Page 1
MP3 Player
Model Name : YP-R1
Model Code : YP-R1AB/XER
SERVICE
Manual
MP3 Player
YP-R1
CONTENTS
1. Precaution
2. Product Specification
3. Disassembly & Reassembly
4. Troubleshooting
5. Exploded View & Part List
6. PCB Diagram
7. Schematic Diagram
Page 2
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
This Service Manual is a property of Samsung Electronics
Co.,Ltd. Any unauthorized use of Manual can be punished
under applicable International and/or domestic law.
© Samsung Electronics Co.,Ltd.
Printed in Korea
Oct. 2009
Page 3
Contents
1. Precaution
1-1 Safety Precautions ...........................................................................................1-1
1-2 Static Electricity Precautions ............................................................................
2. Product Specification
2-1 Product Feature ...............................................................................................2-1
2-2 Specifications ...................................................................................................
2-3 Specifications Analysis .....................................................................................
2-4 Accessories ......................................................................................................
3. Disassembly & Reassembly
3-1 Overall Disassembly & Reassembly ................................................................3-1
1-2
2-2
2-4
2-6
4. Troubleshooting
4-1 Checkpoints by Error Mode.............................................................................. 4-1
4-2 Upgrade Methods
.............................................................................................4-23
5. Exploded View & Part List
5-1 Exploded View .................................................................................................5-1
5-2 Electrical Part List ............................................................................................
6. PCB Diagram
6-1 MAIN PCB Top ................................................................................................. 6-1
6-2 MAIN PCB Bottom ...........................................................................................
7. Schematic Diagram
7-1 Overall Block Diagram .....................................................................................7-1
MAIN CPU-1 .................................................................................................... 7-2
7-2
MAIN CPU-2 .................................................................................................... 7-3
7-3
7-4 Memory (SDRAM, NAND-Flash)
7-5 Power Management .........................................................................................
7-6 AUDIO CODEC ................................................................................................
7-7 24PIN IO INTERFACE .....................................................................................
7-8 PBA / LCD INTERFACE ...................................................................................
7-9 BLUETOOTH / FM ...........................................................................................
......................................................................7-4
5-3
6-3
7-5
7-6
7-7
7-8
7-9
Page 4
Precaution
1. Precaution
1-1 Safety Precautions
1. To remove dust from the cabinet, use a dry cloth. Do not use any liquid or aerosol cleaners.
2. You should not use any attachments that are not recommended by the company. This could cause damage to
the unit.
3. You should not use this product near or in water.
4. You should only use the power supply provided by the company.
5. If replacement material is required you should only use standardized materials, if you use non-standardized
materials you could cause failure to the product.
Samsung Electronics 1-1
Page 5
Precaution
1-2 Static Electricity Precautions
1. Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits
and some field-effect transistors. The following techniques will reduce the occurrence of component damage
caused by static electricity.
2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these
can accumulate sufficient electrical charge to damage ESDs).
7. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
1-2 Samsung Electronics
Page 6
2. Product Specification
2-1 Product Feature
Convenient to use
- Convenient and intuitive menu selection that you can navigate with your
fingertips on a full screen touch pad.
Video playback without converting
- Playback is possible by simply transferring files without converting.
All file formats to the right are supported.
Product Specification
Compact design
- Compact design giving excellent portability.
45.5(H) x 85.2(V) x 8.9(D) mm
Samsung Electronics 2-1
Page 7
Product Specification
2-2 Specifications
Basic Specification
Rating DC 5.0V / 1A
Audio
File
• MPEG1/2/2.5 Layer3 (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• WMA (12kbps ~ 320kbps, 16kHz ~ 48kHz)
• Ogg (32kbps ~ 400kbps, Q0 ~ Q10, 8kHz ~ 48kHz)
• AAC-LC (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• AAC+ (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• Enhanced-AAC-Plus (8kbps ~ 320kbps, 8kHz ~ 48kHz)
• FLAC (levle0 ~ 8, 16kHz ~ 48kHz)
• RA (20kbps ~ 96kbps, 8kHz, 11.025kHz, 44.1kHz)
• WAV (wav standard, 8kHz ~ 48kHz)
Video Audio
• MPEG4 (Max.720 X 480) Advanced Simple Profile@
Level 5, 8 Mbps
• Divx3/4/5/(Max. 720 X 480), 8 Mbps
AVI/
SVI
• Xvid (Max. 720 X 480), 8 Mbps
• H.264/AVC (Max. 720 X 480) High Profile@Level3.0,
12.5 Mbps
MP3/AAC/
AAC+
Video
Image JPEG (Baseline, Progressive), BMP (MAX32Bit), PNG, Gif (89a/87a)
Flash SWF (Flash Player 8.0 or lower, ActionScript2.0 or lower)
Earphones Output
Output Frequency
Range
• WMV9 (MAX 720 X 480) Advanced Profile@level1,
10 Mbps
• MPEG4 (Max.720 X 480) Advanced Simple Profile@
MP4
WMV/
ASF
MOV
20 mW/Ch. (France 5 mW/Ch.) (based on16 Ω)
20Hz ~ 20kHz
Level 5, 8 Mbps
• H.264/AVC (Max. 720 X 480) High Profile@Level3.0,
12.5 Mbps
• WMV9 (MAX 720 X 480) Advanced Profile@level1(vc1),
10 Mbps
• MPEG4 (Max.720 X 480) Advanced Simple Profile@
Level 5, 8 Mbps
• H.264/AVC (Max. 720 X 480) High Profile@Level3.0,
12.5 Mbps
WMA
MP3/AAC/
AAC+
WMA
AAC/AAC+
Signal to Noise Ratio
Supported Number of
Files/Folders
Playing Time
2-2 Samsung Electronics
90dB with 20kHz LPF (based on 1kHz 0dB)
File: Max. 5000
Folder: Max. 5000 (including File)
Music: 25 hours (MP3 128 kbps, Volume level 15, Normal sound mode, LCD off)
Video: 5 hours (Brightness 3, Volume level 15, Normal sound mode, SVI)
Page 8
Product Specification
Temperature Range for
Operation
Case Tempered glass, Plastic, Aluminum
Weight 50g
Dimensions (WxHxD)
FM T.H.D
FM Signal to
FM
Noise Ratio
FM Useable
Sensitivity
Wireless System
Bluetooth QD ID B015440
Emission Type
RF power
Transmit Frequency
-5° C ~ 35° C (23° F ~ 95° F)
45.5 X 85.2 X 8.9 mm
1%
55dB
38dBμ
F1D
CLASS I
2402MHz ~ 2480MHz
Receive Frequency
Number of channels
Modulation System
Communication Mode
Humidity 0 ~ 95%
Specifications Version
Supported
Module BCM2070
2402MHz ~ 2480MHz
79 channels
GFSK
Semi-duplex Operation
2.0 + EDR
Samsung Electronics 2-3
Page 9
Product Specification
2-3 Specifications Analysis
BASIC
FILES
Model
YP-R1 YP-Q2
Photo
Storage Type
Display
Platform i.MX37 (Freescale) Sigmatel (STMP3750)
Battery Type
Battery Capacity
25 Hours of Music Playback with Earphones
Playback Time
(Earphone)
Color Black / Silver / Pink White / Black / Blue
Capacity 8G / 16G / 32G 4G / 8G / 16G
CASE Tempered glass, Aluminum, Plastic, ABS Aluminum, Plastic
NO Conversion
Widgets
Colorful + Moving GUI
MP3
WMA
RA
OGG (MAX Q10)
WAV
AAC
Audible X X
JPEG
FLAC
APE X X
Divx (3, 4, 5) X
Xvid
H.264
ASF
MOV
WMV
MPEG4 (SVI)
SWF
Flash memory (MLC) Flash memory (MLC)
SIZE: 2.6" WQVGA
Display Color: 16.7M LCD
(Dot pitch: 0.14475 (H) x 0.14475 (V))
Resolution: 240RGB (H) x 400 (V)
Li-Polymer Li-Polymer
500mAh 580mAh
(Based on MP3 128 kbps, Volume 15,
Normal EQ, LCD OFF),
5 Hours of Video Playback
(Based on MPEG4@SP, Volume 15,
Normal EQ, LCD lv3)
SIZE: 2.4" QVGA TFT LCD
Resolution: 320 (H) x 240 (V)
50 Hours of Music Playback with Earphones,
4Hours of Video Playback
X
X
X
X
(up to Q10)
X
X
X
X
X
X
X
: application, X: non-application
2-4 Samsung Electronics
Page 10
Product Specification
SOUND
TUNER
FUNCTIONS
DRM
Model
YP-R1 YP-Q2
Photo
DNSE 3.0
DNSE
User EQ
Street Mode
Sound Feedback
High-pitched Sound
Recovery
Playlist DNSE
Speed Control
Output Power (Earphone)
FM
RDS
ETC X X
Alarm X X
Bluetooth
Photo Viewer
Text Viewer
Game
Wallpaper
World Clock
Voice Recording
FM Recording
Wise Volume
(Hearing Protection)
Address Book
Data Cast
Flash Player
Calculator X X
TTS (Text to Speech)
Calender
Bookmark
Vive Woofer
(Using Haptic)
Quick Tray
Mini Player
Netsync
WMA DRM
Janus
(General, Studio, Rock, Classic, Jazz, Ballad,
Club, R&B, Dance, Cafe, Concert, Cathedral)
(9 band control) (9 band control)
(AUI) (AUI)
(MP3 file play 0.75 ~ 1.3X) (MP3 file play 0.75 ~ 1.3X)
20mW/CH 20mW/CH
X (FW will be supported) X
X X
(General, Studio, Rock, Classic, Jazz, Ballad,
DNSE 3.0
R&B, Dance, Concert)
TEXT, VIDEO
X
X
X
X
X
X
X
X
X
X
X
X
: application, X: non-application
Samsung Electronics 2-5
Page 11
Product Specification
2-4 Accessories
2-4-1 Supplied Accessories
Accessories Item Item Code Remark
Earphones GM59-01016A
USB Cable
User's Manual GM68-01002J
GM39-01002A
Samsung Service
Center
2-6 Samsung Electronics
Page 12
Disassembly & Reassembly
3. Disassembly & Reassembly
3-1 Overall Disassembly & Reassembly
- Please follow the disassemble sequence describes below. Otherwise, the product may be
damaged.
- Be sure to carefully read and understand the safety instructions describes at the start of this
manual before performing any work on the IC chips on the PCB.
- To assemble, follow the below instructions in reverse order.
No. Description Description Photo
1 1) Insert a flat screwdriver or tweezers into the hole
shown on the right. Remove the cover attached with
double sided tape.
Be careful not to make any scratches as you remove
the cover.
2 1) Remove the two screws using a phillips screwdriver,
and remove the SUS BRACKET.
3 1) Disconnect the case from the main body by pulling the
AL CASE down.
4 1) Remove the screw from the MAIN PCB.
Samsung Electronics 3-1
Page 13
3-2 Samsung Electronics
Disassembly & Reassembly
No. Description Description Photo
5 1) Remove the Cushion PCB from the MAIN PCB.
6 1) Disconnect the three connectors on the MAIN PCB
and remove the FPCB, and the MAIN PCB.
7 1) Insert a flat screwdriver or tweezers into the hole next
to the battery FPCB and remove the battery FPCB.
8 1) Remove the battery that is fixed with double sided
tape onto the LCD MODULE .
Ensure that the battery doesn’t get damaged.
Page 14
Disassembly & Reassembly
No. Description Description Photo
9 1) When removing the hooked LCD, pull the bottom of
the LCD (2) upwards while widening the side of the
Touch Assy (1).
1
10 1) After disassembly
2
Samsung Electronics 3-3
Page 15
MEMO
3-4 Samsung Electronics
Page 16
4. Troubleshooting
4-1 Checkpoints by Error Mode
Oscilloscope Setting Values Normal Voltage 24MHz 32.768KHz
Voltage/DIV 800mV/DIV 400mV/DIV 400mV/DIV
TIME/DIV 100ms/DIV 100us/DIV 100ns/DIV
4-1-1 If there is no power
If there is no power
Troubleshooting
Charge the battery and
check that the power is on.
No
Check that the
firmware is upgraded.
(See 4-2 Upgrade Methods)
No
1/2/3
C316: 2.5V, C318: 1.2V, C303: 3.0V
Check the voltage.
No
See the waveform and
the image in Fig. 4-1.
Yes
Yes
Yes
Yes
4/5
Check that the clock on X403 and
X402 oscillates.
No
Faulty
See the waveform and
the image in Fig. 4-2.
Yes
Check CPU_RST - HIGH
6/7
R406 - LOW
No
A
See the waveform and
the image in Fig. 4-3.
B
Samsung Electronics 4-1
Page 17
4-2 Samsung Electronics
Troubleshooting
A
B
Check the voltage on the battery.
No
Replace the battery and check the
voltage again.
Complete
Page 18
GND
GND
GND
P_ 1. 8V
P_ 1. 0V
GND
P_ 1. 2V
C3 33
10 0n F
GND
P_ 3. 0V
C3 15
10 0n F
GND
C3 08
10 0n F
C3 36
10 0n F
C3 10
10 0n F
GND
P_ 2. 5V
GND
C3 09
10 0n F
C3 30
10 0n F
C3 11
10 0n F
C3 32
10 0n F
GND
C3 38
10 0n F
C3 03
10 0n F
C3 37
10 0n F
GND
US B_ P5 V
C3 01
10 0n F
GND
C3 02
10 0n F
P_ 2. 5V
DDR_ SD_CKE
P_ 3. 0V
VD DA _1 .2 V
C3 39
10 0n F
P_ 3. 3V
C3 20
10 0n F
C3 23
10 0n F
C3 27
10 0n F
C3 05
10 0n F
C3 31
10 0n F
C3 28
10 0n F
C3 21
10 0n F
C3 04
10 0n F
C3 07
10 0n F
C3 29
10 0n F
C3 12
10 0n F
C3 25
10 0n F
C3 24
10 0n F
U3 01
MC IM X3 7
A1
GN D_ 1
A19
GN D_ 2
H9
GN D_ 3
H10
GN D_ 4
J8
GN D_ 5
J9
GN D_ 6
J10
GN D_ 7
J11
GN D_ 8
K8
GN D_ 9
K9
GN D_ 10
K10
GN D_ 11
K11
GN D_ 12
K12
GN D_ 13
L9
GN D_ 14
L10
GN D_ 15
L11
GN D_ 16
L12
GN D_ 17
W19
GN D_ 18
M8
GN D_ 19
M10
GN D_ 20
W1
GN D_ 21
K13
GN D_ 22
F12
GN D_ AN A_ PLL_ A
M13
GN D_ AN A_ PLL_ B
F14
GN D_ DI G_ PLL_ A
N13
GN D_ DI G_ PLL_ B
P19
NG ND _O SC
G15
NG ND _U SB PHY
T11
NG ND _R GB 1
V11
NG ND _R GB 2
F15
RR EF EX T
F16
ID
H15
VB US
G19
DN
F19
DP
V14
IO B_ BA CK
W11
IO B
V15
IO G_ BA CK
W12
IO G
W15
IO R_ BA CK
W13
IO R
V13
RS ET
T13
VR EF IN
P11
VR EO UT
W14
CO MP
T15
VD D_ FU SE
N16
FA ST R_ DI G
M18
FA ST R_ AN A
P14
NV CC _S RT C_PO W
N8
VD D_ TV DI G
M7
VD DA 2
G12
VD DA 1
N12
VD D_ DI G_ PLL_ B
G14
VD D_ DI G_ PLL_ A
M11
VD D_ AN A_ PLL_ B
F13
VD D_ AN A_ PLL_ A
L19
NV CC _O SC
G16
NV CC _U SB PHY
M9
NV CC _T V_ BACK
P12
NV CC _D AC
V12
AH VD DR GB 2
T12
AH VD DR GB 1
R12
VD D_ TV SU PPLY
L13
PE R9
R14
PE R8
P6
PE R6
L7
PE R4
P7
PE R3
P8
PE R2
J7
NV CC _I PU 2
H7
NV CC _I PU 1
J14
VD DA 33 _2
H14
VD DA 33 _1
N7
PE R1 4
R15
PE R1 3
K14
NV CC _E MI 3
J13
NV CC _E MI 2
H13
NV CC _E MI 1
G7
NV CC _C TN R_EM I
F4
NV CC _E MI _DRA M8
D13
NV CC _E MI _DRA M7
D12
NV CC _E MI _DRA M6
D11
NV CC _E MI _DRA M5
D10
NV CC _E MI _DRA M4
D9
NV CC _E MI _DRA M3
D8
NV CC _E MI _DRA M2
D7
NV CC _E MI _DRA M1
L8
VC C4 _1
K7
VC C4 _2
N10
VC C3
M12
VC C2
J12
VC C_ 1
H12
VC C_ 2
H11
VC C_ 3
H8
VD DG P5
G11
VD DG P4
G10
VD DG P3
G9
VD DG P2
G8
VD DG P1
C3 22
10 00 nF
C3 14
10 00 nF
C3 16
10 00 nF
C3 18
10 00 nF
R3 07
10 0K
C3 19
47 00 nF
C3 35
10 0n F
C3 34
10 0n F
R3 02
1K
R3 04
5. 6K
C3 13
10 00 0n F
VCC_ CORE
VCC_ 1.2V
VCC_ 1.8V
VCC_ 3.0V
VCC_ 3.0V
VCC_ 1.8V
VCC_ 2.5V
VDDA _1.2V
VCC_ 1.8V
DC/D C
DC/D C
DC/D C
LDO
LDO
CVBS VIDEO OUT
LDO
U701
U504
U101
U702
U507
U506
U401
CON601
U503
U502
U301
U601
U501
2
C316
1
Samsung Electronics 4-3
1
MAIN PCB Top, page 6-1
2
C318
<Fig. 4-1>
1
2
3
MAIN CPU-1, page 7-2
3
MAIN PCB Bottom, page 6-3
C303
3
Troubleshooting
Page 19
4-4 Samsung Electronics
Troubleshooting
LCD _RE D2
JTA G_T CK
LCD _GR N0
LCD _RE D0
JTA G_R ST
JTA G_T MS
LCD _BL U4
LCD _GR N1
LCD _GR N5
LCD _BL U6
LCD _GR N4
LCD _DO TCL K
LCD _RE D1
LCD _HS YNC
LCD _GR N2
LCD _RE D3
JTA G_T DO
LCD _BL U7
JTA G_T DI
LCD _RE D5
PWR _ON _OF F
LCD _BL U1
LCD _BL U2
LCD _GR N6
JTA G_R TCK
GND
LCD _BL U0
LCD _GR N3
LCD _GR N7
LCD _RE D4
LCD _BL U3
LCD _VS YNC
LCD _BL U5
LED _DI MMI NG
EAR PHO NE_ DET
R4 13
1M
GND
P_ 3. 0V
C4 06
10 0n F
R4 07
1K
LCD _EN ABL E
CLK _SE LEC T
BOO T_M ODE 1
BOO T_M ODE 0
GND
R4 17
47 K
GND
32. 768 KHZ _OU T
FM_ SEA RCH
LCD _CH ECK
LCD _RS T
X4 03
24 MH z
1
2
3
4
NAN D_C S_C TL
GND
NAN D_R /B1
NAN D_R /B2
R4 04
22 K
C4 07
0. 02 2n F
C4 09
0. 02 2n F
U3 01
MC IM X3 7
T19
PM IC _V STBY
R16
PM IC _P WRFA IL
R19
CK IL
N18
CK IH
P15
CL K_ SS
W7
WD OG _R ST/P MI C_RD Y/ GPIO 3_2 8
N14
RE SE T_ IN_B
N15
PO R_ B
P16
BO OT _M ODE0 /A UD_M CL K2
P18
BO OT _M ODE1
M19
XT AL
N19
EX TA L
R1
TH DI OD E
R18
TE ST _M ODE
F18
GP AN AI O
H4
LC D_ HS YNC/ GP IO3_ 31
G2
LC D_ VS YNC/ GP IO3_ 29
P2
LC D_ WR /GPI O3 _10
P1
LC D_ RD /GPI O3 _11
N6
LC D_ RS /GPI O3 _12
N2
LC D_ RD Y/GP IO 1_30
N5
LC D_ CS /GPI O3 _13
F1
LC D_ DO TCLK /G PIO3 _3 0
T8
GP IO 1_ 31/W DO G_RS T_ B_DE B
J5
DI SP 1_ DAT2 1
H2
DI SP 1_ DAT2 0
J4
DI SP 1_ DAT1 9/ ETM_ D3
H1
DI SP 1_ DAT1 8/ ETM_ D2
K6
DI SP 1_ DAT1 7/ ETM_ D1
J1
DI SP 1_ DAT1 6/ ETM_ D0
J2
DI SP 1_ DAT1 5
K5
DI SP 1_ DAT1 4
L6
DI SP 1_ DAT1 3
K2
DI SP 1_ DAT1 2
L5
DI SP 1_ DAT1 1
K1
DI SP 1_ DAT1 0
L4
DI SP 1_ DAT9
L1
DI SP 1_ DAT8
L2
DI SP 1_ DAT7
M6
DI SP 1_ DAT6
M5
DI SP 1_ DAT5
M2
DI SP 1_ DAT4
M1
DI SP 1_ DAT3
M4
DI SP 1_ DAT2
N4
DI SP 1_ DAT1
N1
DI SP 1_ DAT0
P4
GP IO 1_ 7
P5
GP IO 1_ 6/CL K0 /AUD _M CLK
R2
GP IO 1_ 5/US B_ PWR
R4
GP IO 1_ 4
T1
GP IO 1_ 3
R5
GP IO 1_ 2
T2
GP IO 1_ 1/I2 C2 _SDA
U1
GP IO 1_ 0/I2 C2 _SCL
P13
JT AG _M OD
T14
JT AG _D E_B
R13
JT AG _T RSTB
V16
JT AG _T DO
W16
JT AG _T DI
W17
JT AG _T MS
V17
JT AG _T CK
W18
JT AG _R TCK
14 V
R4 12
4. 7K
R4 15
6. 8K
R4 02
10 K
BLU E
GRE EN
1.1 0V
BOOT MODE
SRT C_P OW
PER 4
PER _9
PER _2
PER _9
NVC C_O SC
PER 4
PER 9
USB PHY
PER 8
NVC C_I PU
JTA G_T CK
BT_ UAR T_R X0
JTA G_R ST
BT_ UAR T_R TS0
JTA G_T MS
TOU CH_ DAT
BT_ UAR T_T X0
JTA G_T DO
JTA G_T DI
JTA G_R TCK
BT_ UAR T_C TS0
GND
CPU _RS T
EAR PHO NE_ DET
R4 13
1M
GND
P_ 3. 0V
TOU CH_ CLK
TOU CH_ INT R
TOU CH_ CE
C4 06
10 0n F
R4 07
1K
DEV ICE _DE T
GND
CLK _SE LEC T
CLK _SE LEC T
EXT _PW R
BOO T_M ODE 1
BOO T_M ODE 0
GND
P_ 3. 0V
C4 04
10 0n F
GND
R4 17
47 K
GND
IN N_ BA TT
GND
C4 03
7p F
12
C4 02
7p F
12
GND
X4 02
32 .7 68 KHz
1
IN
2
OU T
3
GN D
U4 02
S- 35 39 2A
1 32KO
2
XOUT
3 XIN
4 VSS
5
INT2
6
SCL
7
SDA
8
VDD
32. 768 KHZ _OU T
P_ 3. 0V
32. 768 KHZ _OU T
X4 03
24 MH z
1
2
3
4
BOO T_M ODE 1
BOO T_M ODE 0
JTA G_R ST
GND
UAR T_T X1
UAR T_R X1
R4 09
10 K
GND
NAN D_R /B3
NAN D_R /B4
NAN D_R /B5
NAN D_R /B6
NAN D_R /B7
D4 01
KD S1 21 V
P_ 3. 0V
PWR _IN _DD CON
R4 04
22 K
I2C _DA T0
I2C _CL K0
C4 07
0. 02 2n F
C4 09
0. 02 2n F
U4 01
NC 7S V0 8P5X
1
A
2
B
3
GND
4
Y
5
Vcc
C4 08
10 0n F
R4 10
22
NAN D_S ELE CT
AUD _MC LK
R4 11
22
BOO T_M ODE 0
R4 06
22 K
R4 08
10 0K
U3 01
MC IM X3 7
T19
PM IC _V STBY
R16
PM IC _P WRFA IL
R19
CK IL
N18
CK IH
P15
CL K_ SS
W7
WD OG _R ST/P MI C_RD Y/ GPIO 3_2 8
N14
RE SE T_ IN_B
N15
PO R_ B
P16
BO OT _M ODE0 /A UD_M CL K2
P18
BO OT _M ODE1
M19
XT AL
N19
EX TA L
R1
TH DI OD E
R18
TE ST _M ODE
F18
GP AN AI O
LC D_ HS YNC/ GP IO3_ 31
LC D_ VS YNC/ GP IO3_ 29
LC D_ DO TCLK /G PIO3 _3 0
T8
GP IO 1_ 31/W DO G_RS T_ B_DE B
R9
UA RT 2_ RXD_ MU X/GP IO 2_31
V8
UA RT 2_ TXD_ MU X/GP IO 2_30
P9
UA RT 2_ RTS_ MU X/GP IO 2_29
W8
UA RT 2_ CTS
W9
GP IO 2_ 27
V9
GP IO 2_ 26
T9
UA RT _T X1/G PI O2_2 5
V10
UA RT _R X1/G PI O_24
T6
CS PI 2_ SCLK /I 2C3_ SC LK/G PIO 3_ 9
W4
CS PI 2_ SS1/ GP IO3_ 8
V5
CS PI 2_ SS0/ GP IO3_ 7
W5
CS PI 2_ MISO /G PIO3 _6
R7
CS PI 2_ MOSI /I 2C3_ SD A/GP IO3 _5
T7
CS PI 1_ SCLK /I 2C1_ SC L/GP IO3 _4
V6
CS PI 1_ SS1/ GP IO3_ 3
R8
CS PI 1_ SS0/ GP IO3_ 2
W6
CS PI 1_ MISO /G PIO3 _1
V7
CS PI 1_ MOSI /G PIO3 _0
UA RT 3_ CTS/ GP IO2_ 17
UA RT 3_ R_RT S/ GPIO 2_ 16
UA RT 3_ TXD_ MU X/GP IO 2_15
UA RT 3_ RXD_ MU X/GP IO 2_14
I2 C1 _D AT/G PI O2_1 3
I2 C1 _C LK/G PI O2_1 2
CS PI 3_ MISO /G PIO1 _2 4
CS PI 3_ SCLK /G PIO1 _2 3
CS PI 3_ MOSI /G PIO1 _2 2
SD 1_ DA TA3/ CS PI2_ SS 0/GP IO1 _2 1
SD 1_ DA TA2/ GP IO1_ 20
SD 1_ DA TA1/ GP IO1_ 19
SD 1_ DA TA0/ CS PI3_ MI OS/G PIO 1_ 18
SD 1_ CL K/CS PI 3_SC LK /GPI O1_ 17
SD 1_ CM D/CS PI 3_MO SI /GPI O1_ 16
DI SP 1_ DAT1 9/ ETM_ D3
DI SP 1_ DAT1 8/ ETM_ D2
DI SP 1_ DAT1 7/ ETM_ D1
DI SP 1_ DAT1 6/ ETM_ D0
GP IO 1_ 6/CL K0 /AUD _M CLK
P13
JT AG _M OD
T14
JT AG _D E_B
R13
JT AG _T RSTB
V16
JT AG _T DO
W16
JT AG _T DI
W17
JT AG _T MS
V17
JT AG _T CK
W18
JT AG _R TCK
VD 40 1
14 V
R4 12
4. 7K
R4 01
4. 7K
R4 05
6. 8K
R4 15
6. 8K
R4 02
10 K
R4 03
4. 7K
RED
10 : NAND BOOT
1.1 0V
CKI L
BOOT MODE
REAL TIME CLOCK
TOU CH INT ERF ACE
CLK /DA T < --I 2C_ 3
ARM _DE BUG
11 : USB BOOT
Pla ce thi s p art to CP U a s c los e a s p oss ibl e
SRT C_P OW
PER 4
PER _9
PER _2
PER _9
NVC C_O SC
PER 4
PER 9
USB PHY
PER 8
PER 2
PER 3
NVC C_I PU
NVC C_C NTR
PER 13
PER 14
NV CC _E MI
PER 6
AND GATE
CODEC;MCLK
U701
U504
U801
U402
U101
U702
U507
U506
U604
U401
5
MAIN CPU-2, page 7-3
4
MAIN PCB Top, page 6-1
<Fig. 4-2>
4
4
5
MAIN CPU-2, page 7-3
5
Page 20
6
JTA G_T CK
BT_ UAR T_R X0
JTA G_R ST
BT_ UAR T_R TS0
JTA G_T MS
BT_ UAR T_T X0
JTA G_T DO
JTA G_T DI
JTA G_R TCK
BT_ UAR T_C TS0
GND
CPU _RS T
EAR PHO NE_ DET
R4 13
1M
GND
P_ 3. 0V
C4 06
10 0n F
R4 07
1K
DEV ICE _DE T
GND
CLK _SE LEC T
CLK _SE LEC T
EXT _PW R
BOO T_M ODE 1
BOO T_M ODE 0
P_ 3. 0V
C4 04
10 0n F
GND
R4 17
47 K
GND
32. 768 KHZ _OU T
X4 03
24 MH z
1
2
3
4
BOO T_M ODE 1
BOO T_M ODE 0
JTA G_R ST
GND
R4 09
10 K
GND
PWR _IN _DD CON
R4 04
22 K
C4 07
0. 02 2n F
C4 09
0. 02 2n F
U4 01
NC 7S V0 8P5X
1
A
2
B
3
GND
4
Y
5
Vcc
NAN D_S ELE CT
AUD _MC LK
R4 11
22
BOO T_M ODE 0
R4 06
22 K
U3 01
MC IM X3 7
T19
PM IC _V STBY
R16
PM IC _P WRFA IL
R19
CK IL
N18
CK IH
P15
CL K_ SS
W7
WD OG _R ST/P MI C_RD Y/ GPIO 3_2 8
N14
RE SE T_ IN_B
N15
PO R_ B
P16
BO OT _M ODE0 /A UD_M CL K2
P18
BO OT _M ODE1
M19
XT AL
N19
EX TA L
R1
TH DI OD E
R18
TE ST _M ODE
F18
GP AN AI O
LC D_ HS YNC/ GP IO3_ 31
LC D_ VS YNC/ GP IO3_ 29
LC D_ DO TCLK /G PIO3 _3 0
T8
GP IO 1_ 31/W DO G_RS T_ B_DE B
R9
UA RT 2_ RXD_ MU X/GP IO 2_31
V8
UA RT 2_ TXD_ MU X/GP IO 2_30
P9
UA RT 2_ RTS_ MU X/GP IO 2_29
W8
UA RT 2_ CTS
W9
GP IO 2_ 27
V9
GP IO 2_ 26
DI SP 1_ DAT1 9/ ETM_ D3
DI SP 1_ DAT1 8/ ETM_ D2
DI SP 1_ DAT1 7/ ETM_ D1
DI SP 1_ DAT1 6/ ETM_ D0
GP IO 1_ 6/CL K0 /AUD _M CLK
P13
JT AG _M OD
T14
JT AG _D E_B
R13
JT AG _T RSTB
V16
JT AG _T DO
W16
JT AG _T DI
W17
JT AG _T MS
V17
JT AG _T CK
W18
JT AG _R TCK
VD 40 1
14 V
R4 12
4. 7K
R4 01
4. 7K
R4 15
6. 8K
R4 02
10 K
R4 03
4. 7K
RED
10 : NAND BOOT
1.1 0V
CKI L
BOOT MODE
11 : USB BOOT
Pla ce thi s p art to CP U a s c los e a s p oss ibl e
SRT C_P OW
PER 4
PER _9
PER _2
PER _9
NVC C_O SC
PER 4
PER 9
USB PHY
PER 8
PER 2
NVC C_I PU
NVC C_C NTR
AND GATE
CODEC;MCLK
U701
U504
U801
U402
U101
U702
U507
U506
U604
U401
U701
U507
U506
U401
Troubleshooting
6
7
Samsung Electronics 4-5
MAIN PCB Bottom, page 6-3
7
6
MAIN CPU-2, page 7-3
<Fig. 4-3>
7
MAIN PCB Top, page 6-1
Page 21
4-6 Samsung Electronics
Troubleshooting
4-1-2 If there is no sound
If there is no sound
Is audio signal present?
Yes
1
Is R711 high?
Yes Yes
See the waveform and
the image in Fig. 4-4.
Replace the board.
(Detailed inspection is
required.)
No
No
Does U701 work?
Yes
Does U301 work?
No
No
Replace U701.
Replace the board.
(Detailed inspection is
required.)
Replace U301.
Page 22
R7 13
1K
GND
U7 02
FD MA1 0 28N Z
1 S1
2
G1
3 D2_1
4 S2
5
G2
6
D1_1
7
D1_2
8
D2_2
R7 15
56 0
R7 14
56 0
LOU T_EP
MUT E
GND
ROU T_EP
C7 21
33 0uF
2. 5V
C7 22
33 0uF
2. 5V
GND
FM_ LINE_ IN_R
I2C _CLK0
LIN E_OUT _L
C7 13
10 0nF
FM_ LINE_ IN_L
LIN E_OUT _R
I2C _DAT0
C7 18
10 0nF
C7 15
10 00n F
R7 17
10 0K
VID EO_DA COUT
R7 07
75
GND
VID EO_EN
VID EO_OU T
P_ 3.0 V
C7 23
10 0nF
R7 11
20 0K
U7 04
FS M61 5 1L6 X_F 1 13
1
VIN
2
GND
3
SAG
4
VOUT
5
VCC
6
EN
U701
U801
U101
U702
U507
U506
U401
Troubleshooting
1
1
1
AUDIO CODEC, page 7-6
MAIN PCB Top, page 6-1
<Fig. 4-4>
Samsung Electronics 4-7
Page 23
4-8 Samsung Electronics
Troubleshooting
4-1-3 If the touch pad doesn’t work
If the touch pad doesn’t work
Is it set to HOLD OFF?
Yes
Does the touch pad respond?
Yes
Does the touch pad have a defect?
Yes
No
No
No
Cancel the HOLD status by pressing
the power key on the main body.
Disassemble the main body and check
if the TOUCH FPCB is connected
correctly or faulty.
If the touch pad is faulty, replace it.
Replace the board.
(Detailed inspection is required.)
Page 24
4-1-4 If FM doesn’t work
If FM doesn’t work
Troubleshooting
Is audio signal present?
Yes
1
Is the 32.768 clock displayed?
(R118)
Yes Yes
See the waveform and
the image in Fig. 4-5.
Replace the board.
(Detailed inspection is
required.)
No
No
Does U701 work?
Yes
Does X402 work?
No
No
Replace U701.
Replace the board.
(Detailed inspection is
required.)
Replace X402.
Samsung Electronics 4-9
Page 25
4-10 Samsung Electronics
Troubleshooting
GND
FM_ LIN E_I N_L
FM_ LIN E_I N_R
R1 17
1K
R1 16
1K
C1 18
10 nF
C1 19
10 nF
32. 768 KHZ _OU T
C1 14
10 0n F
GND
GND
FM_ ANT
I2C _CL K0
I2C _DA T0
GND
GND
C1 11
10 0n F
FM_ SEA RCH
P_ 3. 0V
C1 10
0. 1n F
U1 01
SI 47 09 -B-G MR
1
NC _1
2
FM I
3
RF GN D
4
RS T
5
SE N6SC LK7SD IO8VI O
9
RC LK
10
VD
11
GN D_ 1
12
RO UT
13
LO UT14VA15GP O16NC _217GN D_ 2
C1 21
22 00 nF
C1 22
22 00 nF
R1 11
10 0K
R1 18
1K
C1 20
47 00 nF
R1 15
10 0K
R1 13
15 0
R1 14
15 0
C1 17
10 0n F
clo se to
VD pin
FMI tr ace as
sho rt as pos sib le
U701
U101
U702
U507
U506
U401
1
BLUETOOTH / FM, page 7-9
1
1
MAIN PCB Top, page 6-1
<Fig. 4-5>
Page 26
4-1-5 If the LCD displays nothing
If the LCD displays nothing
Troubleshooting
Are the FPCB and the
connector connected properly?
Yes
1
Are the LED_PWM and LED_DIMMING
ports’ voltages high?
Yes
Replace the board.
(Detailed inspection is required.)
See the waveform and
the image in Fig. 4-6.
No
No
Connect the LCD FPCB and the
connector properly.
Disassemble the main body and
replace the LCD.
Samsung Electronics 4-11
Page 27
4-12 Samsung Electronics
Troubleshooting
LED +
V_ DD CO N
IN N_ BA TT
P_ 3. 0V
US B_ P5 V
V_ DD CO N
LED _DI MMI NG
C6 20
10 00 0n F
10 V
D6 01
KD S1 21 V
C6 23
10 00 0n F
10 V
GND
R6 06
1K
C6 27
10 0n F
C6 19
10 0n F
LED -
LED _PW M
U6 01
MA X8 81 9
1CO MP 4
2FB 4
3OV P4
4PG 4
5LX 4
6GN D
7EN 4
22
FB 2
23 FB3
24 EN1 2 3
25 PV2
26 LX2
27 PG2
28
DL IM 2
12
CE N
10
SY S
8RS T1
13
FB 1
11DC
9
BA T
14
CI SE T
Q6 01
KT K5 13 2V
1
So urc e
2
Ga te
3
Dr ain
R6 16
39 K
R6 39
20 0K
P_ 3. 0V
C6 31
47 0n F
10 V
L6 04
10 uH
R6 22
10 K
R6 40
10 0K
R6 21
10 0K
R6 15
10 K
C6 08
22 nF
R6 19
10 K
C6 06
47 00 nF
C6 29
22 00 0n F
6. 3V
C6 09
10 0n F
20 0K
D6 03
DS F0 5S 30U
1.5
U504
U507
U506
U604
U401
1
1
1
Power Management, page 7-5
1
1
MAIN PCB Top, page 6-1
<Fig. 4-6>
Page 28
4-1-6 If the battery is not charging
If the battery is not charging
Troubleshooting
Is the screen on when
connecting the USB?
Yes
Are the battery FPCB
and the connector connected
properly?
Yes
1
Is the voltage of the battery
above 4.5V? (C801)
See the waveform and
Yes
the image in Fig. 4-7.
No
No
No
Does it work after
the firmware upgrade?
Yes
Connect the battery FPCB and the
connector properly.
Replace the battery and check the
voltage again.
No
2/3/4
Check voltage of the battery.
R621 – High while charging,
R618 – Low while charging and
High when fully
charged.
See the waveform and
Yes
Change the battery
the image in Fig. 4-8.
No
Replace the board.
(Detailed inspection is required.)
Samsung Electronics 4-13
Page 29
4-14 Samsung Electronics
Troubleshooting
GND
USB _D+
UAR T_T X1
UAR T_R X1
PBA _CE
USB _D-
R8 14
27 K
P_ 3. 0V
US B_ P5 V
IN N_ BA TT
C8 03
10 0n F
CPU _RS T
R8 05
0
R8 15
10 K
R8 12
10 K
R8 03
JTA G_T DO
GND
C8 01
22 00 nF
10 V
D8 01
ES D7 L5 .0DT 5G
CON801
24P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
R8 09
0
R8 01
0
C8 02
10 00 nF
R8 02
22
U8 01
NC P3 60 SNT1 G
1
IN
2
GND
3
EN
4
FLA G
5
OUT
D8 0
2
uC la mp 1201 P. TC
T
R8 08
3. 9o hm
R8 10
3. 9o hm
14 : Ua rt T X1
22 : BA TT
4 : AD APTO R
15 : US B D+ /H OST D+
24 : PB A CE
19 : GN D
12 : GN D
6 : JT AG_R TC K/P ON
1 0: U SB D -/ HOST D -
8 : CP U_RS T
5 : AD APTO R
11 : JT AG_T CK
3 : nc
21 : BA TT
16 : US B PW R
2 : DE VICE D ET/C E
9 : JT AG_T DO
17 : LI NE O UT R
7 : JT AT_R ST
18 : LI NE O UT L
13 : Ua rt R X1
23 : JT AG_T DI
1 : BA TT I D
NC
20 : JT AG_T MS
NC
U701
U504
U801
U402
U101
U702
U507
U506
U401
1
1
24PIN IO INTERFACE, page 7-7
1
MAIN PCB Top, page 6-1
<Fig. 4-7>
Page 30
2
LED +
EXT _PW R
CPU _RS T
V_ DD CO N
IN N_ BA TT
P_ 3. 0V
US B_ P5 V
P_ 1. 0V
R6 29
5. 6K
GND
GND
CHA RGE _EN
LED _DI MMI NG
C6 20
10 00 0n F
10 V
C6 23
10 00 0n F
10 V
R6 23
10 K
GND
C6 27
10 0n F
C6 19
10 0n F
LED -
P_ 3. 0V
U6 01
MA X8 81 9
1CO MP 4
2FB 4
3OV P4
4PG 4
5LX 4
6GN D
7EN 4
15 CHG
16 PG1
17 LX1
18 PV1 3
19 LX3
20 PG3
21 DLI M 1
22
FB 2
23 FB3
24 EN1 2 3
25 PV2
26 LX2
27 PG2
28
DL IM 2
12
CE N
10
SY S
8RS T1
13
FB 1
11DC
9
BA T
14
CI SE T
Q6 01
KT K5 13 2V
P_ 1. 2V
P_ 1. 8V
R6 16
39 K
R6 39
20 0K
C6 31
47 0n F
10 V
R6 18
4. 7K
56 K
L6 04
10 uH
R6 30
10 K
R6 22
10 K
R6 21
10 0K
L6 03
4. 7u H
L6 01
4. 7u H
L6 02
4. 7u H
C6 08
22 nF
R6 19
10 K
C6 06
47 00 nF
C6 11
47 00 nF
C6 29
22 00 0n F
6. 3V
C6 09
10 0n F
R6 08
20 0K
D6 03
DS F0 5S 30U
3.0V
1% OK!
1% OK!
1% OK!
20 0m s dela y
400mA
30 0m A
30 0m A
1% OK!
1.5
=== > 3 00m A
Cur ren t = 20 00 x
R62 3
CON601
U601
Troubleshooting
4
3
Power Management, page 7-5
3
4
2
MAIN PCB Bottom, page 6-3
<Fig. 4-8>
2
4
3
HIGH
LOW
Samsung Electronics 4-15
Page 31
4-16 Samsung Electronics
Troubleshooting
4-1-7 If the MIC doesn’t work properly
If the MIC doesn’t work properly
Does the MIC look fine
when checking visually?
Yes
1
Is the bias voltage present?
(R704 - 1.5V)
Yes
Replace the board.
(Detailed inspection is required.)
See the waveform and
the image in Fig. 4-9.
No
No
Replace the MIC.
Disassemble the main body and
replace the MIC.
Page 32
1
P_ 1. 8V
C7 06
10 0n F
C7 12
10 00 0n F
GND
AUD _LR CK
GND
GND
AUD _BC LK
FM_ LIN E_I N_R
C7 03
10 nF
R7 04
1K
AUD _DA TA_ OUT
I2C _CL K0
ROU T_E P
AUD _MC LK
P_ 3. 0V
LIN E_O UT_ L
AUD _DA TA_ IN
C7 13
10 0n F
U7 01
WM 18 08
1
LI P
2
LI N
3
L2 /G PI O2
4
R2 /G PI O3
5
DA CD AT
6
LR C
7
BC LK
8
AD CD AT9MR CK10DG ND11DC VD D12DB VD D13CS B/ GP IO114SC LK
15
SD IN
16
MO DE
17
AU XL
18
AU XR
19
OU T3
20
RO UT 2
21
AG ND 2
22
LO UT 223AV DD 224VM ID25AG ND 126RO UT 127LO UT 128AV DD 1
FM_ LIN E_I N_L
GND
LIN E_O UT_ R
I2C _DA T0
LOU T_E P
P_ 3. 0V
C7 05
10 00 nF
C7 01
10 00 nF
C7 14
10 00 nF
C7 07
22 00 0n F
C7 15
10 00 nF
R7 09
10 K
R7 08
10 K
C7 16
47 00 nF
MI C7 01
3. 6V
1
Power
2
Ground _1
3
Ground _2
4
Output
P_ 3. 0V
U701
U801
U101
U702
U507
U506
U401
Troubleshooting
AUDIO CODEC, page 7-6
1
1
Samsung Electronics 4-17
MAIN PCB Top, page 6-1
<Fig. 4-9>
Page 33
4-18 Samsung Electronics
Troubleshooting
4-1-8 If the TV-OUT doesn’t work
If the TV-OUT doesn’t work
1
Is the VIDEO_EN voltage
high? (U704 Pin 6)
Yes
See the waveform and
the image in Fig. 4-10.
Is output present?
Yes
Replace the board.
(Detailed inspection is
required.)
No
No
Does U301 work?
Yes
Is it DRM content?
No
No
Yes
Replace U301.
Replace the board.
(Detailed inspection is
required.)
Replace the content.
Page 34
1
C7 12
10 00 0n F
GND
FM_ LIN E_I N_R
I2C _CL K0
LIN E_O UT_ L
C7 13
10 0n F
15
16
17
18
19
20
21
FM_ LIN E_I N_L
LIN E_O UT_ R
I2C _DA T0
C7 14
10 00 nF
C7 15
10 00 nF
R7 09
10 K
R7 17
10 0K
VID EO_ DAC OUT
R7 07
75
GND
VID EO_ EN
VID EO_ OUT
P_ 3. 0V
C7 23
10 0n F
U7 04
FS M6 15 1L6X _F 113
1
VIN
2
GND
3
SAG
4
VOUT
5
VCC
6
EN
CON901
CON601
CON802
U503
U502
U301
U102
U601
U501
Troubleshooting
1
MAIN PCB Bottom, page 6-3
<Fig. 4-10>
AUDIO CODEC, page 7-6
1
Samsung Electronics 4-19
Page 35
4-20 Samsung Electronics
Troubleshooting
4-1-9 If Bluetooth doesn’t work
If Bluetooth doesn’t work
Is the Bluetooth
antenna fine?
Yes
1
Does the clock oscillate?
(X101)
Yes
See the waveform and
the image in Fig. 4-11.
2
Is 1.2V present?
(B101)
Yes
See the waveform and
the image in Fig. 4-11.
No
No
No
Does X101 work?
Yes
Does U102 work?
Yes
No
No
Replace ANT101.
Replace X101.
Replace the board
(Detailed inspection is
required.)
Replace U102.
Replace the board.
(Detailed inspection is
required.)
Page 36
GND
FM_ BUS _EN
FM_ ANT
I2C _CL K0
I2C _DA T0
GND
GND
GND
32. 768 KHZ _OU T
C1 07
10 0n F
GND
P_ 1. 8V
RE G_ BT
GND
R1 05
1K
BT_ WAK E
BT_ RST
BT_ UAR T_R X0
BT_ UAR T_T X0
L1 01
8. 2n H
BT_ UAR T_R TS0
R1 02
10 0K
C1 10
0. 1n F
AN T1 01
OD BT PT R301 5
1
2
3
4
R1 07
15 K
R1 01
47 K
R1 08
47 K
C1 05
10 00 nF
C1 06
10 00 nF
U1 01
SI 47 09 -B-G MR
1
2
3
4
U1 02
BC M2 07 0CB0 KU FBXG
G4
RE S
D1
RF P
G2
XI N
G3
XO UT
A4
LP O_ IN
B2
RE G_ EN
A3
VB AT
A2
VR EG HV
A1
VR EG
B4
RS T_ N
C4
TM 0
F3
TM 2
B5
GP IO _0
B3
GP IO _1
E6
GP IO _5
E3
GP IO _6
B7
GP IO _7
D8
UA RT _R XD
C8
UA RT _T XD
D7
UA RT _R TS_N
B1
VD DI F
C1
VD DT F
E1
VD DL NA
F1
VD DR F
G1
VD DP X
A5
VD DC _1
B8
VD DC _2
F8
VD DC _3
G5
VD DO _1
A6
VD DO _2
G8
VD DO _3
C2
VS S_ 1
D2
VS S_ 2
F2
VS S_ 3
D3
VS S_ 4
C6
VS S_ 5
A7
VS S_ 6
G7
VS S_ 7
GND
BT_ REG _EN
R1 03
10 0K
R1 11
10 0K
X1 01
26 .0 0M Hz
1
2
3
4
C1 02
0. 00 82 nF
C1 01
0. 00 82 nF
F1 01
24 50 MH z
1
GND _1
2
OUT
3
GND _2
4
IN
C1 08
0. 1n F
C1 04
0. 00 2n F
15K
1% OK
For im ped anc e m atc hin g
CON NEC T P IN 1 A ND PIN 4
FMI tr ace as
sho rt as pos sib le
NC
NC
GND
FM_ LIN E_I N_L
FM_ LIN E_I N_R
R1 17
1K
R1 16
1K
C1 18
10 nF
C1 19
10 nF
32. 768 KHZ _OU T
C1 14
10 0n F
GND
GND
FM_ BUS _EN
FM_ ANT
I2C _CL K0
I2C _DA T0
P_ 3. 0V
GND
RE G_ BT
RE G_ BT
GND
GND
GND
B1 01
60 0o hm
C1 11
10 0n F
FM_ SEA RCH
P_ 3. 0V
C1 10
0. 1n F
C1 23
10 0n F
U1 01
SI 47 09 -B-G MR
1
NC _1
2
FM I
3
RF GN D
4
RS T
5
SE N6SC LK7SD IO8VI O
9
RC LK
10
VD
11
GN D_ 1
12
RO UT
13
LO UT14VA15GP O16NC _217GN D_ 2
B1
VD DI F
C1
VD DT F
E1
VD DL NA
F1
VD DR F
G1
VD DP X
A5
VD DC _1
B8
VD DC _2
F8
VD DC _3
G5
VD DO _1
A6
VD DO _2
G8
VD DO _3
C2
VS S_ 1
D2
VS S_ 2
F2
VS S_ 3
D3
VS S_ 4
C6
VS S_ 5
A7
VS S_ 6
G7
VS S_ 7
C1 21
22 00 nF
C1 22
22 00 nF
R1 11
10 0K
R1 18
1K
C1 20
47 00 nF
R1 15
10 0K
C1 25
10 nF
C1 03
10 nF
C1 15
10 nF
10 nF
GND
R1 13
15 0
R1 14
15 0
C1 26
10 0n F
C1 17
10 0n F
C1 16
0. 01 5n F
C1 13
clo se to
VD pin
FMI tr ace as
sho rt as pos sib le
C11 2/C 124 Sh oul d b e p lac ed
CON901
CON601
CON802
U503
U502
U301
U102
U601
U501
Troubleshooting
2
1
Samsung Electronics 4-21
2
BLUETOOTH / FM, page 7-9
1
MAIN PCB Bottom, page 6-3
<Fig. 4-11>
1
2
BLUETOOTH / FM, page 7-9
Page 37
4-22 Samsung Electronics
Troubleshooting
4-1-10 If the PC is not connected properly
Connect USB
Is USB connection
displayed on the LCD?
Yes
Is a mobile
saving device present in
“My Computer”?
Yes
Can you access?
Yes
Install a driver and check
No
No
it again.
No
Reset and
check if USB connection is
displayed.
Yes
Is “Unknown device”
present in the device
manger?
Yes
Can you format
on the browser?
Yes
No
No
No
Yes
Delete and update
it with Upgrade Tool and
check if it works.
No
Complete
Replace the Board
Page 38
Troubleshooting
4-2 Upgrade Methods
If the product does not power on and shows any of the following symptoms it is best to complete a firmware
update before you disassemble the product
- The product does not turn on when you press [Power].
- The product powers on normally but will not connect to the PC over USB.
- The product’s icons appear garbled or they are malfunctioning.
- Files are corrupted or if the product shows up as “removable storage” in Windows and cannot be accessed.
FilesforupgradingmainfirmwareYP-R1→R1.rom
FilesforupgradingTOUCHfirmwareYP-R1→touch_fw.bin
How to main firmware upgrade.
A. You can upgrade firmware copying R1.rom on the YP-R1’s file directory.
B. You can upgrade firmware using R1 Update Tool.
- You will use B-way if A-way make trouble.
- This way can low level format and optimize the YP-R1.
How to TOUCH firmware upgrade
C. You can upgrade firmware copying touch_fw.bin on the YP-R1’s file directory.
- You should upgrade TOUCH firmware, if YP-R1’s TOUCH function didn’t work.
Upgrade Methods
A. R1 firmware upgrade Method (A has 2 steps.)
1) Copy R1.rom
2) Reboot YP-R1
B. R1 firmware upgrade Method (B has 4 steps.)
1) Install Driver (if it was not installed)
2) Enter Firmware Upgrade Mode
3) Select Driver (if it was not installed)
4) Various Firmware Update
C. TOUCH firmware upgrade Method (C has 2 steps.)
1) Copy touch_fw.bin
2) Reboot YP-R1
Samsung Electronics 4-23
Page 39
4-24 Samsung Electronics
Troubleshooting
4-2-1 Copy R1.rom (A-1)
1. Copy the R1.rom on the YP-R1’s file directory.
2. Paste the “R1.rom” to the root director of the YP-R1.
4-2-2 Reboot YP-R1 (A-2)
1. You can see “Firmware Update” on the screen and
then menu will come into being on the screen after
upgrading.
Page 40
4-2-3 Install Driver (B-1)
1. Double click on the file below to execute the driver
installation.
→ windriver/wd_install_4NT.bat
If driver is already installed you do not need to
reinstall.
Troubleshooting
Samsung Electronics 4-25
Page 41
4-26 Samsung Electronics
Troubleshooting
2. Installthisprogrameither→vc_s1_redist_x86.exe
- This program makes environment for doing “R1 Update Tool.exe” program.
- If you did this already, do not install.
If vc_s1_redist_x86.exe makes error like this, use
another way to install.
Install
1) vc_s1_redist_x86.exe file to C:\ root directory.
2) Click“Start”→Click“Run(R)”→Input“cmd”→
[Enter or Click OK]
3) Input next command at DOS window.
cd c:\ [Enter]
vc_s1_redist_x86.exe /t:c: [Enter]
Page 42
4-2-4 Enter Firmware Upgrade Mode (B-2)
1. SET should be bootstrap mode for upgrading firmware.
2. How to be
1) Connect PC and SET by USB Cable.
2) When you pushing the power button, press the
reset button at 5 seconds.
Troubleshooting
Samsung Electronics 4-27
Page 43
4-28 Samsung Electronics
Troubleshooting
4-2-5 Select Driver (B-3)
1. When pc realized firmware upgrade mode, it calls
driver (only first connect)
Make folder in the unpacking directory.
Page 44
Troubleshooting
Install completed.
Check device manager.
Samsung Electronics 4-29
Page 45
4-30 Samsung Electronics
Troubleshooting
4-2-6 Firmware Upgrade (Mboot, kernal, zmage) (B-4)
1. Practice “R1Update Tool.exe” file in the
Upgrade Tool folder.
Check if you want to erase NAND all.
2. Choose the firmware (R1.ROM is in the
firmware realease).
3. You can upgrade all if you choose each images
that Mboot, Linux, Root File & System file.
Skip image (Mboot or Linux or Root File
System) if you don’t need to upgrade.
Page 46
4. After choosing images, push “Program” button.
(Pc calls driver again, if it was first connect.)
5. You can see the message that “~ completed”
after 5 minutes. (almost)
Troubleshooting
6. If you want to erase NAND, push the
“Erase Nand” button and then upgrade.
Check if you want to erase all data in NAND
flash memory.
Situation to erase NAND
- SET doesn’t work. (can’t booting)
- Install Method of release note needs to Erase.
Check if you want to erase
all data in NAND flash memory.
Samsung Electronics 4-31
Page 47
Troubleshooting
4-2-7 Copy touch_fw.bin (C-1)
1. Copy touch_fw.bin on the YP-R1’s file directory.
2. Paste the “touch_fw.bin” file to the root directory of the
YP-R1.
4-2-8 Reboot YP-R1 (C-2)
1. You can see “Touch Sensor Updating” on the screen
and then screen will be off.
4-32 Samsung Electronics
Page 48
MEMO
Samsung Electronics 4-33
Page 49
Exploded View & Part List
QMP01
QME04
QVO03
QFM01
QVO01
QBD01
QBR01
QJA01
QSM09
QLC01
QBA01
QCP01
5. Exploded View & Part List
5-1 Exploded View
5-1 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 50
Exploded View & Part List
Part List
Loc. No. Code No. Description;Specification Q’ty SNA Remark
QBA01 4302-001229 BATTERY-POLYMER;3.7V,500mAH,CELL,200mA,4 1 SA
QBD01 GM61-01018A CASE-BODY;YP-R1,AL,0.8,BLACK,SAMSUNG 1 SA
QBR01 GM98-01007A ASSY BRACKET-JACK;YP-R1,ALL BUYER,ASS’Y, 1 SA
QCP01 AH63-01972A CUSHION-PCB;YP-R1,PORON,1.2mm,30,23,BLAC 1 SA
QFM01 GM61-01016A HOLDER-FRAME;YP-R1,PC,43,81,BLACK 1 SA
QJA01 GM63-01030A COVER-JACK;YP-R1,PC,43.8,9,BLACK 1 SA
QLC01 GM96-01009A ELA ETC-YP-R1 LCD ASS’Y;YP-R1,SAMSUNG,LC 1 SA
QME04 AH97-03272B ASSY FRAME-TOUCH;MP3,YP-R1,WINDOW,TSP,KN 1 SA
QMP01 GM92-01022A ASSY PBA MAIN;YP-R1,WORLDWIDE,4GB 1 SA
QSM09 6003-001660 SCREW-TAPTYPE;CH,+,B,M1.4,L3,NI PLT,SWRC 3 SA
QVO01 GM64-01012A KNOB-VOLUME;YP-R1,PC,40.28,7.75,BLACK 1 SA
QVO03 GM64-01013A KNOB-POWER;YP-R1,PC BLACK,BLACK 1 SA
Samsung Electronics 5-2
This Document can not be used without Samsung’s authorization.
Page 51
Exploded View & Part List
5-2 Electrical Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
QMP01 GM92-01022A ASSY PBA MAIN;YP-R1,WORLDWIDE,4GB 1 SA
C84 2203-000233 C-CER,CHIP;0.1nF,5%,50V,C0G,TP,1005 2 SA
0401-000164 DIODE-SWITCHING;KDS121V,80V,100MA,V 3 SA
0404-001514 DIODE-SCHOTTKY;DSF05S30U,30V,500mA, 1 SNA
0406-001275 DIODE-TVS;uClamp1201P.TCT,13.3/-/-V 1 SA
0406-001370 DIODE-TVS;ESD7L5.0DT5G,5.4/-/-V,0.1 1 SNA
0504-001269 TR-DIGITAL;RN1907FE,NPN,10K/47Kohm, 1 SNA
0505-002088 FET-SILICON;2SK3541,N,30V,100mA,0.0 2 SA
0505-002229 FET-SILICON;FDMA1028NZ,N,20V,3.7A,0 1 SNA
0801-002800 IC-CMOS LOGIC;7SV08,AND GATE,SC-70, 1 SNA
0902-002437 IC-MICROPROCESSOR;MCIMX37,532MHz,MA 1 SNA
0909-001057 IC-REAL TIME CLOCK;S-35392A,SNT-8A, 1 SNA
1105-001940 IC-MOBILE SDRAM;K4X51323PG-8GC6,mDD 1 SNA
1107-001857 IC-NAND FLASH;K9LBG08U0D-PCB0,4GByt 1 SNA
1201-002934 IC-VIDEO AMP;FMS6151L6X_F113,UPAK,6 1 SNA
1203-004802 IC-POSI.FIXED REG.;RP100,PLP,4P,1.6 1 SA
1203-005277 IC-DC/DC CONVERTER;MAX8819,QFN,28P, 1 SNA
1203-005485 IC-POSI.FIXED REG.;MIC5365-3.0YMT,M 1 SNA
1203-005512 IC-POSI.FIXED REG.;MIC5365-3.3YMT,M 1 SNA
1203-005772 IC-VOL. DETECTOR;MAX17040G+T,TDFN,8 1 SA
1203-005865 IC-POSI.FIXED REG.;MIC5365-2.5YMT,M 1 SNA
1203-005866 IC-VOL. DETECTOR;NCP360SNT1G,TSOP,5 1 SNA
1204-003026 IC-TUNER;SI4709-B-GMR,QFN,16P,2.5x2 1 SNA
1205-003214 IC-CODEC;WM1808GECO,QFN,28P,4x4mm,P 1 SA
1205-003729 IC-BLUETOOTH;BCM2070CB0KUFBXG,WFBGA 1 SNA
1405-001093 VARISTOR;14V,20A,1x0.5x0.6mm,TP 7 SA
2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 11 SA
2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,1005 10 SA
2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 15 SA
2007-000153 R-CHIP;22Kohm,5%,1/16W,TP,1005 2 SA
2007-000155 R-CHIP;27Kohm,5%,1/16W,TP,1005 1 SA
2007-000157 R-CHIP;47Kohm,5%,1/16W,TP,1005 10 SA
2007-000162 R-CHIP;100Kohm,5%,1/16W,TP,1005 15 SA
2007-000164 R-CHIP;150Kohm,5%,1/16W,TP,1005 1 SA
2007-000165 R-CHIP;200Kohm,5%,1/16W,TP,1005 5 SNA
2007-000170 R-CHIP;1Mohm,5%,1/16W,TP,1005 1 SA
2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 4 SA
2007-000636 R-CHIP;270Kohm,5%,1/16W,TP,1005 1 SA
2007-001306 R-CHIP;150ohm,5%,1/16W,TP,1005 6 SNA
2007-002797 R-CHIP;560ohm,5%,1/16W,TP,1005 2 SA
2007-003013 R-CHIP;2.4Kohm,5%,1/16W,TP,1005 1 SNA
2007-007009 R-CHIP;75ohm,5%,1/16W,TP,1005 2 SNA
2007-007132 R-CHIP;15Kohm,1%,1/16W,TP,1005 1 SA
2007-007134 R-CHIP;39Kohm,1%,1/16W,TP,1005 1 SNA
2007-007135 R-CHIP;18Kohm,1%,1/16W,TP,1005 1 SNA
2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005 2 SNA
2007-007313 R-CHIP;6.8Kohm,1%,1/16W,TP,1005 2 SA
2007-007314 R-CHIP;5.6Kohm,1%,1/16W,TP,1005 1 SA
2007-007334 R-CHIP;200Kohm,1%,1/16W,TP,1005 1 SA
2007-007538 R-CHIP;56Kohm,1%,1/16W,TP,1005 1 SNA
2007-007590 R-CHIP;82Kohm,1%,1/16W,TP,1005 2 SA
2007-007592 R-CHIP;270Kohm,1%,1/16W,TP,1005 1 SNA
2007-007697 R-CHIP;2.4Kohm,1%,1/16W,TP,1005 1 SNA
2007-007942 R-CHIP;1Mohm,1%,1/16W,TP,1005 1 SA
2007-008167 R-CHIP;120Kohm,1%,1/16W,TP,1005 1 SA
2007-008294 R-CHIP;33ohm,1%,1/16W,TP,1005 1 SNA
2007-010185 R-CHIP;3.9ohm,1%,1/16W,TP,1005 3 SNA
2011-001262 R-NETWORK;22ohm,5%,1/16W,L,CHIP,8P, 1 SA
2011-001396 R-NETWORK;4.7Kohm,5%,1/16W,L,CHIP,8 3 SNA
2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,TP,1005 1 SA
2203-000627 C-CER,CHIP;.022nF,5%,50V,C0G,TP,100 2 SNA
2203-005057 C-CER,CHIP;0.0082nF,0.25pF,50V,NP0, 2 SA
2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160 2 SA
2203-005344 C-CER,CHIP;22nF,10%,25V,X7R,TP,1005 1 SNA
2203-005383 C-CER,CHIP;0.007nF,0.1pF,50V,C0G,TP 2 SA
2203-005729 C-CER,CHIP;0.015nF,5%,25V,NP0,TP,06 2 SA
2203-005818 C-CER,CHIP;470nF,+80-20%,10V,Y5V,TP 1 SA
2203-006194 C-CER,CHIP;10nF,10%,6.3V,X7R,0603 7 SA
2203-006324 C-CER,CHIP;2200nF,10%,10V,X5R,1608 11 SA
2203-006348 C-CER,CHIP;1000nF,10%,25V,X5R,TP,16 1 SA
2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 4 SNA
2203-006378 C-CER,CHIP;4700nF,10%,6.3V,X5R,TP,1 8 SA
2203-006423 C-CER,CHIP;100nF,10%,6.3V,X5R,0603 70 SA
2203-006474 C-CER,CHIP;22000nF,20%,6.3V,X5R,201 4 SA
2203-006562 C-CER,CHIP;1000nF,10%,10V,X5R,TP,10 15 SA
2203-006890 C-CER,CHIP;10000nF,20%,6.3V,X5R,160 1 SA
2404-001576 C-TA,CHIP;330uF,20%,2.5V,TP,3216 2 SNA
2703-002268 INDUCTOR-SMD;8.2nH,5%,1005 1 SA
2703-002829 INDUCTOR-SMD;10uH,20%,2828 1 SA
2703-003297 INDUCTOR-SMD;4.7uH,20%,2520 3 SA
2801-003856 CRYSTAL-SMD;0.032768MHz,20ppm,28-AC 1 SA
2801-004285 CRYSTAL-SMD;24MHz,30ppm,28-ACO,12pF 1 SA
2801-004683 CRYSTAL-SMD;26.00MHz,10ppm,8pF,40oh 1 SA
2909-001307 FILTER-LC;2450MHz,50MHz,1.8dB,TP,88 1 SNA
3003-001136 MIC MEMS;3.6V,0.25mA,-42dB,0.3kOhm 1 SNA
3301-001148 BEAD-SMD;60ohm,1608,TP 1 SA
3301-001364 BEAD-SMD;1000ohm,1608,150mA,TP,1085 2 SNA
3301-001659 BEAD-SMD;600ohm,1005,300mA,TP,,744o 2 SNA
3708-002608 CONNECTOR-FPC/FFC/PIC;43P,0.3MM,SMD 1 SNA
3708-002721 CONNECTOR-FPC/FFC/PIC;8P,0.5MM,SMD- 2 SNA
3710-002791 CONNECTOR-SOCKET;24P,1R,0.5MM,SMD-S 1 SNA
3722-002836 JACK-EAR PHONE;6P,AU,BLK,ANGLE 1 SNA
4202-001463 ANTENNA-CHIP;2400-2485MHz,-4.7dB,3. 1 SA
AH41-01154A PCB;YP-R1,FR4,8 Layer,REV1.0,0.8T,4 1 SNA
AH63-01960A GASKET-FABRIC;ID-23NEF01-0.9-3-14,N 1 SNA
GH70-03928A ICT-ANTENNA COTACT;SCH-U440,BE+CU,2 2 SNA
GH71-08731A NPR CONTACT-CAM;SGH-T929,BE-CU,T0.1 1 SNA
GM94-01027A ASSY SMD;YP-R1,WORLDWIDE,4GB,GM92-0 1 SNA
GM99-01039C ASSY MANUAL-R1 XER BLACK;YP-R1,XER, 1 SNA
6801-001634 CARD-REGISTRATION;Russia,XER,NWT,Ru 1 SNA
6801-001669 CARD-WARRANTY;RUSS,XER,RUS,SNOWWHIT 1 SNA
AH68-50119B LABEL-EAN(B);ART,T0.05,W27,L47,WHT 1 SA
AH69-02428B CARTON-MASTER;YP-Q1,PPR-OTH,6,183,2 1 SNA
GM39-01002A USB CABLE;Samsung New IO Cable 24Pi 1 SNA
GM68-01002J MANUAL USERS-QSG;YP-R1,XER,RUS/URK, 1 SNA
AH69-02524A PACKING-USB;YP-Q1,PPR-OTH,0.6,171,1 1 SNA
AH69-02525A PACKING-IB;YP-Q1,PPR-OTH,0.6,210,21 1 SNA
AH69-02609A PACKING-SET;YP-R1,PAPER,PAPER,0.5,1 1 SNA
AH69-02670A PACKING-PAD;YP-R1,PAPER,0.5,50,90,4 2 SNA
GM69-01011B PACKING-CASE;YP-R1,PAPER,PAPER,0.5, 1 SNA
AH63-01219M COVER-BAG;YP-PB2,HDPE,0.03,175,240, 1 SNA
5-3 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 52
Exploded View & Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
GM59-01010A EAR PHONE OPTION-EARPHONE;YA-EH420, 1 SNA
GM68-01014A LABEL-EAR-PHONE;YP-R1,EUROPE,ART,AR 1 SNA
6902-000297 BAG PE;LDPE,T0.05,W80,L140,TRP,4-PE 1 SA
QCP01 AH63-01972A CUSHION-PCB;YP-R1,PORON,1.2mm,30,23 1 SA
AH68-00511G LABEL-SEAL;YP-Z5F,ART PAPER 1 SA
GM63-01086A SHEET-WINDOW;YP-R1,P E T,0.05,35,50 1 SNA
GM74-01005A TAPE-CONNECTOR;YP-R1,110PE,9.7*17.5 2 SNA
QBA01 4302-001229 BATTERY-POLYMER;3.7V,500mAH,CELL,20 1 SA
AH68-00508U LABEL SERIAL;COMMON,ELS,90 1 SA
Samsung Electronics 5-4
This Document can not be used without Samsung’s authorization.
Page 53
MEMO
5-5 Samsung Electronics
Page 54
6. PCB Diagram
U701
U504
U801
U402
U101
U702
U507
U506
U604
U401
6-1 MAIN PCB Top
TP6
PCB Diagram
TP4
TP1
TP2
TP6
TP5
TP3
1
2
3
5
4
TP7
TP5
TP6
TP8
No. Description
24MHz Crystal
1
- Main CLK
Finger GASKET
2
- Improved resistance to ESD
32.768KHz Crystal
3
- Bluetooth CLK
FM Tuner IC
4
- Supports reception of FM signals
CODEC IC
5
- Supports voice codec
Samsung Electronics 6-1
Page 55
PCB Diagram
6-1-1 Test Point Wave Form
TP1
TP2
TP3
TP6
TP7
TP8
TP4
TP5
6-2 Samsung Electronics
Page 56
6-2 MAIN PCB Bottom
CON901
CON601
CON802
CON801
U503
U502
U301
U102
U601
U501
PCB Diagram
TP4
TP2
1
2
3
4
$
#
@
!
TP6
TP7
TP6
No. Description
MEMORY IC
- Supports data storage and transfer in
1
the system.
LCD Connector
2
- Connects and holds the LCD in position
Finger GASKET
3
- Improved resistance to ESD
26MHz Crystal
4
- Bluetooth CLK
Bluetooth IC
5
- Controls Bluetooth features
Touch PAD Connector
- Insert from the side.
6
- Connect the PCB and the touch pad
using the FPCB.
Earphone Jack
7
5
TP6
TP3
6
7
0
9
8
USB Connector
- Cable port for communication with
8
external devices
MIC
9
- Supports voice recording
Main IC
(ARM1176 Core, 600MHz, RTC module
0
are built in)
- Controls overall system functions
Mobile DDR SDRAM IC
!
- Supports data transfer in the system
PM IC
- Battery charger and dual buck
@
converter are built in
Battery connector
- Connects and holds the battery in
#
position
Finger GASKET
$
- Improved resistance to ESD
Samsung Electronics 6-3
Page 57
PCB Diagram
6-2-1 Pin Connection
2 CON901
LCD Connector
Pin No. Signal Pin No. Signal
1 GND 21 LCD_D[15]
2 LCD_CE 22 LCD_RST
3 LCD_RS 23 GND
4 LCD_WR 24 VDD_IO
5 LCD_RD 25 VDD_IO
6 LCD_D[0] 26 GND
7 LCD_D[1] 27 VDD_IO
8 LCD_D[2] 28 VDD_IO
9 LCD_D[3] 29 GND
10 LCD_D[4] 30 LED4
11 LCD_D[5] 31 LED1
12 LCD_D[6] 32 LED2
13 LCD_D[7] 33 LED3
14 LCD_D[8] 34 VOUT(LED+)_
15 LCD_D[9] 35 LCD_TP
16 LCD_D[10] 36 GND
6 CON802
Touch PAD Connector
Pin No. Signal
1 GROUND
2 GROUND
3 GROUND
4 T_RESET
5 T_DATA
6 T_CLK
7 VCC
8 VCC
7 J701
Earphone Jack
Pin No. Signal
1 GROUND
2 R-CH
3 L-CH
8 CON801
USB Connector
Pin No. Signal
1 BAT ID
2 UART DETECT
3 VCC [IO 2.8V]
4 ADAPTOR INPUT
5 ADAPTOR INPUT
6 NC
7 CRADLE DETECT
8 NC
9 NC
10 USB D-
11 NC
12 GROUND
13 UART RX
14 UART TX
15 USB D+
16 USB POWER
# CON601
Battery Connector
Pin No. Signal
1 GROUND
2 VCC
17 LCD_D[11] 37 GND
18 LCD_D[12] 38 GND
19 LCD_D[13] 39 GND
20 LCD_D[14] 40 GND
17 LINE OUT R
18 LINE OUT L
19 GROUND
20 CRADLE_ANT(FM)
21 BATTERY INPUT
22 BATTERY INPUT
23
24 PBA_CE
EXTERNAL
BATTERY DETECT
6-4 Samsung Electronics
Page 58
6-2-2 Test Point Wave Form
TP2
TP3
PCB Diagram
TP4
TP6
TP7
Samsung Electronics 6-5
Page 59
MEMO
6-6 Samsung Electronics
Page 60
7. Schematic Diagram
AUDIO
BLOCK
TV-OUT
NandFlash
[1G/2G/4G]
XA[1-12]
XD[0-32]
USB D+/D-
LCD_D[0..24]
RGB interface
Memory
interface
USB
Controller
P_1.8V
P_3.0V
CORE_1.2
Li-Polymer
Batt.
500mAh
NF_D[0-7]
UART
interface
16V
GPIO
SENSOR
Uart RX,TX
IIC
NandFlash
[8G/16G/32G]
SDRAM
K4X51323PG
[64MB]
TFT WQVGA 2.7"/2.6"
(16M color)
[400 X 240]
IIS / IIC
P_3.0V
24PIN
Connector
CODEC
[WM1808]
(AUDIO/MIC)
Bluetooth
FM TUNER
(BCM2048B)
32.768KHz (RTC)
24MHz (MAIN CLK)
3-WIRE
Serial
BAT
PMIC
(MAX1819)
BT_3.0V
P_1.8V
△
ANT
50 ohm
TOUCH PAD
DC/DC
3-CH
BUCK
P_3.0V
P_1.8V
P_3.0V
P_1.2V
LED
Driver
(STEP-UP)
CHARGER
RESET
OSC
(RTC)
RTC:BAT
Processor
(i.MX37)
- 32bit ARM1176(600Mhz)
AUDIO
TV-OOUT
[3.5
φ JACK]
7-1 Overall Block Diagram
Schematic Diagram
Main System has basic circuit blocks, e.g. Processor (i.MX37), Mobile DDR RAM, Flash Memory, Power Block, Audio
DAC and a block for the FM-Tuner. The display is connected to a 2.6 inch QVGA TFT LCD.
Serial interface among ICs is delivered with various protocols throughout the overall system.
The power can be turned on and off with the power switch on the right hand side of the product. The source of power
is the built-in battery or an adaptor with 5V input. The power from the adaptor can be used for charging the battery and
generating the system power (3.0V, 1.2V, 1.8V).
Samsung Electronics 7-1
This Document can not be used without Samsung’s authorization.
Page 61
DDR _SD _DA [0]
DDR _SD _DA [1]
DDR _SD _DA [2]
DDR _SD _DA [3]
DDR _SD _DA [4]
DDR _SD _DA [5]
DDR _SD _DA [6]
DDR _SD _DA [7]
DDR _SD _DA [8]
DDR _SD _DA [9]
DDR _SD _DA [10 ]
DDR _SD _DA [11 ]
DDR _SD _DA [12 ]
DDR _SD _DA [13 ]
DDR _SD _DA [14 ]
DDR _SD _DA [15 ]
DDR _SD _DA [20 ]
DDR _SD _DA [17 ]
DDR _SD _DA [18 ]
DDR _SD _DA [21 ]
DDR _SD _DA [16 ]
DDR _SD _DA [19 ]
DDR _SD _DA [26 ]
DDR _SD _DA [23 ]
DDR _SD _DA [24 ]
DDR _SD _DA [27 ]
DDR _SD _DA [22 ]
DDR _SD _DA [25 ]
DDR _SD _DA [28 ]
DDR _SD _DA [29 ]
DDR _SD _DA [30 ]
DDR _SD _DA [31 ]
NAN D_D Q[0 ]
NAN D_D Q[1 ]
NAN D_D Q[2 ]
NAN D_D Q[3 ]
NAN D_D Q[4 ]
NAN D_D Q[5 ]
NAN D_D Q[6 ]
DDR _SD _AD [2]
DDR _SD _AD [1]
DDR _SD _AD [4]
DDR _SD _AD [5]
DDR _SD _AD [3]
DDR _SD _AD [0]
DDR _SD _AD [6]
DDR _SD _AD [7]
DDR _SD _AD [8]
DDR _SD _AD [9]
DDR _SD _AD [10 ]
DDR _SD _AD [11 ]
DDR _SD _AD [12 ]
NAN D_D Q[7 ]
DDR _SD _DA [0- 31]
GND
GND
GND
P_ 1. 8V
P_ 1. 0V
GND
P_ 1. 2V
C3 33
10 0n F
GND
P_ 3. 0V
C3 15
10 0n F
GND
C3 08
10 0n F
C3 36
10 0n F
C3 10
10 0n F
GND
P_ 2. 5V
GND
C3 09
10 0n F
C3 30
10 0n F
C3 11
10 0n F
C3 32
10 0n F
GND
C3 38
10 0n F
C3 03
10 0n F
GND
C3 37
10 0n F
GND
USB _DUSB _D+
US B_ P5 V
VID EO_ DAC OUT
C3 01
10 0n F
GND
C3 02
10 0n F
P_ 2. 5V
NAN D_O E
NAN D_C LE
NAN D_C PU_ CS2
NAN D_R /B0
NAN D_C PU_ CS3
NAN D_W E
NAN D_C PU_ CS0
NAN D_A LE
NAN D_C PU_ CS1
NAN D_W P
DDR _SD _BA [0]
DDR _SD _DQ S[2 ]
DDR _SD _DQ M[3 ]
DDR _SD _DQ M[2 ]
DDR _SD _DQ S[0 ]
DDR _SD _WE
DDR _SD _DQ S[3 ]
DDR _SD _CA S
DDR _SD _DQ M[0 ]
DDR _SD _DQ S[1 ]
DDR _SD _BA [1]
DDR _SD _RA S
DDR _SD _CL K
DDR _SD _CS
DDR _SD _CK E
DDR _SD _/C LK
DDR _SD _DQ M[1 ]
DDR _SD _CK E
GND
DDR _SD _AD [0- 12]
P_ 3. 0V
NAN D_D Q[0 -7]
VD DA _1 .2V
C3 39
10 0n F
P_ 3. 3V
C3 20
10 0n F
C3 23
10 0n F
C3 27
10 0n F
C3 05
10 0n F
C3 31
10 0n F
C3 28
10 0n F
C3 21
10 0n F
C3 04
10 0n F
C3 07
10 0n F
C3 29
10 0n F
C3 12
10 0n F
C3 25
10 0n F
C3 24
10 0n F
U3 01
MC IM X3 7
M15
EI M_ D0 /GPI O3 _20
L18
EI M_ D1 /GPI O3 _21
L16
EI M_ D2 /GPI O3 _22
L15
EI M_ D3 /GPI O3 _23
L14
EI M_ D4 /GPI O3 _24
K18
EI M_ D5 /GPI O3 _25
K19
EI M_ D6 /GPI O3 _26
K15
EI M_ D7 /GPI O3 _27
J19
EI M_ D8 /TRA CE 8/GP IO 1_8
J18
EI M_ D9 /TRA CE 9
J16
EI M_ D1 0/TR AC E10
J15
EI M_ D1 1/TR AC E11
H18
EI M_ D1 2/TR AC E12
H19
EI M_ D1 3/TR AC E13
H16
EI M_ D1 4/TR AC E14/ AN Y_PU _RS T
G18
EI M_ D1 5/TR AC E15/ SY STEM _RS T
D15
NA ND F_ WE_B
C18
NA ND F_ RE_B
C19
NA ND F_ ALE
D19
NA ND F_ CLE
D18
NA ND F_ WP
D16
NA ND F_ RB
E16
NA ND F_ CS0
E18
NA ND F_ CS1
E19
NA ND F_ CS2
E15
NA ND F_ CS3
A3
DR AM _A 14
A4
DR AM _A 13
B4
DR AM _A 12
A5
DR AM _A 11
F7
DR AM _A 10
B7
DR AM _A 9
A7
DR AM _A 8
A8
DR AM _A 7
E8
DR AM _A 6
E9
DR AM _A 5
B9
DR AM _A 4
A9
DR AM _A 3
B13
DR AM _A 2
A11
DR AM _A 1
A12
DR AM _A 0
D6
ET M_ D7 /EIM _D A15/ DR AM_D 31
E7
ET M_ D6 /EIM _D A14/ DR AM_D 30
E6
ET M_ D5 /EIM _D A13/ DR AM_D 29
D5
ET M_ D4 /EIM _D A12/ DR AM_D 28
E5
ET M_ D3 /EIM _D A11/ DR AM_D 27
D4
ET M_ D2 /EIM _D A10/ DR AM_D 26
B3
ET M_ D1 /EIM _D A9/D RA M_D2 5
F5
ET M_ D0 /EIM _D A8/D RA M_D2 4
B2
KE Y_ RO W7/E IM _DA7 /D RAM_ D23
B1
KE Y_ RO W6/E IM _DA6 /D RAM_ D22
C2
KE Y_ RO W5/E IM _DA5 /D RAM_ D21
C1
KE Y_ RO W4/E IM _DA4 /D RAM_ D20
D2
KE Y_ RO W3/E IM _DA3 /D RAM_ D19
D1
KE Y_ RO W2/E IM _DA2 /D RAM_ D18
E2
KE Y_ RO W1/E IM _DA1 /D RAM_ D17
E1
KE Y_ RO W0/E IM _DA0 /D RAM_ D16
F11
DR AM _D 15
E10
DR AM _D 14
E11
DR AM _D 13
A15
DR AM _D 12
G13
DR AM _D 11
F9
DR AM _D 10
E12
DR AM _D 9
D14
DR AM _D 8
A16
DR AM _D 7
B15
DR AM _D 6
B16
DR AM _D 5
B17
DR AM _D 4
A17
DR AM _D 3
A18
DR AM _D 2
B18
DR AM _D 1
B19
DR AM _D 0
A13
DR AM _S DCLK
A14
DR AM _S DCLK _B
B11
DR AM _C S1
B12
DR AM _C S0
G6
DR AM _S DQS3
F6
DR AM _S DQS2
F10
DR AM _S DQS1
E13
DR AM _S DQS0
B10
DR AM _S DCKE 1
A10
DR AM _S DCKE 0
A6
DR AM _S DWE
F8
DR AM _C AS
B8
DR AM _R AS
E4
DR AM _D QM3/ GP IO_1 4
A2
DR AM _D QM2/ GP IO_1 5
E14
DR AM _D QM1
B14
DR AM _D QM0
B6
EI M_ SD BA1
B5
EI M_ SD BA0
U3 01
MC IM X3 7
A1
GN D_ 1
A19
GN D_ 2
H9
GN D_ 3
H10
GN D_ 4
J8
GN D_ 5
J9
GN D_ 6
J10
GN D_ 7
J11
GN D_ 8
K8
GN D_ 9
K9
GN D_ 10
K10
GN D_ 11
K11
GN D_ 12
K12
GN D_ 13
L9
GN D_ 14
L10
GN D_ 15
L11
GN D_ 16
L12
GN D_ 17
W19
GN D_ 18
M8
GN D_ 19
M10
GN D_ 20
W1
GN D_ 21
K13
GN D_ 22
F12
GN D_ AN A_PL L_ A
M13
GN D_ AN A_PL L_ B
F14
GN D_ DI G_PL L_ A
N13
GN D_ DI G_PL L_ B
P19
NG ND _O SC
G15
NG ND _U SBPH Y
T11
NG ND _R GB1
V11
NG ND _R GB2
F15
RR EF EX T
F16
ID
H15
VB US
G19
DN
F19
DP
V14
IO B_ BA CK
W11
IO B
V15
IO G_ BA CK
W12
IO G
W15
IO R_ BA CK
W13
IO R
V13
RS ET
T13
VR EF IN
P11
VR EO UT
W14
CO MP
T15
VD D_ FU SE
N16
FA ST R_ DIG
M18
FA ST R_ ANA
P14
NV CC _S RTC_ PO W
N8
VD D_ TV DIG
M7
VD DA 2
G12
VD DA 1
N12
VD D_ DI G_PL L_ B
G14
VD D_ DI G_PL L_ A
M11
VD D_ AN A_PL L_ B
F13
VD D_ AN A_PL L_ A
L19
NV CC _O SC
G16
NV CC _U SBPH Y
M9
NV CC _T V_BA CK
P12
NV CC _D AC
V12
AH VD DR GB2
T12
AH VD DR GB1
R12
VD D_ TV SUPP LY
L13
PE R9
R14
PE R8
P6
PE R6
L7
PE R4
P7
PE R3
P8
PE R2
J7
NV CC _I PU2
H7
NV CC _I PU1
J14
VD DA 33 _2
H14
VD DA 33 _1
N7
PE R1 4
R15
PE R1 3
K14
NV CC _E MI3
J13
NV CC _E MI2
H13
NV CC _E MI1
G7
NV CC _C TNR_ EM I
F4
NV CC _E MI_D RA M8
D13
NV CC _E MI_D RA M7
D12
NV CC _E MI_D RA M6
D11
NV CC _E MI_D RA M5
D10
NV CC _E MI_D RA M4
D9
NV CC _E MI_D RA M3
D8
NV CC _E MI_D RA M2
D7
NV CC _E MI_D RA M1
L8
VC C4 _1
K7
VC C4 _2
N10
VC C3
M12
VC C2
J12
VC C_ 1
H12
VC C_ 2
H11
VC C_ 3
H8
VD DG P5
G11
VD DG P4
G10
VD DG P3
G9
VD DG P2
G8
VD DG P1
C3 22
10 00 nF
C3 14
10 00 nF
C3 16
10 00 nF
C3 18
10 00 nF
R3 07
10 0K
C3 19
47 00 nF
R3 01
2. 4K
C3 35
10 0n F
C3 34
10 0n F
R3 02
1K
R3 04
5. 6K
C3 13
10 00 0n F
VCC _CO RE
VCC _1. 2V
VCC _1. 8V
VCC _3. 0V
VCC _3. 0V
VCC _1. 8V
VCC _2. 5V
VDD A_1 .2V
VCC _1. 8V
DC/ DC
DC/ DC
DC/ DC
LDO
LDO
CVB S V IDE O O UT
1%
LDO
Schematic Diagram
7-2 MAIN CPU-1
POWER
This Document can not be used without Samsung’s authorization.
TP1
TP2
TP3
7-2 Samsung Electronics
TP1
TP2
TP3
Page 62
7-3 MAIN CPU-2
PBA_ CE
LCD_ RED2
JTAG _TCK
LCD_ GRN0
LCD_ RED0
BT_U ART_RX 0
JTAG _RST
BT_U ART_RT S0
JTAG _TMS
I2C_ CLK1
LCD_ BLU4
TOUC H_DAT
BT_U ART_TX 0
LCD_ GRN1
LCD_ GRN5
LCD_ BLU6
LCD_ GRN4
LCD_ DOTCLK
AUD_ BCLK
LCD_ RED1
LCD_ HSYNC
LCD_ GRN2
LCD_ RED3
JTAG _TDO
LCD_ BLU7
JTAG _TDI
LCD_ RED5
PWR_ ON_OFF
LCD_ RED7
LCD_ BLU1
CHG_ STATUS
LCD_ BLU2
LCD_ GRN6
JTAG _RTCK
AUD_ LRCK
LCD_ RED6
BT_U ART_CT S0
GND
LCD_ BLU0
LCD_ GRN3
I2C_ DAT1
LCD_ GRN7
LCD_ RED4
LCD_ BLU3
LCD_ VSYNC
LCD_ BLU5
MUTE
LED_ DIMMIN G
AUD_ DATA_O UT
AUD_ DATA_I N
CPU_ RST
EARP HONE_D ET
R4 13
1M
BT_W AKE
GND
P_ 3. 0V
P_ 3. 0V
TOUC H_CLK
TOUC H_INTR
CHAR GE_EN
TOUC H_CE
RESE T_IN
EXT_ PWR
C4 06
10 0n F
R4 07
1K
DEVI CE_DET
LCD_ CLK
LCD_ ENABLE
P_ 3. 0V
LCD_ DATA_O UT
LCD_ DATA_I N
P_ 3. 0V
I2C_ CLK0
I2C_ DAT0
GND
CLK_ SELECT
CLK_ SELECT
EXT_ PWR
BOOT _MODE1
BOOT _MODE0
GND
P_ 3. 0V
C4 04
10 0n F
GND
R4 17
47 K
GND
VIDE O_EN
IN N_ BA TT
GND
C4 03
7p F
12
C4 02
7p F
12
GND
X4 02
32 .7 68 KH z
1
IN
2
OU T
3
GN D
U4 02
S- 35 39 2A
1 32 KO
2
XOUT
3 XI N
4 VS S
5
INT2
6
SCL
7
SDA
8
VDD
32.7 68KHZ_ OUT
P_ 3. 0V
32.7 68KHZ_ OUT
FM_S EARCH
BT_R ST
LCD_ CHECK
LCD_ RST
LCD_ CS
X4 03
24 MH z
1
2
3
4
PWR_ IN_CPU
BOOT _MODE1
BOOT _MODE0
JTAG _RST
GND
FM_B US_EN
D4 02
KD S1 21 V
UART _TX1
UART _RX1
NAND _CS_CT L
CORE _CTL
VOLU ME-
VOLU ME+
R4 09
10 K
GND
NAND _R/B1
NAND _R/B2
NAND _R/B3
NAND _R/B4
NAND _R/B5
NAND _R/B6
NAND _R/B7
D4 01
KD S1 21 V
P_ 3. 0V
PWR_ IN_DDC ON
R4 04
22 K
I2C_ DAT0
I2C_ CLK0
C4 07
0. 02 2n F
C4 09
0. 02 2n F
U4 01
NC 7S V0 8P 5X
1
A
2
B
3
GND
4
Y
5
Vcc
LP_C TL
C4 08
10 0n F
R4 21
4. 7K
R4 24
4. 7K
R4 25
4. 7K
R4 22
4. 7K
R4 10
22
BT_R EG_EN
NAND _SELEC T
AUD_ MCLK
R4 11
22
BOOT _MODE0
R4 06
22 K
R4 08
10 0K
U3 01
MC IM X3 7
T19
PM IC _V ST BY
R16
PM IC _P WR FAIL
R19
CK IL
N18
CK IH
P15
CL K_ SS
W7
WD OG _R ST /PMI C_ RDY/ GP IO3_ 28
N14
RE SE T_ IN _B
N15
PO R_ B
P16
BO OT _M OD E0/A UD _MCL K2
P18
BO OT _M OD E1
M19
XT AL
N19
EX TA L
R1
TH DI OD E
R18
TE ST _M OD E
F18
GP AN AI O
H4
LC D_ HS YN C/GP IO 3_31
G2
LC D_ VS YN C/GP IO 3_29
P2
LC D_ WR /G PIO3 _1 0
P1
LC D_ RD /G PIO3 _1 1
N6
LC D_ RS /G PIO3 _1 2
N2
LC D_ RD Y/ GPIO 1_ 30
N5
LC D_ CS /G PIO3 _1 3
F1
LC D_ DO TC LK/G PI O3_3 0
T8
GP IO 1_ 31 /WDO G_ RST_ B_ DEB
R9
UA RT 2_ RX D_MU X/ GPIO 2_ 31
V8
UA RT 2_ TX D_MU X/ GPIO 2_ 30
P9
UA RT 2_ RT S_MU X/ GPIO 2_ 29
W8
UA RT 2_ CT S
W9
GP IO 2_ 27
V9
GP IO 2_ 26
T9
UA RT _T X1 /GPI O2 _25
V10
UA RT _R X1 /GPI O_ 24
T6
CS PI 2_ SC LK/I 2C 3_SC LK /GPI O3 _9
W4
CS PI 2_ SS 1/GP IO 3_8
V5
CS PI 2_ SS 0/GP IO 3_7
W5
CS PI 2_ MI SO/G PI O3_6
R7
CS PI 2_ MO SI/I 2C 3_SD A/ GPIO 3_ 5
T7
CS PI 1_ SC LK/I 2C 1_SC L/ GPIO 3_ 4
V6
CS PI 1_ SS 1/GP IO 3_3
R8
CS PI 1_ SS 0/GP IO 3_2
W6
CS PI 1_ MI SO/G PI O3_1
V7
CS PI 1_ MO SI/G PI O3_0
T4
AU D_ LR CK
U2
AU D_ BC LK
R6
AU D_ DA I
V1
AU D_ DA O
V2
GP IO 2_ 19
T5
GP IO 2_ 18
V3
UA RT 3_ CT S/GP IO 2_17
W2
UA RT 3_ R_ RTS/ GP IO2_ 16
W3
UA RT 3_ TX D_MU X/ GPIO 2_ 15
V4
UA RT 3_ RX D_MU X/ GPIO 2_ 14
M16
I2 C1 _D AT /GPI O2 _13
M14
I2 C1 _C LK /GPI O2 _12
R10
GP IO 1_ 27
W10
GP IO 1_ 26
P10
GP IO 1_ 25
N11
CS PI 3_ MI SO/G PI O1_2 4
R11
CS PI 3_ SC LK/G PI O1_2 3
N9
CS PI 3_ MO SI/G PI O1_2 2
V18
SD 1_ DA TA 3/CS PI 2_SS 0/ GPIO 1_ 21
V19
SD 1_ DA TA 2/GP IO 1_20
U19
SD 1_ DA TA 1/GP IO 1_19
U18
SD 1_ DA TA 0/CS PI 3_MI OS /GPI O1 _1 8
T18
SD 1_ CL K/ CSPI 3_ SCLK /G PIO1 _1 7
T16
SD 1_ CM D/ CSPI 3_ MOSI /G PIO1 _1 6
H5
ET M_ CT L/ GPIO _D 13
G5
EI M_ RW /G PIO1 _9
H6
ET M_ CL K/ GPIO _1 0
G4
EI M_ CS 1/ GPIO 2_ 1
F2
EI M_ CS 0/ GPIO 2_ 0
J6
DI SP 1_ DA T23
G1
DI SP 1_ DA T22
J5
DI SP 1_ DA T21
H2
DI SP 1_ DA T20
J4
DI SP 1_ DA T19/ ET M_D3
H1
DI SP 1_ DA T18/ ET M_D2
K6
DI SP 1_ DA T17/ ET M_D1
J1
DI SP 1_ DA T16/ ET M_D0
J2
DI SP 1_ DA T15
K5
DI SP 1_ DA T14
L6
DI SP 1_ DA T13
K2
DI SP 1_ DA T12
L5
DI SP 1_ DA T11
K1
DI SP 1_ DA T10
L4
DI SP 1_ DA T9
L1
DI SP 1_ DA T8
L2
DI SP 1_ DA T7
M6
DI SP 1_ DA T6
M5
DI SP 1_ DA T5
M2
DI SP 1_ DA T4
M1
DI SP 1_ DA T3
M4
DI SP 1_ DA T2
N4
DI SP 1_ DA T1
N1
DI SP 1_ DA T0
P4
GP IO 1_ 7
P5
GP IO 1_ 6/ CLK0 /A UD_M CL K
R2
GP IO 1_ 5/ USB_ PW R
R4
GP IO 1_ 4
T1
GP IO 1_ 3
R5
GP IO 1_ 2
T2
GP IO 1_ 1/ I2C2 _S DA
U1
GP IO 1_ 0/ I2C2 _S CL
P13
JT AG _M OD
T14
JT AG _D E_ B
R13
JT AG _T RS TB
V16
JT AG _T DO
W16
JT AG _T DI
W17
JT AG _T MS
V17
JT AG _T CK
W18
JT AG _R TC K
LED_ PWM
VD 40 1
14 V
R4 12
4. 7K
R4 01
4. 7K
P3.3 _CTL
R4 05
6. 8K
R4 15
6. 8K
R4 02
10 K
R4 03
4. 7K
R4 26
47 K
R4 23
47 K
R4 20
47 K
RED
BLUE
GREE N
FUEL GAUGE
CPU ---> L CD
LCD ---> C PU
RTC, CODEC , FM
10 : NA ND B OOT
1.10 V
CKIL
BOOT MO DE
REAL TI ME C LOCK
SPI3 INTER FACE
TOUC H INTE RFAC E
CLK/ DAT <- -I2C _3
ARM_ DEBUG
11 : US B BO OT
PWR_ IN_CPU
LED_ DIMMIN G
MUTE
PWR_ ON_OFF
D ef au lt Low p ort
Plac e this par t to CP U as cl ose as pos sible
LCD_ RESET
SRTC _POW
PER4
PER_ 9
PER_ 2
PER_ 9
NVCC _OSC
PER4
PER9
USBP HY
PER8
PER2
PER3
NVCC _IPU
NVCC _CNTR
PER1 3
PER1 4
NV CC _E MI
PER6
AND G AT E
VIDE O_EN
RESE T_IN
NAND _CS_CT L
CODEC ;M CL K
Samsung Electronics 7-3
POWER
TP4
TP5
TP6
TP7
TP6
TP5
TP7
This Document can not be used without Samsung’s authorization.
TP4
Schematic Diagram
Page 63
Schematic Diagram
NAND_ DQ[6]
NAND_ DQ[2]
NAND_ DQ[4]
NAND_ DQ[0]
NAND_ DQ[5]
NAND_ DQ[1]
NAND_ DQ[3]
NAND_ DQ[7]
DDR_S D_DA[17 ]
DDR_S D_DA[8]
DDR_S D_DA[26 ]
DDR_S D_AD[3]
DDR_S D_AD[1]
DDR_S D_DA[5]
DDR_S D_AD[2]
DDR_S D_DA[6]
DDR_S D_DA[19 ]
DDR_S D_AD[8]
DDR_S D_AD[5]
DDR_S D_AD[7]
DDR_S D_DA[7]
DDR_S D_AD[12 ]
DDR_S D_DA[24 ]
DDR_S D_AD[6]
DDR_S D_DA[25 ]
DDR_S D_DA[16 ]
DDR_S D_DA[28 ]
DDR_S D_DA[20 ]
DDR_S D_DA[27 ]
DDR_S D_DA[11 ]
DDR_S D_DA[14 ]
DDR_S D_DA[12 ]
DDR_S D_DA[29 ]
DDR_S D_DA[3]
DDR_S D_AD[9]
DDR_S D_AD[11 ]
DDR_S D_DA[9]
DDR_S D_AD[10 ]
DDR_S D_DA[4]
DDR_S D_DA[10 ]
DDR_S D_DA[15 ]
DDR_S D_DA[18 ]
DDR_S D_DA[13 ]
DDR_S D_DA[2]
DDR_S D_AD[4]
DDR_S D_AD[0]
DDR_S D_DA[30 ]
DDR_S D_DA[0]
DDR_S D_DA[21 ]
DDR_S D_DA[22 ]
DDR_S D_DA[1]
DDR_S D_DA[31 ]
DDR_S D_DA[23 ]
NAND_ DQ[1]
NAND_ DQ[7]
NAND_ DQ[0]
NAND_ DQ[6]
NAND_ DQ[4]
NAND_ DQ[5]
NAND_ DQ[2]
NAND_ DQ[3]
NAND_ DQ[0]
NAND_ DQ[2]
NAND_ DQ[6]
NAND_ DQ[4]
NAND_ DQ[7]
NAND_ DQ[1]
NAND_ DQ[3]
NAND_ DQ[5]
NAND_ DQ[1]
NAND_ DQ[0]
NAND_ DQ[5]
NAND_ DQ[7]
NAND_ DQ[3]
NAND_ DQ[6]
NAND_ DQ[2]
NAND_ DQ[4]
NAND_ DQ[0]
NAND_ DQ[7]
NAND_ DQ[1]
NAND_ DQ[6]
NAND_ DQ[2]
NAND_ DQ[5]
NAND_ DQ[3]
NAND_ DQ[4]
NAND_ WE
NAND_ ALE
NAND_ CS5
NAND_ R/B4
NAND_ CLE
NAND_ CLE
NAND_ OE
NAND_ WE
GND
NAND_ R/B7
NAND_ WP
NAND_ ALE
GND
NAND_ CS6
NAND_ CS4
NAND_ OE
NAND_ CS7
P_3 .0V
DDR_S D_BA[1]
GND
DDR_S D_CS
DDR_S D_AD[0- 12]
DDR_S D_CLK
DDR_S D_WE
DDR_S D_DQS[0 ]
DDR_S D_DQM[2 ]
DDR_S D_CAS
DDR_S D_BA[0]
DDR_S D_DQS[2 ]
DDR_S D_RAS
DDR_S D_CKE
DDR_S D_DQM[0 ]
DDR_S D_DQM[3 ]
DDR_S D_DQS[3 ]
DDR_S D_DQM[1 ]
DDR_S D_DA[0- 31]
DDR_S D_DQS[1 ]
DDR_S D_/CLK
P_1 .8V
C50 4
100 nF
C50 1
100 nF
C51 9
100 nF
C50 6
100 nF
C50 2
100 nF
NAND_ R/B0
NAND_ OE
NAND_ CS0
P_3 .0V
C50 8
100 nF
NAND_ CS1
GND
NAND_ DQ[0-7]
NAND_ ALE
GND
P_3 .0V
NAND_ CLE
C50 9
100 nF
NAND_ WE
NAND_ WP
NAND_ DQ[0-7]
NAND_ WE
NAND_ CS1
C51 4
100 nF
C51 3
100 nF
GND
NAND_ OE
NAND_ WP
GND
NAND_ WE
P_3 .0V
NAND_ CLE
NAND_ OE
NAND_ ALE
NAND_ CS2
NAND_ DQ[0-7]
NAND_ CS0
NAND_ CLE
NAND_ CS3
NAND_ ALE
NAND_ DQ[0-7]
NAND_ WP
GND
NAND_ DQ[0-7]
NAND_ WP
NAND_ CS3
NAND_ CS2
U50 7
DG2 735D TN-T 1-E4
1
V+
2
NO1
3
COM14IN1
5
NC1
6
GND
7
NC2
8
IN2
9
COM2
10
NO2
P_3 .0V
NAND_ CS_CTL
C51 6
100 nF
GND
U50 6
DG2 735D TN-T 1-E4
1
V+
2
NO1
3
COM14IN1
5
NC1
6
GND
7
NC2
8
IN2
9
COM2
10
NO2
P_3 .0V
C50 5
100 nF
GND
NAND_ CPU_CS1
NAND_ CPU_CS0
NAND_ CPU_CS2
NAND_ CPU_CS3
NAND_ CS0
NAND_ CS1
NAND_ CS2
NAND_ CS3
NAND_ CS4
NAND_ CS5
NAND_ CS7
NAND_ CS6
NAND_ CPU_CS0
NAND_ CS0
NAND_ CPU_CS1
NAND_ CS1
NAND_ CPU_CS3
NAND_ CS3
NAND_ CPU_CS2
NAND_ CS2
P_3 .0V
C51 7
100 nF
P_3 .0V
R50 3
22
P_3 .0V
NAND_ CS1
NAND_ CS3
NAND_ CS2
NAND_ CS0
P_3 .0V
NAND_ CS7
NAND_ CS6
NAND_ CS5
NAND_ CS4
NAND_ R/B1
NAND_ R/B2
NAND_ R/B3
NAND_ R/B5
NAND_ R/B6
NAND_ R/B1
NAND_ R/B0
NAND_ R/B2
NAND_ R/B3
NAND_ R/B0
NAND_ R/B1
NAND_ R/B2
NAND_ R/B3
NAND_ R/B4
NAND_ R/B5
NAND_ R/B7
NAND_ R/B6
P_3 .0V
R50 5
4.7 K
R50 6
4.7 K
C51 1
100 nF
C50 7
100 nF
C51 0
100 nF
C50 3
100 nF
C52 2
100 nF
C52 5
100 nF
C52 3
100 nF
C52 4
100 nF
GND
C52 0
100 nF
R50 4
4.7 K
R50 2
4.7 K
R50 7
10K
P_3 .0V
GND
NAND_ SELECT
U50 1
K4X 5132 3PG- 8GC6
H3
A12
H2
A11
J7
A10
H1
A9
J3
A8
J2
A7
J1
A6
K3
A5
K1
A4
K9
A3
K7
A2
J9
A1
J8
A0
H9
BA1
H8
BA0
K8
DM0
K2
DM1
F8
DM2
F2
DM3
L8
DQS 0
L2
DQS 1
E8
DQS 2
E2
DQS 3
G9
RAS
G8
CAS
G7
WE
G2
CLK
G3
CLK
G1
CKE
H7
CS
A1
VSS _1F9VSS _2R1VSS _3C1VSS Q_1E1VSS Q_2L1VSS Q_3N1VSS Q_4A3VSS Q_5R3VSS Q_6
B9
VSS Q_7
D9
VSS Q_8M9VSS Q_9P9VSS Q_10
F7
NC_ 1
F3
NC_ 2
R8
DQ0
P7
DQ1
P8
DQ2
N7
DQ3
N8
DQ4
M7
DQ5
M8
DQ6
L7
DQ7
L3
DQ8
M2
DQ9
M3
DQ1 0
N2
DQ1 1
N3
DQ1 2
P2
DQ1 3
P3
DQ1 4
R2
DQ1 5
A8
DQ1 6
B7
DQ1 7
B8
DQ1 8
C7
DQ1 9
C8
DQ2 0
D7
DQ2 1
D8
DQ2 2
E7
DQ2 3
E3
DQ2 4
D2
DQ2 5
D3
DQ2 6
C2
DQ2 7
C3
DQ2 8
B2
DQ2 9
B3
DQ3 0
A2
DQ3 1
B1
VDD Q_1D1VDD Q_2
M1
VDD Q_3P1VDD Q_4A7VDD Q_5R7VDD Q_6C9VDD Q_7E9VDD Q_8L9VDD Q_9
N9
VDD Q_10
F1
VDD _1R9VDD _2A9VDD _3
C51 2
470 0nF
U50 2
K9H CG08 U1D
1 N.C _1
2 N.C _2
3 N.C _3
4 R/B 4
5 R/B 3
6 R/B 2
7 R/B 1
8 RE
9 CE1
10 CE2
11 N.C _4
12 VCC _1
13 VSS _1
14 CE3
15 CE4
16 CLE
17 ALE
18 WE
19 WP
20 N.C _5
21 N.C _6
22 N.C _7
23 N.C _8
24 N.C _9
25
N.C_10
26
N.C_11
27
N.C_12
28N.C _13
29
I/O0
30I/O1
31
I/O2
32
I/O3
33
N.C_14
34N.C _15
35
N.C_16
36
VSS_2
37VCC_2
38N.C _17
39N.C _18
40N.C _19
41
I/O4
42
I/O5
43I/O6
44I/O7
45
N.C_20
46N.C _21
47N.C _22
48N.C _23
U50 3
K9P DG08 U5D- LCB0
A1
CE2-1
A7
R/B2- 1
C3
CLE2
C5
CE1-2
D2
ALE2
D6
RE2
E1
WE2
E7
R/B1- 2
F2
WP1
G1
IO0-2
G5
WP2
G7
IO7-2
J1
IO1-2
J7
IO6-2
L1
IO2-2
L7
IO5-2
N3
IO3-2
N5
IO4-2
H6
IO7-1
J5
IO6-1
K6
IO5-1
L5
IO4-1
K2
IO3-1
J3
IO2-1
H2
IO1-1
G3
IO0-1
B2
VSS_1
F6
VSS_2
L3
VSS_3
M2
VSS_4
B6
VCC_1
M6
VCC_2
N1
VCC_3
N7
VCC_4
A3
CLE1
A5
CE1-1
C1
ALE1
C7
RE1
E3
WE1
E5
R/B1- 1
A
CE2-2
B
NC_1
C
NC_2
D
NC_3
E
NC_4
F
NC_5
G
NC_6
H
VSS_5
I
NC_7
J
NC_8
K
NC_9
L
R/B2- 2
U50 4
K9P DG08 U5D- LCB0
A1
CE2-1
A7
R/B2- 1
C3
CLE2
C5
CE1-2
D2
ALE2
D6
RE2
E1
WE2
E7
R/B1- 2
F2
WP1
G1
IO0-2
G5
WP2
G7
IO7-2
J1
IO1-2
J7
IO6-2
L1
IO2-2
L7
IO5-2
N3
IO3-2
N5
IO4-2
H6
IO7-1
J5
IO6-1
K6
IO5-1
L5
IO4-1
K2
IO3-1
J3
IO2-1
H2
IO1-1
G3
IO0-1
B2
VSS_1
F6
VSS_2
L3
VSS_3
M2
VSS_4
B6
VCC_1
M6
VCC_2
N1
VCC_3
N7
VCC_4
A3
CLE1
A5
CE1-1
C1
ALE1
C7
RE1
E3
WE1
E5
R/B1- 1
A
CE2-2
B
NC_1
C
NC_2
D
NC_3
E
NC_4
F
NC_5
G
NC_6
H
VSS_5
I
NC_7
J
NC_8
K
NC_9
L
R/B2- 2
R50 8
10K
R50 1
4.7 K
FIRST NAND
SECOND NAND
FIRST NAND
32GB
4G/8G /16G
NAND option resisto r and I C Selec tion
8GB/4 GB 16GB
32GB
LOCAT ION
U502
U503
U504
U506
U507
R502
R503
R504
R505
R506
R507
R508
O
X
O:IN SER T
X :NC
X
X
X
X
O
O
X
O
X
X
X
O
O
O O
O O
O
O O
O
X
O
XX
O
X
X
X
X
O
OO
X
INS ERT FOR 8 G/16G
R501
O
XX
7-4 Memory (SDRAM, NAND-Flash)
POWER
7-4 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 64
7-5 Power Management
LED +
EXT _PW R
CPU _RS T
CHG _ST ATU S
V_ DD CO N
IN N_ BA TT
P_ 3. 0V
US B_ P5 V
P_ 1. 0V
V_ DD CO N
R6 29
5. 6K
R6 10
12 0K
R6 11
15 0K
GND
GND
GND
CHA RGE _EN
PWR _ON _OF F
LED _DI MMI NG
PWR _IN _DD CON
C6 20
10 00 0n F
10 V
D6 01
KD S1 21 V
C6 23
10 00 0n F
10 V
GND
RES ET_ IN
GND
R6 23
10 K
GND
GND
R6 06
1K
C6 10
10 0n F
C6 27
10 0n F
C6 19
10 0n F
C6 26
10 0n F
C6 16
10 0n F
LED -
LED _PW M
RES ET_ SW
P_ 3. 0V
U6 01
MA X8 81 9
1
CO MP 4
2
FB 4
3
OV P4
4
PG 45LX 46GN D7EN 4
15
CH G16PG 117LX 118PV 1319LX 320PG 321DL IM 1
22
FB 2
23
FB 3
24
EN 12 3
25
PV 2
26
LX 2
27
PG 2
28
DL IM 2
12
CE N
10
SY S
8
RS T1
13
FB 1
11
DC
9
BA T
14
CI SE T
Q6 01
KT K5 13 2V
1
So urc e
2
Ga te
3
Dr ain
IN N_ BA TT
I2C _DA T1
P_ 3. 0V
GND
I2C _CL K1
GND
P_ 1. 2V
P_ 1. 8V
R6 03
27 0K
R6 33
15 0
R6 32
15 0
IN N_ BA TT
T6 01
PWR _SW
T6 02
RES ET_ SW
GND
R6 16
39 K
R6 39
20 0K
P_ 3. 0V
C6 31
47 0n F
10 V
R6 41
20 0K
COR E_C TL
C6 12
10 00 0n F
10 V
Q6 02
KT K5 13 2V
1
So urc e
2
Ga te
3
Dr ain
GND
P_ 3. 0V
C6 24
22 00 0n F
6. 3V
C6 18
10 00 nF
VD 60 2
14 V
R6 18
4. 7K
GND
VD DA _1 .2V
R6 24
56 K
R6 25
27 0K
1%
GND
LP_ CTL
C6 30
10 0n F
P_ 1. 8V
U6 04
MA X1 70 40G+ T
1 CTG
2
CELL
3 VDD
4 GND
5
SEO
6
EO
7
SCL
8
SDA
C6 25
10 00 nF
L6 04
10 uH
R6 30
10 K
R6 04
10 K
R6 22
10 K
R6 31
10 0K
R6 12
10 0K
R6 40
10 0K
R6 21
10 0K
R6 28
10 0K
C6 15
22 00 0n F
V_ DD CO N
V_ DD CO N
V_ DD CO N
GND
GND
R6 09
10 K
R6 13
10 K
P_ 1. 8V
C6 34
10 00 nF
R6 07
10 0K
C6 03
22 00 nF
P_ 2. 5V
P_ 3. 3V
P_ 3. 0V
C6 17
22 00 nF
C6 32
22 00 nF
C6 13
22 00 nF
U6 03
MI C5 36 5-3. 3YM T
1
VOUT
2
GND_1
3
EN
5
GND_2
4
VIN
U6 02
MI C5 36 5-2. 5YM T
1
VOUT
2
GND_1
3
EN
5
GND_2
4
VIN
U6 06
MI C5 36 5-3. 0YM T
1
VOUT
2
GND_1
3
EN
5
GND_2
4
VIN
L6 03
4. 7u H
L6 01
4. 7u H
L6 02
4. 7u H
CO N6 01
8P
1
2
3
4
5
6
7
8
R6 15
10 K
C6 08
22 nF
U6 05
RP 10 0
1
VOU T
2
GND
3
CE
4
VDD
C6 33
22 00 nF
C6 04
22 00 nF
R6 19
10 K
C6 01
10 00 nF 1 0V
VD 60 1
14 V
R6 14
1M
1%
GND
C6 28
47 00 nF
R6 43
10 K
C6 06
47 00 nF
C6 11
47 00 nF
C6 07
47 00 nF
C6 29
22 00 0n F
6. 3V
C6 09
10 0n F
R6 08
20 0K
P3. 3_C TL
D6 03
DS F0 5S 30U
Q6 0
3
RN 19 07 F
E
1
2
3
4
5
6
R6 01
47 K
GND
R6 20
82 K
R6 17
82 K
R6 34
18 K
1/ 16 W
3.0V
1% OK!
1% OK!
1% OK!
1% OK
1% OK
20 0m s dela y
1% OK
400mA
30 0m A
30 0m A
1% OK!
HIG H : 1. 05V
LOW : 0. 82V
CO RE _C TL
1% OK!
1.5
=== > 3 00m A
Cur ren t = 20 00 x
R62 3
Schematic Diagram
POWER
TP6
TP6
TP7TP6
TP6
TP6
TP7
Samsung Electronics 7-5
This Document can not be used without Samsung’s authorization.
Page 65
Schematic Diagram
FM_ ANT
R7 13
1K
GND
GND
U7 02
FD MA 1 02 8NZ
1 S1
2
G1
3 D2_1
4 S2
5
G2
6
D1_1
7
D1_2
8
D2_2
GND
EAR PHO NE_ DET
R7 15
56 0
R7 14
56 0
LOU T_E P
MUT E
GND
ROU T_E P
P_ 3. 0 V
R7 06
20 0K
C7 11
10 0n F
C7 10
10 0n F
VD 70 1
14 V
VD 70 2
14 V
VID EO_ OUT
J7 01
6p
1
4A
4B
5
6A
6B
C7 21
33 0u F
2. 5V
C7 22
33 0u F
2. 5V
EP_ TES T_L
EP_ TES T_R
R7 19
75
P_ 1. 8 V
C7 06
10 0n F
C7 12
10 00 0 nF
GND
AUD _LR CK
GND
GND
GND
AUD _BC LK
C7 08
10 0n F
FM_ LIN E_I N_R
C7 09
22 00 n F
C7 03
10 nF
R7 04
1K
GND
AUD _DA TA_ OUT
I2C _CL K0
ROU T_E P
AUD _MC LK
P_ 3. 0 V
LIN E_O UT_ L
GND
AUD _DA TA_ IN
C7 13
10 0n F
U7 01
WM 18 0 8
1
LI P
2
LI N
3
L2 /G P IO 2
4
R2 /G P IO 3
5
DA CD A T
6
LR C
7
BC LK
8
AD CD A T9MR CK10DG ND11DC VD D12DB VD D13CS B/ G PI O114SC LK
15
SD IN
16
MO DE
17
AU XL
18
AU XR
19
OU T3
20
RO UT 2
21
AG ND 2
22
LO UT 223AV DD 2
24
VM ID
25
AG ND 126RO UT 127LO UT 128AV DD 1
FM_ LIN E_I N_L
GND
LIN E_O UT_ R
C7 02
10 0n F
I2C _DA T0
LOU T_E P
P_ 3. 0 V
C7 05
10 00 n F
C7 01
10 00 n F
C7 14
10 00 n F
C7 07
22 00 0 nF
R7 10
47 K
R7 05
10 K
L7 04
60 0o h m
C7 18
10 0n F
C7 15
10 00 n F
R7 09
10 K
R7 08
10 K
R7 17
10 0K
C7 04
22 00 n F
C7 16
47 00 n F
MI C7 0 1
3. 6V
1
Power
2
Ground _1
3
Ground _2
4
Output
L7 01
60
L7 03
AB 1 0 00
L7 02
AB 1 0 00
P_ 3. 0 V
VID EO_ DAC OUT
R7 07
75
GND
VID EO_ EN
VID EO_ OUT
P_ 3. 0 V
C7 23
10 0n F
R7 11
20 0K
U7 04
FS M6 1 51 L6X _F1 13
1
VIN
2
GND
3
SAG
4
VOUT
5
VCC
6
EN
SEM
7-6 AUDIO CODEC
POWER
AUDIO
VIDEO
TP6
TP8
TP8
TP6
7-6 Samsung Electronics
This Document can not be used without Samsung’s authorization.
TP6
Page 66
7-7 24PIN IO INTERFACE
PWR _IN _DD CON
PWR _IN _CP U
GND
USB _D+
UAR T_T X1
UAR T_R X1
DEV ICE _DE T
PBA _CE
USB _D-
R8 14
27 K
P_ 3. 0 V
LIN E_O UT_ R
LIN E_O UT_ L
GND
PWR _IN _DD CON
US B_ P 5V
VD 80 3
14 V
R8 16
10 K
R8 18
47 K
IN N_ B AT T
C8 03
10 0n F
PWR _SW
JTA G_R TCK
JTA G_T DI
CPU _RS T
JTA G_T MS
JTA G_T CK
JTA G_R ST
R8 05
0
R8 15
10 K
R8 12
10 K
TOU CH_ CLK
VOL UME -
TOU CH_ DAT
VOL UME +
TOU CH_ INT R
GND
R8 03
JTA G_T DO
R8 20
47 K
GND
C8 01
22 00 n F
10 V
D8 01
ES D7 L 5. 0DT 5G
CON801
24P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
CO N8 0 2
8P
1
2
3
4
5
6
7
8
R8 17
4. 7K
R8 09
0
R8 01
0
P_ 3. 3 V
C8 02
10 00 n F
R8 06
15 0
R8 04
15 0
C8 04
10 0n F
R8 02
22
TOU CH_ CE
R8 07
10 0K
R8 11
3. 9o h m
U8 01
NC P3 6 0S NT1 G
1
IN
2
GND
3
EN
4
FLA G
5
OUT
D8 0
2
uC la m p1 201 P. T C
T
R8 08
3. 9o h m
R8 10
3. 9o h m
[PO WER /HO LD]
14 : U ar t T X1
22 : B AT T
4 : A DA PTO R
15 : U SB D+ /H O ST D+
24 : P BA CE
19 : G ND
12 : G ND
6 : J TA G_R TC K /P ON
1 0: US B D -/ H OS T D -
8 : C PU _RS T
5 : A DA PTO R
11 : J TA G_T CK
3 : n c
21 : B AT T
16 : U SB PW R
2 : D EV ICE D E T/ CE
9 : J TA G_T DO
17 : L IN E O UT R
7 : J TA T_R ST
18 : L IN E O UT L
13 : U ar t R X1
23 : J TA G_T DI
1 : B AT T I D
NC
20 : J TA G_T MS
NC
VCC
CE
POWER
AUDIO
Schematic Diagram
TP3
TP3
Samsung Electronics 7-7
This Document can not be used without Samsung’s authorization.
Page 67
Schematic Diagram
Mac hine
Hol e
Mac hine
Hol e
GND
LCD _HSYNC
LCD _DOTCLK
LCD _ENABLE
GND
LCD _CLK
LCD _VSYNC
LED -
LED +
LCD _CHECK
LCD _RED2
LCD _RED4
LCD _BLU4
LCD _RED6
LCD _RED0
LCD _BLU7
LCD _BLU0
LCD _GRN2
LCD _RED5
LCD _GRN5
LCD _BLU2
LCD _BLU5
LCD _BLU6
LCD _BLU1
LCD _GRN4
LCD _GRN1
LCD _BLU3
LCD _GRN0
LCD _RED1
LCD _GRN3
LCD _RED7
LCD _RED3
LCD _GRN7
LCD _GRN6
LCD _RST
R9 07
1K
P_ 3.0V
LCD _CS
GND
LED _PWM
LCD _DATA_I N
LCD _DATA_O UT
R9 05
22
CO N901
43 P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
IN N_BA TT
UAR T_TX1
FM_ ANT
EP_ TEST_L
EP_ TEST_R
UAR T_RX1
CO N902
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
USB _D-
USB _D+
US B_P5 V
PWR _IN_DDC ON
GND
PBA _CE
LCD _GRN7
GND
C9 02
10 00nF
R9 01
33
R9 03
10 0K
GND
GND
GND
SCR
1
R9 09
1K
F
2
IC T-04 -00
1
1
2
3
F
3
IC T-04 -00
1
1
2
3
F1
?
1
2
R9 08
10 K
VD 901
14 V
H1
1. 05pi a
1
H2
1. 05pi a
1
C9 01
10 0nF
R9 04
20 0K
LCD ---> C PU
CPU ---> L CD
Con tact wi th LCD-SU S
CE
USB GND
R I N
L O UT
D-
POW ER ON
PBA CHECK
USB VCC
VCC
Tx
FM ANT
GND
R O UT
PCB OUT- SIDE
Rx
AUD IO GND
L I N
D+
1%
SCR EW HOLE
LCD GUIDE HOLE
SYM BOL
SYM BOL
7-8 PBA / LCD INTERFACE
POWER
AUDIO
7-8 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Page 68
7-9 BLUETOOTH / FM
GND
FM_ LIN E_I N_L
FM_ LIN E_I N_R
R1 17
1K
R1 16
1K
C1 18
10 nF
C1 19
10 nF
32. 768 KHZ _OUT
C1 14
10 0n F
GND
GND
FM_ BUS _EN
FM_ ANT
I2C _CL K0
I2C _DA T0
GND
GND
GND
32. 768 KHZ _OUT
P_ 3. 0 V
GND
C1 07
10 0n F
GND
P_ 1. 8 V
RE G_ B T
GND
R1 05
1K
BT_ WAK E
BT_ RST
AUD _DA TA_ IN
RE G_ B T
RE G_ B T
GND
GND
GND
GND
BT_ UAR T_R X0
BT_ UAR T_T X0
AUD _LR CK
AUD _BC LK
L1 01
8. 2n H
B1 01
60 0o h m
BT_ UAR T_R TS0
BT_ UAR T_C TS0
R1 02
10 0K
C1 11
10 0n F
FM_ SEA RCH
P_ 3. 0 V
C1 10
0. 1n F
AN T1 0 1
OD BT P TR 301 5
1
2
3
4
C1 23
10 0n F
R1 07
15 K
R1 01
47 K
R1 08
47 K
C1 05
10 00 n F
C1 06
10 00 n F
U1 01
SI 47 0 9- B-G MR
1
NC _1
2
FM I
3
RF GN D
4
RS T
5
SE N6SC LK7SD IO8VI O
9
RC LK
10
VD
11
GN D_ 1
12
RO UT
13
LO UT14VA
15
GP O
16
NC _217GN D_ 2
AUD _DA TA_ OUT
U1 02
BC M2 0 70 CB0 KU F BX G
G4
RE S
D1
RF P
G2
XI N
G3
XO UT
A4
LP O_ I N
B2
RE G_ E N
A3
VB AT
A2
VR EG H V
A1
VR EG
B4
RS T_ N
C4
TM 0
F3
TM 2
B5
GP IO _ 0
B3
GP IO _ 1
E6
GP IO _ 5
E3
GP IO _ 6
B7
GP IO _ 7
D8
UA RT _ RX D
C8
UA RT _ TX D
D7
UA RT _ RT S_N
E8
UA RT _ CT S_N
F7
SC L
E7
SD A
A8
SP IM _ CL K
C7
SP IM _ CS _N
F6
PC M_ I N
G6
PC M_ O UT
F4
PC M_ C LK
F5
PC M_ S YN C
B6
CO EX _ IN
E4
CO EX _ OU T0
E5
CO EX _ OU T1
B1
VD DI F
C1
VD DT F
E1
VD DL N A
F1
VD DR F
G1
VD DP X
A5
VD DC _ 1
B8
VD DC _ 2
F8
VD DC _ 3
G5
VD DO _ 1
A6
VD DO _ 2
G8
VD DO _ 3
C2
VS S_ 1
D2
VS S_ 2
F2
VS S_ 3
D3
VS S_ 4
C6
VS S_ 5
A7
VS S_ 6
G7
VS S_ 7
GND
BT_ REG _EN
C1 21
22 00 n F
C1 22
22 00 n F
R1 03
10 0K
R1 11
10 0K
R1 18
1K
C1 20
47 00 n F
R1 15
10 0K
C1 25
10 nF
C1 24
10 nF
C1 03
10 nF
C1 15
10 nF
C1 12
10 nF
GND
R1 13
15 0
R1 14
15 0
C1 26
10 0n F
X1 01
26 .0 0 MH z
1
2
3
4
C1 17
10 0n F
C1 02
0. 00 8 2n F
C1 01
0. 00 8 2n F
F1 01
24 50 M Hz
1
GND _1
2
OUT
3
GND _2
4
IN
C1 16
0. 01 5 nF
C1 13
0. 01 5 nF
C1 08
0. 1n F
C1 04
0. 00 2 nF
15K
1% OK
For im ped ance mat chi ng
CON NEC T P IN 1 AND PI N 4
clo se to
VD pin
FMI tr ace as
sho rt as possi ble
C11 6 S hou ld be pl ace d
clo se to VDDTF (C1 )PI N.
clo se to VDDPX (G1 )/V DDIF( B1) PIN .
C11 2/C 124 Shou ld be place d
clo se to VDDLN A(E 1)P IN.
C11 3 S hou ld be pl ace d
NC
NC
POWER
Schematic Diagram
TP4
TP2
TP5
TP2
TP4
TP5
Samsung Electronics 7-9
This Document can not be used without Samsung’s authorization.
Page 69
MEMO
7-10 Samsung Electronics
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