Ordering number:EN4893
FX853
MOSFET:N-Channel Silicon MOSFET
SBD:Schottky Barrier Diode
DC-DC Converter Applications
Features
·Composite type composed of a low ON-resistance N- channel MOSFET for ultrahigh-speed switching and low-voltage driving and a fast-recovery, low forward -voltage Schottky barrier diode. Facilitates highdensity mounting.
·The FX853 is formed with 2 chips, one being equivalent to the 2SK1467 and the other the SB05-05P, placed in one package.
Electrical Connection
1:Gate
2:Source
3:No connection 4:Anode 5:Cathode 6:Drain
(Top view)
Specifications
Absolute Maximum Ratings at Ta = 25˚C
Package Dimensions
unit:mm
2119
[FX853]
1:Gate
2:Source
3:No connection 4:Anode 5:Cathode 6:Drain
SANYO:XP6 (Bottom view)
Parameter |
Symbol |
Conditions |
Ratings |
Unit |
|
|
|
|
|
[MOSFET] |
|
|
|
|
|
|
|
|
|
Drain-to-Source Voltage |
VDSS |
|
30 |
V |
Gate-to-Source Voltage |
VGSS |
|
±15 |
V |
Drain Current (DC) |
ID |
|
2 |
A |
Drain Current (Pulse) |
IDP |
PW≤10µs, duty cycle≤1% |
8 |
A |
Allowable Power Dissipation |
PD |
Tc=25˚C |
6 |
W |
|
PD |
Mounted on ceramic board (750mm2×0.8mm) |
1.5 |
W |
Channel Temperature |
Tch |
|
150 |
˚C |
|
|
|
|
|
Storage Temperature |
Tstg |
|
–55 to +150 |
˚C |
|
|
|
|
|
[SBD] |
|
|
|
|
|
|
|
|
|
Repetitive Peak Reverse Voltage |
VRRM |
|
50 |
V |
Non-repetitive Peak Reverse Surge Voltage |
VRSM |
|
55 |
V |
Average Rectified Current |
IO |
|
500 |
mA |
Surge Forward Current |
IFSM |
50Hz sine wave, 1 cycle |
5 |
A |
Junction Temperature |
Tj |
|
–55 to +125 |
˚C |
|
|
|
|
|
Storage Temperature |
Tstg |
|
–55 to +150 |
˚C |
|
|
|
|
|
· Marking:853 |
|
|
Continued on next page. |
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquaters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
52098HA (KT)/71095TS (KOTO) TA-0118 No.4893-1/4
FX853
Continued from preceding page.
Electrical Characteristics at Ta = 25˚C
Parameter |
|
Symbol |
|
Conditions |
|
|
Ratings |
|
Unit |
|
|
|
|
|
|
||||
|
|
|
|
|
|
min |
typ |
max |
|
|
|
|
|
|
|
|
|
|
|
[MOSFET] |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||
D-S Breakdown Voltage |
V(BR)DSS |
ID=1mA, VGS=0 |
|
30 |
|
|
V |
||
Zero-Gate Voltage Drain Current |
|
IDSS |
VDS=30V, VGS=0 |
|
|
|
100 |
µA |
|
Gate-to-Source Leakage Current |
|
IGSS |
VGS=±12V, VDS=0 |
|
|
|
±10 |
µA |
|
Cutoff Voltage |
|
VGS(off) |
VDS=10V, ID=1mA |
|
1.0 |
|
2.0 |
V |
|
Forward Transfer Admittance |
|
| Yfs | |
VDS=10V, ID=1A |
|
1.2 |
2.0 |
|
S |
|
Static Drain-to-Source ON-State Resistance |
|
RDS(on) |
ID=1A, VGS=10V |
|
|
0.18 |
0.25 |
Ω |
|
|
|
RDS(on) |
ID=1A, VGS=4V |
|
|
0.25 |
0.38 |
Ω |
|
Input Capacitance |
|
Ciss |
VDS=10V, f=1MHz |
|
|
170 |
|
pF |
|
Output Capacitance |
|
Coss |
VDS=10V, f=1MHz |
|
|
100 |
|
pF |
|
Reverse Transfer Capacitance |
|
Crss |
VDS=10V, f=1MHz |
|
|
30 |
|
pF |
|
Turn-ON Delay Time |
|
td(on) |
See specified Test Circuit |
|
|
7 |
|
ns |
|
Rise Time |
|
tr |
See specified Test Circuit |
|
|
11 |
|
ns |
|
Turn-OFF Delay Time |
|
td(off) |
See specified Test Circuit |
|
|
35 |
|
ns |
|
Fall Time |
|
tf |
See specified Test Circuit |
|
|
25 |
|
ns |
|
Diode Forward Voltage |
|
VSD |
IS=2A, VGS=0 |
|
|
|
1.0 |
|
V |
[SBD] |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reverse Voltage |
|
VR |
IR=200µA |
|
|
50 |
|
|
V |
Forward Voltage |
|
VF |
IF=500mA |
|
|
|
|
0.55 |
V |
Reverse Current |
|
IR |
VR=25V |
|
|
|
|
50 |
µA |
Interterminal Capacitance |
|
C |
VR=10V, f=1MHz Cycle |
|
|
18 |
|
pF |
|
Reverse Recovery Time |
|
trr |
IF=IR=100mA, See specified Test CIrcuit |
|
|
|
10 |
ns |
|
Thermal Resistance |
|
Rthj-a |
Mounted on ceramic board (750mm2×0.8mm) |
|
|
100 |
|
˚C/W |
|
Switching Time Test CIrcuit |
[MOSFET] |
Trr Test Circuit |
[SBD] |
|
|
|
No.4893-2/4