Samsung MZILT960HAHQ-00007 User Manual

PM1643 2.5" SAS 12Gb/s SSD

(NAND based Solid State Drive)

SAMSUNG CONFIDENTIAL

Rev. 1.0, Jun. 2018

MZILT960HAHQ-00007 MZILT1T9HAJQ-00007 MZILT3T8HALS-00007 MZILT7T6HMLA-00007 MZILT15THMLA-00007 MZILT30THMLA-00007

datasheet

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All brand names, trademarks and registered trademarks belong to their respective owners.

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS.

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SAMSUNG CONFIDENTIAL

MZILT960HAHQ-00007 MZILT1T9HAJQ-00007 MZILT3T8HALS-00007

MZILT7T6HMLA-00007 MZILT15THMLA-00007 MZILT30THMLA-00007

datasheet

Rev. 1.0

SSD

Revision History

Revision No History Draft Date Remark Edited by Reviewed by

1.0 1. Final Release Jun.28th, 2018 Final H.I. Choi J.H. Park

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MZILT960HAHQ-00007 MZILT1T9HAJQ-00007 MZILT3T8HALS-00007

MZILT7T6HMLA-00007 MZILT15THMLA-00007 MZILT30THMLA-00007

datasheet

PM1643/PM1645

PART NUMBER MZILT960HAHQ-00007 MZILT1T9HAJQ-00007 MZILT3T8HALS-00007

LBA

Capacity

PART NUMBER MZILT7T6HMLA-00007 MZILT15THMLA-00007 MZILT30THMLA-00007

Capacity

960GB 1.92TB 3.84TB

1,875,385,008 3,750,748,848 7,501,476,528

7.68TB 15.36TB 30.72TB

15,002,931,888 30,005,842,608 58,781,073,408

SAMSUNG CONFIDENTIAL

Rev. 1.0

SSD

FEATURES

 SAS 12 Gb/s interface  Fully complies Active-active dual port

ced Power-Loss Data Protection with Tantal capacitors

 Enhan  T

CG-compliant Self-Encryption Drive

ardware based AES 256-bit Encryption Engine

 H  End-to-End D  Support 32 Initiator with TCQ (Up to 256Q-depth) Command Set

RDY provide

 8 R  Suppo

Compliant with SCSI S pe cification (SAS-3 / SPL-3 / SBC-4 / SPC-5 / SAM-5)



 Compliant with TCG Enterprise Specification Rev. 1.01 (Optional)

 R

oHS Compliant

 Suppo

Drive Configuration

Capacity

From Factor Interface

Bytes per Sector

POWER REQUIREMENTS

Supply Voltage 5V±5%, 12V±5%

Active Idle (typical)

ata Protection

rts Tag-overlap check and reserved field check

rt T10 DIF (512B/4096B)

1.92/3.84/7.68/15.36/30.72TB

512/520/4096/4160 Bytes

(Max. RMS)

960GB

2.5"

SAS 12Gbps

13.5W 5W

Performance Specifications

Data Transfer Rate Sequential Read (128KB) (PM1643) Up to 2,100MB/s

Sequential Write (128KB) (PM1643) Up to 2,000MB/s

Data I/O Speed Random Read (4KB) (PM1643) Up to 450K IOPS

Sustained Random Write (4KB) (PM1643) Up to 70K IOPS

Latency (Sustained random workload)

Read (typical)

Write (typical) Quality of service

Read/Write (99%)

Reliability Specifications

Uncorrectable Bit Error Rate MTBF Component Design Life 5 years

Endurance 960GB

1.92/3.84/7.68/15.36/30.72TB Data loss protection

(960GB~3.84TB) 120us

(7.68TB~30.72TB) 130us

45us

(960GB~3.84TB) 180us/90us

(7.68TB~30.72TB) 190us/90us

1bit error in 10

2,000,000 hours

bits

1DWPD

Yes

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SAMSUNG CONFIDENTIAL

MZILT960HAHQ-00007 MZILT1T9HAJQ-00007 MZILT3T8HALS-00007

Environmental Specifications Physical Dimension

Temperature, Case Wi dt h 69.85 ± 0.25 mm Operating Non-operating

Humidity (non-condensing) 5 ~ 95% Weight Up to 157.5 g

MZILT7T6HMLA-00007 MZILT15THMLA-00007 MZILT30THMLA-00007

0°C to 70°C

-40°C to 85°C

datasheet

Depth 100.20 ± 0.25 mm Height 14.80 ± 0.20 mm

Rev. 1.0

SSD

Linear Shock (0.5ms duration with sine wave) Non-operating 1,500 G Vibration (20Hz to 2,000Hz, 4min/cycle, 5cycle/axis on 3axis) Non-operating 20 G Altitude (relative to sea level)

Operating -1,000 to 15,000 feet

NOTE: Design and specifications are subject to change without prior notice.

1) 1MB = 1,000,000 Bytes, 1GB = 1,000,000,000 Bytes, Unformat ted Cap acity. User accessible capacity may vary depending on operating environment and formatting.

2) 1Sector = 520bytes, LBA Count is based on the IDEMA standard.

3) Performance measured using FIO with queue depth 64. Actual performance may vary depending on use conditions and environment.

4) Performance is measured at dual port.

5) Tc is measured at the hottest point on the case . Suf ficie nt airflow is r ecommende d to be operated properly on heavier workload within device operating temperature.

6) Storing (or shipping) temperature without power connection.

7) Active power is measured using FIO

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS.

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SAMSUNG CONFIDENTIAL

MZILT960HAHQ-00007 MZILT1T9HAJQ-00007 MZILT3T8HALS-00007

1.0 INTRODUCTION ........................................................................................................................................................6

1.1 General Description................................................................................................................................................6

1.2 Product List..............................................................................................................................................................6

1.3 Ordering Information .........................................................................................................................................6

2.0 PRODUCT SPECIFICATION......................................................................................................................................7

2.1 Capacity...................................................................................................................................................................7

2.2 Performance............................................................................................................................................................7

2.3 Latency....................................................................................................................................................................8

2.4 Quality of Service (QoS)..........................................................................................................................................8

2.5 Power Consumption................................................................................................................................................8

2.6 Reliability.................................................................................................................................................................9

2.6.1 Mean Time Between Failures ...........................................................................................................................9

2.6.2 Uncorrectable Bit Error Rate............................................................................................................................9

2.6.3 Data Retention.................................................................................................................................................9

2.6.4 Endurance.................................. .................................... ... .................................... ...........................................9

2.7 Environmental Specifications ..................................................................................................................................10

2.7.1 Temperature....................................... ... .................................... ... ....................................................................10

2.7.2 Humidity.................... ... .................................... ... .................................... .........................................................11

2.7.3 Shock and Vibration.........................................................................................................................................11

3.0 MECHANICAL SPECIFICATION........................................ .. .....................................................................................12

3.1 Physical Information................................................................................................................................................12

3.2 Form Factor.............................................................................................................................................................12

4.0 INTERFACE SPECIFICATION. ..................................................................................................................................14

4.1 Connector Dimension and Pin Location..................................................................................................................14

4.2 Pin Assignments and Definition...............................................................................................................................15

5.0 SUPPORTED COMMAND SET..................................................................................................................................16

5.1 Supported SAS/SCSI Commands...........................................................................................................................16

6.0 SPOR SPECIFICATION .............................................................................................................................................18

6.1 Data Recovery in Sudden Power Off.......................................................................................................................18

6.2 Time to Ready Sequence........................................................................................................................................18

7.0 PRODUCT COMPLIANCE .........................................................................................................................................19

7.1 Product regulatory compliance and Certifications ...................................................................................................19

8.0 REFERENCES ...........................................................................................................................................................20

MZILT7T6HMLA-00007 MZILT15THMLA-00007 MZILT30THMLA-00007

datasheet

Rev. 1.0

SSD

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS.

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SAMSUNG CONFIDENTIAL

M Z X X X X X X X X X X

1 2 3 4 5 6 7 8 9 10 11 12

MZILT960HAHQ-00007 MZILT1T9HAJQ-00007 MZILT3T8HALS-00007

MZILT7T6HMLA-00007 MZILT15THMLA-00007 MZILT30THMLA-00007

datasheet

Rev. 1.0

SSD

1.0 INTRODUCTION

1.1 General Description

This document describes the specification of the PM1643 SSD which use SAS 12Gb/s interface. Supporting SAS 12Gb/s interface shows much faster performance than previous SAS 6G SSDs. PM1643 is fully consist of semiconductor As the SSD doesn't have a moving parts such as platter (disk) and head media, it gives a good solution in a Enterprise server and Storage for a storage device with a high performance, high capacity. PM1643 delivers 2,100MB/s for sequential read and 2,000MB/s for sequential write speed under up to 13 By combining the enhanced reliability Samsung NAND Flash memory silicon endurance of up to 1 Drive Writes Per Day (DWPD) for 5 years, which is suitable for enterprise applications, in 2.5-inch form factor lineups: 960GB,

B, 3.84TB, 7.68TB, 15.36TB and 30.72TB.

1.92T Because of SAS 12Gb/s interface has backward compatibil In addition, PM1643 supports Power Loss Protection any loss in the event of sudden power off or sudden power failure.

1.2 Product List

[Table 1] Product Line-up

Type Capacity Part Number

PM1643 2.5"

NOTE:

1) SFF-8680 standard connector

device and using NAND Flash Memory which has a high reliability and a high technology for a storage media.

.5W power.

with NAND Flash management technologies, PM1643 delivers the extended

ity with SAS, you can use PM1643 as 6Gbps speed at old systems for SAS 6G interface.

which can guarantee that data issued by the host system are written to the storage media without

960GB MZILT960HAHQ-00007

1.92TB MZILT1T9HAJQ-00007

3.84TB MZILT3T8HALS-00007

7.68TB MZILT7T6HMLA-00007

15.36TB MZILT15THMLA-00007

30.72TB MZILT30THMLA-00007

1.3 Ordering Information

1. Memory (M)

2. Module Classification

Z: SSD

3. Interface/ Form Factor

I: SAS 12G 2.5 inch

4. Line-Up

L: VT: Client/SV (VNAND 3bit MLC)

5. SSD CTRL

T: RFX

6~8. NAND Density

960: 960GB 7T6: 7.68TB 1T9: 1920GB 15T: 15.36TB 3T8: 3840GB 30T: 30.72TB

9. NAND PKG

H: BGA (LF,HF)

10. Flash Generation

Generation

A: 2

11~12. NAND Density

HQ: 1T QDP 4CE JQ: 2T ODP 4CE

LS: 4T HDP 2CE(FBI) LA: 8T HDP 2CE(FBI)

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