SanDisk INAND Product Manual

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Page 1

SanDisk

Product Manual

Version 3.1

Document No. 80-36-00450

December 2006

SanDisk Corporation

Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035

Phone (408) 801-1000 • Fax (408) 801-8657

www.sandisk.com

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Revision 3.1 SanDisk iNAND Product Manual

SanDisk

Corporation general policy does not recommend the use of its products in life support applications where in a failure or malfunction of the product may directly threaten life or injury. Per SanDisk Terms and Conditions of Sale, the user of SanDisk products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages. See “Disclaimer of Liability.”

This document is for information use only and is subject to change without prior notice. SanDisk Corporation assumes no responsibility for any errors that may appear in this document, nor for incidental or consequential damages resulting from the furnishing, performance or use of this material. No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk Corporation.

All parts of the SanDisk documentation are protected by copyright law and all rights are reserved.

SanDisk and the SanDisk logo are registered trademarks of SanDisk Corporation. CompactFlash is a U.S. registered trademark of SanDisk Corporation.

Product names mentioned herein are for identification purposes only and may be trademarks and/or registered trademarks of their respective companies.

SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032; 5,095,344; 5,168,465; 5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and foreign patents awarded and pending.

Lit. No. 80-36-00450 Rev. 3.1 12/06 Printed in U.S.A.

Revision History September 2005 Revision 0.1—First draft of initial release October 2005 Revision 0.2—Second draft of initial release October 2005 Revision 0.3—Third draft of initial release October 2005 Revision 1.0—Release November 2005 Revision 1.1—Minor revision in Section 1.2; changed area in Table 1-1 January 2006 Revision 2.0—Added 4GB specifications February 2006 Revision 2.1—Added footnote for MB/GB calculation in Section 2, 3 & App B November 2006 Revision 3.0—Major revision to include high capacity information and other changes to the SDA spec;

updated contact information.

December 2006 Revision 3.1—Changed G8 pin from “VCORE” to “FCAP”; adjusted capacitor specifications.

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Revision 3.1 SanDisk iNAND Product Manual

TABLE OF CONTENTS

1. Introduction...................................................................................................1-1

1.1 General Description................................................................................1-1

1.2 Features...................................................................................................1-2

1.3 Document Scope.....................................................................................1-2

1.4 iNAND Standard ....................................................................................1-2

1.5 Functional Description............................................................................1-3

1.6 Technology Independence ......................................................................1-3

1.7 Defect and Error Management................................................................1-4

1.8 Wear Leveling.........................................................................................1-4

1.9 Automatic Sleep Mode ...........................................................................1-4

1.10 iNAND—SD Bus Mode........................................................................1-4

1.11 SPI Mode...............................................................................................1-6

2. Product Specifications...................................................................................2-1

2.1 Overview ................................................................................................2-1

2.2 Typical Card Power Requirements .........................................................2-1

2.3 System Performance...............................................................................2-1

2.4 System Reliability and Maintenance ......................................................2-1

2.5 Physical Specifications...........................................................................2-2

2.6 Capacity Specifications ..........................................................................2-4

3. iNAND Interface Description .......................................................................3-1

3.1 Pins and Registers...................................................................................3-1

3.2 Bus Topologies.......................................................................................3-2

3.3 Electrical Interface..................................................................................3-3

3.4 iNAND Registers....................................................................................3-3

3.5 Data Interchange Format and Card Sizes ...............................................3-3

4. iNAND Protocol Description........................................................................4-1

4.1 General ...................................................................................................4-1

4.2 SD Bus Protocol.....................................................................................4-1

4.3 Functional Description............................................................................4-1

Appendix A Capacitor Specifications..........................................................A-1

Appendix B Ordering Information..............................................................B-1

Appendix C SanDisk Worldwide Sales Offices........................................... C-1

Appendix D Limited Warrant y....................................................................D-1

Appendix E Disclaimer of Liability.............................................................E-1

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Chapter 1 – Introduction Revision 3.1 SanDisk iNAND Product Manual

1 Introduction

1.1 General Description

The SanDisk iNAND is a very small, flash storage device, designed specifically for storage applications that put a premium on small form factor, low power and low cost. Flash is the ideal storage medium for portable, battery-powered devices. It features low power consumption and is non-volatile, requiring no power to maintain the stored data. It also has a wide operating range for temperature, shock and vibration.

iNAND is well-suited to meet the needs of small, low power, electronic devices. With a form factor measuring 12mm by 18mm by 1.2mm, iNAND is expected to be used in a wide variety of portable devices like mobile phones, pagers, and voice recorders.

To support this wide range of applications, iNAND is offered with an SD Interface. T he SD interface product is fully compatible with iNAND produc ts, and provides a 4-bit data bus for maximum performance. For compatibility with existing controllers, the iNAND offers, in addition to these interfaces, an alternate communication-protocol based on the SPI standard.

These interfaces allow for easy integration into any design, regardless of which type of microprocessor is used. All device and interface configuration data (such as maximum frequency and card identification) are stored on the device.

The SanDisk iNAND provides up to 4 GB of memory for use in mass storage applications. In addition to the mass-storage-specific flash memory chip, iNAND includes an intelligent controller, which manages interface protocols, data storage and retrieval, error correction code (ECC) algorithms, defect handling and diagnostics, power management, wear leveling, and clock control. Figure 1-1 is a block diagram of the SanDisk iNAND with SD Interface.

Figure 1-1 SanDisk iNAND Block Diagram

SanDisk iNAND

SD Bus/SPI Bus

Interface

SanDisk

Single Chip

Controller

Data In/Out

Control

Flash

Memory

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Chapter 1 – Introduction Revision 3.1 SanDisk iNAND Product Manual

1.2 Features

SanDisk iNAND product features include the following.

►Up to 4 GB of data storage

►SD-protocol compatible

►Supports SPI Mode

►Designed for portable and stationary applications that require high performance and reliable

data storage

►Voltage range 2.7 to 3.6V

Variable clock rate 0-25 MHz (default), 0-50MHz (high-speed)

►

► Up to 25 MB/sec bus transfer rate (using 4 parallel data lines)

►Correction of memory-field errors

►Built-in write protection features (permanent and temporary)

►Application-specific commands

►Standard footprint across all capacities

1.3 Document Scope

This document describes the key features and specifications of the SanDisk iNAND as well as the information required to interface it to a host system. Chapter 2 describes the physical and mechanical properties of iNAND, Chapter 3 contains the pins and register overview, and Chapter 4 gives a general overview of the SD protocol. Information about SPI Protocol can be referenced in Section 7 of the SDA Physical Layer Specification, Version 2.00.

1.4 iNAND Standard

SanDisk iNAND devices are fully compatible with the SDA Physical Layer Specification, Version 2.00. This specification is available from the SD Card Association (SDA).

SD Card Associations 2400 Camino Ramon, Suite 37 5 San Ramon, CA 94583 USA T elephone: +1 (925) 275-6615 Fax: +1 (925) 886-4870 E-mail: office@sdcard.org Website:

www.sdcard.org

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Chapter 1 – Introduction Revision 3.1 SanDisk iNAND Product Manual

1.5 Functional Description

The SanDisk iNAND contains a high-level, intelligent subsystem as shown in Figure 1-1. This intelligent (microprocessor) subsystem provides many capabilities not found in other types of memory cards. These capabilities include:

• Host independence from details of erasing and programming flash memory

• Sophisticated system for managing defects (analogous to systems found in magnetic

disk drives)

• Sophisticated system for error recovery including a powerful ECC

• Power management for low power operation

1.6 Technology Independence

The 512-byte sector size of the SanDisk iNAND is the same as that in an IDE magnetic disk drive. To write or read a sector (or multiple sectors), the host software simply issues a read or write command to the card. The command contains the address and number of sectors to write or read. The host software then waits for the command to complete.

The host software does not get involved in the details of how the flash memory is erased, programmed or read. This is extremely important because flash devices are expected to get increasingly complex in the future. Because iNAND use an intelligent on-board controller, host system software will not need to be updated as new flash memory evolves. In other words, systems that support iNAND technology today will be able to access future SanDisk devices built with new flash technology without having to update or change host software.

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Chapter 1 – Introduction Revision 3.1 SanDisk iNAND Product Manual

1.7 Defect and Error Management

The SanDisk iNAND contains a sophisticated defect and error management system. This system is analogous to the systems found in magnetic disk drives and in many cases offers enhancements. If necessary, iNAND will rewrite data from a defective sector to a good sector. This is completely transparent to the host and does not consume any user data space. The soft error rate specification for iNAND is much better than the magnetic disk drive specification. In the extremely rare case that a read error does occur, iNAND has innovative algorithms to recover the data. These defect and error management systems, coupled with the solid state construction, give SanDisk iNAND unparalleled reliability.

1.8 Wear Leveling

Wear-leveling is an intrinsic part of the erase pooling functionality of iNAND.

1.9 Automatic Sleep Mode

A unique feature of iNAND is automatic entrance and exit from sleep mode. Upon completion of an operation, cards enter sleep mode to conserve power if no further commands are received in less than 5 milliseconds (ms). The host does not have to take any action for this to occur. However, in order to achieve the lowest sleep current, the host needs to shut down its clock to the card. In most systems, cards are in sleep mode except when accessed by the host, thus conserving power.

When the host is ready to access a card in sleep mode, any command issued to it will cause it to exit sleep, and respond.

1.10 iNAND — SD Bus Mode

The following sections provide valuable information on SanDisk iNAND in SD Bus mode. SanDisk iNAND devices are fully compliant with the SDA Physical Layer Specification,

Version 2.00. Card Specific Data (CSD) Register structures are compliant with CSD Structure 1.0 and 2.0.

This section covers Negotiating Operating Conditions, Card Acquisition and Identification, Card Status, Memory Array Partitioning, Read/Write Operations, Data Transfer Rate, Data Protection in Flash Cards, Write Protection, Copy Bit, and CSD Register.

Additional practical card detection methods can be found in application notes pertaining to the SDA Physical Layer Specification, Version 2.00.

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Chapter 1 – Introduction Revision 3.1 SanDisk iNAND Product Manual

Figure 1-2 Memory Array Parti tioni n g

SanDisk iNAND Memory Module

WP Group 0

Sector 1

Block

Block1Block2Block

Sector 2

Sector 3

Sector n

WP Group 1

WP Group 2

Figure 1-3 Data Transfer Formats

Single Block Mode

Memory Sectors

Start Address

(Read)

Memory Sectors

Start Address

Memory

Sectors

(Write)

Multiple Block Mode

Memory Sectors

Memory

Sectors

Memory

Sectors

Start Address

Memory Sectors

Write

Memory

Sectors

Memory Sectors

Stop Start

Misalignment Error

Memory

Sectors

Start Address

(Read/Write)

Memory

Sectors

Read

Memory

Sectors

Memory

Sectors

Stop

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Chapter 1 – Introduction Revision 3.1 SanDisk iNAND Product Manual

Table 1-1 Mode Definitions

Mode Description

Single Block In this mode the host reads or writes one data block in a pre-specified length. The

Multiple Block This mode is similar to the single block mode, except for the host can read/write

data block transmission is protected with 16-bit CRC that is generated by the sending unit and checked by the receiving unit.

The block length for read operations is limited by the device sector size (512 bytes) but can be as small as a single byte. Misalignment is not allowed. Every data block must be contained in a single physical sector.

The block length for write operations must be identical to the sector size and the start address aligned to a sector boundary.

multiple data blocks (all have the same length) that are stored or retrieved from contiguous memory addresses starting at the address specified in the command. The operation is terminated with a stop transmission command.

Misalignment and block length restrictions apply to multiple blocks and are identical to the single block read/write operations.

1.11 SPI Mode

The SPI Mode is a secondary communication protocol for iNAND devices. This mode is a subset of the SD Protocol, designed to communicate with an SPI channel, commonly found in Motorola and other vendors’ microcontrollers. Table 1-1 contains names and descriptions of SPI Mode functions. More information about SPI Mode can be found in Section 7 or the SDA Physical Layer Specification, Version 2.00.

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Chapter 2 – Product Specifications Revision 3.1 SanDisk iNAND Product Manual

2 Product Specifications

2.1 Overview

For details about the environmental, reliability and durability specifications, refer to Section 8.1 of the SDA Physical Layer Specification, Version 2.00.

2.2 Typical Card Power Requirements

Table 2-1 iNAND Power Requirements (Ta=25°C@3.0V)

VDD (ripple: max, 60mV peak-to-peak) 2.7 V – 3.6 V Value Measurement Average

Sleep 250 uA Max Read 100 mA Max

Write 100 mA Max

2.3 System Performance

All performance values for iNAND in Table 2-2 were measured using the following conditions:

• Voltage range 2.7 V to 3.6 V

• Temperature -25° C to 85° C

• Independent of the iNAND clock frequency

Table 2-2 System Performance

Timing Maximum Value

Block Read Access Time

Block Write Access Time CMD1 to Ready after Power-up 1000 ms

2.4 System Reliability and Maintenance

Ta ble 2-3 Reliability and Maintenance Specifications

MTBF >1,000,000 hours

Preventative Maintenance None

Data Reliability <1 non-recoverable error in 1014 bits read

100 ms

250 ms

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Chapter 2 – Product Specifications Revision 3.1 SanDisk iNAND Product Manual

2.5 Physical Specifications

The SanDisk iNAND is a 56-pin, thin fine-pitched ball grid array (BGA). See Figure 2-1 (56-pin) for physical specifications and dimensions. See Figure 2-2 for a top view of the pin definitions.

Figure 2-1 iNAND Specifications (18 x 12mm Package)

Top View

Bottom View

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Chapter 2 – Product Specifications Revision 3.1 SanDisk iNAND Product Manual

Table 2-4 iNAND Package Specifications (18 x 12mm Package)

Dimension in millimeters Dimension in inches

Symbol Minimum Nominal Maximum Minimum Nominal Maximum

A --- --- 1.20 or 1.40 --- --- 0.047 A1 0.30 0.35 0.38 0.012 0.014 0.015 A2 0.69 0.74 0.79 0.027 0.029 0.031

D 17.90 18.00 18.10 0.705 0.709 0.713

E 11.90 12.00 12.10 0.469 0.472 0.476 D1 --- 7.00 --- --- 0.276 --D2 --- 11.00 --- --- 0.433 --D3 --- 13.00 --- --- 0.512 --E1 --- 7.00 --- --- 0.276 ---

e --- 1.00 --- --- 0.039 ---

b 0.45 0.50 0.55 0.018 0.020 0.022

aaa 0.10 0.004 bbb 0.10 0.004 ddd 0.15 0.006 eee 0.25 0.010

fff 0.10 0.004

MD/ME 12/11 12/11

Figure 2-2 iNAND Ball Array (Top View)

FCAP

GND

VDDG6DAT2G5CSB_DAT3

H5DUH4DUH3DUH2

VDD

CMD

DAT1

GND

DAT0

CLK

E8 DU

VDD

E2DUE1

VDD

A3 DU

D2DUD1

C2DUC1

B2 DU

VDD

GND

VDD

GND

B7DUB6DUB5

GNDA6VDDA5DU

VDD

DU = Don't use

Pin A1 ID

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Chapter 2 – Product Specifications Revision 3.1 SanDisk iNAND Product Manual

2.6 Capacity Specifications

Table 2-5 Model Capacity Summary*

Model No. Capacity

SDINB1-256 256 MB SDINB1-512 512 MB SDINB1-1024 1024 MB SDINB1-2048 2048 MB SDINB1-4096 4096 MB

* 1 megabyte (MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes. Some of the listed capacity is used for formatting and other functions, and thus is not available for data storage.

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

3 iNAND Interface Description

3.1 Pins and Registers

Table 3-1 contains the SanDisk iNAND functional ball assignment

Table 3-1 iNAND Pin Assignment

Pin No. Name Type1 Description Comment

SD Bus Mode

H6, F1, C1, A2, A6

H7, H2, D1, B1, A7

G2 DAT0 I/O Data Line [Bit 0] G3 DAT1 I/O Data Line [Bit 1] G6 DAT2 I/O Data Line [Bit 2] G5 DAT3 I/O Data Line [Bit 3] G1 CLK I Clock G4 CMD I/O Command/Response B5 WPB I Defines I/F Connect to

G7 RSTB I Defines I/F Connect to

B2 RDY/BSY NC B3 SEL_A I Defines I/F Connect to

B4 SEL_B I Defines I/F Connect to

G8 FCAP -- Grounded filter capacitor

SPI Mode

VDD S Supply Voltage

VSS S Supply Voltage Ground

VDD

H6, F1, C1, A2, A6

H7, H2, D1, B1, A7

G2 DataOut I/O Device to Host Data and Status G3 DAT1 I/O Unused Pull up to VDD G6 DAT2 I/O Unused Pull up to VDD G5 CS I Chip Select (Active low) G1 CLK I Clock G4 DataIn I Host to Device Commands and

Type Key: S=power supply; I=input; O=output using push-pull drivers; PP=I/O using push-pull drivers

VDD S Supply Voltage

VSS S Supply Voltage Ground

Data

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

Pin No. Name Type1 Description Comment

B5 WPB I Write Protect (Active low) Connect to

G7 RSTB I Reset (Active low) Connect to

B2 RDY/BSY NC

VDD

B3 SEL_A I Defines I/F Connect to

B4 SEL_B I Defines I/F Connect to

G8 FCAP -- Grounded filter capacitor

SanDisk iNAND contains a set of information registers. Register descriptions and SDA references are provided in Section 5.0 of the SDA Physical Layer Specification, Version

2.00.

Table 3-2 iNAND Register Overview

CID 128 Card Identification Number RCA 16 Relative Card Address CSD 128 Card Specific Data SCR 64 SD Configuration OCR 32 Operation Conditions

SSR 512 SD Status

CSR 32 Card status; information about the card status.

3.2 Bus Topologies

VDD

SanDisk iNAND products support two communication protocols: SD and SPI. For more details, refer to Section 3.5 of the SDA Physical Layer Specification, Version 2.00. Section 6 of the specification contains a bus circuitry diagram for reference.

3.2.1 SD Bus

For more details, refer to Secti on 3. 5.1 of the SDA Physical Layer Specification, Version

2.00.

3.2.2 SPI Bus

For more details, refer to Secti on 3. 5.2 of the SDA Physical Layer Specification, Version

2.00.

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

3.3 Electrical Interface

The power scheme of SanDisk iNAND is handled locally in each card and in the bus master. Refer to Section 6.4 of the SDA Physical Layer Specification, Version 2.00.

3.3.1 Power Up

Refer to Section 6.4.1 of the SDA Physical Layer Specification, Version 2.00.

3.3.2 Bus Operating Conditions

SPI Mode bus operating conditions are identical to SD Bus Mode operating conditions. For details, see Section 6.6 of the SDA Physical Layer Specification, Version 2.00.

3.3.3 Bus Timing (Default)

See Section 6.7 of the SDA Physical Layer Specification, Version 2.00.

3.3.4 Bus Timing (High-Speed Mode)

See Section 6.8 of the SDA Physical Layer Specification, V ersion 2.00.

3.4 iNAND Registers

There is a set of eight registers within the iNAND interface. For specific information about each register, refer to Section 5 of the SDA Physical Layer Specification, Version 2.00.

3.4.1 Operating Conditions Register

The Operation Conditions Register (OCR) stores the VDD voltage profile for iNAND. Refer to Section 5.1 of the SDA Physical Layer Specification, Version 2.00.

3.4.2 Card Identification Register

The Card Identification (CID) Register is 16 bytes long and contains the unique card identification number. It is programmed during manufacturing and cannot be changed by iNAND hosts. See Table 3-3.

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Chapter 3 – iNAND Interface Description

(

Revision 3.1 SanDisk iNAND Product Manual

Table 3-3 CID Register Definitions

Name Type Width CID Value Comments

Manufacturer ID (MID)

OEM/Application ID (OID)

Product Name (PNM)

Product Revision (PRV)

Serial Number (PSN)

Binary 8 0x03 Manufacturer IDs are controlled and

ASCII 16 SD ASCII Code

ASCII 40

BCD 8 Product

Binary 32 Product Serial

0x53, 0x44

ST04G ST02G

ST01G ST512 ST256

Revision xx

Number

assigned by the SD-3C, LLC

Identifies the card OEM and/or the card contents. The OID is controlled and assigned by the SD-3C, LLC

Five ASCII characters long

See Section 5.2 in the SDA Physical Layer Specification, Version 2.00

32-bit unsigned integer

Reserved --- 4 --- --Manufacture Date

Code (MDT)

CRC7 checksum

CRC)

Not used, always --- 1 --- ---

Note: SD-3C, LLC is a limited liability company established by Matsushita Electric Industrial Co. Ltd., SanDisk Corporation and Toshiba Corporation.

*The CRC checksum is computed by using the following formula: CRC Calculation: G(x)

7+x3

= x

+1 M(x)=(MID-MSB)*x CRC[6…0]=Remainder[(M(x)*x

BCD 12 Manufacture

Binary 7 CRC7* Calculated

119

+…+(CIN-LSB)*x0

)/G(x)]

date (for ex. April 2001= 0x014)

Manufacturing date—yym (offset from

2000)

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

3.4.3 Card Specific Data Regis ter

The Card Specific Data (CSD) Register configuration information is required to access iNAND data. The CSD defines the data format, error correction type, maximum data access time, etc. The field structures of the CSD Register vary depending on the physical specifications and card capacity. The CSD_STRUCTURE field in the CSD Register indicates which structure version is used. Table 3-4 shows the version number as it relates to the CSD structure. Refer to Section 5.3.1 of the SDA Physical Layer Specification, Version 2.00 for more information.

Table 3-4 CSD Register S tructures

CSD_STRUCTURE CSD Structure Version Valid for SD Memory Card Physical

1 CSD Version 2.0 Version 2.00 / High Capacity

2-3 Reserved ---

Specification Version / Card Capacity

Version 1.01 to 1.10 0 CSD Version 1.0

Version 2.00 / Standard Capacity

Table 3-5 provides an overview of the CSD Register. More field-specific information can be found in Section 5.3.2, Table 5-4 of the SDA Physical Layer Specification, Version 2.00.

Table 3-5 CSD Register (CSD Version 1.0)

Field CSD Value Description

CSD_ STRUCTURE 1.0 CSD structure

--- --- Reserved TAAC

NSAC 0 Data read access time-2 in CLK cycles

CCC All (inc. WP,

READ_BL_ LEN 2G

READ_BL_ PARTIAL Yes Partial blocks for read allowed WRITE_BLK_ MISALIGN No Write block misalignment READ_BLK_ MISALIGN No Read block misalignment DSR_IMP No DSR implemented

--- --- Reserved C_SIZE 2 GB

VDD_R_ CURR_MIN 100 mA Max. read current @VDD min. VDD_R_ CURR_MAX 80 mA Max. read current @VDD max.

1.5 msec Data read access time-1

(NSAC*100) Default 25MHz TRANS_ SPEED High-speed 50MHz

lock/unlock)

Up to 1G

1 GB 512 MB 256 MB

Max. data transfer rate

Card command classes

Max. read data block length

Device size

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

Field CSD Value Description

VDD_W_ CURR_MIN 100 mA Max. write current @VDD min. VDD_W_ CURR_MAX 80 mA Max. write current @VDD max. C_SIZE_ MULT 2G=2048

1G=1024 512=512 256=256

ERASE_BLK_EN Yes Erase single block enable SECTOR_ SIZE 32 blocks Erase sector size WP_GRP_ SIZE 128 sectors Write protect group size WP_GRP_ ENABLE Yes Write protect group enable Reserved --- Reserved for MMC compatibility R2W_ FACTOR x16 Write speed factor

Device size multiplier

WRITE_BL_ LEN 2G

WRITE_BL PARTIAL No Partial blocks for write allowed

--- --- Reserved FILE_ FORMAT_ GRP 0 File format group COPY Has been copied Copy flag (OTP) PERM_ WRITE_

PROTECT TMP_WRITE_PROTECT Not protected Temporary write protection FILE_ FORMAT HD w/partition File format Reserved --- Reserved CRC CRC7 CRC

--- --- Not used, always “1”

Up to 1G

Not protected Permanent write protection

Max. write data block length

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

Refer to Section 5.3.3, Table 5-16 of the SDA Physica l Layer Specification, Version 2.00 for more detailed information.

Table 3-6 CSD Register (CSD Version 2.0)

Field CSD Value Description

CSD_ STRUCTURE 2.0 CSD structure

--- --- Reserved TAAC

NSAC 0 Data read access time-2 in CLK cycles

CCC 010110110101b All

READ_BL_ LEN --- Max. read data block length

1.5 ms Data read access time-1

(NSAC*100) Default 25MHz TRANS_ SPEED High-speed 50MHz

(inc. WP, lock/unlock)

Max. data transfer rate

Card command classes

READ_BL_ PARTIAL Yes Partial blocks for read allowed WRITE_BLK_ MISALIGN No Write block misalignment READ_BLK_ MISALIGN No Read block misalignment DSR_IMP No DSR implemented

--- 0 Reserved C_SIZE

--- 0 Reserved ERASE_BLK_EN 1 Erase single block enable SECTOR_ SIZE 32 blocks Erase sector size WP_GRP_ SIZE 128 sectors Write protect group size WP_GRP_ ENABLE Yes Write protect group enable Reserved --- Reserved for MMC compatibility R2W_ FACTOR x16 Write speed factor

WRITE_BL_ LEN --- Max. write data block length WRITE_BL PARTIAL No Partial blocks for write allowed

--- --- Reserved FILE_ FORMAT_ GRP 0 File format group COPY Has been copied Copy flag (OTP) PERM_ WRITE_

PROTECT

32 GB 16 GB 8 GB 4 GB

Not protected Permanent write protection

Device size

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

Field CSD Value Description

TMP_WRITE_PROTECT No protected Temporary write protection FILE_ FORMAT HD w/partition File format Reserved --- Reserved CRC CRC7 CRC

--- --- Not used, always “1”

3.4.4 Card Status Register

The Card Status Register (CSR) transmits the card’s status information (which may be stored in a local status register) to the host. The CSR is defined in Section 4.10.1 in the SDA Physical Layer Specification, Version 2.00.

3.4.5 SD Status Register

The SD Status Register (SSR) contains status bits that are related to iNAND proprietary features and may be used for future applications. The SD Status structure is described in Section 4.10.2 in the SDA Physical Layer Specification, Version 2.00.

3.4.6 Relative Card Address Register

The 16-bit Relative Card Ad dress (RCA) Register carries the card address published by the card during the card identification. Refer to Section 5.4 in the SDA Physical Layer Specification, Version 2.00 for more information.

3.4.7 SD Card Configuration Register

The SD Card Configuration Register (SCR) is in addition to the CSD Register. The SCR provides information about special features in SanDisk iNAND. For more information, refer to Section 5.6 in the SDA Physical Layer Specification, Version 2.00.

3.4.8 SD Card Registers in SPI Mode

All registers are accessible in SPI Mode. Their format is identical to the format in the SD Bus Mode, however a few fields are irrelevant in SPI Mode. In SPI Mode, the Card Status Register has a different, shorter, format as well. Refer to Section 7. 4 in the SDA Physical Layer Specification, Version 2.00. for more details.

3.5 Data Interchange Format and Card Sizes

In general, a file system provides structure for iNAND data. The SD Card File System Specification, published by the SD Association, describes the file format system implemented in the SanDisk iNAND.

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Chapter 3 – iNAND Interface Description Revision 3.1 SanDisk iNAND Product Manual

Table 3-7 User Area DOS Image Parameters

Capacity* Total

LBAs

4 GB 8,027,136 8192 8,018,944 8,012,708 4,102,506,496 2 GB 4,013,056 523 4,011,595 4,011,072 2,053,668,864

1 GB 2,006,528 523 2,005,675 2,005,152 1,026,637,824 512 MB 1,003,264 279 1,002,727 1,002,448 513,253,376 256 MB 501,632 157 501,149 500,992 256,507,904

Number of

Partition

System Area

Sectors

Total Partition

Sectors

User Data

Sectors

User Data

Bytes

1 megabyte (MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes. Some of the listed capacity is used

for formatting and other functions, and thus is not available for data storage.

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Chapter 4 – iNAND Protocol Description Revision 3.1 SanDisk iNAND Product Manual

4 iNAND Protocol Description

4.1 General

iNAND protocol information is contained in this chapter; information includes bus protocol, card identification, and a functional description.

4.2 SD Bus Protocol

Communication over the SD bus is based on command and data-bit streams in itiated by a start bit and terminated by a stop bit. See Section 3.6.1 of the SDA Physical Layer Specification, Version 2.00 for details.

4.3 Functional Description

The host controls all communication between itself and iNAND. To demonstrate how this communication works, this section provides a general overview of the card identification and data transfer modes; commands; card dependencies; various card operation modes and restrictions for controlling the clock signal. All iNAND commands, together with corresponding responses, state transitions, error conditions, and timin gs are also provided. For detailed information, refer to Section 4 of the SDA Physical Layer Specification, Version 2.00.

4.3.1 Card Identification Mode

In Card Identification Mode the host resets all cards, validates operation voltage range, identifies and requests cards to publish a relative card address. For more information see Section 4.2 in the SDA Physical Layer Specification, Version 2.00.

4.3.2 Data Transfer Mode

In Data Transfer Mode, the host may operate iNAND in the f section contains information about data read and write, erase, write protect management, card lock/unlock operations, application-specific commands, the switch function command, high-speed mode, the command system, the Send Interface Condition command (CMD8). CMD8 is part of identification mode and command functional differences in high capacity iNAND. For more detailed information, refer to Section 4.3 of the SDA Physical Layer Specification, Version 2.00.

4.3.3 Clock Control

The host can use the bus clock signal in iNAND to switch them to energy saving mode or to control data flow on the bus. See Section 4.4 of the SDA Physical Layer Specification, Version 2.00.

frequency range. This

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Chapter 4 – iNAND Protocol Description Revision 3.1 SanDisk iNAND Product Manual

4.3.4 Cyclic Redundancy Codes

The Cyclic Redundancy Check (CRC) protects against transmission errors that may occur on the iNAND bus. Detailed information and examples for CRC7 and CRC16 are provided in Section 4.5 of the SDA Physical Layer Specification, Version 2.00.

4.3.5 Error Conditions

See Section 4.6 of the SDA Physical Layer Specification, Version 2.00.

4.3.6 Commands

See Section 4.7 of the SDA Physical Layer Specification, Version 2.00 for detailed information about iNAND commands.

4.3.7 Card State Transition

The state transition is dependent on the received command. The transition is defined in Section 4.8 of the SDA Physical Layer Specification, Version 2.00 along with responses sent on the command line.

4.3.8 Timing Diagrams and Values

See Section 4.12 of the SDA Physical Layer Specification, Version 2.00.

4.3.9 Speed Class Specification

The speed class specification classifies card performance by speed class number and offers the method to calculate performance. For more information, refer to Section 4.13 of the SDA Physical Layer Specification, Version 2.00.

4.3.10 Erase Timeout Calculation

See Section 4.14 of the SDA Physical Layer Specification, Version 2.00.

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Appendix A –Capacitor Specifications Revision 3.1 SanDisk iNAND Product Manual

Appendix A Capacitor Specifications

A.1 SanDisk iNAND Operation

In order for iNAND to operate at 3V, an external capacitor must be added to the FCAP (G8) pin and grounded to VSS. The capacitor’s specifications and its placement instructions are detailed below.

The trace requirements from the FCAP (G8) pin to the capacitor are as follows:

• Resistance: <2 ohm

• Inductance: <5 nH

The capacitor requirements are as follows:

• Capacitance: >=2.2uF

• Voltage: >=6.3 V

• Dielectric: X7R or X5R

Trace

C1=C3>=2.2uF C2=C4<=100nF

C1, C2: X7R or XR5

Close to ball F1

VDD

FCAP

Requirements:

Resistance < 2 ohm Inductance < 5 nH

VSS

C1=C3>=2.2uF C2=C4<=100nF

C3, C4: X7R or XR5

Close to ball A 6

Bottom View

VDD

VSS

Capacitor Requirements:

Capacitance > = 2.2uF Voltage > =6.3V Dielectric X7R or XR5

Page 26

Appendix B –Ordering Information Revision 3.1 SanDisk iNAND Product Manual

Appendix B Ordering Information

B.1 iNAND

To order SanDisk products directly from SanDisk, call (408) 801-1000.

Part Number Block Size1

SDINB1-256 256 MB SDINB1-512 512 MB SDINB1-1024 1024 MB SDINB1-2048 2048 MB SDINB1-4096 4096 MB

1 megabyte (MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes. Some of the listed capacity is used for

formatting and other functions, and thus is not available for data storage.

Page 27

Appendix C –SanDisk Worldwide Sales Offices Revision 3.1 SanDisk iNAND Product Manual

Appendix C SanDisk Worldwide Sales Offices

To order SanDisk products directly from SanDisk, call (408) 801-1000.

SanDisk Corporate Headquarters

601 McCarthy Blvd. Milpitas, CA 95035 Tel: 408-801-1000 Fax: 408-801-8657

http://www.sandisk.com

U.S. OEM Sales Offices

Southwest/Northwest USA & Mexico 601 McCarthy Blvd. Milpitas, CA 95035 Tel: 408-801-1000 Fax: 408-801-8657

Northeastern USA/Canada 620 Herndon Pkwy. Suite 200 Herndon, VA 22070 Tel: 703-481-9828 Fax: 703-437-9215

International OEM Sales Offices

Europe SanDisk GmbH Karlsruher Str. 2C D-30519 Hannover, Germany Tel: 49-511-875-9131 Fax: 49-511-875-9187

Northern/Central/Southern Europe Rudolf-Diesel-Str. 3 40822 Mettmann, Germany Tel: 49-210-495-3433 Fax: 49-210-495-3434

Japan 8F Nisso Bldg. 15 2-17-19 Shin-Yokohama, Kohoku-ku Yokohama 222-0033, Japan Tel: 81-45-474-0181 Fax: 81-45-474-0371

Asia/Pacific Rim

Suite 902-903 Bank of East Asia Harbour View Centre 56 Gloucester Road Wanchai Hong Kong

Tel: 852-2712-0501 Fax: 852-2712-9385

Page 28

Appendix D –Limited Warranty Revision 3.1 SanDisk iNAND Product Manual

Appendix D Limited Warranty

I. WARRANTY STATEMENT

SanDisk warrants its products to be free of any defects in materials or workmanship that would prevent them from functioning properly for one year from the date of purchase. This express warranty is extended by SanDisk Corporation.

II. GENERAL PROVISIONS

This warranty sets forth the full extent of SanDisk’s responsibilities regarding the SanDisk iNAND. In satisfaction of its obligations hereunder, SanDisk, at its sole option, will repair, replace or refund the purchase price of the product.

NOTWITHSTANDING ANYTHING ELSE IN THIS LIMITED WARRANTY OR OTHERWISE, THE EXPRESS WARRANTIES AND OBLIGATIONS OF SELLER AS SET FORTH IN THIS LIMITED WARRANTY, ARE IN LIEU OF, AND BUYER EXPRESSLY WAIVES ALL OTHER OBLIGATIONS, GUARANTIES AND WARRANTIES OF ANY KIND, WHETHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR INFRINGEMENT, TOGETHER WITH ANY LIABILITY OF SELLER UNDER ANY CONTRACT, NEGLIGENCE, STRICT LIABILITY OR OTHER LEGAL OR EQUITABLE THEORY FOR LOSS OF USE, REVENUE, OR PROFIT OR OTHER INCIDENTAL OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION PHYSICAL INJURY OR DEATH, PROPERTY DAMAGE, LOST DATA, OR COSTS OF PROCUREMENT OF SUBSTITUTE GOODS, TECHNOLOGY OR SERVICES. IN NO EVENT SHALL THE SELLER BE LIABLE FOR DAMAGES IN EXCESS OF THE PURCHASE PRICE OF THE PRODUCT, ARISING OUT OF THE USE OR INABILITY TO USE SUCH PRODUCT, TO THE FULL EXTENT SUCH MAY BE DISCLAIMED BY LAW.

SanDisk’s products are not warranted to operate without failure. Accordingly, in any use of products in life support systems or other applications where failure could cause injury or loss of life, the products should only be incorporated in systems designed with appropriate redundancy, fault tolerant or back-up features.

III. WHAT T HIS WARRANTY COVERS

For products found to be defective within one year of purchase, SanDisk will have the option of repairing or replacing the defective product, if the following conditions are met:

A. A warranty registration card for each defective product was submitted and is on file

at SanDisk. If not, a warranty registration card must accompany each returned defective product. This card is included in each product’s original retail package.

B. The defective product is returned to SanDisk for failure analysis as soon as possible

after the failure occurs.

C. An incident card filled out by the user, explaining the conditions of usage and the

nature of the failure, accompanies each returned defective product.

D. No evidence is found of abuse or operation of products not in accordance with the

published specifications, or of exceeding storage or maximum ratings or operating conditions.

All failing products returned to SanDisk under the provisions of this limited warranty shall be tested to the product’s functional and performance specifications. Upon confirmation of failure, each product will be analyzed, by whatever means necessary, to determine the root cause of failure. If the

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Appendix D –Limited Warranty Revision 3.1 SanDisk iNAND Product Manual

root cause of failure is found to be not covered by the above provisions, then the product will be returned to the customer with a report indicating why the failure was not covered under the warranty.

This warranty does not cover defects, malfunctions, performance failures or damages to the unit resulting from use in other than its normal and customary manner, misuse, accident or neglect; or improper alterations or repairs.

SanDisk reserves the right to repair or replace, at its discretion, any product returned by its customers, even if such product is not covered under warranty, but is under no obligation to do so.

SanDisk may, at its discretion, ship repaired or rebuilt products identified in the same way as new products, provided such cards meet or exceed the same published specifications as new products. Concurrently, SanDisk also reserves the right to market any products, whether new, repaired, or rebuilt, under different specifications and product designations if such products do not meet the original product’s specifications.

IV. RECEIVING WARRANTY SERVICE

According to SanDisk’s warranty procedure, defective product should be returned only with prior authorization from SanDisk Corporation. Please contact SanDisk’s Customer Service department at 408-801-1000 with the following information: product model number and description, serial numbers, nature of defect, conditions of use, proof of purchase and purchase date. If approved, SanDisk will issue a Return Material Authorization or Product Repair Au thorization number. Ship the defective product to:

SanDisk Corporation Attn: RMA Returns (Reference RMA or PRA #) 601 McCarthy Boulevard Milpitas, CA 95035

V. STATE LAW RIGHTS

SOME STATES DO NOT ALLOW THE EXCLUSION OR LIMITATION OF INCIDENTAL OR CONSEQUENTIAL DAMAGES, OR LIMITATION ON HOW LONG AN IMPLIED WARRANTY LASTS, SO THE ABOVE LIMITATIONS OR EXCLUSIONS MAY NOT APPLY TO YOU. This warranty gives you specific rights and you may also have other rights that vary from state to state.

Page 30

Appendix E –Disclaimer of Liability Revision 3.1 SanDisk iNAND Product Manual

Appendix E Disclaimer of Liability

E.1 SanDisk Corporation Policy

SanDisk Corporation general policy does not recommend the use of its products in life support applications wherein a failure or malfunction of the product may directly threaten life or injury. Accordingly, in any use of products in life support systems or other applications where failure could cause damage, injury or loss of life, the products should only be incorporated in systems designed with appropriate redundancy, fault tolerant or back-up features.

SanDisk shall not be liable for any loss, injury or damage caused by use of the Products in any of the following applications:

− Special applications such as military related equipment, nuclear reactor control, and

aerospace

− Control devices for automotive vehicles, train, ship and traffic equipment

− Safety system for disaster prevention and crime prevention

− Medical-related equipment including medical measurement device