SANYO LC573104A, LC573102A Datasheet

Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges,or other parameters) listed in products specifications of any and all SANYO products described or contained herein.
CMOS IC
4-bit Single Chip Microcontroller
Ordering number:ENN*4144
LC573104A, 573102A
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Preliminary Overview
LC573104A and LC573102A are CMOS 4-bit microcontrollers featuring low-voltage operation and low power dissipation. Both LC573104A and LC573102A incorporate a 4-bit par­allel processing ALU, 4K bytes/2K bytes ROM, a 64×4-bit RAM, a 16-bit timer, and an infrared remote control trans­mission carrier output circuit.
Applications
• Remote controller.
• Control of small measuring instruments.
Features
• ROM :4096×8 bits (LC573104A)
• RAM : 64×4 bits
• Cycle time
elcyC
emit
sµ6.71
2048×8 bits (LC573102A)
kcolcmetsyS
rotareneg
noitallicsocimareC
tiucric
noitallicsO ycneuqerf
zHk554V0.6ot3.2
ylppuS egatlov
Package Dimensions
unit:mm
3112A-MFP24S
[LC573104A, 573102A]
24
112
Pin Assignment
12.5
0.35
13
5.4
0.15
1.7max
1.5
0.1
1.0
(0.75)
7.6
0.63
SANYO : MFP24S
• Current Drain a. At normal operation
tnerruC
niard
pytAµ051noitallicsoRCzHk554V0.3 pytAµ004noitallicsoRCzHk554V0.5
kcolcmetsyS
rotareneg
noitallicsO ycneuqerf
ylppuS egatlov
b. HALT mode
tnerruC
niard
pytAµ08noitallicsoRCzHk554V0.3
pytAµ003noitallicsoRCzHk554V0.5
kcolcmetsyS
rotareneg
noitallicsO ycneuqerf
ylppuS egatlov
c. HOLD mode
egakaeL
tnerruc
pytAµ1.0
noitidnoC
noitallicsoRCnehW
edomPOTStasi
noitallicsO ycneuqerf
zHk554V0.5
ylppuS egatlov
O1501TN (KT)/13195JN/5252JN No.4144–1/16
LC573104A, 573102A
• Port
· Input port (S port, M port) : 2-port (8 pins) [Key scan input port]
· Input/Ouput port : 3-port (10 pins) P0 port, P1 port 2-port (8 pins) [Key scan output port] P2 port 1-port (2 pins) [Key scan expansion port]
[LED direct drivable port]
• Infrared remote control carrier generation circuit.
·Software-controllable remote control carrier output ON/OFF.
·Software-controllable carrier frequency and duty ratio. <38kHz-1/3 duty, 38kHz-1/2 duty, 57kHz-1/2 duty> (When fixed carrier signal is output, it is specified by mask option)
·1kHz to 200kHz infrared remote control transmission carrier frequency. (When carrier output is selected by timer at mask option, and when 455kHz CR oscillator is used)
·Infrared carrier output-dedicated terminal built-in (CA terminal).
·108ms HALT-mode cancel signal output.
• Timer
·16-bit software-controllable Timer Timer input clock : Ceramic (CR) oscillation frequency (455kHz).
·108ms HALT release request signal generation timer (Free running timer).
·Watchdog timer (changed over between USED/UNUSED by mask option)
• Sub-routine stack level
·2 levels
• Oscillation circuit
·Ceramic (CR) oscillation circuit : 455kHz (for System clock generation), Feedback resistor built-in.
• Standby function
·HALT mode HALT mode used to reduce current drain. HALT mode suspends program execution.
Following shows how to release the HALT mode.
(A) System reset (B) HALT mode release request signal.
·HOLD mode HOLD mode stops ceramic resonator (CR). The HOLD mold can be released in two ways. (A) System reset (B) Apply H level input to S port pin or M port pin. (However, it is necessary to set S port or M port HOLD mode
release permission flag beforehand.)
• From of shipment
·MFP-24S (1.0mm pitch) and chip.
NOTE : When dipping in solder to mount the MFP package on board, contact SANYO for instructions.
No.4144–2/16
LC573104A, 573102A
The Application Development System for the LC573100 Series.
(1) Manual
(A) Users Manual : LC573100 Series Users Manual. (B) Development Tool Manual : LC573100 Series Development Tool Manual.
(2) Development Tools
• Tools for application development of the LC573100 Series. (A) Personal computer (MS-DOS based). (B) Cross assembler (LC573100.EXE). (C) Mask option generator (SU573100.EXE).
• Tools to evaluate application development of the LC573100 Series. (A) EVA chip (LC5797).
NOTE 1) As RAM capacity differs between EVA chip (LC5797) and the LC573100 Series, always check before pro-
gramming and debugging. LC573100 : 64×4 bits LC5797 : 256×4 bits
NOTE 2) Always keep the DPH value in mind when programming. Only DPH ‘0’ to ‘3’ may be used as the RAM
address. If DPH other than ‘0’ to ‘3’ is used as RAM address when pro gramming, SANYO will not be liable for any trouble caused.
(B) EVA chip board (TB5730).
NOTE) The application evaluation board is the evaluation board made by the user.
(C) Evaluation board [EVA420 (Monitor ROM : ER-573000)] (D) Display and mask option data control board [DCB-1A (REV3.6)]
Development Support System Outline
Do not cross or twist these cables.
No.4144–3/16
(A) Block Diagram
(LC573104A)
LC573104A, 573102A
No.4144–4/16
Die Specifications
Pad Layout
LC573104A, 573102A
Chip size : 3.51mm×3.19mm Chip thickness : 480µm Pad size : 120µm×120µm
Pad coordinates
MFP24S pin assignment
Pad
Pin
No.
Name
17
1
V 18 19 20 21 22 23 24
1 2 3 4 5
DD
2
CA
3
P20
4
P21
5
P00
6
P01
7
P02
8
P03
9
P10
10
P11
11
P12
12
P13
13
S1
X
(µm)Y(µm)
1465
1155 – 305 –1485 –1485 –1485 –1485 –1485 –1485 –1485 –1485 –1485 – 410
– 220 – 480 –1395 –1395
1365 1365 1365 1365 1110
870 565 325
20
MFP24S pin assignment
Pad
Pin
No.
Name
6
14 7 8 – – 9
10 11 12 13 14 15 16
S2
15
S3
16
S4
17
TEST
18
TEST
19
M1
20
M2
21
M3
22
M4
23
RES
24
V
SS
25
CF1
26
CF2
X
(µm)Y(µm)
360
–1395
560
–1395
760
–1395
960
–1395
1140
–1395
1560
–1395
1560
– 905
1560
– 685
1560
– 445 1465 1465 1465 1465
330 570 755
1155
• The chip center is the origin of the above pad coordinates. The X, Y values represent the coordinate of the pad center.
• When dipping the MFP24S package in solder to mount on boards, contact SANYO for instructions, etc.
• Chip substrate should be connected to VSS or left open.
No.4144–5/16
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