The information in this publication has been carefully
checked and is believed to be entirely accurate at
the time of publication. Samsung assumes no
responsibility, however, for possible errors or
omissions, or for any consequences resulting from
the use of the information contained herein.
Samsung reserves the right to make changes in its
products or product specifications with the intent to
improve function or design at any time and without
notice and is not required to update this
documentation to reflect such changes.
This publication does not convey to a purchaser of
semiconductor devices described herein any license
under the patent rights of Samsung or others.
Samsung makes no warranty, representation, or
guarantee regarding the suitability of its products for
any particular purpose, nor does Samsung assume
any liability arising out of the application or use of
any product or circuit and specifically disclaims any
and all liability, including without limitation any
consequential or incidental damages.
"Typical" parameters can and do vary in different
applications. All operating parameters, including
"Typicals" must be validated for each customer
application by the customer's technical experts.
Samsung products are not designed, intended, or
authorized for use as components in systems
intended for surgical implant into the body, for other
applications intended to support or sustain life, or for
any other application in which the failure of the
Samsung product could create a situation where
personal injury or death may occur.
Should the Buyer purchase or use a Samsung
product for any such unintended or unauthorized
application, the Buyer shall indemnify and hold
Samsung and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all
claims, costs, damages, expenses, and reasonable
attorney fees arising out of, either directly or
indirectly, any claim of personal injury or death that
may be associated with such unintended or
unauthorized use, even if such claim alleges that
Samsung was negligent regarding the design or
manufacture of said product.
any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior
written consent of Samsung Electronics.
Samsung Electronics' microcontroller business has been awarded full ISO-14001
certification (BSI Certificate No. FM24653). All semiconductor products are
designed and manufactured in accordance with the highest quality standards and
objectives.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Dong, Giheung-Gu,
Yongin-City, Gyunggi-Do, Korea
C.P.O. Box #37, Korea 446-711
Chapter 1, "Product Overview," is a high-level introduction to
as detailed information about individual pin characteristics and pin circuit types.
Chapter 2, "Address Spaces," describes program and data memory spaces, the internal register file, and register
addressing. Chapter 2 also describes working register addressing, as well as system stack and user-defined stack
operations.
Chapter 3, "Addressing Modes," contains detailed descriptions of the addressing modes that are supported by the
S3C8-series CPU.
Chapter 4, "Control Registers," contains overview tables for all mapped system and peripheral control register
values, as well as detailed one-page descriptions in a standardized format. You can use these easy-to-read,
alphabetically organized, register descriptions as a quick-reference source when writing programs.
Part II Hardware Descriptions
Chapter 4 Control Registers
Chapter 5 Interrupt Structure
Chapter 6 Instruction Set
S3F80JB with general product descriptions, as well
Chapter 5, "Interrupt Structure," describes the
additional information presented in the individual hardware module descriptions in Part II.
Chapter 6, "Instruction Set," describes the features and conventions of the instruction set used for all S3F8-series
microcontrollers. Several summary tables are presented for orientation and reference. Detailed descriptions of
each instruction are presented in a standard format. Each instruction description includes one or more practical
examples of how to use the instruction when writing an application program.
A basic familiarity with the information in Part I will help you to understand the hardware module descriptions in
Part II. If you are not yet familiar with the S3F8-series microcontroller family and are reading this manual for the
first time, we recommend that you first read Chapters 1–3 carefully. Then, briefly look over the detailed information
in Chapters 4, 5, an d 6. La t er , y ou c a n reference the in f o rm ation in Part I as nece s sary.
Part II "hardware Descriptions," has detailed information about specific hardware components of the
microcontroller. Also included in Part II are electrical, mechanical, MTP, and development tools data. It has 14
chapters:
Two order forms are included at the back of this manual to facilitate customer order for
the Flash Factor Writing Order Form. You can photocopy these forms, fill them out, and then forward them to your
local Samsung Sales Representative.
S3F80JB interrupt structure in detail and further prepares you for
Hard Lock Protection............ ......................................................................................................................15-18
15-7 Sector Configurations in User Program Mode ..........................................................15-8
15-8 Sector Erase Flowchart in User Program Mode................................................... .....15-9
15-9 Byte Program Flowchart in a User Program Mode....................................................15-13
15-10 Program Flowchart in a User Program Mode............................................................15-14
16-1 Low Voltage Detect (LVD) Block Diagram······················································· ·········16-2
16-2 Low Voltage Detect Control Register (LVDCON)······················································16-3
17-1 Typical Low-Side Driver (Sink) Characteristics (P3.1 only)·······································17-5
17-2 Typical Low-Side Driver (Sink) Characteristics (P3.0 and P2.0-2.3)······· ··················17-5
17-3 Typical Low-Side Driver (Sink) Characteristics
(Port0, Port1, P2.4-2.7, P3.4-P3.5 and Port4)··························································17-6
17-4 Typical High-Side Driver (Source) Characteristics (P3.1 only)··································17-6
17-5 Typical High-Side Driver (Source) Characteristics (P3.0 and P2.0-2.3)····················17-7
17-6 Typical High-Side Driver (Source) Characteristics
(Port0, Port1, P2.4-2.7, P3.4-P3.5 and Port4)··························································17-7
17-7 Stop Mode Release Timing When Initiated by an External Interrupt····················· ····17-8
17-8 Stop Mode Release Timing When Initiated by a Reset·············································17-8
17-9 Stop Mode Release Timing When Initiated by a LVD···············································17-9
17-10 Input Timing for External Interrupts (Port 0 and Port 2)············································17-10
17-11 Input Timing for Reset (nRESET Pin)·······································································17-10
17-12 Operating Voltage Range of S3F80J9······································································ 17-13
xii S3F80JB MICROCONTROLLER
List of Figures (Continued)
Figure Title Page
Number Number
18-1 Typical Low-Side Driver (Sink) Characteristics (P3.1 only)··································· ····18-5
18-2 Typical Low-Side Driver (Sink) Characteristics (P3.0 and P2.0-2.3)·························18-5
18-3 Typical Low-Side Driver (Sink) Characteristics
(Port0, Port1, P2.4-2.7, P3.4-P3.5 and Port4)········· ·················································18-6
18-4 Typical High-Side Driver (Source) Characteristics (P3.1 only)··································18-6
18-5 Typical High-Side Driver (Source) Characteristics (P3.0 and P2.0-2.3)····················18-7
18-6 Typical High-Side Driver (Source) Characteristics
(Port0, Port1, P2.4-2.7, P3.4-P3.5 and Port4)········· ·················································18-7
18-7 Stop Mode Release Timing When Initiated by an External Interrupt·························18-8
18-8 Stop Mode Release Timing When Initiated by a Reset·············································18-8
18-9 Stop Mode Release Timing When Initiated by a LVD···············································18-9
18-10 Input Timing for External Interrupts (Port 0 and Port 2)············································18-10
18-11 Input Timing for Reset (nRESET Pin)·······································································18-10
18-12 Operating Voltage Range of S3F80JB·····································································18-13
17-10 AC Electrical Characteristics for Internal Flash ROM......................... ......... ..... .... .....17-13
18-1 Absolute Maximum Ratings ······················································································18-2
18-2 D.C. Electrical Characteristics··················································································18-2
18-3 Characteristics of Low Voltage Detect Circuit···························································18-4
18-4 Data Retention Supply Voltage in Stop Mode········································· ···· ·········· ····18-4
18-5 Input/Output Capacitance·························································································18-9
18-6 A.C. Electrical Characteristics ··················································································18-9
18-7 Comparator Electrical Characteristics·······································································18-11
18-8 Oscillation Characteristics ························································································18-11
18-9 Oscillation Stabilization Time··········································································· ·········18-12
18-10 AC Electrical Characteristics for Internal Flash ROM··············································18-13
20-1 Components Consisting of S3F80JB Target Board ··················································20-3
20-2 Default Setting of the Jumper in S3F80JB Target Board··········································20-4
xvi S3F80JB MICROCONTROLLER
List of Programming Tips
Description Page
Number
Chapter 2 Address Spaces
Setting the Register Pointers......................................................................... .............................................2-11
Using the RPs to Calculate the Sum of a Series of Registers............................................................. ........2-12
Addressing the Common Working Register Area.......................................................................... .............2-16
Standard Stack Operations Using PUSH and POP....................................................................................2-21
Chapter 8 Reset
To Enter STOP Mode.................................................................................................................................8-10
Chapter 10 Basic Timer and Timer 0
Configuring the Basic Timer.......................................................................... .............................................10-11
Hard Lock Protection............ ......................................................................................................................15-18
S3F80JB MICROCONTROLLER xvii
List of Register Descriptions
Register Full Register Name Page
Identifier Number
BTCON Basic Timer Control Register....................................................................................4-5
CACON Counter A Control Register ....................... ......... ..... .... ..... ......... .... ..... .... ......... ..... ....4-6
CLKCON System Clock Control Register...................... ...........................................................4-7
Samsung's S3C8/S3F8-series of 8-bit single-chip CM OS mi crocon trollers offers a fast and efficient CPU, a wide
range of integrated peripherals, and various flash memory ROM sizes. Important CPU features include :
— Efficient register-oriented architecture
— Selectable CPU clock sources
— Idle and Stop power-down mode release by interrupts
— Bu ilt-in basic timer with watchdog function
A sophisticated interrupt structure recognizes up to eight interrupt levels. Each level can have one or more
interrupt sources and vectors. Fast interrupt processing (wit hin a minimum four CPU clocks) can be assigned to
specific interrupt levels.
S3F80JB MICROCONTROLLER
The S3F80JB single-chip CMOS microcontroller is fabricated usin g a highly advanced CMOS process and is
based on Samsung's newest CPU architecture.
The S3F80JB is the microcontroller which has 64-Kbyte Flash Memory ROM.
Using a proven modular design approach, Samsung engineers developed S3F80JB by integrating the following
peripheral modules with the powerful SAM8 RC core:
— Internal LVD circuit and 16 bit-programmable pins for external interrupts.
— One 8-bit basic timer for oscillation stabilization and watchdog function (system reset).
— One 8-bit Timer/counter with three oper at ing modes.
— Two 16-bit timer/counters with selectable operating modes.
— 4-bit analog voltage comparator with four/three channels (internal/extern al re ference).
— One 8-bit counter with auto-reload function and one-shot or repeat cont rol.
The S3F80JB is a versatile general-purpose microcont rol ler, which is especially suitable for use as remote
transmitter controller. It is currently av ailable in a 32-pin SOP and 44-pin QFP package.
1-1
PRODUCT OVERVIEW S3F80JB
FEATURES
CPU
• SAM8 RC CPU core
Memory
• Program memory:
- 64-Kbyte Internal Flash Memory
- Sector size: 128Bytes
- 10years data retention
- Fast Programming Time: Sector Erase: 10ms
Byte Program: 32us
- Byte Programmable
- User programmable by ‘LDC’ instruction
- Sector (128-bytes) Erase available
- External serial programming support
- Endurance: 10,000 Erase/Program cycles
- Expandable OBPTM (On Board Program)
• Data memory: 272-byte general purpose RAM
Instruction Set
• 7 8 in stru ctions
• I DLE and STOP instructions added for power-
down modes
Instruction Execution Time
• 500 ns at 8-MHz f
(minimum)
OSC
Interrupts
• 24 interrupt sources with 18 vectors
and 8 levels.
I/O Ports
• Fou r 8- bit I / O p orts (P0–P2 , P4) and 6-bit port
(P3) for a total of 38 bit-programmable p i ns.
(44-QFP)
• Fo ur 8 -bit I/O ports (P0–P2 , P4) and 4-bit port
(P3) for a total of 36 bit-programmable p i ns.
(42-SDIP)
• Th ree 8-bit I/O ports (P0–P2) and one 2-bit I / O
port (P3) for a total of 26-bit prog ramma ble pins.
(32-SOP)
Carrier Frequency Generator
• One 8-bit counter with auto-reload function and
one-shot or repeat control (Counter A)
Basic Timer and Timer/Counters
• One programmable 8-bit basic timer (BT) for
oscillation stabilization control or watchdog timer
(software reset) function
• One 8-bit timer/counter (Timer 0) with three
operating modes: Interval mode, Capture and
PWM mode.
• One 16-bit timer/counter (Timer1) with two
operating modes: Interval and Cap tu re mo de.
• One 16-bit timer/counter (Timer2) with two
operating modes: Interval and Cap tu re mo de.
Back-up Mode
• When V
is lower than V
DD
, the chip enters
LVD
Back-up mode to block oscillation and reduce the
current consumption.
In S3F80JB, this function is disabled when
operating state is “STOP mode”.
• When reset pin is lower than Input Low Voltage
), the chip enters Back-up mode to block
(V
IL
oscillation and reduce the current consumption.
Analog Voltage Comparator
•4-bit resolution: 16-step variable reference
voltage, 150mV Input Voltage Accuracy (worst
case)
•4-channel mode: CIN0-3, Internal refe ren ce
voltage generator
•3-channel mode: CIN0-2, External reference
voltage source (CIN3) supply
Low Voltage Detect Circuit
• L ow v oltage detect to get into Back-up mode and
Reset
2.15V (Typ) ± 200mV at 8MHz
1.90V (Typ) ± 200mV at 4MHz
•Low voltage detect to control LVD_Flag bit
2.30V (Typ) ± 200mV at 8MHz
2.15V (Typ) ± 200mV at 4MHz
Operating Temperature Range
• –25
°
C to + 85 °C
Operating Voltage Range
• 1.95V to 3.6V at 8MHz
Package Types
• 32-pin SOP
• 44-pin QFP
1-2
S3F80JB PRODUCT OVERVIEW
BLOCK DIAGRAM (32-PIN PACKAGE)
P0.0-0.3 (INT0-INT3)
P0.4-P0.7(INT4)
P1.0-1.7
Port0Port1
V
DD
X
IN
X
OUT
LVD
IPOR(note)
Main
OSC
8-Bit
Basic
Timer
8-Bit
Timer0
/Counter
16-Bit
Timer1
/Counter
16-Bit
Timer2
/Counter
I/O Port and Interrupt
SAM8RC CPU
64K-byte
FLASH
Memory
Comparator
Control
272-byte
Register File
Carrier Generator
(Counter A)
TEST
nRESET
Port2
Port3
P2.0-2.3
(INT5-INT8)
P2.4-2.7
(INT9)
(CIN0-CIN3)
P3.0/T0PWM/T0CAP/
SDAT/T1CAP/T2CAP
P3.1/REM/T0CK/SCLK
Figure 1-1. Block Diagram (32-pin)
NOTE
IPOR can be enabled or disabled by IPOR / LVD control bit in the smart option. (Refer to Figure 2-2)
1-3
PRODUCT OVERVIEW S3F80JB
BLOCK DIAGRAM (44-PIN PACKAGE)
P0.0-0.3 (INT0-INT3)
P0.4-P0.7(INT4)
P1.0-1.7
Port0Port1
V
DD
X
IN
X
OUT
LVD
IPOR(note)
Main
OSC
8-Bit
Basic
Timer
8-Bit
Timer0
/Counter
16-Bit
Timer1
/Counter
16-Bit
Timer2
/Counter
I/O Port and Interrupt
SAM8RC CPU
64K-byte
FLASH
Memory
Comparator
Control
272-byte
Register File
Carrier Generator
(Counter A)
TEST
nRESET
Port2
Port3
Port4
P2.0-2.3
(INT5-INT8)
P2.4-2.7
(INT9)
(CIN0-CIN3)
P3.0/T0PWM/T0CAP/SDAT
P3.1/REM/SCLK
P3.2/T0CK
P3.3/T1CAP/T2CAP
P3.4-P3.5
P4.0-P4.7
Figure 1-2. Block Diagram (44-pin)
NOTE
IPOR can be enabled or disabled by IPOR / LVD control bit in the smart option. (Refer to Figure 2-2)
I/O I/O port with bit-programmable pins. Configurable
to input or push-pull output mode. Pull-up resistors
Pin Description Circuit
Type
1 17–24 Ext. INT
32 Pin
No.
Functions
(INT0–INT3)
are assignable by software. Pins can be assigned
individually as external interrupt inp ut s wi th noi se
filters, interrupt enable/ disable, and interrupt
pending control. SED&R (note) circuit built in P0
for STOP releasing.
I/O I/O port with bit-programmable pins. Configurable
2 9–16 –
to input mode or output mode. Pin circuits are
either push-pull or n-channel open-drain type.
I/O I/O port with bit-programmable pins. Configurable
to input or push-pull output mode. Pull-up resistors
1
25–28
29,5,6,8
(INT5–INT8)
can be assigned by software. Pins can be
assigned individually as external inte rru pt inputs
(CIN0-CIN3)
with noise filters, interrupt enable/disa ble , a nd
interrupt pending control. SED & R (note) circu it
built in P2-P2.7 for STOP releasing. Also P2.4P2.7 can be assigned individually as analog input
pins for Comparator.
I/O I/O port with bit-programmable pin. Configurable to
3 30 T0PWM/T0CAP
input mode, push-pull output mode, or n-channel
open-drain output mode. Input mode wit h a pu ll- up
resistor can be assigned by software.
This port 3 pin has high current drive capability.
Also P3.0 can be assigned individually as an
output pin for T0PWM or input pin for T0CAP.
In the tool mode, P3.0 is assigned as serial MTP
interface pin; SDAT
I/O I/O port with bit-programmable pin. Configurable to
4 31 REM
input mode, push-pull output mode, or n-channel
open-drain output mode. Input mode wit h a p ull- up
resistor can be assigned by software.
This port 3 pin has high current drive capability .
Also P3.1 can be assigned individually as an
output pin for REM.
In the tool mode, P3.1 is assigned as serial MTP
interface pin; SCLK
– System clock input and output pins – 2,3 –
I System reset signal input pin and back-up mode
6 7 –
input.
I Test signal input pin
(for factory use only; must be connected to V
–
Power supply input pin
–
Ground pin
SS
).
– 4 –
– 32 –
– 1 –
Shared
(INT4)
Ext. INT
(INT9)
(SDAT)
(SCLK)
1-7
PRODUCT OVERVIEW S3F80JB
Table 1-2. Pin Descriptions of 44-QFP
Pin
Names
Pin
Type
Pin Description Circuit
P0.0–P0.7 I/O I/O port with bit-programmable pins.
Configurable to input or push-pull output
mode. Pull-up resistors can be assigned
by software. Pins can be assigned
individually as external interrupt inputs
with noise filters, interrupt enable/
disable, and interrupt pending control.
SED & R(note)circuit built in P0 for STOP
releasing.
P1.0–P1.7 I/O I/O port with bit-programmable pins.
Configurable to input mode or output
mode. Pin circuits are either push-pull or
n-channel open-drain type.
P2.0–P2.3
P2.4–P2.7
I/O I/O port with bit- pro gra mmable pins.
Configurable to input or push-pull output
mode. Pull-up resistors can be assigned
by software. Pins can be assigned
individually as external interrupt inputs
with noise filters, interrupt enable/
disable, and interrupt pending control.
SED & R(note) circuit built in P2.4-P2.7
for STOP releasing. Also P2.4-P2.7 can
be assigned individually as analog input
pins for Comparator.
P3.0 I/O I/O port with bit- pro gra mmab le pin.
Configurable to input mode, push-pull
output mode, or n-channel open-drai n
output mode. Input mode with a pull-up
resistor can be assigned by software.
This port 3pin has high current drive
capability. Also P3.0 can be assigned
individually as an output pin for T0PWM
or input pin for T0CAP.
In the tool mode, P3.0 is assigned as
serial MTP interface pin; SDAT
Type
44 Pin
No.
Shared
Functions
1 30–37 Ext. INT
(INT0–INT3)
(INT4)
2 16
–
20–26
1
42–44
1, 2,
10,11,
15
Ext. INT
(INT5–INT8)
(INT9)
(CIN0-CIN3)
3 3 T0PWM/T0CAP
(SDAT)
NOTE: SED & R means “STOP Error Detect & Recovery”. The Stop Error Detect & Recovery Circuit is used to release stop
mode and prevent abnormal-stop mode. Refer to page 8-11.
1-8
S3F80JB PRODUCT OVERVIEW
Table 1-2. Pin Descriptions of 44-QFP (Continued)
Pin
Names
P3.1
Pin
Pin Description Circuit
Type
I/O I/O port with bit-prog rammable pin. Configurable to
input mode, push-pull output mode, or n-channel
44 Pin
Type
No.
4 4 REM
open-drain output mode. Input mode with a pull-up
resistor can be assigned by software.
This port 3pin has high current drive capability.
Also P3.1 can be assigned individually as an
output pin for REM.
In the tool mode, P3.1 is assigned as serial MTP
interface pin; SCLK
P3.2–P3.3 I C-MOS Input port with a pull-up resistor 5 17
18
P3.4–P3.5 I/O I/O port with bit-programmable pins. Configurable
2 13–14 –
to input mode or output mode. Pin circuits are
either push-pull or n-channel open-drain type. Pullup resistors can be assigned by software.
P4.0–P4.7 I/O I/O port with bit-programmable pins. Configurable
to input mode or output mode. Pin circuits are
either push-pull or n-channel open-drain type.
X
OUT
, XIN
– System clock input and output pins – 7,8 –
nRESET I System reset signal input pin and back-up mode
2 38–41
27–29
19
6 12 –
input.
TEST I Test signal input pin
(for factory use only; must be connected to V
VDD
– Power supply input pin – 5 –
SS
.)
_ 9 _
Shared
Functions
(SCLK)
(T0CK)
(T1CAP/T2CAP)
–
VSS
– Ground pin – 6 –
1-9
PRODUCT OVERVIEW S3F80JB
PIN CIRCUITS
V
DD
Pull-Up
Resistor
Ω
- typ)
Pull-up
Enable
Data
Output Disable
V
DD
(55k
INPUT/OUTPUT
P2.4-P2.7 Only
External
Interrupt
Stop
V
SS
P2CONx.x
CMPSEL.0-.3
External REF (P2.7 only)
+
MUX
-
Comparator
REF
Noise
Filter
Stop
Release
Figure 1-5. Pin Circuit Type 1 (Port 0 and Port2)
1-10
S3F80JB PRODUCT OVERVIEW
PIN CIRCUITS (Continued)
V
DD
Pull-up
Resistor
(55k
Ω
-Typ)
Pull-up
Enable
V
DD
Data
INPUT/OUTPU T
Open-Drain
Output Disable
V
SS
Normal
Input
Noise
Filter
Figure 1-6. Pin Circuit Type 2 (Port 1, Port4, P3.4 and P3.5)
1-11
PRODUCT OVERVIEW S3F80JB
PIN CIRCUITS (Continued)
V
DD
Pull-up
Resistor
(55k
Ω
Pull-up
Enable
P3CON.2
V
DD
-Typ)
Port 3.0 Data
T0_PWM
Open-Drain
Output Disable
P3.0 Input
T0CAP/(T1CAP/T2CAP)
M
U
X
P3CON.2,6,7
M
U
X
Data
Noise filter
P3.0/T0PWM T0CAP/
(T1CAP/T2CAP)
V
SS
Figure 1-7. Pin Circuit Type 3 (P3.0)
1-12
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1 point = 1 manual.
You can buy points or you can get point for every manual you upload.