Samsung S5750E, S5753 Service Manual

GSM TELEPHONE

GT-S5750E/S5753E Common

efrcom

GSM TELEPHONE

CONTENTS

Safety Precautions

1.

Specification

2.

Product Function

3.

Exploded View and Parts list

4.

MAIN Electrical Parts List

5.

Level1Repair

6.

Disassembly and Assembly

7. Instructions

Chart of Troubleshooting

8.

Reference data

9.

Notice All functionality, features, specifications and other product information provided in this document inclu ding, but not limited to, the benefits, design, pricing, components, performance, availability, and capabiliti

es of the product are subject to change without

-

notice or obligation. Samsung reserves the right to make changes to this document and the product described herein, at anytime, without obligation on Samsung to provide notification of such change.

:

GSPN(Global Service Partner Network)

Country Web Site

North America service.samsungportal.com

Latin America latin.samsungportal.com

CIS cis.samsungportal.com

Europe europe.samsungportal.com

China china.samsungportal.com

Asia asia.samsungportal.com

Mideast&Africa mea.samsungportal.com

This Service Manual isaproperty of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

Samsung Electronics Co.,Ltd.

ⓒ

2010. 10.

Rev.1.0

Specification

2.

GSM General Specification

2-1.

GSM850

Phase 1

Freq.

Band[MHz]

Uplink/Downlin

k

ARFCN range 128~251

Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz 190MHz 45MHz

Mod. Bit rate/

Bit Period

Time Slot

Period/Frame

Period

824~849 869~894

270.833kbp s

3.692us

576.9us

4.615ms

EGSM 900

Phase 2

880~915 925~960

0~124 &

975~1023

270.833kbp s

3.692us

576.9us

4.615ms

DCS1800

Phase 1

1710~1785 1805~1880

512~885 512~810

270.833kbp s

3.692us

576.9us

4.615ms

PCS1900

1850~1910 1930~1990

270.833kbp s

3.692us

576.9us

4.615ms

WCDMA

2100

1922~1977 2112~2167

UL:9612~98 88DL:10562

~10838

3.84Mcps 3.84Mcps

FrameLengt

h:

10ms

Slotlength:

0.667ms

WCDMA900

880~915 925~960

UL:2712~28

63,DL:2937

~3088

FrameLengt

h:

10ms

Slotlength:

0.667ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power

Power Class

Se

nsitivity

TDMA Mux 8 8 8 8

Cell Radius 35Km 35Km 2Km 2Km 2Km 2Km

33dBm~5dBm33dBm~5dBm30dBm~0dBm30dBm~0dBm24dBm~-

5pcl ~

19pcl

-102dBm -102dBm -100dBm -100dBm -106.7dBm -106.7dBm

pcl

5

~19

pcl0pcl

2-1

~15

pcl0pcl

~15

QPSKHQPSKQPSKHQPS

24dBm~-

pcl

50dBm

max+24dB

3(

m)

8

50dBm

max+24dB

3(

K

m)

8

Specification

GSM Tx Power Class

2-2.

TX Power

control

GSM850

level

533±2

631±2

729±2

827±2

925±2

10 23±2

11 21±2

12 19±2

dBm

TX Power

control

EGSM900

level

533±2

631±2

729±2

827±2

925±2

10 23±2

11 21±2

12 19±2

dBm

TX Power

control

DCS1800

level

030±3

128±3

226±3

324±3

422±3

520±3

618±3

716±3

dBm

TX Power

control

PCS1900

level

030±3

128±3

226±3

324±3

422±3

520±3

618±3

716±3

dBm

13 17±2

14 15±2

15 13±2

16 11±3

17 9±3

18 7±3

19 5±3

dBm

13 17±2

14 15±2

15 13±2

16 11±3

17 9±3

18 7±3

19 5±3

dBm

2-2

814±3

912±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

15 0±5

dBm

814±3

912±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

15 0±5

dBm

Operation Instruction and Installation

3.

Main Function

l Bada

l HSDPA

l EDGE Quad Band(D/L only)

l

3.2’’

l

3M

l Wi-Fi/BT v3.0+EDR/USB v2.0

l A-GPS

l FM Radio with RDS+Rec.

l TouchWiz

l80MB internal memory/microSD(up to16G)

l

1200

OS

3.6 900(

WQVGA, TFT

FF Camera+Video Rec.

mAh standard Battery

option)/2100MHz

262K

3.0UI/

Dolfin Browser/Social Hub/DNSe

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6.

Level

Repair

1

6-1-1.

Pre-requsite for S/W Downloading

Downloader Program(

•

GT-S5750E mobilePhone

•

Data Cable

•

JIG BOX(GH99-36900A)

•

RF Test Cable(GH39-00985A)

JIG Cable(GH39-01339A)

•

Adapter(GH99-38251A)

Binary files

•

Settings

（

Flash loader

7.2.4

SEC

Connect to the computer by

USB cable

Lite And Slave

2.4

0.4

)

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Level1Repair

6-1-2.

1.

｝

S/W Downloader Program

Load the binary download program by executing the

"Downloader V5.64"

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Level1Repair

Select the

2.

BRCM2153".

"

as Control.

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Level1Repair

Select the Full Download.

3.

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Level1Repair

Load the file of Boot, Amss, Apps, Rsrc

4.

the folder that you saved the binary files.

Rsrc2, Factory FS, CSC, SHP APP from

1.

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Level1Repair

Click the

5.

Port Search

button

en the download cable is connected to PC.

wh

cf. You have to set the phone asadownload mode by pressing Volume UP

Camera+POWER key simultaneously before connecting to PC

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.

+

Then the down loader can search the port.

6.

Level1Repair

6-7

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Level1Repair

Click the

7.

Download

It will start to download.

button

en the Port searched.

wh

When downloading is finished successfully, there is

8.

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All files complete"message.

a"

Reference Abbreviate

9.

Reference Abbreviate

Advanced Audio Coding.

AAC:

―

AVC :

BER :

BPSK:

CA :

CDM :

C/I :

DMB :

EN

ES

ETSI:

MPEG:

PN :

PS :

QPSK:

RS :

SI :

TDM :

TS

Advanced Video Coding.

Bit Error Rate

Binary Phase Shift Keying

Conditional Access

Code Division Multiplexing

Carrier to Interference

Digital Multimedia Broadcasting

European Standard

:

Elementary Stream

:

European Telecommunications Standards Institute

Moving Picture Experts Group

Pseudo-random Noise

Pilot Symbol

Quadrature Phase Shift Keying

Reed-Solomon

Service Information

Time Division Multiplexing

Transport Stream

:

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Safety Precautions

1.

Repair Precaution

1-1.

Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because

―

specipicty of cellular phone is sensitive for surrounding interference(RF noise).

Be careful to useakind of magnetic object or tool, because performance of parts is damaged by

―

the influence of magnetic force.

Surely useastandard screwdriver when you disassemble this product, otherwise screw will be

―

worn away.

Useathicken twisted wire when you measure level.

―

thicken twisted wire has low resistance, therefore error of measurement is few.

A

Repair after separate Test Pack and Set because for short danger(for example an overcurrent

―

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

Take specially care of soldering, because Land of PCB is small and weak in heat.

―

Surely tune on/off while using AC power plug, becausearepair of battery charger is dangerous

―

when tuning ON/OFF PBA and Connector after disassembling charger.

Don't use as you pleases after change other material than replacement registered on SEC System.

―

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

ESD(Electrostatically Sensitive Devices) Precaution

1-2.

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

(

You can prevent from ESD damage by static electricity.

Remove static electricity remained your body before you touch semiconductor or parts with

―

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

Use earthed soldering steel when you connect or disconnect ESD.

―

Use soldering removing tool to break static electricity.,otherwise ESD will be damaged by static

―

electricity.

Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

―

aluminum plate to have conductive power,they are prevented from static electricity.

You must maintain electric contact between ESD and place due to be set up until ESD is

―

connected completely to the proper place oracircuit board.

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Exploded View and Parts List

4.

Cellular phone Exploded View

4-1.

QME03

QFR01

QLC01

QLB01

QKP01

QME01

QJK01

QAR01

QMP01

QRE01

QCR101

QMO01

QVO01

QRF06

QCA01

QSP01

QCK02

QCK01

QBC00

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Exploded View and Parts List

Cellular phone Parts list

4-2.

Design LOC Description SEC CODE

QAR01 AUDIO-RECEIVER

QCR101 SCREW-MACHINE

3009-001499

6001-002005

QJK01 KEY FPCB-EARJACK ASSY(GT_S5250) GH59-09640A

QME03 TOUCH/PANEL-GT_S5250 GH59-09672A

QSP01 MODULE-SPK+INT(GT-S5750E) GH59-10394A

QMP01 A/S ASSY-PBA MAIN(COMM) S5750E,NEE,SVC GH82-05313A

QCA01 ASSY CAMERA-MODULE,3M(GT_S5250) GH96-04935A

QLC01 ASSY LCD-3.2",WQVGA(GT-S5750E) GH96-04963A

QFR01 ASSY CASE-FRONT GH98-17542A

QBC00 ASSY COVER-BATT GH98-17544A

QKP01 ASSY KEYPAD-MAIN GH98-17546A

QLB01 ASSY BRACKET-LCD

3G

GH98-18402A

QME01 KEY FPCB-MAIN KEY PBA(GT_S5250) GH59-09658A

QRE01 ASSY CASE-REAR GH98-17543A

QMO01 MOTOR DC-GT-S5250 GH31-00503A

QRF06 PMO COVER-USB GH72-60559A

QCK01 ASSY KEY-CAM GH98-17855A

QVO01 ASSY KEY-VOL GH98-17856A

QCK02 ASSY KEY-POWER GH98-17857A

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MAIN Electrical Parts List

5.

Main

5-1.

SEC CODE DESIGN LOC DESCRIPTION

0403-001688

0404-001172

0406-001293

0407-001002

0801-002970

1001-001585

1001-001607

1001-001655

1108-000379

1201-002967

1201-003088

1201-003136

1203-006158

1203-006331

1205-003868

1205-004099

1205-004101

1205-004105

1209-001922

1404-001221

2007-000138

2007-000140

2007-000141

2007-000143

2007-000148

2007-000156

2007-000162

2007-000170

2007-000172

2007-001288

2007-001323

ZD603 DIODE-ZENER

D300,D500 DIODE-SCHOTTKY

ZD400,ZD401,ZD402 DIODE-TVS

ZD403,ZD404,ZD405 DIODE-TVS

ZD406,ZD500,ZD501 DIODE-TVS

ZD502,ZD503,ZD601 DIODE-TVS

ZD604 DIODE-TVS

D600 DIODE-ARRAY

U602 IC

U601 IC

U103 IC

U401 IC

UME200 MEMORY

PAM102 IC

PAM101 IC

PAM100 IC

U301 IC

U500 IC

U102 IC

U105 IC

U104 IC

UCP200 IC

U402 IC

VR100 THERMISTOR

R406,R503,R606 R-CHIP

R402 R-CHIP

R420,R421 R-CHIP

R500,R600,R601 R-CHIP

R118 R-CHIP

R604 R-CHIP

R114,R115,R117,R132 R-CHIP

R222,R315,R501,R605 R-CHIP

R204,R307 R-CHIP

R502 R-CHIP

R302,R303 R-CHIP

R403 R-CHIP

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MAIN Electrical Parts List

SEC CODE DESIGN LOC DESCRIPTION

2007-003014

2007-007092

2007-007132

2007-007489

2007-007981

2007-008213

2007-008401

2007-008419

2007-008806

2007-008809

2203-000233

2203-000254

2203-000278

2203-000386

2203-000438

2203-000550

2203-000627

2203-000696

2203-000812

2203-000854

2203-000995

2203-001101

2203-001124

2203-001153

2203-001385

2203-002487

2203-002709

2203-005234

2203-005450

2203-005552

R221 R-CHIP

R400 R-CHIP

R110,R131 R-CHIP

R116 R-CHIP

R113 R-CHIP

R217 R-CHIP

R218 R-CHIP

R103,R105,R106,R107 R-CHIP

R210,R213 R-CHIP

R127,R128,R129,R130 R-CHIP

R201,R202,R211 R-CHIP

C1035,C108,C193,C231 C-CERAMIC,CHIP

C1030,C1031,C1032 C-CERAMIC,CHIP

C163,C194 C-CERAMIC,CHIP

C120,C121,C122,C145 C-CERAMIC,CHIP

C148,C151,C155,C160 C-CERAMIC,CHIP

C167,C173,C183 C-CERAMIC,CHIP

C111 C-CERAMIC,CHIP

C113,C401,C402,C417 C-CERAMIC,CHIP

C305,C308 C-CERAMIC,CHIP

C154 C-CERAMIC,CHIP

C139 C-CERAMIC,CHIP

C1001,C1002,C1003 C-CERAMIC,CHIP

C1004,C197 C-CERAMIC,CHIP

C400,C404 C-CERAMIC,CHIP

C613 C-CERAMIC,CHIP

C415,C416 C-CERAMIC,CHIP

C1023 C-CERAMIC,CHIP

C1037 C-CERAMIC,CHIP

C1017,C144 C-CERAMIC,CHIP

C603 C-CERAMIC,CHIP

C1033,C128,C150,C152 C-CERAMIC,CHIP

C156,C161,C164,C232 C-CERAMIC,CHIP

C414 C-CERAMIC,CHIP

C106,C140,C147 C-CERAMIC,CHIP

C1010,C1011,C190 C-CERAMIC,CHIP

C132,C134 C-CERAMIC,CHIP

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MAIN Electrical Parts List

SEC CODE DESIGN LOC DESCRIPTION

2203-005682

2203-005729

2203-005734

2203-005792

2203-006048

2203-006141

2203-006194

2203-006260

2203-006348

2203-006399

2203-006410

2203-006423

2203-006562

2203-006642

2203-006665

2203-006681

2203-006707

2203-006824

2203-006846

2203-006872

2203-006890

2203-007270

2203-007271

2203-007279

2203-007317

2203-007391

C1028,C1029,C180 C-CERAMIC,CHIP

C177 C-CERAMIC,CHIP

C1012,C1020,C1021 C-CERAMIC,CHIP

C1022 C-CERAMIC,CHIP

C198,C199 C-CERAMIC,CHIP

C102,C103,C109,C110 C-CERAMIC,CHIP

C112,C419,C604,C607 C-CERAMIC,CHIP

C609 C-CERAMIC,CHIP

C601 C-CERAMIC,CHIP

C185,C222,C224,C236 C-CERAMIC,CHIP

C115,C116,C133 C-CERAMIC,CHIP

C300 C-CERAMIC,CHIP

C168,C169,C170,C171 C-CERAMIC,CHIP

C502,C503,C610 C-CERAMIC,CHIP

C184,C186 C-CERAMIC,CHIP

C209,C210,C212,C214 C-CERAMIC,CHIP

C215,C217,C219,C221 C-CERAMIC,CHIP

C223,C225,C228,C229 C-CERAMIC,CHIP

C235,C315,C317 C-CERAMIC,CHIP

C323,C328,C329,C330 C-CERAMIC,CHIP

C405,C407,C408,C411 C-CERAMIC,CHIP

C1026 C-CERAMIC,CHIP

C1006,C1007 C-CERAMIC,CHIP

C157,C165,C166 C-CERAMIC,CHIP

C1038 C-CERAMIC,CHIP

C303,C504 C-CERAMIC,CHIP

C1005,C189,C192,C195 C-CERAMIC,CHIP

C104,C158,C159,C162 C-CERAMIC,CHIP

C172,C174,C175,C176 C-CERAMIC,CHIP

C191,C196,C321,C322 C-CERAMIC,CHIP

C325,C326,C327 C-CERAMIC,CHIP

C312,C313 C-CERAMIC,CHIP

C606 C-CERAMIC,CHIP

C1019,C1027,C149 C-CERAMIC,CHIP

C100,C501 C-CERAMIC,CHIP

C114,C420 C-CERAMIC,CHIP

C309,C310,C311,C314 C-CERAMIC,CHIP

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MAIN Electrical Parts List

SEC CODE DESIGN LOC DESCRIPTION

2203-007393

2203-007449

2203-007687

2404-001377

2404-001506

2404-001516

2404-001572

2703-001409

2703-001708

2703-001751

2703-002170

2703-002176

2703-002203

2703-002205

2703-002207

2703-002208

2703-002269

2703-002309

2703-002313

2703-002368

2703-002608

2703-002793

2703-002907

2703-002953

2703-003485

2703-003686

2703-003698

2703-003878

2801-004551

2801-004589

2809-001351

C101,C118,C119 C-CERAMIC,CHIP

C201,C203,C208,C211 C-CERAMIC,CHIP

C213,C216,C218,C220 C-CERAMIC,CHIP

C226,C307,C316,C319 C-CERAMIC,CHIP

C320,C324,C331,C332 C-CERAMIC,CHIP

C333,C334,C335,C336 C-CERAMIC,CHIP

C337,C341,C342,C509 C-CERAMIC,CHIP

C510,C512,C600,C602 C-CERAMIC,CHIP

C500 C-CERAMIC,CHIP

C410 C-TA,CHIP

C306 C-TA,CHIP

C107,C605,C608 C-TA,CHIP

C301,C302 C-TA,CHIP

L115,L136 INDUCTOR-SMD

L105 INDUCTOR-SMD

L131 INDUCTOR-SMD

L130 INDUCTOR-SMD

L113 INDUCTOR-SMD

L109 INDUCTOR-SMD

L126 INDUCTOR-SMD

L108 INDUCTOR-SMD

L112,L114 INDUCTOR-SMD

L102,L127 INDUCTOR-SMD

L128 INDUCTOR-SMD

L408,L410 INDUCTOR-SMD

L110 INDUCTOR-SMD

L120 INDUCTOR-SMD

L117,L119 INDUCTOR-SMD

L123 INDUCTOR-SMD

L122,L124 INDUCTOR-SMD

L501 INDUCTOR-SMD

L300,L301 INDUCTOR-SMD

L103 INDUCTOR-SMD

L406 INDUCTOR-SMD

OSC300 CRYSTAL-UNIT

OSC102 CRYSTAL-UNIT

TCX100 OSCILLATOR-VCTCXO

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MAIN Electrical Parts List

SEC CODE DESIGN LOC DESCRIPTION

2809-001363

2901-001454

2904-001759

2904-001891

2904-001914

2909-001324

2910-000092

2910-000114

3003-001136

3301-001438

3301-001534

3301-001659

3301-001789

3301-001810

3301-002065

3301-002078

3404-001410

3705-001731

3708-002222

3708-002283

3709-001575

3709-001625

3711-006615

3711-006843

3711-007312

3712-001348

3722-003065

OSC101 OSCILLATOR-VCTCXO

F500,F501,F502,F503 FILTER-EMI SMD

F504,F505,F506 FILTER-EMI SMD

F105 FILTER-SAW

F100 FILTER-SAW

F101 FILTER-SAW

F104 FILTER-DUPLEXER

F102 FILTER

F103 FILTER

MIC400 MIC-CONDENSOR

L118 CORE-FERRITE BEAD

L100,L101 CORE-FERRITE BEAD

L116,L125 CORE-FERRITE BEAD

L600 CORE-FERRITE BEAD

L505 CORE-FERRITE BEAD

L400,L401,L402,L403 CORE-FERRITE BEAD

L405,L508,L509,L510 CORE-FERRITE BEAD

L511 CORE-FERRITE BEAD

L407,L409 CORE-FERRITE BEAD

TAC600,TAC601,TAC602 SWITCH-TACT

TAC603 SWITCH-TACT

RFS100 CONNECTOR-COAXIAL

SLC501 CONNECTOR-FPC/FFC/PIC

HDC400 CONNECTOR-FPC/FFC/PIC

CD300 CONNECTOR-CARD EDGE

SIM300 CONNECTOR-CARD EDGE

HDC501 CONNECTOR-HEADER

HDC500 CONNECTOR-HEADER

BTC600 CONNECTOR-HEADER

ANT100,ANT101,ANT102 CONNECTOR

ANT103,MOT600,MOT601 CONNECTOR

SPK400,SPK401 CONNECTOR

IFC600 JACK-PHONE

GH80-03320A R100 PB-SHORT-1005

GH80-03321A R223 PB-SHORT-0603

RES-Z0603-S R104,R126 RES-Z0603-SHORT-P

RES-Z1005-S R235,R300 RES-Z1005-SHORT-P

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Level

7.

Disassembly

7-1.

Repair

2

1

（

1)

Unscrew the6points.

1)

Caution

Be care of scratch and molding damage.

2

（

1)

Seperate lower part of rear using

1) decomposition tool.

Caution

Be care of scratch and molding damage.

a

Separate the LCD and Sub key Connectors

1)

3

from PBA.

Disassemble the Cam and

2)

Caution

（

Be care of damage to Connectors, Cam and

1)

phi Earjack

5

phi Earjack.

3.5

Separate the PBA ASS'Y from the FRONT

1)

4

ASS'Y.

Caution

（

Be care of scratch and molding damage.

3.

1) Be care of damage to FPCB.

2)

7-1

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Level2Repair

7.

Disassemble the9hooks. then separate

1)

5 6

Bracket from FRONT Ass'y.

7

Unlock the TSP Connector. then detach TSP

1) IC and FPCB from LCD.

Separate LCD and Subkeypad from the

2) FRONT CASE.

5

3

2

1

Caution

（

Be care of scratch and Gascketdamage.

1)

Unlock the

1)

7 8

Phi Earjack.

3.5 Unlock the Cam Connector then separate Cam

2)

module.

6

4

Phi Connector then separate

3.5

1)

2)

2

1

Caution

（

Be care of scratch and molding damage. Be care of damage to the LCD.

Unsolder Receiver FPCB and separate

1) Receiver from the PBA.

Caution

（

Be care of damage to FPCB.

1)

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This Document can not be used without Samsung's authorization

Caution

（

Be care of damage to FPCB.

1)

7-2

7-2.

Assembly

Level2Repair

7.

1

（

1)

Solder the Receiver.

1)

Caution

Be care of damage the FPCB.

Insert the

1)

2

actuator.

Insert the Cam FPCB then lock the actuator.

2)

Caution

（

Be care of damage the FPCB.

1)

phi earjack FPCB then lock the

3.5

1

2

3 4

1) Insert the TSP FPCB into the hole of front.

2) Put the TSP on the upper of the front.

Caution

（

Be care of damage the FPCB.

1)

（

1)

2)

Put the LCD on the front matching4points.

1) Insert the TSP FPCB. then attatch TSP IC.

2) Put the keypad on the front.

3)

2

Caution

Be care of damage to F-CPB and LCD. Be care of scratch and molding damage.

1

7-3

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Level2Repair

7.

5

（

Put the LCD FPCB though the hole of the

1) bracket.

Assemble the Sub Cam

2)

Caution

Be care of damage the FPCB.

1) Be care of scratch and molding damage.

2)

6

（

Put the PBA ass'y on the front ass'y.

1) Connect the LCD and Sub key connectors.

2) Push the Cam and

3)

phi earjack.

3.5

Caution

Be care of damage the FPCB.

1) Be care of scratch and molding damage.

2)

7 8

（

Be care of scratch and molding damage.

1)

Assemble the REAR upper side first.

1)

Caution

Screw6points.(1.2

1)

Caution

（

Be care of scratch and molding damage.

1)

kg/force)

7-4

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Level

8.

Block Diagram

8-1.

Repair

3

GT-S5750E Block Diagram>

<

4Gb oneNAND

D P X

Flash LED

u-USB

IF

Flash LED Driver

SD CARD

USB

Switch

2Gb SDR SDRAM

EARPHONE

8-1

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