Samsung Z110V Service Manual

UMTS TELEPHONE
SGH-Z110V
UMTS TELEPHONE
CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
6. PCB Diagrams
7. Flow Chart of Troubleshooting
This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.
Samsung Electronics Co.,Ltd. Nov. 2004
Samsung Electronics Co.,Ltd. Nov. 2004 Printed in South Korea.
Printed in South Korea.
Code No.: BASIC.
GH68-05795A
1. SGH-Z110V Specification
1. GSM General Specification
GSM900 Phase 1
Freq. Band[MHz]
Uplink/Downlink
ARFCN range 1~124
Tx/Rx spacing 45MHz 45MHz 95MHz
Mod. Bit rate/
Bit Period
Time Slot
Period/Frame
Period
Modulation 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm
890~915 935~960
270.833kbps
3.692us
576.9us
4.615ms
EGSM 900
Phase 2
880~915 925~960
0~124 &
975~1023
270.833kbps
3.692us
576.9us
4.615ms
DCS1800
Phase 1
1710~1785 1805~1880
512~885
270.833kbps
3.692us
576.9us
4.615ms
Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -100dBm
TDMA Mux 8 8 8
Cell Radius 35Km 35Km 2Km
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Specification
2. GSM TX power class
TX Pow er
control level
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
GSM900
TX Pow er
DCS1800
control level
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
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2. SGH-Z110V Circuit Description
1. SGH-Z110V RF Circuit Description
1. Antenna Switch Module (U100) The antenna switch module allows multiple operating bands and modes to share the same antenna. A common antenna connects to one of five paths: 1) UMTS-2100 Rx/Tx, 2) EGSM-900 Rx, 3) EGSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx. UMTS operation requires simultaneous reception and transmission.
2. Filter To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM Rx FILTER (F100)→For filtering the frequency band between 925 ~ 960 MHz.
- DCS Rx FILTER (F101)→For filtering the frequency band 1805 and 1880 MHz.
- WCDMA Rx FILTER (F200)→For filtering the frequency band 2110 and 2170 MHz.
- WCDMA Tx FILTER (F201)→For filtering the frequency band 1920 and 1980 MHz.
3. VCTCXO (OSC200) To generate the 19.2MHz reference clock to drive the logic and RF.
4. Duplexer (F202) A duplexer splits a single operating band into receive and transmit paths.
5. WCDMA PAM (U201) This is a key component in the transmitter chain and must complement the RTR6200 IC precisely; jointly they dominate the UMTS transmitter performance characteristics. Parameters such as gain, output power level, ACLR, harmonics, Rx-band noise, and power supply current are critical.
6. GSM/DCS PAM (U102) The PAM is a key component in any transmitter chain and must complement the rest of the transmitter precisely. For GSM and DCS operation, the closed-loop transmit power control functions add even more requirements relative to the UMTS PA. In addition to gain control and switching requirements, the usual RF parameters such as gain, output power level, several output spectrum requirements, and power supply current are critical.
7. GSM/DCS Dual Tx VCO (OSC100) The dual Tx VCO outputs, one for EGSM and one for DCS, drive a resistive network that splits the active signal into two signals: 1) the input to the active PAM – this is the low loss path, and 2) the OPLL feedback signal.
8. Dual VCO (OSC201) The dual-band UHF VCO is a key component within its phase-locked loop; VCO performance directly impacts PLL and transceiver performance. GSM/DCS Rx/Tx LO & UMTS Rx LO signal is generated from this dual VCO's output.
9. RFL6200 (U200) The RFL6200 includes an LNA circuit optimized for UMTS-2100 operation. The LNA is separated from all other receive functions contained within the RFR6200 receiver IC to improve mixer LO to RF isolation – a critical parameter in the Zero-IF architecture.
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Circuit Description
10. RFR6200 (U203) The RFR6200 provides the Zero-IF receiver signal path, from RF to analog baseband, for UMTS-2100 applications. The RFR6200 accepts its UMTS input signal from the handset RF front-end design. The UMTS input is configured differentially to optimize second-order inter-modulation and common mode rejection performance, and implements MSM-controlled gain adjustments to extend the receiver dynamic range.
11. RTR6200 (U101) The RTR6200 supports multi-band, multi-mode phones with two receiver signal paths and three transmitter signal paths:
1) Receiver paths
- EGSM-900
- DCS-1800
2) Transmitter paths
- EGSM-900 (using OPLL technique)
- DCS-1800 (using OPLL technique)
- UMTS-2100 Numerous secondary functions are integrated on-chip as well:
3) Phase-locked loop circuits
- PLL#1 and an on-chip VCO supports UMTS Tx
- PLL#2 and an external VCO supports EGSM Rx and Tx, DCS Rx and Tx, and UMTS Rx
4) Transceiver LO generation and distribution circuits
- EGSM-900 Rx and Tx
- DCS-1800 Rx and Tx
- UMTS-2100 Tx
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Circuit Description
2. Baseband Circuit description of SGH-Z110V
1. PM6050
1.1. Power Management Ten low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life. It provides seven LDO support for 2.6V, 2.8V while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as RTC module and RTC charger, Clock Buffer, aid in reducing both board area and system complexity. SBI BUS serial interface provides access to control and configuration registers. This interface gives full control of the MSM6200 and enables system designers to maximize both standby and talk times. Supervisory functions. including a reset generator, an input voltage monitor, and a ADC support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
1.2 TCXO Controller and Buffers
The PM6050 IC includes circuits for controlling the TCXO warm-up and buffering its signal for distribution throughout the handset. Performance specifications are presented below.
2. Connector
2-1. LCD Connector LCD is consisted of main LCD(color 262K TFT LCD) and small LCD(color 65K TFT LCD). Chip select signals in the MA55141(U501), SLCD_CS can enable small LCD and DEN for main LCD. I2C buses in MSM6200 (U301) control white-LED of LCDs. "SLCD_RESET, MLCD_RESET" signals initiate the Reset process of LCDs. 8-bit data lines(RGB[10:17]) transfers data and commands to Small LCD through bypass capacitor. Data and commands use "SCLD_RS" signal. If this signal is high, Inputs to Small LCD are commands. If it is low, Inputs to Small LCD are data. The signal which informs the input or output state to Small LCD, is required. Main LCD interface is 18bit data lines(RGB[0:17]) CPU Interface. "RGB_VSYNC","RGB_HSYNC","RGB_DE",and,"RGB_CLK" are the signal for transferring data. Power signals for LCD are "2.8VDV" and "VBATT". "SPKR_P","SPKL_P", "SPKR_N" and "SPKL_N" from U602 are used for dual audio speaker.
2-2. Key This is consisted of key interface pins among U301, KEY_0~3 and SCAN_0~6. These signals compose the matrix. Result of the matrix informs the key status to key interface in U301. Power on/off key is seperated from the matrix. So power on/off signal is connected with U301 to enable U400. Eighteen key LED use the "VCC_BK" supply voltage from U304. "HALL_SW" informs the status of folder (open or closed) to modem. This uses the hall effect IC,EM1681. A magnet under main LCD enables EM1681. It has additional two hall-effect ICs, that are needed for camera sensing. One senses the rotation of Z110V camera, and the other senses the Push-pull of the camera.
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Circuit Description
2-3. EMI ESD Filter
This system uses the EMI ESD filter, GMF05LC to protect ESD and Noise from IF CONNECTOR part, LCD, Camra, and KEY PCB.
2-4. IF connetor It is 24-pin connector. They are designed to use VBATT, VF, Q_TXD0, Q_RXD0, JIG_ON, M_RXD0, M_TXD0, USB signal(D+,D-,USB_VCC) and GND. They connected to power supply IC, microprocessor and signal processor IC.
3. Audio RCV_P and RCV_N from U601 are connected to the main receiver. EAR10P and EAR10N are connected to the Earphone receiver. MIC1P and MIC1N are connected to the main MIC. And MIC2P and MIC2N are connected to the Earphone. YMU769 has a virtual speaker image function, so that it is the most suitable LSI as a sound source output device which is used in mobile phones for high functional game sounds or high quality ringing melodies, and so on. Synthesizer section in YMU769 adopts the “Stereophonic Hybrid Synthesizer System” that is given the advantages of both FM Synthesizers and Wave Table Synthesizers, makes it possible to generate up to 32 FM voices and 32 wave table voices simultaneously. YMU769 is a LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and ADPCM decoder that are included in this device. As a synthesis, YMU769 is equipped 32 voices with different tones. Since the device is capable of simultaneously generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects. Since the play data of YMU769 is interpreted at anytime through data bus, the length of the data(playing period) is not limited, so the device can flexibly support application such as incoming call melody music distribution service. The hardware sequence built in this device allows playing of the complex music without giving excessive load to the CPU of the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for real time sound generation, allowing, for example, utilization of various sound effects when using the game software installed in the portable telephone. YMU769 includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW (SPVDD=3.6V). For the headphone, it is provided with a stereophonic output terminal.
4. Memory
The signals in the MSM6200 enable two memories. They use only one volt supply voltage, VDD_LP from the PM6050. This system uses SPANSION's memory, S99PL129JCOBAWUC. It is consisted of 128M bits flash NOR memory and 32M bits SRAM memory. It has 16 bit data line, AD[0~15] which is connected to MSM6200. It has 22 bit address lines, A[1~22]. ROM_CS and RAM_CS signals is chip select. In the multi-media processor, it has two type of memories. One is 1GMbit NAND Flash memory and the other is 512Mbit SDRAM memory. Multi-media processor doesn't have a NAND memory interface. But we make a software algorithm use for NAND memory.
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Circuit Description
5. Multi-media processor MA55141
MA55141 is an LSI, which is designed on 3GPP 3G-324M Standard for a video telephone system. Since protocol software is external, MA55141 can run with another protocol like H.323 by changing its software. MA55141 has ARM9 CPU, so supports more various application.
Feature
- Based on 3GPP 3G-324M standard
- Video MPEG-4 (simple profile level1) or H263 (baseline)
- Audio AMR, G723.1, MP3 or AAC (program downloadable)
- Multiplexing H.223 (Level 0, 1, 2, processed by CPU with assistant hardware)
- Control H.245 (Processed all by CPU)
- Built-in 32bit RISC CPU(ARM926EJ) for control. (Max 133MHz, I-cache 16KB, D-cache 8KB, MMU and JAVA accelerator (Jazelle) included.)
- Built-in 16bit DSP for audio CODEC
- Built-in SD/MMC/Memory Stick I/F
- Video input Rec601/656 YUV = 4:2:2, 8 bit I/F
- Video output Rec601 YUV = 4:2:2(8bit) / RGB 18bit Built-in Picture-In-Picture Image Displaying Functions Built-in On Screen Display(OSD) Functions with alpha blending
- Video CODEC Encoding and decoding : QCIF 40fps, CIF 10fps Encoding only : QCIF 68fps, CIF 17fps Decoding only : QCIF 96fps, CIF 24fps Deblocking filter is built-in. Max output image size : 2032×2032
- Program on SDRAM is executable without ROM (optional).
- Power supply VDDI1=1.425V to 1.65V (For internal circuit. Please power off during stand-by) VDDI2=VDDI1 (For internal circuit. Please provide during stand-by) VDDP0, VDDP1=1.425V to 1.65V (For internal PLL0 and PLL1) VDDO, VDDOD=2.7V to 3.0V (For I/O)
- Max operating frequency CPU clock = 133MHz
DSP clock = 100MHz SDRAM clock = 100MHz Video clock = SDRAM clock/2
6. MIC2211 (U604/U605)
This LDO is the voltage source of Multimedia part. The MIC2211 is a dual-output LDO regulator. The one of dual is capable of sourcing 150mA, while the another one can supply up to 300mA. Ideal for battery operated applications, the MIC2211 offers 1% accuracy, extremely low dropout voltage (80mV @ 100mA), and extremely low ground current (only 48mA total). Equipped with TTL logic compatible enable pins, the MIC2211 can be put into a zero-off-mode current state, drawing no current when disabled. Separate enable pins allow individual control of each output voltage.
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Circuit Description
7. Camera (HV7151SP)
The HV7151SP is a highly integrated single chip CMOS color image sensor implemented by proprietary Hynix 0.35um COMS sensor process realizing high sensitivity and wide dynamic range. Total pixel array size is 1170 x 880 pixels are active. So, It can supports the picture below 1Mega-pixel snap shot. Each active pixel composed of 4 transistors has a micro-lens to enhance sensitivity, and converts photon energy to analog pixel voltage. On-chip 10bit Analog to Digital Converter(ADC) ditgitizes analog pixel voltage, and on-chip Correlated Double Sampling(CDS) scheme reduces Fixed Pattern Noise(FPN) dramatically. The integration of sensor function and image processing functions make HV7151SP especially very suitable for mobile imaging systems such as IMT-2000.
8. Irda
This system uses IRDA module, HSDL_3208, Agilent's. This has signals, Input data and output data. These signals are connected to MSN6200.
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3. SGH-Z110V Exploded View and its Parts list
1. Cellular phone Exploded View
QCA01
QFR01
QCR42
QCR12
QKP01
QME01
QSH02
QFU01
QLC01
QSP02 QSP01 QSP03
QFL01 QCR20 QSC14 QMW01
QCR05
QAN01
QVO01 QCR26
QSC13 QRF01
QMP01
QMI01
QMO01
QVO02
QRE01
QIF01
QCR07
QBA32
QBA33
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Exploded view and its Part list
2. Cellular phone Parts list
Location
NO.
QFU01 FOLDER UPPER GH75-05245A QLC01 LCD GH07-00614A
QSP01 SPEAKER 3001-001540 QSP02 SPEAKER 3001-001622 QSP03 SPEAKER 3001-001623
QFL01 FOLDER LOWER GH75-05246A QCR20 SCREW 6001-001429 QSC14 FOLDER SCREW SHEET GH74-10909A
QMW01 MAIN WINDOW LCD GH72-16368A
QFR01 FRONT COVER GH75-05243A QCA01 CAMERA GH59-01767A QCR12 SCREW 6001-001530 QKP01 KEYPAD GH75-05247A QME01 UNIT KEYPAD GH59-01768A QSH02 SHIELD COVER GH71-04036A QMP01 MAIN PBA GH92-01730A
QMI01 MICROPHONE ASSY GH30-00143A QCR05 SCREW 6001-001478 QMO01 MOTOR 3101-001415 QVO02 KEY REJECT GH72-15405A QVO01 KEY VOL GH72-15407A QAN01 ANTENNA GH42-00488A QRE01 REAR COVER GH75-05244A QSC13 REAR SCREW CAP GH72-17726A
QRF01 RF COVER GH72-15400A
QIF01 IF COVER GH72-15401A QCR07 SCREW 6001-001691 QCR26 SCREW 6001-001850 QCR42 SCREW 6001-001300 QBA32 BATTERY-860MAH GH43-01529A QBA33 BATTERY-1360MAH GH43-01530A
Description SEC CODE Remark
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3. Test Jig (GH80-03308A)
Exploded view and its Part list
3-1. RF Test Cable
(GH39-00105A)
3-4. Power Supply Cable
3-2. Test Cable
(GH39-00337E)
3-5. DATA CABLE
(GH39-00326A)
3-3. Serial Cable
3-6. TC
(GH44-00701A)
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4. SGH-V110V MAIN Electrical Parts List
SEC Code Design LOC 0403-001387 ZD303 0403-001427 ZD304 0404-001153 ZD401 0404-001167 ZD308 0406-001178 ZD307 0406-001197 ZD300 0406-001197 ZD301 0406-001197 ZD302 0406-001197 ZD305 0406-001197 ZD400 0406-001197 ZD403 0406-001197 ZD404 0406-001197 ZD700 0406-001197 ZD701 0406-001197 ZD702 0406-001197 ZD703 0406-001197 ZD704 0406-001197 ZD705 0406-001197 ZD706 0406-001197 ZD707 0406-001197 ZD708 0406-001197 ZD709 0406-001197 ZD710 0406-001197 ZD711 0406-001197 ZD712 0406-001197 ZD713 0406-001197 ZD714 0406-001197 ZD715 0406-001197 ZD716 0406-001197 ZD717 0407-001002 ZD306 0407-001002 ZD402 0407-001038 U307 0504-001060 U202 0504-001113 Q201 0505-001423 U303 0505-001423 U305 0505-001423 U313 0505-001423 U608
SEC Code Design LOC 0505-001464 Q200 0505-001464 Q300 0604-001261 LED700 1001-001231 U205 1001-001231 U312 1001-001231 U402 1001-001288 U100 1001-001296 U306 1001-001296 U503 1001-001296 U601 1001-001306 U404 1109-001302 U300 1109-001317 U500 1201-001984 U200 1201-002174 U102 1201-002196 U201 1203-003007 U400 1203-003105 U302 1203-003105 U304 1203-003137 U403 1203-003275 U605 1203-003322 U604 1203-003359 U607 1203-003501 U401 1203-003563 U310 1203-003585 U700 1203-003591 U204 1204-002316 U602 1204-002354 U501 1205-002295 U301 1205-002297 U203 1205-002300 U101 1205-002530 U606 1205-002592 U308 1404-001224 TH300 1405-001082 V602 1405-001082 V603 2007-000138 R123 2007-000138 R202
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Electrical Parts List
SEC Code Design LOC 2007-000138 R209 2007-000140 R351 2007-000147 R125 2007-000148 R105 2007-000148 R111 2007-000148 R331 2007-000149 R352 2007-000160 R631 2007-000168 R321 2007-000171 R204 2007-000171 R205 2007-000171 R220 2007-000171 R628 2007-000171 R633 2007-000172 R112 2007-000173 R201 2007-000174 R733 2007-000242 R348 2007-000775 R408 2007-001119 R353 2007-001217 R113 2007-001217 R127 2007-001217 R128 2007-001284 R212 2007-001291 R114 2007-001291 R115 2007-001291 R224 2007-001291 R225 2007-001295 R116 2007-001298 R210 2007-001298 R211 2007-001301 R122 2007-001305 R121 2007-001307 R117 2007-001307 R118 2007-001307 R119 2007-001307 R120 2007-001313 R316 2007-001325 R109
SEC Code Design LOC 2007-001325 R607 2007-001339 R320 2007-001339 R322 2007-002796 R410 2007-002796 R514 2007-003006 R420 2007-003022 R731 2007-003022 R732 2007-007107 R219 2007-007107 R412 2007-007135 R334 2007-007137 R218 2007-007142 R126 2007-007314 R200 2007-007314 R206 2007-007314 R208 2007-007314 R333 2007-007318 R330 2007-007318 R615 2007-007318 R616 2007-007491 R110 2007-007491 R207 2007-007538 R327 2007-007698 R216 2007-007981 R421 2007-008045 R107 2007-008045 R124 2007-008045 R129 2007-008045 R306 2007-008045 R307 2007-008045 R308 2007-008045 R309 2007-008045 R700 2007-008045 R701 2007-008045 R702 2007-008045 R703 2007-008045 R704 2007-008045 R705 2007-008045 R706
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