Samsung KM62256DLRG-5, KM62256DLP-7, KM62256DLP-5L, KM62256DLP-5, KM62256DLG-7L Datasheet

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KM62256D Family CMOS SRAM
Document Title
32Kx8 bit Low Power CMOS Static RAM
Revision History
Revision No
0.0
0.1
1.0
History
Initial draft
First revision
- KM62256DL/DLI ISB1 = 10050µA KM62256DL-L ISB1 = 2010µA KM62256DLI-L ISB1 = 5015µA
- CIN = 6 8pF, CIO = 810pF
- KM62256D-4/5/7 Family tOH = 510ns
- KM62256DL/DLI IDR = 50→30µA KM62256DL-L/DLI-L IDR = 3015µA
Finalize
- Remove ICC write value
- Improved operating current ICC2 = 7060mA
- Improved standby current KM62256DL/DLI ISB1 = 5030µA KM62256DL-L ISB1 = 105µA KM62256DLI-L ISB1 = 155µA
- Improved data retention current KM62256DL/DLI IDR = 305µA KM62256DL-L/DLI-L IDR = 153µA
- Remove 45ns part from commercial product and 100ns part from industrial product. Replace test load 100pF to 50pF for 55ns part
Draft Data
May 18, 1997
April 1, 1997
November 11, 1997
Design target
Preliminily
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
Revision 1.0
November 1997
KM62256D Family CMOS SRAM
32Kx8 bit Low Power CMOS Static RAM
FEATURES
Process Technology : TFT
Organization : 32Kx8
Power Supply Voltage : 4.5~5.5V
Low Data Retention Voltage : 2V(Min)
Three state output and TTL Compatible
Package Type : 28-DIP-600B, 28-SOP-450
28-TSOP1-0813.4 F/R
GENERAL DESCRIPTION
The KM62256D families are fabricated by SAMSUNG′s advanced CMOS process technology. The families support various operating temperature ranges and have various package types for user flexibility of system design. The fami­lies also support low data retention voltage for battery back­up operation with low data retention current.
PRODUCT FAMILY
Product Family Operating Temperature VCC Range Speed
(ISB1, Max)
KM62256DL KM62256DL-L 5µA KM62256DLI KM62256DLI-L 5µA
1. The parameter is tested with 50pF test load.
PIN DESCRIPTION
A14
1
A12
2
3
A7
4
A6
5
A5
6
A4
28-DIP
7
A3
28-SOP
8
A2
9
A1
10
A0
11
I/O1
12
I/O2
13
I/O3
14
VSS
Pin Name Function Pin Name Function
CS Chip Select Input I/O1~I/O8 Data Inputs/Outputs OE Output Enable Input Vcc Power WE Write Enable Input Vss Ground
A0~A14 Address Inputs NC No connect
Commercial (0~70°C)
4.5 to 5.5V
Industrial (-40~85°C) 70ns
1
OE
2
A11
3
A9
4
A8
VCC
28
27
WE
26
A13
25
A8
A9
24
A11
23
22
OE
21
A10
20
CS
19
I/O8
18
I/O7
17
I/O6
16
I/O5
15
I/O4
A13
VCC
A14 A12
A12 A14
VCC
A13
A11
WE
WE
5 6 7 8 9 10
A7
11
A6
12
A5
13
A4
14
A3
14
A3
13
A4 A5
12
A6
11
A7
10 9 8 7 6 5
A8
4
A9
3 2 1
OE
28-TSOP
Type1 - Forward
28-TSOP
Type1 - Reverse
28 27 26 25 24 23 22 21 20 19 18 17 16 15
15 16 17 18 19 20 21 22 23 24 25 26 27 28
551)/70ns
FUNCTIONAL BLOCK DIAGRAM
A10 CS I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2
A2 A1 A0 I/O1 I/O2 I/O3 VSS I/O4 I/O5 I/O6 I/O7 I/O8 CS A10
CS
WE
OE
I/O1 I/O8
A13 A8
A12 A14 A4
A5 A6 A7
Control Logic
Power Dissipation
Standby
Operating (Icc2, Max)
30µA
30µA
Clk gen.
Row select
Data cont
Data cont
28-DIP,28-SOP 28-TSOP1-F/R
60mA
28-SOP 28-TSOP1-F/R
Precharge circuit.
Memory array 256 rows 128×8 columns
I/O Circuit
Column select
A10 A3 A0 A1 A2 A11A9
PKG Type
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
Revision 1.0
November 1997
KM62256D Family CMOS SRAM
PRODUCT LIST
Commercial Temperature Products(0~70°C) Industrial Temperature Products(-40~85°C) Part Name Function Part Name Function
KM62256DLP-5 KM62256DLP-5L KM62256DLP-7 KM62256DLP-7L KM62256DLG-5 KM62256DLG-5L KM62256DLG-7 KM62256DLG-7L KM62256DLTG-5 KM62256DLTG-5L KM62256DLTG-7 KM62256DLTG-7L KM62256DLRG-5 KM62256DLRG-5L KM62256DLRG-7 KM62256DLRG-7L
FUNCTIONAL DESCRIPTION
28-DIP, 55ns, L-pwr 28-DIP, 55ns, LL-pwr 28-DIP, 70ns, L-pwr 28-DIP, 70ns, LL-pwr 28-SOP, 50ns, L-pwr 28-SOP, 50ns, LL-pwr 28-SOP, 70ns, L-pwr 28-SOP, 70ns, LL-pwr 28-TSOP1 F, 55ns, L-pwr 28-TSOP1 F, 55ns, LL-pwr 28-TSOP1 F, 70ns, L-pwr 28-TSOP1 F, 70ns, LL-pwr 28-TSOP1 R, 55ns, L-pwr 28-TSOP1 R, 55ns, LL-pwr 28-TSOP1 R, 70ns, L-pwr 28-TSOP1 R, 70ns, LL-pwr
KM62256DLGI-7 KM62256DLGI-7L KM62256DLTGI-7 KM62256DLTGI-7L KM62256DLRGI-7 KM62256DLRGI-7L
28-SOP, 70ns, L-pwr 28-SOP, 70ns, LL-pwr 28-TSOP1 F, 70ns, L-pwr 28-TSOP1 F, 70ns, LL-pwr 28-TSOP1 R, 70ns, L-pwr 28-TSOP1 R, 70ns, LL-pwr
CS OE WE I/O Mode Power
H
L H H High-Z Output Disabled Active L L H Dout Read Active L
1. X means dont care (Must be in high or low states)
1)
X
1)
X
ABSOLUTE MAXIMUM RATINGS
Item Symbol Ratings Unit Remark
Voltage on any pin relative to Vss VIN,VOUT -0.5 to 7.0 V ­Voltage on Vcc supply relative to Vss VCC -0.5 to 7.0 V ­Power Dissipation PD 1.0 W ­Storage temperature TSTG -65 to 150 °C -
Operating Temperature TA
Soldering temperature and time TSOLDER 260°C, 10sec (Lead Only) - -
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
1)
X
L Din Write Active
1)
High-Z Deselected Standby
0 to 70 °C KM62256DL
-40 to 85 °C KM62256DLI
Revision 1.0
November 1997
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