Samsung SGH-E700 Service Manual

GSM TELEPHONE

SGH-E700

SERVICE

Manual

GSM TELEPHONE CONTENTS

1. Specification

2. Circuit Description

3. Exploded Views and Parts List

4. Electrical Parts List

5. Block Diagrams

6. PCB Diagrams

7. Flow Chart of Troubleshooting

ELECTRONICS

This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

ⓒ

Samsung Electronics Co.,Ltd. June. 2003 Printed in Korea.

Code No.: GH68-04050A BASIC.

1. SGH-E700 Specification

1. GSM General Specification

GSM900

Phase 1

Freq. Band[MHz]

Uplink/Downlink

ARFCN range 1~124

Tx/Rx spacing 45MHz 45MHz 95MHz

Mod. Bit rate/

Bit Period

Time Slot

Period/Frame Period

Modulation 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm

890~915 935~960

270.833kbps

3.692us

576.9us

4.615ms

EGSM 900

Phase 2

880~915 925~960

0~124 &

975~1023

270.833kbps

3.692us

576.9us

4.615ms

DCS1800

1710~1785 1805~1880

270.833kbps

Phase 1

512~885

3.692us

576.9us

4.615ms

Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl

Sensitivity -102dBm -102dBm -100dBm

TDMA Mux 8 8 8

Cell Radius 35Km 35Km 2Km

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SGH-E700 Specification

2. GSM TX power class

TX Power

control level

5 33±2 dBm

6 31±2 dBm

7 29±2 dBm

8 27±2 dBm

9 25±2 dBm

10 23±2 dBm

11 21±2 dBm

GSM900

TX Power

DCS1800

control level

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3dBm

18 7±3 dBm

19 5±3 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

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2. SGH-E700 Circuit Description

1. SGH-

E700

RF Circuit Description

1) RX PART

1. ASM(F101)→Switching Tx, Rx path for GSM900, DCS1800 by logic controlling.

2. ASM Control Logic (U102, U103)→Truth Table VC_1 VC_2

GSM Tx Mode L H DCS Tx Mode H L GSM Rx Mode L L DCS Rx Mode L L

3. FILTER

To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.

- GSM FILTER (C105,C107,L101)→For filtering the frequency band between 925 ~ 960 MHz

- DCS FILTER (C110,C113,L103)→For filtering the frequency band 1805 and 1880 MHz.

4. TC-VCXO (OSC100)

To generate the 13MHz reference clock to drive the logic and RF.

After additional process, the reference clock applies to the U101 Rx IQ demodulator and Tx IQ modulator. The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock mode for GPRS high class operation.

5. OM5178 (U100) This chip integrates two differential-input LNAs. The GSM input supports the E-GSM, DCS input supports the DCS1800. The LNA inputs are matched to the 200 ohm differential output SAW filters through eternal LC matching network. Image-reject mixer downconverts the RF signal to a 100 KHz intermediate frequency(IF) with the RFLO from VOL1861 frequency synthesizer. The RFLO frequency is between 1801 ~ 1921 MHz. The Mixer output is amplified with an analog programmable gain amplifier(PGA), which is controlled by AGAIN. The quadrature IF signal is digitized with high resolution A/D converts (ADC).

2) TX PART

Baseband IQ signal fed into offset PLL, this function is included inside of U100 chip. OM5178 chip generates modulator signal which power level is about 1.5dBm and fed into Power Amplifier(PAM100). The PA output power and power ramping are well controlled by Auto Power Control circuit. We use offset PLL below table.

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SGH-E700 Circuit Description

GSM -35dBc

DCS -35dBc PCS -35dBc GSM -66dBc

DCS -65dBc PCS -66dBc GSM -75dBc

DCS -68dBc PCS -75dBc

Modulation Spectrum

200kHz offset 30 kHz bandwidth

400kHz offset 30 kHz bandwidth

600kHz ~ 1.8MHz offset 30 kHz bandwidth

2. Baseband Circuit description of SGH-E700

1. PCF50601

1.1. Power Management Ten low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V, and 5.0V SIMs, while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and sy stem complexity. I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor full control of the PCF50601 and enables system designers to maximize both standby and talk times. Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

Backlight Brightness Modulator

1.2.

The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width

to modulate the intensity of a series of LED’s or to control a DC/DC converter that drives LCD backlight. This phone (SGH-E700) is not use PWM, but use DC CONTROL (BL_VDD) So "BL_VDD" voltage is high value, backlight brigtness is gloomy and "BL_VDD" voltage is low value, backlight is bright.

Clock Generato

1.3.

The Clock Generator (CG) generates all clocks for internal and external usage. The 32768 Hz crystal oscillator provides an accurate low clock frequency for the PCF50601 and other circuitry.

modulator (PWM) and FET

2. Connector

2-1. LCD Connector

LCD is consisted of main LCD(color 65K TFT LCD) and small LCD(256 EL LCD). Chip select signals in the LCD_MAIN_CS and LCD_SUB_CS, can enable Each LCD. LCD_MAIN_CS signal enables white LED of main LCD and LCD_SUB_CS signal enables EL of small LCD. These two signals are from IO part of the DSP in the U302(alpha chip).

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U302

SGH-E700 Circuit Description

"RESET_2V8" signal initiates the Reset process of the LCD. 16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD through by pass capacitor. Data and commands use "RS" signal. If this signal is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output state to LCD, is required. But this system is not necessary this signal. So "L_WR" signal is used to write data or commands to LCD. Power signals for LCD are "VBAT" and "VDD2". "SPK_P" and "SPK_N" from OM6357 are used for audio speaker. And "VDD_VIB" from PCF50601 enables the motor.

2-3. IRDA

This system uses IRDA module, HSDL_3208, Agilent's. This has signals, "IRDA_DOWN"(enable signal), "RXD0"(input data) and "TXD0"(output data). These signals are connected to OM6357. It uses two power signals. "VDD2" is used for circuit and "VBAT" is used for LED.

2-4. Key This is consisted of key interface pins among OM6357, KBIO(0:7). These signals compose the matrix. Result of matrix informs the key status to key interface in the OM6357. Power on/off key is seperated from the matrix. So power on/off signal is connected with PCF50601 to enable PCF50601. twelve key LED use the "VBAT" supply voltage. "VDD_KEY" signal enables LEDs with current control. "FLIP" informs the status of folder (open or closed) to the OM6357. This uses the hall effect IC, A3210ELH. A magnet under main LCD enables A3210ELH.

2-5. EMI ESD Filter

This system uses the EMI ESD filter, EMIF09 to protect noise from IF CONNECTOR part.

2-6 IF connetor

It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, TXD0, RXD0, RTS0, CTS0, JIG_REC, CHARGER_OK, RXD1, TXD1, AUX_MIC, AUX_SPK and GND. They connected to power supply IC, microprocessor and signal processor IC.

3. Battery Charge Management

a complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries. If ta connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery. when fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.

4. Audio

EARP_P and EARP_N from OM6357 are connected to the main speaker. AUXSP is connected to the Hands free kit. MIC_P and MIC_N are connected to the main MIC. And AUX_MIC_P and AUX_MIC_N are connected to the Hands free kit. YMU762MA3 is a LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and ADPCM decorder that are included in this device. As a synthesis, YMU762MA3 is equipped 32 voices with differenttones. Since the device is capable of simultaneously generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects. Since the play data of YMU762MA3 are interpreted at anytime through FIFO, the length of the data(playing period) is not limited, so the device can flexiblysupport application such as incoming call melody music distribution service.

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SGH-E700 Circuit Description

The hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for real time sound generation, allowing, for example, utilization of various sound effects when using the game software installed in the portable telephone. YMU762 includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW (SPVDD=3.6V). The device is also equipped with conventional function including a vibartor and a circuit for controlling LEDs synchornous with music. For the headphone, it is provided with a stereophonic output terminal. For the purpose of enabling YMU762MA3 to demonstarte its full capablities, Yamaha purpose to use "SMAF:Synthetic music Mobile Application Format" as a data distribution format that is compatible wiht multimedia. Since the SMAF takes a structure that sets importance on the synchronization between sound and images, various contents can be written into it including incoming call melody with words that can be used for traning karaoke, and commercial channel that combines texts, images and sounds, and others. The hardware sequencer of YMU762MA3 directly interprets and plays blocks relevant to systhesis (playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed in SMAF.

5. Memory

signals in the OM6357 enable two memories. They use only one volt supply voltage, VDD3 in the PCF50601. This system uses Samsung's memory, KBB06A300M-T402. It is consisted of 128M bits flash NOR memory and 128M bits flash NAND memory and 32M bits UtRAM. It has 16 bit data line, HD[0~15] which is connected to OM6357 and MV317S. It has 23 bit address lines, HA[1~23]. CS_NAND and NCSRAM signals is chip select. Wrting process, HWR_N is low and it enables writing process to flash memory and SRAM. During reading process, HRD_N is low and it enables reading process to flash memory and SRAM. Each chip select signals in the OM6357 select memory among 2 flash memory and UtRAM. Reading or writing procedure is processed after HWR_N or HRD_N is enabled. Memories use reset, which is VDD3 delay from PCF50601. HA[22] signal enables lower byte of SRAM and HA[22] signal enables higher byte of SRAM.

6. OM6357

OM6357 is consisted of ARM core and DSP core. It has

on-chip program ROM

of KBS, JTAG, EMI and UART. ARM core is consisted of EMI, PIC(Programmable Interrupt Controller), reset/power/clock unit, DMA controller, TIC(Test Interface Controller), eripheral bridge, PPI, SSI(Synchronous Serial Interface), ACC(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface. KBIO(0:7), address lines of DSP core and HD[0~15]. HA[1~23], address lines of ARM core and HD[0~15], data lines of ARM core are connected to memory, YMU759. MV317S(Camera DSP Chip) controls the communication between ARM core and DSP core. CS_NAND, NCSRAM, NCSFLASH in the ARM core are connected to each memory. HWR_N and HRD_N control the process of memory. External IRQ(Interrupt ReQuest) signals from each units, such as, PMU need the compatible process. KBIO[0~7] receive the status from key and RXD0/TXD0/irDA_DOWN are used for the communicatios using IRDA and data link cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR). It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It recieves 13MHz clock in CKI pin from external TCXO. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and battery voltage.

in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted

8x1Kword on-chip program/data RAM, 55 Kwords

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SGH-E700 Circuit Description

7. TCO-9141D(13MHz) This system uses the 13MHz TCXO, TCO-9141D, Toyocom. AFC control signal form OM6357 controls frequency from 13MHz x-tal. It generates the clock frequency. This clock is connected to OM6357, YMU762 and OM5178.

9.Camera DSP(MV317SA)

Tiger is an Integrated circuit for mobile phone camera. This structure will allow effectiveness for large data management and significantly reduces main processor will get burden. In hence, Tiger will allow the user to be able to display to LCD direct without burdening the main processor. It also allows to have various kinds of display size on the LCD and snapshot for Jpeg. Digital effect will also be executed on real time base resulting Tiger as being a video co-processor in the mobile platform. Also,an

with Tiger. As the additional 8Mbit is usable except 2Mbit buffer embedded in Tiger, the diverse UI data processing which is not a

JPEG compliance (DCT-based). JPEG decoder supports YUV444, YUV422, YUV420 and YUV411 format standard JPEG image.

i80 type processor’ s 16bit parallel interface of Tiger makes it available for the CPU to interchange the data

burden to the CPU is available. JPEG encoder and decoder are baseline ISO/IEC 10918-1

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3. SGH-E700 Exploded View and its Parts list

1. Cellular phone Exploded View

10 11

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2. Cellular phone Parts list

SGH- E700 Exploded view and its Part list

Location

Description SEC CODE Remark

NO.

1 FOLDER UPPER GH75-03647A 2 DUAL LCD GH07-00397A 3 MOTOR 3101-001368 4 SPEAKER 3001-001444 5 MAIN LCD GH07-00190A 6 CAMERA FPCB GH59-00903A 7 CAMERA GH59-00900A 8 FOLDER LOWER GH75-02917A

9 WINDOW LCD GH75-02919A 10 SCREW 6001-001811 11 SCREW CAP(R) GH73-01890A 12 SCREW CAP(L) GH73-01891A 13 FRONT COVER GH75-02912A 14 KEYPAD GH75-03646A 15 MAIN PBA GH92-01568A 16 DOME SHEET GH59-00901A 17 VOLKEY FPCB GH59-00902A 18 CONNECTOR COVER GH73-01394A 19 MIC GH30-00045A 20 INTENNA GH42-00315A 21 SCREW 6001-001812 22 RF COVER GH73-01894A 23 CAMERA KEY GH75-02915A 24 SIDE KEY GH75-02914A 25 SCREW 6001-001635 26 REAR COVER GH75-02918A 27 BATTERY GH43-00987A

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SGH-E700 Exploded view and its Part list

3. Test Jig (GH80-01909A)

3-1. RF Test Cable

(GH39-00172A)

3-2. Test Cable

(GH39-00217A)

3-4. Power Supply Cable 3-5. DATA CABLE

(GH39-00219A)

3-3. Serial Cable

3-6. TA

(GH44-00482A)

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4. SGH-E700 MAIN Electrical Parts List

SEC CODE Design LOC

0405-001122 D101 0406-001104 ZD600 0406-001104 ZD601 0406-001104 ZD700 0406-001104 ZD701 0501-000225 TR100 0504-001060 U102 0504-001060 U103 0504-001134 TR500 0505-001332 TR501 0505-001423 U601 0506-000107 TR700 0601-001647 LED600 0601-001647 LED601

SEC CODE Design LOC

1001-001253 U602 1009-001010 U600 1109-001280 UME300 1201-001954 PAM100 1202-001036 U604 1203-002076 U304 1203-002824 U101 1203-002980 U501 1204-001960 U301 1205-002264 U100 1205-002276 UCP200 1205-002350 U400 1404-001221 V500

1405-001082 VR600 0601-001647 LED602 0601-001647 LED603 0601-001647 LED611 0601-001647 LED605 0601-001647 LED608 0601-001647 LED607 0601-001819 LED604 0601-001819 LED606 0601-001819 LED609 0601-001819 LED610 0604-001261 IRD600 0801-002237 U300 0801-002529 U411 0801-002882 U305 0801-002882 U202

1405-001082 VR601

1405-001082 VR602

1405-001082 VR603

1405-001082 VR604

1405-001128 VR700

1405-001128 VR701

2007-000137 R504

2007-000140 R315

2007-000141 R205

2007-000141 R206

2007-000141 R307

2007-000142 R101

2007-000142 R102

2007-000142 R105

2007-000142 R106 0801-002882 U201

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2007-000142 R112

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