Samsung X490 Service Manual
GSM TELEPHONE
SGH-X490
GSM TELEPHONE
CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ
Samsung Electronics Co.,Ltd. December. 2005
Printed in Korea.
Code No.: GH68-08926A
BASIC.
1. Specification
1-1. GSM General Specification
GSM900
Phase 1
Freq. Band[MHz]
Uplink/Downlink
ARFCN range 1~124
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period
Time Slot
Period/Frame Period
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
890~915
935~960
270.833kbps
3.692us
576.9us
4.615ms
EGSM900
Phase 2
880~915
925~960
0~124 &
915~1023
270.833kbps
3.692us
576.9us
4.615ms
DCS1800
Phase 1
1710~1785
1805~1880
512~885 512~810
270.833kbps
3.692us
576.9us
4.615ms
Phase 1
1850~1910
1930~1990
270.833kbps
4.615ms
PC1900
3.692us
576.9us
Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMAMux8888
Cell Radius 35Km 35Km 2Km 2Km
1-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Specification
1-2. GSM TX power class
TX Power
control level
5 33±3 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
GSM900
TX Power
control level
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
DCS1800
TX Power
control level
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
PCS1900
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5dBm
18 7±5 dBm
19 5±5 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2
15 0±5 dBm
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
2. Circuit Description
2-1. SGH-X490 RF Circuit Description
2-1-1. RX PART
- ASM(U100)→Switching Tx, Rx path for GSM900, DCS1800, PCS1900 by logic controlling.
- ASM Control Logic (U100)
Tx Mode (GSM900) H L L
Tx Mode (DCS1800/1900) L H L
Rx Mode (GSM900) L L L
Rx Mode (DCS1800) L L L
Rx Mode (PCS1900) L L H
- FILTER
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM FILTER (F101)→For filtering the frequency band between 925 and 960 MHz
- DCS FILTER (F102)→For filtering the frequency band between 1805 and 1880 MHz.
- PCS FILTER (F100)→For filtering the frequency band between 1930 and 1990 MHz.
- VC-TCXO (OSC101)
This module generates the 26MHz reference clock to drive the logic and RF. After division by two a reference clock of
13MHz is supplied to the other parts of the system through the pin CLKOUT. After additional process, the reference
clock applies t o the U100 Rx IQ demodulator and Tx IQ modulator. And then, the oscillator is controlled by serial data
to select channel and use fast lock mode for GPRS high class operation.
→
Truth Table
VC1 VC2 VC3
- Transceiver (U101)
The receiver front-end which amplifies the GSM, DCS, PCS aerial signal, converts the chosen channel down to a low IF
signal of 100 kHz. The first stages are symmetrical low noise amplifiers (LNAs). The LNAs are followed by an IQ down
mixer. It consists of two mixers in parallel but driven by quadrature out of phase LO signals. The In phase (I) and
Quadrature phase (Q) IF signals are low pass filtered to provide protection from high frequency offset interferes. The low
IF I and Q signals are then fed into the channel filter. The front-end low IF I and Q outputs enter the integrated
bandpass channel filter with provision for five 8 dB gain steps in front of the filter.
2-1-2. TX PART
I and Q baseband signals are applied to the IQ modulator that shifts the modulation spectrum up to the transmit IF. It is
designed for low harmonic distortion, low carrier leakage and high image rejection to keep the phase error as small as
possible.
2-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Circuit Description
The modulator is loaded at its IF output by an integrated low pass filter that suppress unwanted spurs prior to get into
the phase detector. The clock drive is generated by division of the RFLO signal provided for the transmit offset mixer.
Baseband IQ signal fed into offset PLL, this function is included inside of U101 chip. OSC100 chip generates modulator
signal which power level is about 6.5dBm and fed into Power Amplifier(U102). The PA output power and power ramping
are well controlled by Auto Power Control circuit. We use offset PLL below table.
GSM -36dBm
DCS -36dBm
GSM -36dBm
DCS -36dBm
GSM -51dBm
DCS -56dBm
Modulation Spectrum
200kHz offset
30 kHz bandwidth
400kHz offset
30 kHz bandwidth
600kHz ~ 1.8MHz offset
30 kHz bandwidth
2-2. Baseband Circuit description of SGH-X490
2-2-1. PCF50601
- Power Management
Ten low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system
performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0VSIMs, while a selfresetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as RTC
module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor full
control of the PCF50601 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault
condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
-Backlight Brightness Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width
to modulate the intensity of a series of LED’s or to control a DC/DC converter that drives LCD backlight.
This phone (SGH-X490) use PWM control to contrast the backlight brightness.
Clock Generato
-
The Clock Generator (CG) generates all clocks for internal and external usage. The 32768 Hz crystal
oscillator provides an accurate low clock frequency for the PCF50601 and other circuitry.
r
2-2
modulator (PWM) and FET
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Circuit Description
2-2-2. LCD Connector
LCD is consisted of main LCD(color 65K UFB LCD) and sub LCD (B/W LCD).
Chip select signals LCD_MAIN_CS and LCD_SUB_CS, can enable Each LCD. BACKLIGHT signal enables white LED
of main LCD. "LCD_RESET" signal initiates the reset process of the LCD.
16-bit data lines(HD(0)~HD(15)) transfers data and commands to LCD. Data and commands use "HA(1)" signal. If this
signal is low, inputs to LCD are commands. If it is high, inputs to LCD are data.
The signal which informs the state of LCD is whether input or output, is required. But in this system, there is no input
state from LCD. So only "HA(1)" signal is used to indicate write data or command to LCD. Power signals for LCD are
"VBAT and "VDD3".
"SPK_P" and "SPK_N" are used for audio speaker containing voice or melody. And "VDD_VIB" from PCF50601
enables the motor.
2-2-3. Key
This is consisted of key interface pins among OM6359, KBIO(0:7). These signals compose the matrix. Result of matrix
informs the key status to key interface in the OM6359. Power on/off key is separated from the matrix. So power on/off
signal is connected with PCF50601 to enable PCF50601. Twelve key LEDs are use the "VDD_KEY" as supply voltage.
"FLIP" informs the status of folder (open or closed) to the OM6359. This uses the hall effect IC, A321ELH-SAMSUNG.
A magnet under main LCD enables A321ELH-SAMSUNG.
2-2-4. EMI ESD Filter
This system uses the EMI ESD filter, EMIF09 to protect noise from IF CONNECTOR part.
2-2-5. IF connetor
It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, TXD0, RXD0, RTS0, CTS0, JIG_REC,
CHARGER_OK, RXD1, TXD1, AUX_MIC, AUX_SPK and GND. They connected to power supply IC, microprocessor
and signal processor IC.
2-2-6. Battery Charge Management
A complete constant-current/constant-voltage linear charger is used for single cell lithium-ion batteries.
If TA connected to phone, "+DCVOLT" enable charger IC and supply current to battery.
When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging
process.
2-2-7. Audio
EARP_P and EARP_N from OM6359 are connected to the main speaker. MIC_P and MIC_N are connected to the main
MIC. YMU788 is a synthesizer LSI for mobile phones. It is a LSI as an input/output device for sound sources, which is
the mobile phones, such as MP3, AAC, etc, in addition to ringing-melodies.
As a synthesis, YMU788 is equipped 32 voices with different tones. Since the device is capable of simultaneously
generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects.
Since the play data of YMU788 are interpreted at anytime through FIFO, the length of the data(playing period) is not
limited, so the device can flexibly support application such as incoming call melody music distribution service.
2-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Circuit Description
The hardware sequencer built in this device allows playing of the complex music without giving excessive load to the
CPU of the portable telephones.
For the purpose of enabling YMU788 to demonstrate its full capabilities, Yamaha purpose to use "SMAF:Synthetic music
Mobile Application Format" as a data distribution format that is compatible with multimedia. Since the SMAF takes a
structure that sets importance on the synchronization between sound and images, various contents can be written into it
including incoming call melody with words that can be used for training karaoke, and commercial channel that combines
texts, images and sounds, and others. The hardware sequencer of YMU788 directly interprets and plays blocks relevant to
synthesis (playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed in SMAF.
2-2-8. Memory
Signals in the OM6359 enable two memories. They use two volt supply voltage, VDD3 in the PCF50601 & VDD_1.9V
with a LDO. This system uses Intel's memory, RD38F3050LOZTQ0. It is consisted of 128M bits flash NOR memory and
64M bits SRAM. It has 16 bit data line, HD[0~15] which is connected to OM6359. It has 26 bit address lines,
HA[1~26]. NCSFLASH & NCSRAM signals are chip select. Writing process, HWR_N is low and it enables writing
process to flash memory and SRAM. During reading process, HRD_N is low and it enables reading process to flash
memory and SRAM. Reading or writing procedure is processed after HWR_N or HRD_N is enabled.
2-2-9. OM6359
OM6359 is consisted of ARM core and DSP core. It has
on-chip program ROM
of KBS, JTAG, EMI and UART. ARM core is consisted of EMI, PIC(Programmable Interrupt Controller),
reset/power/clock unit, DMA controller, TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous Serial
Interface), ACC(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface.
KBIO(0:7), address lines of DSP core and HD[0~15]. HA[1~26], address lines of ARM core and HD[0~15], data lines of
ARM core are connected to memory, YMU788.
NCSRAM, NCSFLASH in the ARM core are connected to each memory. HWR_N and HRD_N control the process of
memory. External IRQ(Interrupt ReQuest) signals from each units, such as, PMU need the compatible process.
KBIO[0~7] receive the status from key and RXD0/TXD0 are used for the communication using data link
cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It receives 13MHz clock in CKI pin from
external TCXO. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and battery voltage.
in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted
8x1Kword on-chip program/data RAM, 55 Kwords
2-2-10. TOH2600DGI4KRA(26MHz)
This system uses the 26MHz TCXO, TOH2600DGI4KRA, SEM. AFC control signal from OM6359 controls frequency
from 26MHz x-tal. The clock output frequency of UAA3536 is 13MHz. This clock is connected to OM6359, YMU788.
2-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
3. Exploded View and Parts List
3-1. Exploded View
QFU01
QLC01
QSP01
QFR01
QSC14
QVO01
QKP01
QMP01
QME01
QVK01
QMI01
QAN02
QRE01
QMO01
QFL01
QCR53
QSC01
QMW02
QCR11
QRF01
QBA01
QRF03
QMI03
QIF01
3-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Exploded view and Part List
3-2. Parts List
Location NO. Description SEC CODE
QAN02
QBA01
QCR11
QCR53
QFL01
QFR01
QFU01
QKP01
QLC01
QME01
QMI01
QMO01
QMP01
QMW02
QRF01
QSC01
QSC14
QSP01
QVK01
QVO01
QRE01
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
ㅤ
INTENNA-SGHX490 GH42-00699A
BATTERY-1000MAH,WH/SIL,MAIN GH43-02197A
SCREW-MACHINE 6001-001654
SCREW-MACHINE 6001-001639
MEC-FOLDER LOWER GH75-08664A
MEC-FRONT COVER GH75-06966A
MEC-FOLDER UPPER GH75-06471A
MEC-KEYPAD(TMB/WST) GH75-08152A
MEA-LCD MODULE KIT(X495) GH97-05095A
UNIT-METAL DOME GH59-02046A
MICROPHONE-ASSY-SGHX497 GH30-00198A
MOTOR DC-SGHZ130 GH31-00154D
PBA MAIN-SGHX490 GH92-02444A
PCT-WINDOW MAIN GH72-19918B
MPR-RF SHEET GH74-14435B
MPR-SCREW SHEET GH74-13610B
MPR-TAPE FRONT FPC GH74-08876A
SPEAKER 3001-001779
UNIT-VOLUME KEY GH59-02053A
MEC-VOLUME KEY GH75-07274A
MEC-REAR COVER GH75-08454A
QRF03 PMO-EAR COVER GH72-23535A
QIF01 PMO-IF COVER GH72-23556A
QMI03 RMO-RUBBER MIC REAR GH73-04847A
3-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Exploded view and Part List
Description SEC CODE
CARD-REGISTRATION 6801-001446
BAG PE 6902-000634
CBF INTERFACE-SGHS500 TEST CAB GH39-00217A
CBF SIGNAL-SGHE800TEST GH39-00283A
ADAPTOR-TAD GH44-00482A
LABEL(P)-WATER SOAK GH68-02026A
MANUAL-USER GH68-08536A
LABEL(R)-MAIN(EU) GH68-08622A
CUSHION-CASE(1-2) GH69-03333A
BOX(P)-UNIT(T-MOBILE) GH69-03459A
PMO-BATT LOCKER GH72-19954A
PCT-WINDOW SUB GH72-19964A
RMO-RUBBER TOP LCD A GH73-04923A
RMO-RUBBER TOP LCD B GH73-04924A
MPR-BOHO VINYL SUB(S-R) GH74-03429B
MPR-BOHO VINYL REAR GH74-12905A
MPR-TAPE WINDOW SUB GH74-13223A
MPR-TAPE WINDOW MAIN GH74-13608A
MPR-BOHO VINYL SUB GH74-14432A
MPR-TAPE EL GH74-14881A
MPR-BOHO VINYL LCD CONN GH74-15350A
MPR-TAPE PBA EMI GH74-15484A
MPR-SPONGE MOTOR GH74-15610A
MPR-SPONGE PBA GH74-15911A
MPR-TAPE PBA A GH74-16066A
MPR-BOHO VINYL MAIN GH74-16545B
MPR-BOHO VINYL MAIN(S) GH74-16545C
MPR-BOHO VINYL SUB GH74-17302A
INSTALL-SGHS500 TEST JIG GH80-01909A
3-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Exploded view and Part List
3-3. Test Jig (GH80-01909A)
3-3-1. RF Test Cable
(GH39-00283A)
3-3-2. Test Cable
(GH39-00217A)
3-3-4. Power Supply Cable 3-3-5. DATA CABLE
(GH39-00219A)
3-3-3. Serial Cable
3-3-6. TA
(GH44-00184G)
3-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
4. Electrical Parts List
Design LOC Description SEC COD E STATUS
BAT300 BATTERY-LI(2ND) 4302-001180 SA
C101 C-CER,CHIP 2203-000278 SA
C102 C-CER,CHIP 2203-000812 SA
C103 C-CER,CHIP 2203-000854 SA
C104 C-CER,CHIP 2203-000854 SA
C105 C-CER,CHIP 2203-000278 SA
C106 C-CER,CHIP 2203-000278 SA
C107 C-CER,CHIP 2203-000854 SA
C108 C-CER,CHIP 2203-005057 SA
C109 C-CER,CHIP 2203-005482 SA
C110 C-CER,CHIP 2203-005057 SA
C111 C-CER,CHIP 2203-005482 SA
C112 C-CER,CHIP 2203-000233 SA
C113 C-CER,CHIP 2203-000233 SA
C114 C-CER,CHIP 2203-005482 SA
C115 C-CER,CHIP 2203-005057 SA
C116 C-CER,CHIP 2203-005138 SA
C117 C-CER,CHIP 2203-001383 SA
C118 C-CER,CHIP 2203-000359 SA
C119 C-CER,CHIP 2203-000696 SA
C120 C-CER,CHIP 2203-000836 SA
C121 C-CER,CHIP 2203-001101 SA
C122 C-CER,CHIP 2203-005482 SA
C123 C-CER,CHIP 2203-005057 SA
C124 C-CER,CHIP 2203-006053 SA
C125 C-CER,CHIP 2203-000438 SA
C126 C-CER,CHIP 2203-000233 SA
C127 C-TA,CHIP 2404-001239 SA
C128 C-CER,CHIP 2203-006141 SA
C129 C-CER,CHIP 2203-000438 SA
C130 C-CER,CHIP 2203-006190 SA
C132 C-CER,CHIP 2203-005503 SA
C133 C-CER,CHIP 2203-000311 SA
C134 C-CER,CHIP 2203-000233 SA
C135 C-CER,CHIP 2203-000254 SA
C136 C-CER,CHIP 2203-001153 SA
C137 C-CER,CHIP 2203-000550 SA
C138 C-CER,CHIP 2203-006137 SA
C139 C-CER,CHIP 2203-005482 SA
C140 C-CER,CHIP 2203-000679 SA
C141 C-CER,CHIP 2203-005482 SA
C142 C-CER,CHIP 2203-005057 SA
C143 C-CER,CHIP 2203-000233 SA
C144 C-CER,CHIP 2203-000254 SA
C145 C-CER,CHIP 2203-000438 SA
C146 C-CER,CHIP 2203-000438 SA
C147 C-CER,CHIP 2203-000438 SA
C152 C-CER,CHIP 2203-000278 SA
C153 C-CER,CHIP 2203-000278 SA
C156 C-CER,CHIP 2203-000438 SA
4-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
Design LOC Description SEC COD E STATUS
C157 C-CER,CHIP 2203-000359 SA
C158 C-CER,CHIP 2203-000359 SA
C200 C-CER,CHIP 2203-005061 SA
C203 C-CER,CHIP 2203-005061 SA
C204 C-CER,CHIP 2203-000254 SA
C206 C-CER,CHIP 2203-005061 SA
C207 C-CER,CHIP 2203-000254 SA
C208 C-CER,CHIP 2203-000254 SA
C210 C-CER,CHIP 2203-006423 SA
C212 C-CER,CHIP 2203-005061 SA
C213 C-CER,CHIP 2203-005482 SA
C214 C-CER,CHIP 2203-000854 SA
C215 C-CER,CHIP 2203-006423 SA
C216 C-CER,CHIP 2203-000854 SA
C218 C-CER,CHIP 2203-005061 SA
C219 C-CER,CHIP 2203-005482 SA
C220 C-CER,CHIP 2203-000254 SA
C221 C-CER,CHIP 2203-006423 SA
C222 C-CER,CHIP 2203-006423 SA
C223 C-CER,CHIP 2203-005482 SA
C224 C-CER,CHIP 2203-000438 SA
C225 C-CER,CHIP 2203-005482 SA
C300 C-CER,CHIP 2203-005482 SA
C301 C-CER,CHIP 2203-006105 SA
C302 C-CER,CHIP 2203-005482 SA
C304 C-TA,CHIP 2404-001394 SA
C305 C-CER,CHIP 2203-005482 SA
C306 C-CER,CHIP 2203-005482 SA
C307 C-TA,CHIP 2404-001374 SA
C308 C-CER,CHIP 2203-006257 SA
C309 C-CER,CHIP 2203-005482 SA
C310 C-CER,CHIP 2203-006208 SA
C311 C-TA,CHIP 2404-001225 SA
C312 C-CER,CHIP 2203-005395 SA
C313 C-CER,CHIP 2203-000386 SA
C314 C-CER,CHIP 2203-005482 SA
C315 C-CER,CHIP 2203-006257 SA
C316 C-CER,CHIP 2203-000386 SA
C317 C-CER,CHIP 2203-006562 SA
C318 C-CER,CHIP 2203-000386 SA
C319 C-CER,CHIP 2203-006562 SA
C320 C-CER,CHIP 2203-006053 SA
C321 C-CER,CHIP 2203-000885 SA
C322 C-CER,CHIP 2203-006208 SA
C323 C-CER,CHIP 2203-006324 SA
C324 C-CER,CHIP 2203-000812 SA
C325 C-CER,CHIP 2203-005065 SA
C326 C-TA,CHIP 2404-001225 SA
C327 C-TA,CHIP 2404-001225 SA
C328 C-CER,CHIP 2203-005482 SA
4-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
Design LOC Description SEC COD E STATUS
C329 C-CER,CHIP 2203-005482 SA
C330 C-CER,CHIP 2203-005482 SA
C332 C-CER,CHIP 2203-006257 SA
C333 C-CER,CHIP 2203-006562 SA
C334 C-CER,CHIP 2203-006208 SA
C335 C-CER,CHIP 2203-006208 SA
C336 C-CER,CHIP 2203-000679 SA
C337 C-CER,CHIP 2203-006053 SA
C338 C-CER,CHIP 2203-006208 SA
C339 C-CER,CHIP 2203-006208 SA
C340 C-CER,CHIP 2203-006053 SA
C400 C-TA,CHIP 2404-001348 SA
C401 C-CER,CHIP 2203-000995 SA
C402 C-CER,CHIP 2203-005482 SA
C403 C-CER,CHIP 2203-005061 SA
C404 C-CER,CHIP 2203-006562 SA
C406 C-CER,CHIP 2203-000278 SA
C407 C-CER,CHIP 2203-000679 SA
C408 C-CER,CHIP 2203-005482 SA
C409 C-CER,CHIP 2203-005061 SA
C410 C-CER,CHIP 2203-005736 SA
C411 C-CER,CHIP 2203-000679 SA
C412 C-CER,CHIP 2203-005482 SA
C413 C-CER,CHIP 2203-000679 SA
C415 C-CER,CHIP 2203-000489 SA
C416 C-CER,CHIP 2203-000679 SA
C418 C-CER,CHIP 2203-000278 SA
C419 C-CER,CHIP 2203-006423 SA
C420 C-CER,CHIP 2203-005736 SA
C421 C-CER,CHIP 2203-000885 SA
C422 C-CER,CHIP 2203-000254 SA
C423 C-CER,CHIP 2203-001153 SA
C424 C-CER,CHIP 2203-005483 SA
C425 C-CER,CHIP 2203-005483 SA
C426 C-CER,CHIP 2203-006562 SA
C429 C-CER,CHIP 2203-000995 SA
C430 C-CER,CHIP 2203-000995 SA
C437 C-CER,CHIP 2203-006053 SA
C438 C-CER,CHIP 2203-005482 SA
C439 C-TA,CHIP 2404-001352 SA
C501 C-CER,CHIP 2203-002443 SA
C502 C-CER,CHIP 2203-005482 SA
C503 C-CER,CHIP 2203-005482 SA
C504 C-CER,CHIP 2203-000278 SA
C505 C-CER,CHIP 2203-000679 SA
C507 C-CER,CHIP 2203-000995 SA
C508 C-CER,CHIP 2203-000278 SA
C509 C-CER,CHIP 2203-000995 SA
C510 C-CER,CHIP 2203-000995 SA
C511 C-CER,CHIP 2203-000278 SA
4-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
Design LOC Description SEC COD E STATUS
C513 C-CER,CHIP 2203-006562 SA
C514 C-CER,CHIP 2203-006562 SA
C515 C-CER,CHIP 2203-006562 SA
CN300 CONNECTOR-CARD EDGE 3709-001355 SA
CN502 CONNECTOR-INTERFACE 3710-001611 SA
CN503 HEADER-BATTERY 3711-005783 SA
CON101 CONNECTOR-COAXIAL 3705-001358 SA
EAR400 JACK-EAR PHONE 3722-002067 SA
F100 FILTER-SAW 2904-001571 SA
F101 FILTER-SAW 2904-001550 SA
F102 FILTER-SAW 2904-001570 SA
HEA1 HEADER-BOARD TO BOARD 3711-005728 SA
L101 INDUCTOR-SMD 2703-002207 SA
L102 INDUCTOR-SMD 2703-002199 SA
L103 INDUCTOR-SMD 2703-002207 SA
L104 INDUCTOR-SMD 2703-002203 SA
L105 INDUCTOR-SMD 2703-002700 SA
L106 INDUCTOR-SMD 2703-001726 SA
L107 INDUCTOR-SMD 2703-002308 SA
L108 INDUCTOR-SMD 2703-002700 SA
L109 INDUCTOR-SMD 2703-002308 SA
L110 INDUCTOR-SMD 2703-002308 SA
L111 INDUCTOR-SMD 2703-002199 SA
L112 INDUCTOR-SMD 2703-002176 SA
L113 INDUCTOR-SMD 2703-001727 SA
L114 INDUCTOR-SMD 2703-002176 SA
L115 INDUCTOR-SMD 2703-002203 SA
L116 INDUCTOR-SMD 2703-002368 SA
L117 INDUCTOR-SMD 2703-001708 SA
L300 BEAD-SMD 3301-001105 SA
L400 BEAD-SMD 3301-001362 SA
L401 BEAD-SMD 3301-001362 SA
L402 BEAD-SMD 3301-001105 SA
L403 BEAD-SMD 3301-001105 SA
L501 BEAD-SMD 3301-001438 SA
LED501 LED 0601-002037 SA
LED502 LED 0601-002037 SA
LED503 LED 0601-002037 SA
LED504 LED 0601-002037 SA
LED505 LED 0601-002037 SA
LED506 LED 0601-002037 SA
LED507 LED 0601-002037 SA
LED508 LED 0601-002037 SA
LED509 LED 0601-002037 SA
LED510 LED 0601-002037 SA
LED511 LED 0601-002037 SA
LED512 LED 0601-002037 SA
OSC100 OSCILLATOR-VCO 2806-001326 SA
OSC101 OSCILLATOR-VCTCXO 2809-001281 SA
Q100 TR-DIGITAL 0504-001151 SA
4-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
Design LOC Description SEC COD E STATUS
R101 R-CHIP 2007-000162 SA
R102 R-CHIP 2007-000162 SA
R103 R-CHIP 2007-000162 SA
R104 R-CHIP 2007-007148 SA
R105 R-CHIP 2007-000141 SA
R106 R-CHIP 2007-007528 SA
R107 R-CHIP 2007-001288 SA
R108 R-CHIP 2007-000171 SA
R109 R-CHIP 2007-001329 SA
R110 R-CHIP 2007-000144 SA
R111 R-CHIP 2007-001308 SA
R112 R-CHIP 2007-001308 SA
R113 R-CHIP 2007-000566 SA
R114 R-CHIP 2007-000148 SA
R115 R-CHIP 2007-001288 SA
R116 R-CHIP 2007-007311 SA
R117 R-CHIP 2007-000566 SA
R118 R-CHIP 2007-007699 SA
R119 R-CHIP 2007-007699 SA
R120 R-CHIP 2007-001308 SA
R121 R-CHIP 2007-001308 SA
R122 R-CHIP 2007-000171 SA
R123 R-CHIP 2007-000171 SA
R125 R-CHIP 2007-008672 SA
R126 R-CHIP 2007-001308 SA
R127 R-CHIP 2007-000142 SA
R128 R-CHIP 2007-000148 SA
R129 R-CHIP 2007-000138 SA
R130 R-CHIP 2007-008213 SA
R131 R-CHIP 2007-008213 SA
R132 R-CHIP 2007-008213 SA
R133 R-CHIP 2007-008213 SA
R134 R-CHIP 2007-000140 SA
R135 R-CHIP 2007-000140 SA
R136 R-CHIP 2007-000171 SA
R200 R-CHIP 2007-000174 SA
R201 R-CHIP 2007-008055 SA
R204 R-CHIP 2007-000162 SA
R205 R-CHIP 2007-008055 SA
R206 R-CHIP 2007-008055 SA
R207 R-CHIP 2007-008055 SA
R208 R-CHIP 2007-008052 SA
R209 R-CHIP 2007-008516 SA
R210 R-CHIP 2007-008055 SA
R211 R-CHIP 2007-007107 SA
R212 R-CHIP 2007-007142 SA
R213 R-CHIP 2007-007001 SA
R214 R-CHIP 2007-007142 SA
R215 R-CHIP 2007-001284 SA
R216 R-CHIP 2007-000148 SA
4-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Electrical Parts List
Design LOC Description SEC COD E STATUS
R217 R-CHIP 2007-001284 SA
R218 R-CHIP 2007-000162 SA
R219 R-CHIP 2007-000162 SA
R220 R-CHIP 2007-007107 SA
R221 R-CHIP 2007-007001 SA
R222 R-CHIP 2007-000171 SA
R223 R-CHIP 2007-008588 SA
R224 R-CHIP 2007-008588 SA
R225 R-CHIP 2007-008542 SA
R227 R-CHIP 2007-008542 SA
R228 R-CHIP 2007-008542 SA
R300 R-CHIP 2007-000157 SA
R301 R-CHIP 2007-000148 SA
R302 R-CHIP 2007-007573 SA
R303 R-CHIP 2007-007334 SA
R304 R-CHIP 2007-008117 SA
R305 R-CHIP 2007-000151 SA
R306 R-CHIP 2007-007100 SA
R400 R-CHIP 2007-002796 SA
R401 R-CHIP 2007-000140 SA
R402 R-CHIP 2007-000148 SA
R403 R-CHIP 2007-008054 SA
R404 R-CHIP 2007-000140 SA
R405 R-CHIP 2007-008542 SA
R406 R-CHIP 2007-008055 SA
R407 R-CHIP 2007-002796 SA
R408 R-CHIP 2007-008055 SA
R409 R-CHIP 2007-007334 SA
R410 R-CHIP 2007-001313 SA
R411 R-CHIP 2007-008542 SA
R412 R-CHIP 2007-007483 SA
R413 R-CHIP 2007-007589 SA
R414 R-CHIP 2007-007138 SA
R415 R-CHIP 2007-007981 SA
R416 R-CHIP 2007-007488 SA
R417 R-CHIP 2007-007489 SA
R418 R-CHIP 2007-000138 SA
R422 R-CHIP 2007-000138 SA
R424 R-CHIP 2007-008542 SA
R500 R-CHIP 2007-000162 SA
R501 R-CHIP 2007-008055 SA
R502 R-CHIP 2007-008531 SA
R503 R-CHIP 2007-008531 SA
R504 R-CHIP 2007-008531 SA
R505 R-CHIP 2007-008531 SA
R506 R-CHIP 2007-008531 SA
R507 R-CHIP 2007-000162 SA
R508 R-CHIP 2007-008531 SA
R510 R-CHIP 2007-001298 SA
R511 R-CHIP 2007-001298 SA
4-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Loading...