Sanyo FX853 Specifications

Ordering number:EN4893

FX853

MOSFET:N-Channel Silicon MOSFET

SBD:Schottky Barrier Diode

DC-DC Converter Applications

Features

·Composite type composed of a low ON-resistance N- channel MOSFET for ultrahigh-speed switching and low-voltage driving and a fast-recovery, low forward -voltage Schottky barrier diode. Facilitates highdensity mounting.

·The FX853 is formed with 2 chips, one being equivalent to the 2SK1467 and the other the SB05-05P, placed in one package.

Electrical Connection

1:Gate

2:Source

3:No connection 4:Anode 5:Cathode 6:Drain

(Top view)

Specifications

Absolute Maximum Ratings at Ta = 25˚C

Package Dimensions

unit:mm

2119

[FX853]

1:Gate

2:Source

3:No connection 4:Anode 5:Cathode 6:Drain

SANYO:XP6 (Bottom view)

Parameter

Symbol

Conditions

Ratings

Unit

 

 

 

 

 

[MOSFET]

 

 

 

 

 

 

 

 

 

Drain-to-Source Voltage

VDSS

 

30

V

Gate-to-Source Voltage

VGSS

 

±15

V

Drain Current (DC)

ID

 

2

A

Drain Current (Pulse)

IDP

PW≤10µs, duty cycle≤1%

8

A

Allowable Power Dissipation

PD

Tc=25˚C

6

W

 

PD

Mounted on ceramic board (750mm2×0.8mm)

1.5

W

Channel Temperature

Tch

 

150

˚C

 

 

 

 

 

Storage Temperature

Tstg

 

–55 to +150

˚C

 

 

 

 

 

[SBD]

 

 

 

 

 

 

 

 

 

Repetitive Peak Reverse Voltage

VRRM

 

50

V

Non-repetitive Peak Reverse Surge Voltage

VRSM

 

55

V

Average Rectified Current

IO

 

500

mA

Surge Forward Current

IFSM

50Hz sine wave, 1 cycle

5

A

Junction Temperature

Tj

 

–55 to +125

˚C

 

 

 

 

 

Storage Temperature

Tstg

 

–55 to +150

˚C

 

 

 

 

 

· Marking:853

 

 

Continued on next page.

SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquaters

TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN

52098HA (KT)/71095TS (KOTO) TA-0118 No.4893-1/4

Sanyo FX853 Specifications

FX853

Continued from preceding page.

Electrical Characteristics at Ta = 25˚C

Parameter

 

Symbol

 

Conditions

 

 

Ratings

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

min

typ

max

 

 

 

 

 

 

 

 

 

 

 

[MOSFET]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D-S Breakdown Voltage

V(BR)DSS

ID=1mA, VGS=0

 

30

 

 

V

Zero-Gate Voltage Drain Current

 

IDSS

VDS=30V, VGS=0

 

 

 

100

µA

Gate-to-Source Leakage Current

 

IGSS

VGS=±12V, VDS=0

 

 

 

±10

µA

Cutoff Voltage

 

VGS(off)

VDS=10V, ID=1mA

 

1.0

 

2.0

V

Forward Transfer Admittance

 

| Yfs |

VDS=10V, ID=1A

 

1.2

2.0

 

S

Static Drain-to-Source ON-State Resistance

 

RDS(on)

ID=1A, VGS=10V

 

 

0.18

0.25

Ω

 

 

RDS(on)

ID=1A, VGS=4V

 

 

0.25

0.38

Ω

Input Capacitance

 

Ciss

VDS=10V, f=1MHz

 

 

170

 

pF

Output Capacitance

 

Coss

VDS=10V, f=1MHz

 

 

100

 

pF

Reverse Transfer Capacitance

 

Crss

VDS=10V, f=1MHz

 

 

30

 

pF

Turn-ON Delay Time

 

td(on)

See specified Test Circuit

 

 

7

 

ns

Rise Time

 

tr

See specified Test Circuit

 

 

11

 

ns

Turn-OFF Delay Time

 

td(off)

See specified Test Circuit

 

 

35

 

ns

Fall Time

 

tf

See specified Test Circuit

 

 

25

 

ns

Diode Forward Voltage

 

VSD

IS=2A, VGS=0

 

 

 

1.0

 

V

[SBD]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Reverse Voltage

 

VR

IR=200µA

 

 

50

 

 

V

Forward Voltage

 

VF

IF=500mA

 

 

 

 

0.55

V

Reverse Current

 

IR

VR=25V

 

 

 

 

50

µA

Interterminal Capacitance

 

C

VR=10V, f=1MHz Cycle

 

 

18

 

pF

Reverse Recovery Time

 

trr

IF=IR=100mA, See specified Test CIrcuit

 

 

 

10

ns

Thermal Resistance

 

Rthj-a

Mounted on ceramic board (750mm2×0.8mm)

 

 

100

 

˚C/W

Switching Time Test CIrcuit

[MOSFET]

Trr Test Circuit

[SBD]

 

 

 

No.4893-2/4

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