SAMSUNG SDC33 Service Manual

DIGITAL STILL CAMERA

SDC-30

SDC-33

SERVICE Manual

DIGITAL STILL CAMERA		CONTENTS
	1.	Precautions
	2.	Reference Information
	3.	Product Specifications
MODE	4. Disassembly and Reassembly
TIMER
DELETE
	5.	Alignment and Adjustment
POWER

6. Troubleshooting

7. Exploded View and Parts List

8. Electrical Parts List

9. Block Diagram

10. PCB Diagrams

11. Schematic Diagrams

© Samsung Electronics Co., Ltd. JUN. 1997

AD68-20286A / AD68-20289A

1. Precautions

1.Be sure that all of the built-in protective devices are replaced. Restore any missing protective shields.

2.When reinstalling the chassis and its assemblies, be sure to restore all pretective devices, including : control knobs and compartment covers.

3.Make sure that there are no cabinet openings through which people--particularly children --might insert fingers and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet mask, excessively wide cabinet ventilation slots, and improperly fitted back covers.

If the measured resistance is less than 1.0 megohm or greater than 5.2 megohms, an abnormality exists that must be corrected before the unit is returned to the customer.

4.Leakage Current Hot Check (See Fig. 1) : Warning : Do not use an isolation transformer during this test. Use a leakage current tester or a metering system that complies with American National Standards Institute (ANSI C101.1,

Leakage Current for Appliances), and Underwriters Laboratories (UL Publication UL1410, 59.7).

5.With the unit completely reassembled, plug the AC line cord directly the power outlet. With the unit’s AC switch first in the ON position and then OFF, measure the current between a known erath ground (metal water pipe, conduit, etc.) and all exposed metal parts, including : antennas, handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5 milliamp. Reverse the power-plug prongs in the AC outlet and repeat the test.

6.X-ray Limits :

The picture tube is designed to prohibit X-ray emissions. To ensure continued X-ray protection, replace the picture tube only with one that is the same type as the original.

							(Reading should
							not be above
							0.5mA)
Device							Leakage
Under
Test							Currant
							Tester
		Test all
	exposed metal
		surfaces
2-Wire Cord
Also test with										Earth
plug reversed
										Ground
(using AC adapter
plug as required)

Fig. 1 AC Leakage Test

7. Antenna Cold Check :

With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. Connect one lead of the ohmmeter to an AC prong.

Connect the other lead to the coaxial connector.

8.High Voltage Limit :

High voltage must be measured each time servicing is done on the B+, horizontal deflection or high voltage circuits.

Heed the high voltage limits. These include the

X-ray protection Specifications Label, and the Product Safety and X-ray Warning Note on the service data schematic.

9.Some semiconductor (“solid state”) devices are easily damaged by static electricity.

Such components are called Electrostatically Sensitive Devices (ESDs); examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity.

10.Immediately before handling sny semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging Wrist-strap device. (Be sure to remove it prior to applying power--this is an electric shock precaution.)

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Precautions

11.High voltage is maintained within specified limits by close-tolerance, safety-related components and adjustments. If the high voltage exceeds the specified limits, check each of the special components.

12.Design Alteration Warning :

Never alter or add to the mechanical or electrical design of this unit. Example : Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty.

13. Hot Chassis Warning :

Some TV receiver chassis are electrically connected directly to one conductor of the AC power cord. If an isolation transformer is not used, these units may be safely serviced only if the AC power plug is inserted so that the chassis is connected to the ground side of the AC source.

To confirm that the AC power plug is inserted correctly, do the following : Using an AC voltmeter, measure the voltage between the chassis and a known earth ground. If the reading is greater than 1.0V, remove the AC power plug, reverse its polarity and reinsert. Re-measure the voltage between the chassis and ground.

14.Some TV chassis are designed to operate with 85 volts AC between chassis and ground, regardless of the AC plug polarity. These units can be safely serviced only if an isolation transformer inserted between the receiver and the power source.

15.Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.

16.Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last.

17.Observe the original lead dress, especially near the following areas : Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched, out- of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that leads and components do not touch thermally hot parts.

18. Picture Tube Implosion Warning :

The picture tube in this receiver employs “integral implosion” protection. To ensure continued implosion protection, make sure that the replacement picture tube is the same as the original.

19.Do not remove, install or handle the picture tube without first putting on shatterproof goggles equipped with side shields. Never handle the picture tube by its neck. Some “in-line” picture tubes are equipped with a permanently attached deflection yoke; do not try to remove such “permanently attached” yokes from the picture tube.

20.Product Safety Notice :

Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original--even if the replacement is rated for higher voltage, wattage, etc.

Components that are critical for safety are indicated in the circuit diagram by shading, ( or ).

Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.

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2. Reference Information

2-1 Circuit description

2-1-1 DSC

Digital camera(SDC-30/33), is an image-input device that connects to a PC. It’s small and light welght, supplies high quality images and has a large capacity (4MB/2MB). The digital camera consists of 3 sections: Camera, signal processing and storage.

1. Camera

The camera is similar to a camcorder but adapts a scanning method of 525/30 (which can read an entire image of in one frame, whereas the camcorder’s scanning method is 525/60.

Photo-exposure is controlled by the electronic shutter through timing generator and CCD driver IC (where as a camcorder controls the exposure using an IRIS).

Main function of this part is to control the photo-exposure in accordance with the brightness, and to store the image in DRAM.

2. Digital Signal Processing

Image information of 1 frame is temporarily stored in DRAM. Image information stored in DRAM is the digitalized CCD signal from the camera. It needs additional image signal processing by the 32-bit microprocessor. The image signal processing done by the microprocessor includes white balance, shape adjustment and Y/C signal conversion.

3. Storage

After image signal processing, an image signal compression technique allows more image to be stored in the limited memory. In the case of SDC-30/33, 10:1 compression is normally executed for standard JPEG specification. After compression, the image information is stored in the nonvolatile flash memory : Max. 45/22 frame for VGA(640*480), and max 180/90 frame for QVGA(320*240).

The image can be stored, edited, and printed by the PC image editing program that is supplied with the camera.

2-1-2 Power

LCD MICOM generates the control signal that turns on the system (5V). When the power is on, the signal turns on IC140 PWM IC which outputs 5V through T141.

When shot key is pressed, the signal for output is generated from MICOM, which turns on IC120 PWM IC and outputs 5V, -7V, and 15V through T121. After the shot, the camera control signal turns off the power supply within. 5sec (through T121).

2-1-3 DC/DC block operation description

2-1-3(A) DC/DC BLOCK CONSISTS OF THREE COMPONENTS AS BELOW.

1. EVER5V

EVER5V consists of S8420 (IC100) IC and the assocciat battery circuitry (CN101 Pin2) is input to

IC100 (S8420). Pin 8 and 5V voltage are generated internally and are output to pins 1 and 7. EVER5V power (Pin 1) is input to the function board for LCD MICOM (IC601) drive, POWER S/W (LED01) driving power, and

PULL-UPvoltage. RESET output of IC100 Pin 5, which changes from low to high at the power input, is connected to LCD MICOM RESET PIN (and resets LCD MICOM).

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Reference Information

2. Camera power

Camera power block consists of IC120 (PWM IC MB3800), Q121 (INVERTER TR DTC144EU), Q122 (SWITCHING TR KSD1621), and rectifier circuit.

When CAM5V control pin of LCD MICOM 10PIN is high, it is converted at Q121 and IC 120. Pin 4 becomes low; then IC120 Pin 7 starts oscillating and the PWM output from IC120 Pin 5 switches Q122. Pin 6 generates the 15V output by a switching pulse and this output is rectified by D121, L123, C127, and C128 to generate 15V power for the drive of CCD (IC201) and V DRIVE IC (MN3112SA).

The pulse for -7V (which is generated at T121 pin 10), is rectified by D121, C129, L124, C130 and becomes -7V power for the drive of CCD and V DRIVE IC.

The pulse for 5V power, which is output from T121 pin 7, becomes CAMERA 5V power by D122, C133, L127, and C134. The 5V power is divided by D5V for the drive of IC204(MN5246) and IC202(MN3112SA) and A5V for the drive of IC203, IC205, and IC206 through L125.

3. SYS 5V

Using the same technique as with camera 5V (L141, IC140, Q142, and T141), the SYS 5V power drives IC301, IC302, IC303, IC304 and IC307, and is generated by SYS 5V CONT from the LCD micom.

EVER5V power is always output when battery and adapter are connected; SYS 5V power is output only when power is turned on. CAM power is output for 0.5 second (only during shot operation).

2-1-4 Camera
1/3" 35		CDS out	AGC IN
					D7~D0		D15~D0
CCD	Vout	CDS	Vout	A/D	Data 8	8-16 CONV.	Data 16	DRAM
		AGC		(8bit)		DRAM CTRL		4Mb
							16
V1~V4	R	SMD						Address
	H1	SHP
								A9~A1
VSUB	H2
LENS
V-Drive		Timing		D Data, DCLK
		Gen
				HD, VD
						Camera		S/W
						Ctrl		DSCP

RISC Chip

1. Camera operation

Fig. 2-1

The image from the lens is converted to an electrical signal by the photoelectric conversion component, CCD (MN3776PE). Each pulse used to extract CCD signal is generated by the timing geneartor IC(MN5246), converted to actual driving voltage by V Drive IC(MN3112SA), and supplied to CCD. After noise elimination (CDS) and amplification (AGC) at analog process IC(NN2038FAQ), CCD output signal is converted to a digital signal by A/D converter. The 8-bit digital data is changed to 16-bit by DRAM control IC(SMA9606), and stored in the DRAM.

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Effective Pixel 325,546=659(H)X494(V) ØV1~ØV4: Vertical Shift Clock ØH1~ØH2:

Horizontal Shift Clock V01: Video output

Reference Information

2. Lens

SDC-30/33 lens uses a fixed focus method, and can take a photograph clearly at over 1 meter distance (optimal quality is between 1.5 and 3 meters).

	3. Color Filter	R	G	R	G	–	–
	Color filter, which remove, the color information on CCD, adapts RGB method
		G	B	G	B	–	–
	for best color characteristics and Bayer method for best.
	4. CCD(MN3776PE) and V Driver(MN3112SA)	R	G	R	G	–	–
		G	B	G	B	–	–
	CCD converts the optical image to an electrical signal and is similar to an
		–	–	–	–	–	–
	existing camcorder (except for the scanning method). The camcorder method
	uses interlace scanning, which outputs a field image every 1/60 second. (First
		–	–	–	–	–	–
	field consists of odd lines, the second field consists of even line, and a complete

picture consists of two fields. However, SDC-30/33 uses a the progressive

scanning method, which outputs a frame every 1/30 second (and has excellent vertical resolution).

The image is output at Pin 1 of CCD, and is input to Pin39 of analog signal process IC (IC203) through TR (Q201). V Driver IC (MN3112SA) mixes each CCD driving pulse from Timing Generator IC, and converts it to

the required voltage.

P W 16

V O 1 1

(Bias) L G 2

V O 2 5

O D 4

<BLOCK>

Ø	Ø	Ø	Ø
V	V	V	V
1	3	2	4
15	13	14	12

V e r t i c a l

S h i f t

R e g i s t e r

Horizontal Shift Register 1

Horizontal Shift Register 2

3	6	8	7
Ø R	O G	Ø H 1	Ø H 2

Fig. 2-2

9 S U B

11 P T

10

S G

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Reference Information

5. Timing Generator (MN5246)

A timing generator generates each clock, synchronized signal, and CCD driving pulse for the system. Also, it receives the shutter speed information for the photo-exposure control (from the microprocessor).

CCD

CDS

Signal

Image signal

process

Ø V1

Ø V2

Ø V3

Ø V4

ØSUB

ØSG

H1

H2

R

V1

V2

V3 V4

SUB

CH1

SG

DS1,DS2

CLK

CSYNC

VDO,HDO

bias

MN5246

VDLIDE

2fck=24.5Mhz

Fig. 2-3

6. Analog processing IC (MN2038FAQ)

After eliminating the noise (CDS) from the CCD output signal (which is input to Pin39, to DS1/DS2 signal

of TG), Analog processing IC outputs it to Pin 46, and then it is input to pin 2 through C232 (for Row Clip and primary amplificationAGC). Then it is output to Pin 35 and Pin 37 of EVR (IC206), which is input to pin 36, which controls AGC. Pin 35 output signal is input to Pin 26 through C218, and is amplified second time at the main amplifier. The offset adjust (pin 16 input) is activated by EVR output signal (Pin 4) and the output (Pin 21) is sent to A/D converter.

Fig. 2-4

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Reference Information

7. A/D converter (KAD0228) and DRAM Controller (SMA9606)

A/D converter converts the analog signal which is output from Analog processing IC to the 8-bit digital signal (24.54Mhz). DRAM Controller is synchronized with Vsync, converts the 8-bit data which is output from A/D converter to 16-bit data, and stores it in DRAM (controlled by the 32-bit microprocessor).

			Data Register		SO
		MODE	&		SCK
			SIO		SI
					SCS
		AE Data Detect.			AD_IN(9:0)
	D_OUT(15:0)	2 & Knee,			–
	–	8bit to 16bit Convert			ADCK IN(12.27MHz)
TRI
STATE					WND1 OUT
OUTPUT	RAS–				WND2 OUT
(High Z	CASU–	DRAM
when	CASL–			VD/HD
		Address
Power Off)	WR–			GEN	EXT VD IN
		Generator
	OE–				EXT HD IN
	A–OUT(9:1)				CLK IN(24.54MHz)
		EOC–		H ADJ
				V ADJ
	R/B	ADDR/DATA
	–	BUS	OE
	BREQ			–
	–	CONTROL
	BACK
	–
		Fig. 2-5

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Reference Information

2-1-5 Digital Section

1. Overview

	8-6 CONV					DRAM			Flash
									Memory
	DRAM CTRL					4Mb
									16Mb/32Mb

Camera

S/W

S/W

Memory

PC I/F

Ctrl

DSCP

JPEG

Ctrl

32bit RISC MICROPROCESSOR

Power		LCD		LCD
Control		Micom		Pannel

Fig. 2-6

2. DRAM (KM416C256BLT) and flash memory (TC5832FT/TC5816FT)

DRAM stores the image signal temporarily and enables the microprocessor to process the signal. Flash memory (nonvolatile) records various system information and the compressed image.

3. 32-bit RISC microprocessor (HD6477043F28)

This microprocessor is the core of the system and handles the camera control, image signal processing, image compression, flash memory control, communication with PC, and communication with LCD control MICOM. (Refer to 2-1-6 “System Control” for details.)

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Reference Information

2-1-6 Sytem control

Dual controller (MICOM) is located in DSC : A RISC chip controls the signal processing, and is the 4-bit MICOM controls the LCD, timer, and switch.

Fig. 2-7

1. 4-bit MICOM; Functions and connections

1)PIN connection status

-RISC is connected to the 4-bit MICOM (total 7 lines).

-Pins 98, 130, and 108 and SCI No. 1 are used.

-Pins 132, 133, 134, and 136 are used for communication with 4-bit MICOM.

-Synchronized communication is used with 4-bit MICOM.

2)Function

-RISC is usally in the standby mode (low-power) because it consumes so much current when it operates.

-4-bit MICOM acknowledges the starting time (for example, when the user pushes the shot key) and sends the NMI pin signal to RISC, so that the standby mode can be changed to the operation mode. The information is sent to RISC through communication port. After RISC executes the appropriate program, it returns to the standby mode.

2.Main function of 4-bit MICOM

-Power ON/OFF: 4-bit MICOM turns the PC (main body) on, and turns on the RISC.

-Execution of shot: When the shot is executed by the PC key (or main body), 4-bit MICOM signals the shot execution to RISC. When the shot is finished (system 5V and head power 5V), 4-bit MICOM changes the RISC mode to standby mode.

-Delay shot: When the delay shot is executed by the PC key (or main body), 4-bit MICOM signals the RISC and supplies the system 5V and head power 5V. Then, the RISC changes to standby mode.

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Reference Information

-Mode change: When the mode is input by the PC key (or main body), 4-bit MICOM signals the RISC. When the mode is changed, 4-bit MICOM displays it on LCD, and changes the RISC to standby mode.

-Delete execution: When the delete instruction is input by the PC key (or main body), 4-bit MICOM signal the RISC and changes the RISC to standby mode.

-LCD display: DSC status is displayed.

-Error handling: When an error occurs, (or RISC) the error message is displayed on LCD. If the RISC cannot operate, the power is automatically off.

-Battery operation: The capacity of battery is classified as "Full", "Half", "Low", or "Battery replacement". For the "Battery replacement" status, only the power on/off function is available, and other functions cannot operate.

-Auto power OFF: When any operation has not been executed (three minutes for main body operation, or 10 minutes for PC operation) the power automatically turns off.

3.Main functions of RISC processor

-Communication with 4-bit MICOM: RISC operation is completely controlled by the 4-bit MICOM.

A synchronization method is adapted for communication between 4-bit MICOM and RISC (with 8-bit*11 byte communication).

-DRAM control: RISC processor includes internal BSC. BSC helps RISC to control the DRAM. RISC uses DRAM as though it were internal RAM (with the help of BSC). BSC generates all DRAM control signals by itself. RISC uses DRAM for the image buffer, temp memory for the calculation, and an area that manages the flash memory and FAT(File Allocation Table).

-Camera Head control: RISC handles the control of the camera head during the shot. RISC controls the timing generator, ASIC, etc. so that the image data from CCD can be transferred.

-Signal processing: RISC executes the signaling processing internally with CCD image data stored in DRAM. After RISC separates CCD data into RGB, and processes detail and gamma, it creates a YUV signal, and executes JPEG compression. The compressed JPEG data will be stored in DRAM again.

-Flash memory control: The compressed data (in DRAM) is stored in the flash memory. The file management program is recorded in RISC, and manages the files in the flash memory (file location, file size, etc).

-PC communication: RISC processor receives the signal from PC (4-bit MICOM) and activates up RISC. Then, RISC processor sets the flag for the request input from PC, and transfers the flag to RISC. The RISC communicates with PC through the serial port. (PC always requests the PC communication to DSC, but RISC does not request it from the PC.)

-Battery level checking: Battery indicator, which is displayed in LCD of 4-bit MICOM, accepts the data from RISC. Battery level checking is executed when the camera head and main board are on. When new battery is inserted, it outputs 6.2V; but the actual voltage drops below 6V after supplying power to the camera head and main board.

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Reference Information

2-2 IC Blocks

2-2-1 IC301 (SMA9606)

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Reference Information

2-2-2 IC302 (KM416C256BLT)

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Reference Information

2-2-3 IC304 (HD6477043)

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Reference Information

2-2-4 IC307 (TC5832FT)

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Reference Information

2-2-5 IC601 (UPD75P3116GC)

2-2-6 IC501 (MAX232C)

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Reference Information

2-2-7 IC203 (NN2038FAQ)

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Reference Information

2-2-8 IC204 (NN5248)

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Reference Information

MEMO

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3. Product Specifications

Design and specifications are subject to change without notice.

	Operation		Descriptions
			SDC-30	SDC-33
	Image sensor		350,000 pixel CCD	350,000 pixel CCD
			(STD) :640 X 480 pixels (ECO)20 X 240 pixels	(STD) :640 X 480 pixels (ECO) : 320 X 240 pixels
	Color depth		24 bit true color (16million colors)	24 bit true color (16million colors)
	Memory		2MB internal flash memory	4MB internal flash memory
	Image capacity		Standard (STD) : 22 images	Standard (STD) : 45 images
			Economical (ECO) : 88 images	Economical (ECO) : 180 images
	Compression		Standard JPEG	Standard JPEG
	Lens		Fixed focusing	Fixed focusing
	Range		100 cm (3.3 feet) - infinity	100 cm (3.3 feet) - infinity
	Viewfinder		Separate optical	Sparate optical
	Shutter		Auto electronic (1/4 ~ 1/8000 seccond)	Auto electronic (1/4 ~ 1/8000 seccond)
	Exposure system		Auto exposure	Auto exposure
	Color balance		Automatic White Balance (AWB)	Automatic White Balance (AWB)
	Sensitivity		ISO 100	ISO 100
	Picture formats		BMP, JPG, PCX, PNG	BMP, JPG, PCX, PNG
			PSD, TGA, TIF, TPL	PSD, TGA, TIF, TPL
	Supported OS		Windows 3.1 or higher (Including Windows 95)	Windows 3.1 or higher (Including Windows 95)
			RAM : 8MB or more	RAM : 8MB or more
	PC		HDD : 30MB or more (free space)	HDD : 30MB or more (free space)
	requirements		CPU : 486DX or higher (IBM PC based)	CPU : 486DX or higher (IBM PC based)
			CDROM drive (recommended)	CDROM drive (recommended)
	PC lnterface		Standard RS-232C (9600 -115200bps)	Standard RS -232C (9600 -115200bps)
	Image transfer		(STD) Standard images : 7~8 sec. (at 115Kbps)	(STD) Standard images : 7~8 sec. (at 115Kbps)
	time (speed)		(ECO) Economy images : Under 2 sec. (at 115Kbps)	(ECO) Economy images : Under 2 sec. (at 115Kbps)
	Power		4AA TYPE alkaline batteries	4AA TYPE allaline batteries
			6V DC in using AC adaptor (not supplied)	6V DC in using AC adaptor (not supplied)
	Power		At power on : below 500mA	At power on : below 500mA
	consumption
			At power off : below 500uA	At power off : below 500uA
	Battery life		More than 200 images using new alkaline batteries	More than 200 images using new alkaline batteries
	Dimensions		115(W) X 75(H) X 38(D)mm	115(W) X 75(H) X 38(D)mm
	Net weight		140g (without batteries)	140g (without batteries)

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Product Specifications

MEMO

3-2	Samsung Electronics

4. Disassembly and Reassembly

4-1 Cabinet and PCB

Disassemble in the order shown. (Reassemble in reverse order.)

4-1-1 Case-Side Removal

3 Disconnect 2 tabs while lifting

up the case-side to the arrow direction.

Bottom Side

1 Remove 2 screws.

Precision screw Driver

2 Lift up the case-side using the precision screw driver.

<BOTTOM SIDE>

Fig. 1

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