1 = VS2) VSxOp 5.5 32 V
DC Output Current IxOp 0.5 A
Junction Temperature TjOp 40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
Vesd4k Vesd2k
Vesd750
R
q
JA
R
Y
JBOARD
≥ ±4.0 kV ≥ ±2.0 kV
≥ ±750 V
32.1
21.8
°C/W °C/W
ELECTRICAL CHARACTERISTICS
(40°C T
POWER SUPPLIES
Supply Current (VS1 + VS2)
Supply Current (VS1 + VS2)
Supply Current (Vcc)
Total Sleep Mode Current
VCC Poweron Reset Threshold VCCpor V
VSx Undervoltage Detection Threshold VSxuv VSx decreasing
VSx Undervoltage Detection Hysteresis VSxuHys 100 450 mV
VSx Overvoltage Detection Threshold VsXov VSx increasing
VSx Overvoltage Detection Hysteresis VSxoHys 2.5 V
DRIVER OUTPUT CHARACTERISTICS
Output High R
Output Low R
Source Leakage Current
150°C, 5.5 V VSx 40 V, 3.15 V VCC 5.25 V, EN = VCC, unless otherwise specified.)
J
Characteristic
Sleep Mode
Symbol Conditions Min Typ Max Unit
IqVSx85 VS1 = VS2 = 13.2 V, V
40°C to 85°C
CC
= 0 V
IvsOp EN = VCC, 5.5V < VSx < 32 V
Active Mode
No Load,All Outputs Off
CSB = VCC, EN = SI = SCLK = 0 V
Sleep Mode
Active Mode
IqV
CC
IVCCOp
EN = CSB = V
40°C to 85°C
, SI = SCLK = 0 V
CC
No Load, All Outputs Off
IqTot Sleep Mode, 40°C to 85°C
I(VS1) + I(VS2) + I(VCC)
VS1 = VS2 = 13.2 V, No Load
increasing 2.70 2.90 V
CC
VSx increasing
VSx decreasing
(source) RDSonHS Iout = 500 mA, Vs = 13.2 V
DS(on)
(sink) RDSonLS Iout = 500 mA, Vs = 13.2 V
DS(on)
IsrcLkg13.2
IsrcLkg28
V
= 3.15 V
CC
V
= 3.15 V
CC
V
= 5 V, OUT (1−6) = 0 V, EN = 0/5 V
CC
VSx = 13.2 V VSx = 28 V
1.0 2.5
0.5 1.0 mA
1.0
2.5
1.5
3.0
2.0 5.0
3.5
4.1
4.3
4.5
4.7
3.7
32
29.53633.54037.5
0.8 1.8
0.8 1.8
1.0
2.0−−
mA
mA
mA
mA
V
V
W
W
mA mA
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NCV7723B
ELECTRICAL CHARACTERISTICS
(40°C T
DRIVER OUTPUT CHARACTERISTICS
Sink Leakage Current
Overcurrent Shutdown Threshold (Source) IsdSrc V
Overcurrent Shutdown Threshold (Sink) IsdSnk V
Over Current Delay Timer TdOc 10 25 50
Underload Detection Threshold (Low Side) IuldLS
Underload Detection Threshold (High Side)
Underload Detection Delay Time TdUld V
Body Diode Forward Voltage IbdFwd If = 500 mA 0.9 1.3 V
DRIVER OUTPUT SWITCHING CHARACTERISTICS
High Side Turn On Time
High Side Turn Off Time ThsOff
Low Side Turn On Time TlsOn
Low Side Turn Off Time TlsOff
High Side Rise Time ThsTr
High Side Fall Time ThsTf
Low Side Rise Time TlsTr
Low Side Fall Time TlsTf
High Side Off to Low Side On NonOverlap Time
Low Side Off to High Side On NonOverlap Time
PWM High to High Side On Time ThsOnPWM
PWM Low to High Side Off Time ThsOffPWM
PWM High to Low Side On Time TlsOnPWM
PWM Low to Low Side Off Time TlsOffPWM
THERMAL RESPONSE
Thermal Warning
Thermal Warning Hysteresis TwHy (Note 3) 20 °C
Thermal Shutdown Ts d (Note 3) 150 175 200 °C
Thermal Shutdown Hysteresis TsdHy (Note 3) 20 °C
LOGIC INPUTS EN, SI, SCLK, CSB, PWM1, PWM2
Input Threshold High
Input Hysteresis SI, SCLK, CSB, PWM1, PWM2
Input Hysteresis EN VthENHys 150 400 800 mV
Pulldown Resistance EN, SI, SCLK, PWM1, PWM2
Pullup Resistance CSB RpuCSB CSB = 0 V 50 125 250
Input Capacitance Cinx (Note 3) 15 pF
150°C, 5.5 V VSx 40 V, 3.15 V VCC 5.25 V, EN = VCC, unless otherwise specified.) (continued)
J
Characteristic UnitMaxTypMinConditionsSymbol
IsnkLkg13.2
IsnkLkg28
IuldHS
ThsOn
ThsOffLsOn
TlsOffHsOn
OUT (16) = VSx = 13.2 V OUT (16) = VSx = 28 V
= 5 V, VSx = 13.2 V −2.0 −1.5 −1.1 A
CC
= 5 V, VSx = 13.2 V 1.1 1.5 2.0 A
CC
V
= 5 V, VSx = 13.2 V
CC
V
= 5 V, VSx = 13.2 V −7.5 −2.5 mA
CC
= 5 V, VSx = 13.2 V 200 350 600
CC
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
Vs = 13.2 V, R
load
load
load
load
load
load
load
load
load
load
load
load
load
load
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
= 70 W
2.5 7.5
120 165
20 45
120 165
35 75
10 30 50
10 30 50
10 30 50
10 30 50
5
5
120 165
20 45
120 165
35 75
V
= 5 V, EN = 0/5 V
CC
Twr (Note 3) 120 140 170 °C
Low
VthInH VthInL
2.0
VthInHys 50 150 300 mV
Rpdx EN = SI = SCLK = V
CC
50 125 200
1.0
2.0
mA mA
ms
mA
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
0.6
V V
kW
kW
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NCV7723B
ELECTRICAL CHARACTERISTICS
(40°C T
LOGIC OUTPUT SO
Output High
Output Low VsoL ISINK = 1.6 mA 0.4 V
Tri−state Leakage ItriStLkg CSB = 5 V −5 5
Tri−state Output Capacitance ItriStCout CSB = VCC, 0 V < V
SERIAL PERIPHERAL INTERFACE
SCLK Frequency
SCLK Clock Period TpClk V
SCLK High Time TclkH 1 85 ns
SCLK Low Time TclkL 2 85 ns
SCLK Setup Time TclkSup 3, 4 85 ns
SI Setup Time TsiSup 11
SI Hold Time TsiH 12
CSB Setup Time TcsbSup 5, 6
CSB High Time TcsbH (Note 4) 7
SO enable after CSB falling edge TenSo 8
SO disable after CSB rising edge TdisSo 9
SO Rise/Fall Time TsoR/F Cload = 40 pF (Note 3) 10 25 ns
SO Valid Time TsoV Cload = 40 pF (Note 3)
EN Low Valid Time TenL V
EN High to SPI Valid TenHspiV
SRR Delay Between Consecutive Frames Tsrr (Note 5)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Not production tested.
4. This is the minimum time the user must wait between SPI commands.
5. This is the minimum time the user must wait between consecutive SRR requests.
150°C, 5.5 V VSx 40 V, 3.15 V VCC 5.25 V, EN = VCC, unless otherwise specified.) (continued)
J
Characteristic UnitMaxTypMinConditionsSymbol
VsoH ISOURCE = 1 mA V
< 5.25 V (Note 3) 15 pF
CC
CC
0.6
Fclk 5.0 MHz
= 5 V
CC
V
= 3.3 V
CC
200 500
50
50
100
5.0
10
SCLK to SO 50%
= 5 V; EN H → L 50% to
CC
OUTx turning off 50%
10
150
V
mA
ns
ns
ns
ns
ms
200 ns
200 ns
50 100 ns
100
ms
ms
ms
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NCV7723B
CHARACTERISTIC TIMING DIAGRAMS
TlsTr
TlsOff
90%
LS Turn OFF
HS Turn ON
CSB
LS Turn On
10%
TlsOffHsOn
90%
10%
ThsTr
90%
ThsOn
TlsTf
90%
TlsOn
HS Turn Off
CSB
10%
ThsOffLsOn
90%
10%
ThsTf
90%
ThsOff
Figure 4. Detailed Driver Timing
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