SAMSUNG SD_608BDEL.NL040.1.16 Service Manual
DVD-ROM DRIVE
SD-608B
1. Precautions
2. Specifications
3. General information
3-1 External part name
3-2 Circuit description
3-3 Troubleshooting
3-4 IC internal block and IC pin option
4. Disassembly and assembly
5. Alignment and adjustment
6. Exploded views and prats
7. Circuit Parts list
8. Block diagram
9. Schematic diagrams
DVD-ROM Service
Manual
DVD-ROM DRIVE CONTENTS
Electronics
©
Samsung Electronics Co., Ltd.
AUGUST, 1999
Printed in Korea
Code No.: BG68-00148A
1-1 Samsung Electronics
1. Precautions
1-1 General items
1-2 Electricity sensing device
1) Be careful not to have your eyes or a part of body
touch with laser diode at repair because this product
uses laser diode.
2) Do not disassemble Pick-up at repair.
If the laser diode is bad, replace the entire Pick-up.
3) Keep away from TV or other electrical units at repair
to prevent a influence from surrounding units.
4) If you want to replace the parts during repair, be sure
to plug off the power cable before replacement.
5) If you insert a disc into CD player, be sure to load it
correctly.
6) Because this unit cant' be used by itself, surely mount
it on PC(pentium or more) and check the operations in
use of private device drive floppy diskettd.
Refer to Instruction manual.
7) This unit has many parts with features related to
safety and especially, for essential parts, the
importance is indicated on circuit diagram and partlist.
Be certain to use the parts with same specifications at
replacing these parts.
Some semiconductor units may be damaged easily by
electricity.
These elements are called as electricity sensing
device(ESD) in general. For example, integrated circuit,
field effect transister, semiconductor chip.
The following methods have to be used to reduce the
accident of element damage generated by electricity.
1) Emit all electric charges in your body through contact
with earthing materail at once before handling a
semiconductor factor or device including it.
In other way, make use of commercial wristlet against
electricity
It shall be detached before power impression to the
unit on testing because of shock.
2) After detaching an electrical device including ESD, it
shall be placed on conductive surface such as
aluminium to prevent the charge acummulation and
unit exposure.
3) Utilize only the soldering iron with earthed end for
ESD soldering or release
4) Make use of only anti-static soldering release unit.
A soldering release unit not to be classified as
antistatic may generate the enough charge to damage
ESD unit.
5) Never use a Freon-propelling chemical product.
It may generate the enough charge to damage ESD.
6) Untill installing ESD unit for replacement, never it from
protection package.
(Most of ESD unit for replacement have lead
composed of package shorted electrically by
conductive foam, aluminium or similar conductive
material.)
7) Contact with shassis including ESD or protection
material in circuit parts just before detaching the
protection material from lead of ESD unit for replacement
8) Minimize the body action at handling an unpacked
ESD unit for replacement.
(Otherwise, an unconscious action, so to speak,
friction between clothes or foot lifting from carpet floor
may generate the enough charge to damage ESD
unit.)
Note : Be sure to avoid the power impression to the
shassis or circuit and observe the safety instruction.
1-2Samsung Electronics
1-3 Safety instructions
1-4. Earthing cautions at handling Pick-up
Because the laser diode in optical Pick-up is subject to
get out of order due to the potential difference occurring
by electricity load charged in clothes or bodies, observe
the following earthing items at handling.
1) Body earthing at repair : Be sure to wear a wrist strip
with one side earthed.(Impedance : Below 104½).
It removes the electricity formed in body.
2) Work table earthing : Put the earthed conductive
plate(Impedance : Below 104½) such as copper plate on
work table.
3) Cautions for clothes : Do not have any clothes touch
with Pick-up because the electricity formed in clothes
is destroyed easily.
4) FPCB operation be careful to handle FPCB because it
may be damaged easily.
1) Read all safety and operational manuals before
operating this product
2) Keep the safety and operational manuals for future
reference.
3) Observe all precations and operational instructions in
or on the surface of this product.
4) Follow all operation and maintenance cautions.
5) Be sure to plug off the power cable before cleaning.
Use a dry cloth to clean a dusty cover of cabinet
instead of liquid or aersol cleaner.
6) Never use a attachment not to be recommended by
this company. It may result in danger and damage.
7) Never use this product around water such as
bathtub, washbasin, laundry machine, swimming pool
or lakeside.
8) Never place this product on bed, sofa or around
radiator and heater.
9) Power : Utilize the only power displayed on lebel
If the power type can't be checked, call to dealer or
Korea Electricity, Co, Ltd. Refer tooperate this product
by battery or other power.
10) Lightning : Plug off the power cable for product
protection during thunder and lightning flashes or this
product is unused for a long time.
11) Overload : Be careful that the wall outlet and
expanded cord is overloaded due to danger of fire
and electrical shock.
12) Never insert a substance or liquid into this product.
It may cause fire or shorck by contact with voltage
point or short.
13) Part replacement : The service engineer has to use
the parts of same specification at replacement.
Otherwire, fire, shock or other dangers may be
occurred.
14) Safety check : Be sure to perform the safety check at
service or repair completion
Importance : This product includes special impotrant
parts on safety.
These parts are indicated by on schematic
diagram.
At replacement of these parts, use the
parts of same specification due to shock,
fire or other dangers.
Never transform the original design without
permission of this company.
3-1Samsung Electronics
3. General information
3-1-1 Circuit description
3-1-1. Front
ROM
3-1-2. Rear
Figure 3-1
Figure 3-2
Earphone
jack
Up/Down
Volume
LED
Disc
tray
Emergency
HOLE
Stop/Open
button
Digital output
terminal
(Optional)
Sound output
terminal
Master/Slave
select pin
Interface terminal
Power terminal
3-2 Samsung Electronics
3-2. Circuit description
3-2-1. RF
3-2-1(A) IC101 (TA1313F)
IC101(TA1313F) is used in combination with TC9489F as bipolar IC developed for CD/DVD RF signal system. In main, it
receives the pick-up output converted into I/V and preforms DVD waveform equalization(EQ), CD equalization(EQ),
astigmatic focus error signal generation, 1-beam tracking error signal generation(by DPD method), 3-beam tracking error
signal generation FE, TE, RF GAIN adjutment and laser power control, etc.
1) Reference potentiometer
IC101 selects a single power method and from pick-up input singnal terminl works on the basis VrA of 2.1.V.
2) CD/DVD-RF signal system: IC101(TA1313F)
Figure 3-3 shows the flow of RF signal generated in pick-up.
EQ control parameter
1. EQF(58pin): Change the peak frequency with EQ frequency features.
(Convert PWM signal, (TC9489F(168-pin) into DC via low-pass fiter and supply it.)
2. EQB(57pin): Change the boost of EQ frequency features.
3. VRCK(17pin):Input the base clock and link the peak frequency with it.
Figure 3-3
3-3Samsung Electronics
3-2-2 SERVO circuit description
3-2-2(A) Outline
SERVO system of DVD is divided into FOCUS SERVO, TRACKING SERVO, STEP MOTOR LINKED SERVO and
SPINDLE MOTOR CONTROL SERVO.
1) FOCUS SERVO
Focus the optical spot outputted from object lens on disc surface correctly by maintaining a regular distance between
object lens of Pick-up and disc for surface vibration of disc.
2) TRACKING SERVO
Make the object lens follow the disc track in use of tracking error signal created from Pick-up.
3) STEP MOTOR LINKED SERVO
When the tracking actuator inclines to outer as the object lens follow the track at play, move STEP motor a little. and
prevent it from leaning.
4) SPINDLE MOTOR CONTROL SERVO
Control the disc motor to maintain a constant angular velocity in use of FG signal outted in Drive IC.
3-4 Samsung Electronics
3-2-2(B) SERVO SYSTEM BLOCK DIAGRM
Circuit description
Figure 3-4
Samsung Electronics 3-5
3-2-2(C) OPERATION DESCRIPTIONS
Circuit description
1) Focusing SERVO
(1) Focus input
The focus loop is changed from open loop to close loop. The triangular waveform moves the object lens up and down
in 158pin terminal of IC201 at Focus SERVO ON. At that time, S curve is inputted to 150 pin terminal of IC201.
SBAD(152pin terminal of IC201) signal, summing signal of PD A, B, C, D, is gernerated at occurrence of S curve and
zero cross(1.7V) point is found by S curve and focused on when SBAD signal exceeds a regular value.
The focus loop is changed into close loop and the object lens follows the moving of disc, maintaining a regular
distance with disc. While, this operations are same in CD and DVD.
(2) Play
When focus loop gets to close loop at focus servo on, both 150pin and 158pin terminal of IC201 are contoled by Verf
voltage(approx. 1.7V) and focus on cascade on the disc up and down.
158pin terminal of IC201(FOO)
150pin terminal of IC201(FEO)
152pin terminal of IC201(SBAD)
Figure 3-5
3-6 Samsung Electronics
Circuit description
2) TRACKING SERVO
NORMAL PLAY MODE
(1) For DVD
Make the signal outputted though PD A,B,C,D of pick-up, tracking error signal in use of phase difference of A+C and
B+D in IC101 and inputted to IC201 151(TED) terminal. This signal is outputted to IC201 159 terminal(TRO) via
digital equalizer and impressed to tracking actuator through IC401, IC201 159 terminal is controlled in Vref
(approx 1.7V) at normal play.
(2) For CD, VCD
Receive the signal outputted through E, F of Pick-up, from IC101, differently from DVD and make the tracking error
signal through IC101 33pin terminal.
SEARCH MODE
Search mode is divided into fine seek, moving the tracking actuator a little and coarse serch, moving much in use of
STEP motor. The coarse search will be described in STEP linked servo and now, the fine seek is explained shortly.
If the object lens is located near target, cut off the tracking loop and give the control signal as many as desired count
to move the tracking actuator via IC201 159pin terminal(TRO).
3) SLED LINKED SERVO
NORMAL PLAY MODE
During the play signal come from 162pin of IC201 where according to movement of the tracking actuator along the
track,
and the signal is turn into terminal 50 of micom.
COARSE SEARCH MODE
After making seek lead the track make search for ID, and check up the number of must-go-track, in case the
remaining track is within the extend of fine seek, move the fine seek to object track, In case pick up move in the long
distance, the step motor move to half-step use the profile of must-go velocity in micom(IC301).
4) SPINDLE MOTOR CONTROL SERVO
The FG is generated IC402 39terminal rotation of disk, and this signal is IC201 175terminal where is outputted
IC201
163terminal with ckeck up velocity.
This signal is supplied in IC402 21terminal where control velocity of rotation at disk. The disk is rotated standard
angular velocity(CAV FORM) without relations of the inside and the outside of circumference of pick up.
Samsung Electronics 3-7
Circuit description
3-2-3 ATAPI interface circuit description(IC501 : TC9492F)
3-2-3(A) ATAPI
ATAPI is interface specification to add SCSI paket command to the interface of HDD and support DVD-ROM drive as
abbreviation of AT ATTACHMENT PACKET INTERFACE.
3-2-3(B) Interface operation introduction
Micom judges the command type, controls SERVO IC, reads data from disk, sends to IC501 interface IC and transmitts
them to host at receiving a command(READ, SEEK, etc) from host(computer). Especially, in case of READ command, it
stores the data read from disk in IC502 :DRAM(V53C16258HK25) before transmission to host.
CD-ROM disk
Data are transferred to interface IC(IC501:TC9492F) though servo(IC201:TC9489F), stored in memory after
decoding and error correcting and then sent to host.
DVD-VIDEO, ROM disk
Data are transferred to interface IC501 through copy protection Servo IC(IC201:TC9489F)after error correcting in
data processor and stored in memory before transmission to host.
Figure 3-6
MICOM
Samsung Electronics3-8
Circuit description
3-2-3 ATAPI interface circuit description(IC501 : TC9492F)
For flash memory using model, the version may be changed by downloading the micom program in PC without
ROM replacement.
Utilize FROMDOS.EXE supplied separately as download program.
2-1 Samsung Electronics
2.Specifications
The specification and design may be altered without previous notice and the below weight and dimensions are approximate values.
Drive type Computer built-in
Power consumption DC +5V, 1.5A DC +12V, 1.0A(MAX)
Weight 860g
Dimension 149mm(W) X200mm(D) X 42.5mm(H)
Allowable operational temperature
+5ûC~ +45
ûC
Allowable operational humidity :
8% ~ 80%
Standard mode CD-ROM Mode 1,2
Interface ATAPI BUS (IDE)
Data transfer rate CD-ROM : 6,000Kbyte/sec, DVD-ROM :10,800Kbyte/sec
1/3 stroke Below: 110ms
ACCESS full stroke Below : 200ms
TIME 1/3 stroke Below : 130ms
full stroke Below : 230ms
Buffer capacity 512KB
Mode 1 : Below 10
-12
Error ratio Mode 1 : Below 10
-9
Below 10
-15
Frequency response 20Hz to 2KHz : Below ±3dB
Signal to noise ratio
LINE OUT over : 75dB
H/PHONE over : 65dB
Distortion factor Below 0.15%(1KHz)
Signal output level
LINE OUT : 0.7Vrms±20%
H/PHONE : 0.6Vrms±20%
Laser Semiconductor laser
General
option
Electrical
features
CD-ROM
DVD-ROM
CD-ROM
DVD-ROM
4-1 Samsung Electronics
4. Disassembly and assembly
4-1. Exterior and PCB disassembly
4-1-1 Door-tray
1) Supply power to open the tray in direction of arrow ÒAÓ
2) Lift up the door in direction of arrow ÒBÓ
3) Close the tray and power off.
Figure 4-1 Door-tray
Reference : If the tray doesn't open, push the clip into specified hole shown in detailed figure to open it
compulsorily.
4-2Samsung Electronics
4-1-2 Panel-front
1) Remove 6 hooks
2) Take out the panel-front forward.
Figure 4-2 Panel-front
4-3 Samsung Electronics
4-1-3 Top-cabinet
1) Remove 4screws in the bottom
2) Lift up the top-cabinet
Figure 4-3 Top-cabinet
Samsung Electronics 4-4
4-1-4 Ass'y-frame Low
1) Lift up the assÕy frame low
Figure 4-4 Ass'y-frame Low
4-5 Samsung Electronics
Figure 4-5 Disassembly connector
4-1-5 MAIN-PCB
1) Remove 4hooks for PCB fixing in deck.
2) Disassemble the MAIN-PCB
3) Disassemble the pick up FPC in PCB.
4) Remove soldering at motor connection wire PCB.
5) Disassemble the FPC between Main PCB and Front PCB.
6) Disassemble the FPC between Main PCB and Front PCB.
Samsung Electronics 4-6
Figure 4-6 Tray, Clamper
4-2-1 Tray, Clamper
1) Remove 4screws
2) Lift up the assÕy clanper
3) Push 2hooks
4) Lit up the tray
4-2 Deck disassembly
4-7 Samsung Electronics
Figure 4-7 AssÕy-Deck DVD
4-2-2 AssÕy-Deck DVD
1) Move the slide cam in left direction.
2) Disassemble the assÕy-deck DVD in arrow ÒBÓ direction with pushing the 2hooks in direction of arrow ÒAÓ
Samsung Electronics 4-8
Figure 4-8 Chassis-main individual materials
4-2-3 Chassis-main individual materials
1) Remove screw , and lift up the GEAR TRAY
2) Lift up the GEAR B
3) Remove screw and lift up the GEAR A , GEAR D
4) Lift up the ASSÕY OPEN LEVER
5) Lift up the SLIDE CAM
6) Remove 2screw , and remove the MOTOR ASSÕY in ÒAÓ direction
Assembling the motor and pulley: The height of pulley shall
be same as the endd of motor shaft.
4-9 Samsung Electronics
Figure 4-9 AssÕy-deck
1
2
DECK FPC
Ass'y-deck
3 Pick up FPC
4-2-4 AssÕy-deck
1) Remove 4screws
2) Lift up the AssÕy-deck
3) Remove the pick-up FPC in ÒAÓ
Samsung Electronics 4-10
Circuit description
Figure 4-10 AssÕy-deck individual materials
4-2-5 AssÕy-deck individual materials
1) Remove 4 dampers
2) Rotate 180¼the SHAFT COVER in CCW direction.
3) Remove 2screws , and remove the 2 CAMs , and lift up P/U
4) Lift up the AssÕy
5) Remove 3screws , and remove the MOTOR SPINDLE , and disassemble the DECK-FPC
6) Remove 2screws , and disassemble the STEP MOTOR
7) Remove 1screw and disassemble the spring plate
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