Samsung SCX 6220 Reference Information

Reference Information

Samsung Electronics

Service Manual

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2

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2. Reference Information

This chapter contains the tools list, list of abbreviations used in this manual, and a guide to the
location space required when installing the printer. A definition of test pages and Wireless
Network information definition is also included.

2.1 Tool for Troubleshooting

The following tools are recommended safe and easy troubleshooting as described in this service manual.

• DVM (Digital Volt Meter)

Standard : Indicates more than 3 digits.

• Driver

Standard : "-" type, "+" type (M3 long, M3 short, M2

long, M2 short).

• T weezers

Standard : For general home use, small type.

• Cotton Swab

Standard : For general home use, for medical service.

• Cleaning Equipments

Standard : An IPA(Isopropyl Alcohol) dry wipe tissue or

a gentle neutral detergent and lint-free cloth.

• Vacuum Cleaner

• Spring Hook

Standard : For general use

• Software (Driver) installation CD ROM

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2.2 Acronyms and Abbreviations

The table below explains abbreviations used in this service manual.
The contents of this service manual are declared with abbreviations in many parts. Please refer to the
table.

2.2.1 General

AC Alternating Current
ADF Automatic Document Feeder
ASIC Application Specific Integrated Circuit
ASSY assembly
BIOS Basic Input Output System
CCD Charge Coupled Device
CMOS Complementary Metal Oxide Semiconductor
CN connector
CON connector
CPM Copies Per Minute
CPU Central Processing Unit
CRU Customer Replaceable Unit
CRUM CRU Memory
dB decibel
dbA decibelampere
dBM decibel milliwatt
DADF Duplex Auto Document Feeder(=DADH)
DC direct current
DCU Diagnostic Control Unit
DPI Dot Per Inch
DRAM Dynamic Random Access Memory
DVM Digital Voltmeter
ECM Error Correction Mode
ECP Enhanced Capability Port
EEPROM Electronically Erasable Programmable Read

Only Memory
EMI Electro Magnetic Interference
EP electrophotographic
EPP Enhanced Parallel Port
FCOT First Copy Out Time
FPOT First Print Out Time
F/W firmware
GDI graphics device interface
GND ground
HBP Host Based Printing
HDD Hard Disk Drive
HV high voltage
HVPS High Voltage Power Supply
I/F interface
I/O Input and Output

IC integrated circuit
IDE Intelligent Drive electronics or Imbedded

Drive Electronics

IEEE Institute of Electrical and Electronics

Engineers. Inc
IPA Isopropy Alcohol
IPM Images Per Minute
LAN local area network
lb pound(s)
LBP Laser Beam Printer
LCD Liquid Crystal Display
LED Light Emitting Diode
LSU Laser Scanning Unit
MB Megabyte
MFP Multi-Functional Product
MHz Megahertz
MP Multi Purpose
NVRAM Nonvolatile random access memory
OPC Organic Photo Conductor
PBA Printed Board Assembly
PCL Printer Command Language , Printer Control

Language
PDL Page Discription Language
PPM Page Per Minute
PS/3 Post Script Level-3
PTL Pre-Transfer Lamp
Q’ty Quantity
RAM Random Access Memory
ROM Read Only Memory
SCF Second Cassette Feeder
SMPS Switching Mode Power Supply
SPGP Samsung Printer Graphic Processor
SPL Samsung Printer Language
Spool Simultaneous Peripheral Operation Online
SW Switch
Sync Synchronous or synchronization
TBD To Be Determined
USB Universal Serial Bus
W x D x H Width x Depth x Height

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2.2.2 Service Parts

ELA HOU-SCANNER ASS’Y ELA=Electrical Assembly, HOU =Housing
MEA UNIT-COVER PAEXITASS’Y MEA= Mechanical Assembly, PA=Paper
PMO-TRAY EXTENTION MP NE PMO= Processing Mold

MP=Multi-Purpose(Bypass) tray

NE=for NEC (common as Samsung Halk printer)
MEC-CASSETTE ASS’Y(LETTER) MEC = Mechanic Combined unit
COVER-M-FRONT M=Mold
MPR-NAME/PLATE MPR= Machinery Press,
UNIT-LSU LSU =Laser Scanning Unit
SMPS-SMPS(V1)+HVPS SMPS =Switching Mode Power Supply

HVPS =High Voltage Power Supply
ELA-OPC UNIT SET OPC=Organic Photo-Conductive
ELA HOU-MP ASS’Y MP=Multi-Purpose (Bypass) tray
PBA MAIN-MAIN PBA =Printed circuit Board Assembly
PMO-CONNECT PAPER MFP MFP =Multi-Functional Peripheral
FAN-DC DC =Direct Current
CBF POWER STITCH GRAY CBF= Cable Form
MEA UNIT GUIDE CST PAASS’Y CST=Cassette(Paper tray), PA=Paper
PBA LIU PBA =Printed circuit Board Assembly

LIU =Line Interface Unit for FAX
SHIELD-P_MAIN LOWER P=Press
CBF HARNESS-LIU GND LIU =Line Interface Unit for FAX

GND= Ground
PMO-COVER FEED AY AY=Assembly
PMO-COVER BRKT MOTER BRKT=Bracket
CBF HARNESS-LSU LSU =Laser Scanning Unit
IPR-SHIELD SMPS UPPERI IPR=Iron Press
PMO-BUSHING P/U.MP P/U=Pickup

MP=Multi-Purpose (Bypass) Tray
PMO-HOLDER GEAR TRr TR= Transfer Roller
SPRING ETC-TR_L TR_L=Transfer Roller - Left

ACRONYM EXPLANA TION

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PMO-CAM JAM REMOVE PMO-CAM= Processing Mold-CAM
PMO-LOCKER DEVE DEVE=Developer
SPECIAL SCREW(PANNEL MFP) MFP =Multi-Functional Peripheral
A/S MATERAL-DUMMY UPPER ASS’Y A/S=After-Service
MCT-GLASS ADF MCT= Machinery Cutting

ADF=Automatic Document Feeder
PPR-REGISTRATION EDGE(F) PPR= Processing Press
IPR-HOLDER GLASSI PR=Iron Press
MCT-GLASS SCANNER(LEGAL) MCT= Machinery Cutting
CBF HARNESS-OPE OPE=Operation Panel(Control Panel)
PBA SUB-D_SUB PBA SUB-D_SUB =>Sub Printed circuit Board

Assembly for the D-SUB type electrical connector

(D-Sub) a kind of the connector type(shape ‘D’)
COVER-M-CCD CABLE M=Mold

CCD=Charge Coupled Device
COVER-SCAN LOWER(UMAX) UMAX=> Supplier’s name for CCD module
ICT-INSERT SHAFTI ICT= Iron Cutting
IPR-BRK SCAN BD IPR=Iron Press

BRK=Bracket

BD= Board
CBF SIGNAL-CCD FFC CCD = Charge Coupled Device

FFC =Flexible Flat Cable
COVER-M-OPE M=Mold

OPE=Operation Panel(Control Panel)
KEY -M-COPY M=Mold
PLA TE-M-ALPHAKEY M=Molde

ALPHA=Alphabet
PMO-GUIDE DP SIDE DP=Duplex
RING-CS CS= Compress
GEAR-MP/DUP DRV MP =Multi-Purpose (Bypass) tray

DUP DRV = Duplex Driver
IPR-BRKT G DUPI PR=Iron Press

BRKT=BRACKET

G= Ground

DUP=Duplex
PMO-BUSHING TX(B4) TX=Transmit
PMO-TRAY CASE, MP MP=Multi-Purpose tray(Bypass tray)

ACRONYM EXPLANA TION

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SPRING CS RE CS=Compress

RE=Rear

SPRING CS FR CS=Compress

FR=Front
PMO-BUSHING FINGER, F F=Front
ICT-SHAFT-EXIT LOWER ID ID=Idler
SPRING-EXIT ROLL FD FD=Face Down
PMO-BUSHING_P/U,MP P/U=Pickup

MP =Multi-Purpose (Bypass) tray
PMO-HOLDER CAM MPF MPF=Multi-Purpose Feeder(=MP)
PMO-GEAR P/U MPF P/U=Pickup
MFP =Multi-Functional Peripheral
RPR-RUBBER PICK UP,MP RPR=Rubber Press
PBA SUB-MP SEN PBA SUB-MP-SEN =>Sub Printed circuit Board

Assembly for the MP-SEN(= Multi-Purpose (Bypass)

tray-Sensor)
A/S MATERAL-PICKUP,MP
FOOT-ML80
HOLDER CATCH CST MC2 MC2=>McKInley2 (Samsung Project code name)
IPR-GROUND PLATE A(OPC) OPC=Organic Photo-Conductive
ELA M/M-AUD SPEAKER ELA M/M => Electrical Assembly M/M

AUD=Audio
CBF HARNESS-OPC GND OPC GNG=Organic Photo-Conductive-Ground
IPR-GROUND PLATE SCF SCF=Second Cassette Feeder(Tray2)
PBA SUB-PTL PBA SUB-PTL=>Sub Printed circuit Board Assembly

for the PTL(= Pre Transfer Lamp)
PBA SUB-FEED+P.EMP SEN. PBA SUB-FEED=>Sub Printed circuit Board

Assembly for the feeder

EMP SEN=Empty Sensor
MOTOR STEP-MCK2(MAIN)
GEAR-EXIT/U EXIT/U=EXIT/Upper
GEAR-RDCN FEED INNER RDCN=Reduction
CBF-HARNESS-MAIN-THV WIRE THV =Transfer High Voltage
CBF-HARNESS-MAIN-MHV WIRE MHV= High Voltage(Charge Voltage)

ACRONYM EXPLANA TION

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GEAR-EXIT/U,ID U=Upper

ID=Idler
IPR-TERMINAL FU FU=Fuser
PMO-BEARING H/R-F H/R-F=Heat Roller - Front
BEARING-H/R L H/R-L=Heat Roller -Left
PEX-ROLLER EXIT F_UP PEX= Processing Extrude

F_UP=Face Up
SPRING ETC-P/R P/R=Pressure Roller
SPRING(R)-CAU-HOT-FU CAU-HOT-FU = Caution Hot -Fuser
PMO-ARM ACTUATOR PMO-ARM= Processing Mold Arm
LABEL(R)-HV FUSER HV=High Voltage (220V)
LABEL(R)-LV FUSER LV=Low Voltage (110V)
PPR-SPONG SHEET PPR=Plastic Press
IPR-P_PINCH(SCAN)I PR-P = Iron Press
ROLLER-REGI REGI=Registration
PBA SUB-REGI PBA SUB-REGI => Sub Printed circuit Board

Assembly for the Registration
GROUND-P_SCAN ROLLER GROUND-P =Ground-Press
IPR-GUARD C/O S/W C/O = Cover Open

S/W= Switch
MEA UNIT-TX STACKER TX =Transmit
IPR-WASHER SPRING CU CU=Curve

ACRONYM EXPLANA TION

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2.3 The Sample Pattern for the Test

The sample pattern shown in below is the standard pattern used in the factory.
The life of the toner cartridge and the printing speed are measured using the pattern shown below.
(The image is 70% of the actual A4 size).

2.3.1 A4 5% Pattern

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2.3.2 A4 2% Pattern

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2.3.3 A4 ISO 19752 Standard Pattern

This test page is reproduced at 70% of the normal A4 size

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2.4 Wireless LAN

• This product uses a printing function with a wireless LAN, which is an option.

- The wireless LAN function uses a frequency instead of connecting LAN cable to connect data to
an access point for print.

- For a wireless LAN connection, an AP is needed, It is possible to use wireless LAN onnection with
wired LAN. Also, if AP is installed in an office or at home, the wireless LAN function can be simply
used.

• Types of desk top PC (or Lap top) that uses the wireless LAN.

• About the certificated mark of Wi-Fi

TM

- The Wi-FiTMis a registered trademark of WECA (Wireless Ethernet
Compatibility Alliance). Over 50 of a wireless LAN companies are member
of it. The most of main wireless networking companies are attending and
the main companies are Lucent technologies, Cisco, Intel/Symbol, 3Com,
Enterasys (Cabletron), Compaq, IBM, Nokia, Dell, Philips, Samsung elec­tronic, Sony, Intersil, and so on. This mark certifies mutual compatibility
among product has Wi-FiTM(IEEE 802.1) and it is certified as a standard of
a wireless LAN market.

Division Basic type Recommend type

CPU Over PENTIUM 233M PENTIUM 300MHz
MEMORY Over 64MB Over 128MB
VIDEO CARD Over 800X600 Over 1024X768
OS Over WINDOWS 98 Over WINDOWS ME
INTERFACE CARD A product has a certificated mark of Wi-Fi

TM