Samsung YP-R1 Service Manual
MP3 Player
Model Name : YP-R1
Model Code : YP-R1AB/XER
SERVICE
Manual
MP3 Player
YP-R1
CONTENTS
1. Precaution
2. Product Specification
3. Disassembly & Reassembly
4. Troubleshooting
5. Exploded View & Part List
6. PCB Diagram
7. Schematic Diagram
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
This Service Manual is a property of Samsung Electronics
Co.,Ltd. Any unauthorized use of Manual can be punished
under applicable International and/or domestic law.
© Samsung Electronics Co.,Ltd.
Printed in Korea
Oct. 2009
Contents
1. Precaution
1-1 Safety Precautions ...........................................................................................1-1
1-2 Static Electricity Precautions ............................................................................
2. Product Specification
2-1 Product Feature ...............................................................................................2-1
2-2 Specifications ...................................................................................................
2-3 Specifications Analysis .....................................................................................
2-4 Accessories ......................................................................................................
3. Disassembly & Reassembly
3-1 Overall Disassembly & Reassembly ................................................................3-1
1-2
2-2
2-4
2-6
4. Troubleshooting
4-1 Checkpoints by Error Mode.............................................................................. 4-1
4-2 Upgrade Methods
.............................................................................................4-23
5. Exploded View & Part List
5-1 Exploded View .................................................................................................5-1
5-2 Electrical Part List ............................................................................................
6. PCB Diagram
6-1 MAIN PCB Top ................................................................................................. 6-1
6-2 MAIN PCB Bottom ...........................................................................................
7. Schematic Diagram
7-1 Overall Block Diagram .....................................................................................7-1
MAIN CPU-1 .................................................................................................... 7-2
7-2
MAIN CPU-2 .................................................................................................... 7-3
7-3
7-4 Memory (SDRAM, NAND-Flash)
7-5 Power Management .........................................................................................
7-6 AUDIO CODEC ................................................................................................
7-7 24PIN IO INTERFACE .....................................................................................
7-8 PBA / LCD INTERFACE ...................................................................................
7-9 BLUETOOTH / FM ...........................................................................................
......................................................................7-4
5-3
6-3
7-5
7-6
7-7
7-8
7-9
Precaution
1. Precaution
1-1 Safety Precautions
1. To remove dust from the cabinet, use a dry cloth. Do not use any liquid or aerosol cleaners.
2. You should not use any attachments that are not recommended by the company. This could cause damage to
the unit.
3. You should not use this product near or in water.
4. You should only use the power supply provided by the company.
5. If replacement material is required you should only use standardized materials, if you use non-standardized
materials you could cause failure to the product.
Samsung Electronics 1-1
Precaution
1-2 Static Electricity Precautions
1. Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits
and some field-effect transistors. The following techniques will reduce the occurrence of component damage
caused by static electricity.
2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these
can accumulate sufficient electrical charge to damage ESDs).
7. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
1-2 Samsung Electronics
2. Product Specification
2-1 Product Feature
Convenient to use
- Convenient and intuitive menu selection that you can navigate with your
fingertips on a full screen touch pad.
Video playback without converting
- Playback is possible by simply transferring files without converting.
All file formats to the right are supported.
Product Specification
Compact design
- Compact design giving excellent portability.
45.5(H) x 85.2(V) x 8.9(D) mm
Samsung Electronics 2-1
Product Specification
2-2 Specifications
Basic Specification
Rating DC 5.0V / 1A
Audio
File
• MPEG1/2/2.5 Layer3 (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• WMA (12kbps ~ 320kbps, 16kHz ~ 48kHz)
• Ogg (32kbps ~ 400kbps, Q0 ~ Q10, 8kHz ~ 48kHz)
• AAC-LC (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• AAC+ (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• Enhanced-AAC-Plus (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• FLAC (levle0 ~ 8, 16kHz ~ 48kHz)
• RA (20kbps ~ 96kbps, 8kHz, 11.025kHz, 44.1kHz)
• WAV (wav standard, 8kHz ~ 48kHz)
Video Audio
• MPEG4 (Max.720 X 480) Advanced Simple Profile@
Level 5, 8 Mbps
• Divx3/4/5/(Max. 720 X 480), 8 Mbps
AVI/
SVI
• Xvid (Max. 720 X 480), 8 Mbps
• H.264/AVC (Max. 720 X 480) High Profile@Level3.0,
12.5 Mbps
MP3/AAC/
AAC+
Video
Image JPEG (Baseline, Progressive), BMP (MAX32Bit), PNG, Gif (89a/87a)
Flash SWF (Flash Player 8.0 or lower, ActionScript2.0 or lower)
Earphones Output
Output Frequency
Range
• WMV9 (MAX 720 X 480) Advanced Profile@level1,
10 Mbps
• MPEG4 (Max.720 X 480) Advanced Simple Profile@
MP4
WMV/
ASF
MOV
20 mW/Ch. (France 5 mW/Ch.) (based on16 Ω)
20Hz ~ 20kHz
Level 5, 8 Mbps
• H.264/AVC (Max. 720 X 480) High Profile@Level3.0,
12.5 Mbps
• WMV9 (MAX 720 X 480) Advanced Profile@level1(vc1),
10 Mbps
• MPEG4 (Max.720 X 480) Advanced Simple Profile@
Level 5, 8 Mbps
• H.264/AVC (Max. 720 X 480) High Profile@Level3.0,
12.5 Mbps
WMA
MP3/AAC/
AAC+
WMA
AAC/AAC+
Signal to Noise Ratio
Supported Number of
Files/Folders
Playing Time
2-2 Samsung Electronics
90dB with 20kHz LPF (based on 1kHz 0dB)
File: Max. 5000
Folder: Max. 5000 (including File)
Music: 25 hours (MP3 128 kbps, Volume level 15, Normal sound mode, LCD off)
Video: 5 hours (Brightness 3, Volume level 15, Normal sound mode, SVI)
Product Specification
Temperature Range for
Operation
Case Tempered glass, Plastic, Aluminum
Weight 50g
Dimensions (WxHxD)
FM T.H.D
FM Signal to
FM
Noise Ratio
FM Useable
Sensitivity
Wireless System
Bluetooth QD ID B015440
Emission Type
RF power
Transmit Frequency
-5° C ~ 35° C (23° F ~ 95° F)
45.5 X 85.2 X 8.9 mm
1%
55dB
38dBμ
F1D
CLASS I
2402MHz ~ 2480MHz
Receive Frequency
Number of channels
Modulation System
Communication Mode
Humidity 0 ~ 95%
Specifications Version
Supported
Module BCM2070
2402MHz ~ 2480MHz
79 channels
GFSK
Semi-duplex Operation
2.0 + EDR
Samsung Electronics 2-3
Product Specification
2-3 Specifications Analysis
BASIC
FILES
Model
YP-R1 YP-Q2
Photo
Storage Type
Display
Platform i.MX37 (Freescale) Sigmatel (STMP3750)
Battery Type
Battery Capacity
25 Hours of Music Playback with Earphones
Playback Time
(Earphone)
Color Black / Silver / Pink White / Black / Blue
Capacity 8G / 16G / 32G 4G / 8G / 16G
CASE Tempered glass, Aluminum, Plastic, ABS Aluminum, Plastic
NO Conversion
Widgets
Colorful + Moving GUI
MP3
WMA
RA
OGG (MAX Q10)
WAV
AAC
Audible X X
JPEG
FLAC
APE X X
Divx (3, 4, 5) X
Xvid
H.264
ASF
MOV
WMV
MPEG4 (SVI)
SWF
Flash memory (MLC) Flash memory (MLC)
SIZE: 2.6" WQVGA
Display Color: 16.7M LCD
(Dot pitch: 0.14475 (H) x 0.14475 (V))
Resolution: 240RGB (H) x 400 (V)
Li-Polymer Li-Polymer
500mAh 580mAh
(Based on MP3 128 kbps, Volume 15,
Normal EQ, LCD OFF),
5 Hours of Video Playback
(Based on MPEG4@SP, Volume 15,
Normal EQ, LCD lv3)
SIZE: 2.4" QVGA TFT LCD
Resolution: 320 (H) x 240 (V)
50 Hours of Music Playback with Earphones,
4Hours of Video Playback
X
X
X
X
(up to Q10)
X
X
X
X
X
X
X
: application, X: non-application
2-4 Samsung Electronics
Product Specification
SOUND
TUNER
FUNCTIONS
DRM
Model
YP-R1 YP-Q2
Photo
DNSE 3.0
DNSE
User EQ
Street Mode
Sound Feedback
High-pitched Sound
Recovery
Playlist DNSE
Speed Control
Output Power (Earphone)
FM
RDS
ETC X X
Alarm X X
Bluetooth
Photo Viewer
Text Viewer
Game
Wallpaper
World Clock
Voice Recording
FM Recording
Wise Volume
(Hearing Protection)
Address Book
Data Cast
Flash Player
Calculator X X
TTS (Text to Speech)
Calender
Bookmark
Vive Woofer
(Using Haptic)
Quick Tray
Mini Player
Netsync
WMA DRM
Janus
(General, Studio, Rock, Classic, Jazz, Ballad,
Club, R&B, Dance, Cafe, Concert, Cathedral)
(9 band control) (9 band control)
(AUI) (AUI)
(MP3 file play 0.75 ~ 1.3X) (MP3 file play 0.75 ~ 1.3X)
20mW/CH 20mW/CH
X (FW will be supported) X
X X
(General, Studio, Rock, Classic, Jazz, Ballad,
DNSE 3.0
R&B, Dance, Concert)
TEXT, VIDEO
X
X
X
X
X
X
X
X
X
X
X
X
: application, X: non-application
Samsung Electronics 2-5
Product Specification
2-4 Accessories
2-4-1 Supplied Accessories
Accessories Item Item Code Remark
Earphones GM59-01016A
USB Cable
User's Manual GM68-01002J
GM39-01002A
Samsung Service
Center
2-6 Samsung Electronics
Disassembly & Reassembly
3. Disassembly & Reassembly
3-1 Overall Disassembly & Reassembly
- Please follow the disassemble sequence describes below. Otherwise, the product may be
damaged.
- Be sure to carefully read and understand the safety instructions describes at the start of this
manual before performing any work on the IC chips on the PCB.
- To assemble, follow the below instructions in reverse order.
No. Description Description Photo
1 1) Insert a flat screwdriver or tweezers into the hole
shown on the right. Remove the cover attached with
double sided tape.
Be careful not to make any scratches as you remove
the cover.
2 1) Remove the two screws using a phillips screwdriver,
and remove the SUS BRACKET.
3 1) Disconnect the case from the main body by pulling the
AL CASE down.
4 1) Remove the screw from the MAIN PCB.
Samsung Electronics 3-1
3-2 Samsung Electronics
Disassembly & Reassembly
No. Description Description Photo
5 1) Remove the Cushion PCB from the MAIN PCB.
6 1) Disconnect the three connectors on the MAIN PCB
and remove the FPCB, and the MAIN PCB.
7 1) Insert a flat screwdriver or tweezers into the hole next
to the battery FPCB and remove the battery FPCB.
8 1) Remove the battery that is fixed with double sided
tape onto the LCD MODULE .
Ensure that the battery doesn’t get damaged.
Disassembly & Reassembly
No. Description Description Photo
9 1) When removing the hooked LCD, pull the bottom of
the LCD (2) upwards while widening the side of the
Touch Assy (1).
1
10 1) After disassembly
2
Samsung Electronics 3-3
MEMO
3-4 Samsung Electronics
4. Troubleshooting
4-1 Checkpoints by Error Mode
Oscilloscope Setting Values Normal Voltage 24MHz 32.768KHz
Voltage/DIV 800mV/DIV 400mV/DIV 400mV/DIV
TIME/DIV 100ms/DIV 100us/DIV 100ns/DIV
4-1-1 If there is no power
If there is no power
Troubleshooting
Charge the battery and
check that the power is on.
No
Check that the
firmware is upgraded.
(See 4-2 Upgrade Methods)
No
1/2/3
C316: 2.5V, C318: 1.2V, C303: 3.0V
Check the voltage.
No
See the waveform and
the image in Fig. 4-1.
Yes
Yes
Yes
Yes
4/5
Check that the clock on X403 and
X402 oscillates.
No
Faulty
See the waveform and
the image in Fig. 4-2.
Yes
Check CPU_RST - HIGH
6/7
R406 - LOW
No
A
See the waveform and
the image in Fig. 4-3.
B
Samsung Electronics 4-1
4-2 Samsung Electronics
Troubleshooting
A
B
Check the voltage on the battery.
No
Replace the battery and check the
voltage again.
Complete
GND
GND
GND
P_ 1. 8V
P_ 1. 0V
GND
P_ 1. 2V
C3 33
10 0n F
GND
P_ 3. 0V
C3 15
10 0n F
GND
C3 08
10 0n F
C3 36
10 0n F
C3 10
10 0n F
GND
P_ 2. 5V
GND
C3 09
10 0n F
C3 30
10 0n F
C3 11
10 0n F
C3 32
10 0n F
GND
C3 38
10 0n F
C3 03
10 0n F
C3 37
10 0n F
GND
US B_ P5 V
C3 01
10 0n F
GND
C3 02
10 0n F
P_ 2. 5V
DDR_ SD_CKE
P_ 3. 0V
VD DA _1 .2 V
C3 39
10 0n F
P_ 3. 3V
C3 20
10 0n F
C3 23
10 0n F
C3 27
10 0n F
C3 05
10 0n F
C3 31
10 0n F
C3 28
10 0n F
C3 21
10 0n F
C3 04
10 0n F
C3 07
10 0n F
C3 29
10 0n F
C3 12
10 0n F
C3 25
10 0n F
C3 24
10 0n F
U3 01
MC IM X3 7
A1
GN D_ 1
A19
GN D_ 2
H9
GN D_ 3
H10
GN D_ 4
J8
GN D_ 5
J9
GN D_ 6
J10
GN D_ 7
J11
GN D_ 8
K8
GN D_ 9
K9
GN D_ 10
K10
GN D_ 11
K11
GN D_ 12
K12
GN D_ 13
L9
GN D_ 14
L10
GN D_ 15
L11
GN D_ 16
L12
GN D_ 17
W19
GN D_ 18
M8
GN D_ 19
M10
GN D_ 20
W1
GN D_ 21
K13
GN D_ 22
F12
GN D_ AN A_ PLL_ A
M13
GN D_ AN A_ PLL_ B
F14
GN D_ DI G_ PLL_ A
N13
GN D_ DI G_ PLL_ B
P19
NG ND _O SC
G15
NG ND _U SB PHY
T11
NG ND _R GB 1
V11
NG ND _R GB 2
F15
RR EF EX T
F16
ID
H15
VB US
G19
DN
F19
DP
V14
IO B_ BA CK
W11
IO B
V15
IO G_ BA CK
W12
IO G
W15
IO R_ BA CK
W13
IO R
V13
RS ET
T13
VR EF IN
P11
VR EO UT
W14
CO MP
T15
VD D_ FU SE
N16
FA ST R_ DI G
M18
FA ST R_ AN A
P14
NV CC _S RT C_PO W
N8
VD D_ TV DI G
M7
VD DA 2
G12
VD DA 1
N12
VD D_ DI G_ PLL_ B
G14
VD D_ DI G_ PLL_ A
M11
VD D_ AN A_ PLL_ B
F13
VD D_ AN A_ PLL_ A
L19
NV CC _O SC
G16
NV CC _U SB PHY
M9
NV CC _T V_ BACK
P12
NV CC _D AC
V12
AH VD DR GB 2
T12
AH VD DR GB 1
R12
VD D_ TV SU PPLY
L13
PE R9
R14
PE R8
P6
PE R6
L7
PE R4
P7
PE R3
P8
PE R2
J7
NV CC _I PU 2
H7
NV CC _I PU 1
J14
VD DA 33 _2
H14
VD DA 33 _1
N7
PE R1 4
R15
PE R1 3
K14
NV CC _E MI 3
J13
NV CC _E MI 2
H13
NV CC _E MI 1
G7
NV CC _C TN R_EM I
F4
NV CC _E MI _DRA M8
D13
NV CC _E MI _DRA M7
D12
NV CC _E MI _DRA M6
D11
NV CC _E MI _DRA M5
D10
NV CC _E MI _DRA M4
D9
NV CC _E MI _DRA M3
D8
NV CC _E MI _DRA M2
D7
NV CC _E MI _DRA M1
L8
VC C4 _1
K7
VC C4 _2
N10
VC C3
M12
VC C2
J12
VC C_ 1
H12
VC C_ 2
H11
VC C_ 3
H8
VD DG P5
G11
VD DG P4
G10
VD DG P3
G9
VD DG P2
G8
VD DG P1
C3 22
10 00 nF
C3 14
10 00 nF
C3 16
10 00 nF
C3 18
10 00 nF
R3 07
10 0K
C3 19
47 00 nF
C3 35
10 0n F
C3 34
10 0n F
R3 02
1K
R3 04
5. 6K
C3 13
10 00 0n F
VCC_ CORE
VCC_ 1.2V
VCC_ 1.8V
VCC_ 3.0V
VCC_ 3.0V
VCC_ 1.8V
VCC_ 2.5V
VDDA _1.2V
VCC_ 1.8V
DC/D C
DC/D C
DC/D C
LDO
LDO
CVBS VIDEO OUT
LDO
U701
U504
U101
U702
U507
U506
U401
CON601
U503
U502
U301
U601
U501
2
C316
1
Samsung Electronics 4-3
1
MAIN PCB Top, page 6-1
2
C318
<Fig. 4-1>
1
2
3
MAIN CPU-1, page 7-2
3
MAIN PCB Bottom, page 6-3
C303
3
Troubleshooting
4-4 Samsung Electronics
Troubleshooting
LCD _RE D2
JTA G_T CK
LCD _GR N0
LCD _RE D0
JTA G_R ST
JTA G_T MS
LCD _BL U4
LCD _GR N1
LCD _GR N5
LCD _BL U6
LCD _GR N4
LCD _DO TCL K
LCD _RE D1
LCD _HS YNC
LCD _GR N2
LCD _RE D3
JTA G_T DO
LCD _BL U7
JTA G_T DI
LCD _RE D5
PWR _ON _OF F
LCD _BL U1
LCD _BL U2
LCD _GR N6
JTA G_R TCK
GND
LCD _BL U0
LCD _GR N3
LCD _GR N7
LCD _RE D4
LCD _BL U3
LCD _VS YNC
LCD _BL U5
LED _DI MMI NG
EAR PHO NE_ DET
R4 13
1M
GND
P_ 3. 0V
C4 06
10 0n F
R4 07
1K
LCD _EN ABL E
CLK _SE LEC T
BOO T_M ODE 1
BOO T_M ODE 0
GND
R4 17
47 K
GND
32. 768 KHZ _OU T
FM_ SEA RCH
LCD _CH ECK
LCD _RS T
X4 03
24 MH z
1
2
3
4
NAN D_C S_C TL
GND
NAN D_R /B1
NAN D_R /B2
R4 04
22 K
C4 07
0. 02 2n F
C4 09
0. 02 2n F
U3 01
MC IM X3 7
T19
PM IC _V STBY
R16
PM IC _P WRFA IL
R19
CK IL
N18
CK IH
P15
CL K_ SS
W7
WD OG _R ST/P MI C_RD Y/ GPIO 3_2 8
N14
RE SE T_ IN_B
N15
PO R_ B
P16
BO OT _M ODE0 /A UD_M CL K2
P18
BO OT _M ODE1
M19
XT AL
N19
EX TA L
R1
TH DI OD E
R18
TE ST _M ODE
F18
GP AN AI O
H4
LC D_ HS YNC/ GP IO3_ 31
G2
LC D_ VS YNC/ GP IO3_ 29
P2
LC D_ WR /GPI O3 _10
P1
LC D_ RD /GPI O3 _11
N6
LC D_ RS /GPI O3 _12
N2
LC D_ RD Y/GP IO 1_30
N5
LC D_ CS /GPI O3 _13
F1
LC D_ DO TCLK /G PIO3 _3 0
T8
GP IO 1_ 31/W DO G_RS T_ B_DE B
J5
DI SP 1_ DAT2 1
H2
DI SP 1_ DAT2 0
J4
DI SP 1_ DAT1 9/ ETM_ D3
H1
DI SP 1_ DAT1 8/ ETM_ D2
K6
DI SP 1_ DAT1 7/ ETM_ D1
J1
DI SP 1_ DAT1 6/ ETM_ D0
J2
DI SP 1_ DAT1 5
K5
DI SP 1_ DAT1 4
L6
DI SP 1_ DAT1 3
K2
DI SP 1_ DAT1 2
L5
DI SP 1_ DAT1 1
K1
DI SP 1_ DAT1 0
L4
DI SP 1_ DAT9
L1
DI SP 1_ DAT8
L2
DI SP 1_ DAT7
M6
DI SP 1_ DAT6
M5
DI SP 1_ DAT5
M2
DI SP 1_ DAT4
M1
DI SP 1_ DAT3
M4
DI SP 1_ DAT2
N4
DI SP 1_ DAT1
N1
DI SP 1_ DAT0
P4
GP IO 1_ 7
P5
GP IO 1_ 6/CL K0 /AUD _M CLK
R2
GP IO 1_ 5/US B_ PWR
R4
GP IO 1_ 4
T1
GP IO 1_ 3
R5
GP IO 1_ 2
T2
GP IO 1_ 1/I2 C2 _SDA
U1
GP IO 1_ 0/I2 C2 _SCL
P13
JT AG _M OD
T14
JT AG _D E_B
R13
JT AG _T RSTB
V16
JT AG _T DO
W16
JT AG _T DI
W17
JT AG _T MS
V17
JT AG _T CK
W18
JT AG _R TCK
14 V
R4 12
4. 7K
R4 15
6. 8K
R4 02
10 K
BLU E
GRE EN
1.1 0V
BOOT MODE
SRT C_P OW
PER 4
PER _9
PER _2
PER _9
NVC C_O SC
PER 4
PER 9
USB PHY
PER 8
NVC C_I PU
JTA G_T CK
BT_ UAR T_R X0
JTA G_R ST
BT_ UAR T_R TS0
JTA G_T MS
TOU CH_ DAT
BT_ UAR T_T X0
JTA G_T DO
JTA G_T DI
JTA G_R TCK
BT_ UAR T_C TS0
GND
CPU _RS T
EAR PHO NE_ DET
R4 13
1M
GND
P_ 3. 0V
TOU CH_ CLK
TOU CH_ INT R
TOU CH_ CE
C4 06
10 0n F
R4 07
1K
DEV ICE _DE T
GND
CLK _SE LEC T
CLK _SE LEC T
EXT _PW R
BOO T_M ODE 1
BOO T_M ODE 0
GND
P_ 3. 0V
C4 04
10 0n F
GND
R4 17
47 K
GND
IN N_ BA TT
GND
C4 03
7p F
12
C4 02
7p F
12
GND
X4 02
32 .7 68 KHz
1
IN
2
OU T
3
GN D
U4 02
S- 35 39 2A
1 32KO
2
XOUT
3 XIN
4 VSS
5
INT2
6
SCL
7
SDA
8
VDD
32. 768 KHZ _OU T
P_ 3. 0V
32. 768 KHZ _OU T
X4 03
24 MH z
1
2
3
4
BOO T_M ODE 1
BOO T_M ODE 0
JTA G_R ST
GND
UAR T_T X1
UAR T_R X1
R4 09
10 K
GND
NAN D_R /B3
NAN D_R /B4
NAN D_R /B5
NAN D_R /B6
NAN D_R /B7
D4 01
KD S1 21 V
P_ 3. 0V
PWR _IN _DD CON
R4 04
22 K
I2C _DA T0
I2C _CL K0
C4 07
0. 02 2n F
C4 09
0. 02 2n F
U4 01
NC 7S V0 8P5X
1
A
2
B
3
GND
4
Y
5
Vcc
C4 08
10 0n F
R4 10
22
NAN D_S ELE CT
AUD _MC LK
R4 11
22
BOO T_M ODE 0
R4 06
22 K
R4 08
10 0K
U3 01
MC IM X3 7
T19
PM IC _V STBY
R16
PM IC _P WRFA IL
R19
CK IL
N18
CK IH
P15
CL K_ SS
W7
WD OG _R ST/P MI C_RD Y/ GPIO 3_2 8
N14
RE SE T_ IN_B
N15
PO R_ B
P16
BO OT _M ODE0 /A UD_M CL K2
P18
BO OT _M ODE1
M19
XT AL
N19
EX TA L
R1
TH DI OD E
R18
TE ST _M ODE
F18
GP AN AI O
LC D_ HS YNC/ GP IO3_ 31
LC D_ VS YNC/ GP IO3_ 29
LC D_ DO TCLK /G PIO3 _3 0
T8
GP IO 1_ 31/W DO G_RS T_ B_DE B
R9
UA RT 2_ RXD_ MU X/GP IO 2_31
V8
UA RT 2_ TXD_ MU X/GP IO 2_30
P9
UA RT 2_ RTS_ MU X/GP IO 2_29
W8
UA RT 2_ CTS
W9
GP IO 2_ 27
V9
GP IO 2_ 26
T9
UA RT _T X1/G PI O2_2 5
V10
UA RT _R X1/G PI O_24
T6
CS PI 2_ SCLK /I 2C3_ SC LK/G PIO 3_ 9
W4
CS PI 2_ SS1/ GP IO3_ 8
V5
CS PI 2_ SS0/ GP IO3_ 7
W5
CS PI 2_ MISO /G PIO3 _6
R7
CS PI 2_ MOSI /I 2C3_ SD A/GP IO3 _5
T7
CS PI 1_ SCLK /I 2C1_ SC L/GP IO3 _4
V6
CS PI 1_ SS1/ GP IO3_ 3
R8
CS PI 1_ SS0/ GP IO3_ 2
W6
CS PI 1_ MISO /G PIO3 _1
V7
CS PI 1_ MOSI /G PIO3 _0
UA RT 3_ CTS/ GP IO2_ 17
UA RT 3_ R_RT S/ GPIO 2_ 16
UA RT 3_ TXD_ MU X/GP IO 2_15
UA RT 3_ RXD_ MU X/GP IO 2_14
I2 C1 _D AT/G PI O2_1 3
I2 C1 _C LK/G PI O2_1 2
CS PI 3_ MISO /G PIO1 _2 4
CS PI 3_ SCLK /G PIO1 _2 3
CS PI 3_ MOSI /G PIO1 _2 2
SD 1_ DA TA3/ CS PI2_ SS 0/GP IO1 _2 1
SD 1_ DA TA2/ GP IO1_ 20
SD 1_ DA TA1/ GP IO1_ 19
SD 1_ DA TA0/ CS PI3_ MI OS/G PIO 1_ 18
SD 1_ CL K/CS PI 3_SC LK /GPI O1_ 17
SD 1_ CM D/CS PI 3_MO SI /GPI O1_ 16
DI SP 1_ DAT1 9/ ETM_ D3
DI SP 1_ DAT1 8/ ETM_ D2
DI SP 1_ DAT1 7/ ETM_ D1
DI SP 1_ DAT1 6/ ETM_ D0
GP IO 1_ 6/CL K0 /AUD _M CLK
P13
JT AG _M OD
T14
JT AG _D E_B
R13
JT AG _T RSTB
V16
JT AG _T DO
W16
JT AG _T DI
W17
JT AG _T MS
V17
JT AG _T CK
W18
JT AG _R TCK
VD 40 1
14 V
R4 12
4. 7K
R4 01
4. 7K
R4 05
6. 8K
R4 15
6. 8K
R4 02
10 K
R4 03
4. 7K
RED
10 : NAND BOOT
1.1 0V
CKI L
BOOT MODE
REAL TIME CLOCK
TOU CH INT ERF ACE
CLK /DA T < --I 2C_ 3
ARM _DE BUG
11 : USB BOOT
Pla ce thi s p art to CP U a s c los e a s p oss ibl e
SRT C_P OW
PER 4
PER _9
PER _2
PER _9
NVC C_O SC
PER 4
PER 9
USB PHY
PER 8
PER 2
PER 3
NVC C_I PU
NVC C_C NTR
PER 13
PER 14
NV CC _E MI
PER 6
AND GATE
CODEC;MCLK
U701
U504
U801
U402
U101
U702
U507
U506
U604
U401
5
MAIN CPU-2, page 7-3
4
MAIN PCB Top, page 6-1
<Fig. 4-2>
4
4
5
MAIN CPU-2, page 7-3
5
6
JTA G_T CK
BT_ UAR T_R X0
JTA G_R ST
BT_ UAR T_R TS0
JTA G_T MS
BT_ UAR T_T X0
JTA G_T DO
JTA G_T DI
JTA G_R TCK
BT_ UAR T_C TS0
GND
CPU _RS T
EAR PHO NE_ DET
R4 13
1M
GND
P_ 3. 0V
C4 06
10 0n F
R4 07
1K
DEV ICE _DE T
GND
CLK _SE LEC T
CLK _SE LEC T
EXT _PW R
BOO T_M ODE 1
BOO T_M ODE 0
P_ 3. 0V
C4 04
10 0n F
GND
R4 17
47 K
GND
32. 768 KHZ _OU T
X4 03
24 MH z
1
2
3
4
BOO T_M ODE 1
BOO T_M ODE 0
JTA G_R ST
GND
R4 09
10 K
GND
PWR _IN _DD CON
R4 04
22 K
C4 07
0. 02 2n F
C4 09
0. 02 2n F
U4 01
NC 7S V0 8P5X
1
A
2
B
3
GND
4
Y
5
Vcc
NAN D_S ELE CT
AUD _MC LK
R4 11
22
BOO T_M ODE 0
R4 06
22 K
U3 01
MC IM X3 7
T19
PM IC _V STBY
R16
PM IC _P WRFA IL
R19
CK IL
N18
CK IH
P15
CL K_ SS
W7
WD OG _R ST/P MI C_RD Y/ GPIO 3_2 8
N14
RE SE T_ IN_B
N15
PO R_ B
P16
BO OT _M ODE0 /A UD_M CL K2
P18
BO OT _M ODE1
M19
XT AL
N19
EX TA L
R1
TH DI OD E
R18
TE ST _M ODE
F18
GP AN AI O
LC D_ HS YNC/ GP IO3_ 31
LC D_ VS YNC/ GP IO3_ 29
LC D_ DO TCLK /G PIO3 _3 0
T8
GP IO 1_ 31/W DO G_RS T_ B_DE B
R9
UA RT 2_ RXD_ MU X/GP IO 2_31
V8
UA RT 2_ TXD_ MU X/GP IO 2_30
P9
UA RT 2_ RTS_ MU X/GP IO 2_29
W8
UA RT 2_ CTS
W9
GP IO 2_ 27
V9
GP IO 2_ 26
DI SP 1_ DAT1 9/ ETM_ D3
DI SP 1_ DAT1 8/ ETM_ D2
DI SP 1_ DAT1 7/ ETM_ D1
DI SP 1_ DAT1 6/ ETM_ D0
GP IO 1_ 6/CL K0 /AUD _M CLK
P13
JT AG _M OD
T14
JT AG _D E_B
R13
JT AG _T RSTB
V16
JT AG _T DO
W16
JT AG _T DI
W17
JT AG _T MS
V17
JT AG _T CK
W18
JT AG _R TCK
VD 40 1
14 V
R4 12
4. 7K
R4 01
4. 7K
R4 15
6. 8K
R4 02
10 K
R4 03
4. 7K
RED
10 : NAND BOOT
1.1 0V
CKI L
BOOT MODE
11 : USB BOOT
Pla ce thi s p art to CP U a s c los e a s p oss ibl e
SRT C_P OW
PER 4
PER _9
PER _2
PER _9
NVC C_O SC
PER 4
PER 9
USB PHY
PER 8
PER 2
NVC C_I PU
NVC C_C NTR
AND GATE
CODEC;MCLK
U701
U504
U801
U402
U101
U702
U507
U506
U604
U401
U701
U507
U506
U401
Troubleshooting
6
7
Samsung Electronics 4-5
MAIN PCB Bottom, page 6-3
7
6
MAIN CPU-2, page 7-3
<Fig. 4-3>
7
MAIN PCB Top, page 6-1
4-6 Samsung Electronics
Troubleshooting
4-1-2 If there is no sound
If there is no sound
Is audio signal present?
Yes
1
Is R711 high?
Yes Yes
See the waveform and
the image in Fig. 4-4.
Replace the board.
(Detailed inspection is
required.)
No
No
Does U701 work?
Yes
Does U301 work?
No
No
Replace U701.
Replace the board.
(Detailed inspection is
required.)
Replace U301.
Loading...