Samsung GT-S5260 Service Manual

GSM TELEPHONE

GT-S5260

GSM TELEPHONE

CONTENTS

Safety Precautions

1. Specification

2. Product Function

3. Exploded View and Parts list

4. MAIN Electrical Parts List

5. Level1Repair

6. Level2Repair

7. Level3Repair

Reference data

Notice All functionality, features, specifications and other product information provided in this document inclu ding, but not limited to, the benefits, design, pricing, components, performance, availability, and capabiliti

es of the product are subject to change without

notice or obligation. Samsung reserves the right to make changes to this document and the product described herein, at anytime, without obligation on Samsung to provide notification of such change.

This Service Manual isaproperty of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

Samsung Electronics Co.,Ltd.

ⓒ

2011. 01.

Rev.1.0

Specification

2-1.

GSM General Specification

EGSM 900 DCS1800

Freq. Band[MHz]

Uplink/Downlink

ARFCN range

Tx/Rx spacing 45MHz 95MHz

Mod. Bit rate/

Bit Period

Time Slot

Period/Frame

Period

Modulation 0.3GMSK 0.3GMSK

880~915 925~960

0~124 &

975~1023

270.833kbps

3.692us

576.9us

4.615ms

1710~1785 1805~1880

512~885

270.833kbps

3.692us

576.9us

4.615ms

MS Power 33dBm~5dBm 30dBm~0dBm

Power Class

Sensitivity -102dBm -100dBm

TDMA Mux 8 8

Cell Radius 35Km 2Km

max

(

+33

dBm)

max

(

+30

dBm)

2-1

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Specification

2-2.

GSM Tx Power Class

TX Power

control level

5 32.5±2

631±2

729±2

827±2

925±2

10 23±2

11 21±2

GSM900

dBm

TX Power

DCS1800

control level

0 29.5±3

128±3

226±3

324±3

422±3

520±3

618±3

dBm

12 19±2

13 17±2

14 15±2

15 13±2

16 11±3

17 9±3

18 7±3

19 5±3

dBm

716±3

814±3

912±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

15 0±5

dBm

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Operation Instruction and Installation

Main Function

Android OS: Eclair

•

HSDPA

•

MP AF w/o LED Flash

•5

•4.0"

•

WVGA Super AMOLED Full Touch(C-Type)

A-GPS/BT v3.0/USB v2.0/WiFi

HD Recording

Sensors: Accelerometer, Compass, Proximity, Light

TouchWiz

SNS, IM, E-mail, Face Recognition, etc.

Mbps/HSUPA

7.2

(720p)/

for Android, Multistage, Augmented Reality, Integrated phonebook with

3.0

Mbps

5.76

(802.11

Full HD Playback

b/g/n)

(1080

p), DLNA

3-1

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Level

S/W Download

6-1.

Repair

6-1-1.

Pre-requsite for S/W Downloading

Downloader Program

•

GT-S5260 Mobile Phone

•

Data Cable

•

JIG BOX(GH99-36900A)

•

RF Test Cable(GH39-00985A)

•

JIG Cable(GH39-01290A)

•

Adapter(GH99-38251A)

•

Binary files

•

Settings

（

(MultiLoader_V5.65.exe)

Connect to ANYWAY JIG BOX

JIG CABLE(Phone to JIG)

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Level1Repair

6-1-2.

S/W Downloader Program

Load the binary download program by executing the

｝

MultiLoader_V5.65.exe

Check the"Full Download BOX" and open binary folder.

enter this file.



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Select the each items in the Downloader V5.65 and Choose the files.

Downloader V5.65 file name

Boot BOOTFILES(folder)

Apps apps_compressed.bin

Rsrc1 Rsrc_S5260_Open_Europe_Common.rc1

Rsrc2 Rsrc2_S5260(Low).rc2

Factory FS FactoryFs_S5260_Open_Europe_Common.ffs

CSC CSC_S5260_Open_Europe_Common_OXA.csc

SHP APP ShpApp.app

Level1Repair

6-3

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Level1Repair

Connect the handset, select Download.

For enter"Download mode", press hold key+Vol. up key+send key.)

(

downloading screen)

(

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6-4

When downloading is complete, confirm the this message.

All files complete"

Level1Repair

Confirm the downloaded version name and etc.

*#1234#

Full Reset

*2767*3855#

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Reference Abbreviate

Advanced Audio Coding.

AAC:

―

AVC :

BER :

BPSK:

CA :

CDM :

C/I :

DMB :

ETSI:

MPEG:

PN :

PS :

QPSK:

RS :

SI :

TDM :

Advanced Video Coding.

Bit Error Rate

Binary Phase Shift Keying

Conditional Access

Code Division Multiplexing

Carrier to Interference

Digital Multimedia Broadcasting

European Standard

Elementary Stream

European Telecommunications Standards Institute

Moving Picture Experts Group

Pseudo-random Noise

Pilot Symbol

Quadrature Phase Shift Keying

Reed-Solomon

Service Information

Time Division Multiplexing

Transport Stream

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Safety Precautions

Repair Precaution

1-1.

Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because

―

specipicty of cellular phone is sensitive for surrounding interference(RF noise).

Be careful to useakind of magnetic object or tool, because performance of parts is damaged by

―

the influence of magnetic force.

Surely useastandard screwdriver when you disassemble this product, otherwise screw will be

―

worn away.

Useathicken twisted wire when you measure level.

―

thicken twisted wire has low resistance, therefore error of measurement is few.

Repair after separate Test Pack and Set because for short danger(for example an overcurrent

―

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

Take specially care of soldering, because Land of PCB is small and weak in heat.

―

Surely tune on/off while using AC power plug, becausearepair of battery charger is dangerous

―

when tuning ON/OFF PBA and Connector after disassembling charger.

Don't use as you pleases after change other material than replacement registered on SEC System.

―

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

ESD(Electrostatically Sensitive Devices) Precaution

1-2.

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

(

You can prevent from ESD damage by static electricity.

Remove static electricity remained your body before you touch semiconductor or parts with

―

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

Use earthed soldering steel when you connect or disconnect ESD.

―

Use soldering removing tool to break static electricity.,otherwise ESD will be damaged by static

―

electricity.

Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

―

aluminum plate to have conductive power,they are prevented from static electricity.

You must maintain electric contact between ESD and place due to be set up until ESD is

―

connected completely to the proper place oracircuit board.

1-2

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Exploded View and Parts List

Cellular phone Exploded View

4-1.

QME03

QFR01

QLC01

QLB01

QCA01

QJK01

QAR01

QMO01

QRE01

QVO01

QKP02

QME01

QMP01

QSP01

QRF06

QCK02

QSD01

QCR67

QBC00

4-1

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Exploded View and Parts List

Cellular phone Parts list

4-2.

Design LOC Description SEC CODE

QAR01 AUDIO-RECEIVER

QCR67 SCREW-MACHINE

QMO01 MOTOR DC-SPHV8400 GH31-00187A

QJK01 MODULE-EARJACK/FPCB ASSY GH59-10334A

QME03 TOUCH/PANEL-EU COMMON(WHITE) GH59-10336A

QSP01 MODULE-SPK/INTENNA(GT-S5260) GH59-10488A

QCA01 CAMERA MODULE-3M CAMERA MODULE GH59-10594A

QMP01 A/S ASSY-PBA MAIN(COMM) GH82-05493A

QLC01 ASSY LCD-MODULE ASSY(GT-S5260) GH96-04956A

QME01 ASSY MODULE-KEY PBA/MIC/BRACKET GH96-05038A

QKP02 ASSY KEYPAD-SUB GH98-18495A

QFR01 ASSY CASE-FRONT GH98-18510A

QBC00 ASSY COVER-BATT GH98-18512A

QLB01 ASSY BRACKET-LCD GH98-18513A

QRE01 ASSY CASE-REAR GH98-18511A

3009-001521

6001-002083

QVO01 PMO KEY-VOLUME GH72-61830A

QCK02 PMO KEY-HOLD GH72-61831A

QRF06 PMO COVER-USB GH72-61832A

QSD01 PMO COVER-SD GH72-61833A

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MAIN Electrical Parts List

SEC CODE Design LOC Description

0403-001870

0404-001172

0404-001504

0406-001286

0406-001329

0406-001446

0407-001002

0505-002388

0801-003130

1001-001607

1001-001655

1001-001687

1108-000395

1201-003166

1202-001068

1203-006589

1203-006660

1205-003868

1205-004046

1205-004113

1209-001945

1404-001221

1405-001231

1405-001298

2007-000137

2007-000138

2007-000140

2007-000141

2007-000143

2007-000144

2007-000148

ZD300 DIODE-ZENER

D402 DIODE-SCHOTTKY

D100,D101 DIODE-SCHOTTKY

ZD400 DIODE-TVS

ZD401 DIODE-TVS

ZD402,ZD40 DIODE-TVS

ZD405 DIODE-TVS

D300 DIODE-ARRAY

Q401 FET-SILICON

U200 IC

U104 IC

U401 IC

U102 IC

UME200 IC

PAM100 IC

U409 IC

U402 IC

U300 IC

U100 IC

UCP200 IC

U103 IC

U302 IC

VR300 VARISTOR

VR200,VR20 VARISTOR

VR411,VR41 VARISTOR

VR400,VR40 VARISTOR

VR405,VR40 VARISTOR

VR412 VARISTOR

R407 R-CHIP

R101 R-CHIP

R103,R424 R-CHIP

R204,R205, R-CHIP

R415,R416 R-CHIP

R201,R219, R-CHIP

C231,R211, R-CHIP

R304,R411 R-CHIP

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Main Electrical Parts List

SEC CODE Design LOC Description

2007-000156

2007-000157

2007-000159

2007-000162

2007-000165

2007-000169

2007-000170

2007-000172

2007-000758

2007-001244

2007-001291

2007-001295

2007-001298

2007-001333

2007-002965

2007-003014

2007-003015

2007-007008

2007-007014

2007-007015

2007-007132

2007-007193

2007-007312

2007-007315

2007-007981

2007-008401

2203-000233

2203-000254

2203-000278

2203-000386

2203-000425

R305 R-CHIP

R423 R-CHIP

R208 R-CHIP

R107,R110, R-CHIP

R217,R221, R-CHIP

R300,R421, R-CHIP

R429 R-CHIP

R402,R408, R-CHIP

R401,R406 R-CHIP

R422 R-CHIP

R209 R-CHIP

R301,R302 R-CHIP

R404,R413 R-CHIP

R102,R403 R-CHIP

R409 R-CHIP

R108 R-CHIP

R312 R-CHIP

R418,R419 R-CHIP

R306 R-CHIP

R410 R-CHIP

R430 R-CHIP

R106,R112 R-CHIP

R200 R-CHIP

R214 R-CHIP

R218 R-CHIP

R309,R311 R-CHIP

R308 R-CHIP

C129,C130, C-CERAMIC

C234 C-CERAMIC

C137,C223, C-CERAMIC

C120,C121, C-CERAMIC

C127,C128, C-CERAMIC

C166,C167, C-CERAMIC

C165,C312, C-CERAMIC

C416 C-CERAMIC

C220 C-CERAMIC

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Main Electrical Parts List

SEC CODE Design LOC Description

2203-000438

2203-000466

2203-000696

2203-000714

2203-000812

2203-000854

2203-000995

2203-001101

2203-001153

2203-002487

2203-005057

2203-005450

2203-005481

2203-006048

2203-006141

2203-006190

2203-006257

2203-006260

2203-006348

2203-006399

C144,R425 C-CERAMIC

C131 C-CERAMIC

C140 C-CERAMIC

C119 C-CERAMIC

C114,C342, C-CERAMIC

C414 C-CERAMIC

C118,C151, C-CERAMIC

C206,C217, C-CERAMIC

C224 C-CERAMIC

C400,C405, C-CERAMIC

C428,C429, C-CERAMIC

C117 C-CERAMIC

C145 C-CERAMIC

C423 C-CERAMIC

C102,C104, C-CERAMIC

C109,C125, C-CERAMIC

C157,C171, C-CERAMIC

C211,C212, C-CERAMIC

C215,C216, C-CERAMIC

C316,C341, C-CERAMIC

C402,C403, C-CERAMIC

C419,C420 C-CERAMIC

C306 C-CERAMIC

C112,C155 C-CERAMIC

C345 C-CERAMIC

C122 C-CERAMIC

C301,C437, C-CERAMIC

C126,C133, C-CERAMIC

C147,C200, C-CERAMIC

C208,C210, C-CERAMIC

C307,C309, C-CERAMIC

C319,C322, C-CERAMIC

C328,C329, C-CERAMIC

C352,C412, C-CERAMIC

C427,C431, C-CERAMIC

C434,C435 C-CERAMIC

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Main Electrical Parts List

SEC CODE Design LOC Description

2203-006562

2203-006681

2203-006824

2203-006841

2203-006872

2203-006890

2203-007271

2203-007279

2203-007317

2203-007775

2404-001377

2404-001496

2404-001506

2404-001516

2703-001733

2703-001748

2703-001751

2703-001938

2703-002170

2703-002176

2703-002198

2703-002200

2703-002204

2703-002267

2703-002281

2703-002309

2703-002367

2703-002369

2703-003485

2703-003686

2703-003698

2801-004466

C401 C-CERAMIC

C226,C421 C-CERAMIC

C100,C422 C-CERAMIC

C305 C-CERAMIC

C105,C135, C-CERAMIC

C205,C207, C-CERAMIC

C225,C349 C-CERAMIC

C300,C320, C-CERAMIC

C337 C-CERAMIC

C326,C327, C-CERAMIC

C334,C335 C-CERAMIC

C113,C303, C-CERAMIC

C101,C143 C-CERAMIC

C115,C116 C-CERAMIC

TA400 C-TA,CHIP

TA300 C-TA,CHIP

TA301 C-TA,CHIP

C302 C-TA,CHIP

C103 INDUCTOR-SMD

L106,L107 INDUCTOR-SMD

L119,L121 INDUCTOR-SMD

L403 INDUCTOR-SMD

L110 INDUCTOR-SMD

L118 INDUCTOR-SMD

L115,L116 INDUCTOR-SMD

L120,L122 INDUCTOR-SMD

L112,L123 INDUCTOR-SMD

L114,L117 INDUCTOR-SMD

L109,L113 INDUCTOR-SMD

L410 INDUCTOR-SMD

C153,C154 INDUCTOR-SMD

L127 INDUCTOR-SMD

L401 INDUCTOR-SMD

L300,L301 INDUCTOR-SMD

L105 INDUCTOR-SMD

OSC300 CRYSTAL-UNIT

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SEC CODE Design LOC Description

2801-004787

2801-005054

2901-001639

2904-001935

2904-001937

2909-001337

3003-001136

3301-001438

3301-001534

3301-001659

3301-001812

3301-002062

3301-002065

3404-001303

3705-001731

3708-002222

3709-001575

3709-001668

3711-006615

3711-006676

3711-007650

3712-001348

3722-002867

OSC200 CRYSTAL-UNIT

OSC100 CRYSTAL-UNIT

F400,F401, FILTER-EMI SMD

F100 FILTER-SAW

F101 FILTER-SAW

F102 FILTER-DUPLEXER

MIC401 MIC-CONDENSOR

L128 CORE-FERRITE BEAD

L100,L101 CORE-FERRITE BEAD

L124,L125, CORE-FERRITE BEAD

L400,L402 CORE-FERRITE BEAD

L404 CORE-FERRITE BEAD

L406,L407, CORE-FERRITE BEAD

R400 CORE-FERRITE BEAD

TAC_DN,TAC SWITCH-TACT

TAC_UP SWITCH-TACT

RFS100 CONNECTOR-COAXIAL

SLC401 CONNECTOR-FPC/FFC/PIC

SD300 CONNECTOR-CARD EDGE

SIM300 CONNECTOR-CARD EDGE

HDC401,SLC CONNECTOR-HEADER

HDC400 CONNECTOR-HEADER

BTC300 CONNECTOR-HEADER

ANT400,ANT CONNECTOR-TERMINAL

IFC400 JACK-PHONE

GH62-00018A GA100 PAD GAP-PCB GASKET

Main Electrical Parts List

Please consult the GSPN website(Samsung Portal) for the most recent version of the product's part list.

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Level

Disassembly and Assembly Instructions

7-1.

Repair

7-1-1.

rear and scratch.

Disassembly

When you disassemble screw, be careful crack of

Screw size

TORQUE

disassemble Screw6point from Rear

: 1.4 * 3.5 (6001-002083)

:1.0~1.2

Kgf·cm

When using disassemble tool, be careful crack of

rear and scratch.

Start side line and then bottom line using

disassemble tool.

3 4

When using disassemble tool, be careful crack of rear

and scratch.

Next step, opposite side of rear using

1) disassemble tool.

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Take rear from set.

be careful crack of rear and scratch.

7-1

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