SAMSUNG FAXF4300CXEU Service Manual

SF4300C

SERVICE Manual

	INKJET PRINTER COMPOUND		CONTENTS

1. Precaution

2. Referential Information

3. Specifications

4. Disassembly & Assembly

5. Circuit

6. Repair

7. Exploded View

8. Packing

9. Circuit Diagram & Parts List

10. Block Diagram

11. PCB Layout

12. Wiring Diagram

ELECTRONICS

1. Precautions

1-1 Safeguards

Please read these instructions carefully and completely.

1.Do not use this product in a humid place nor outdoor.

2.Do not place this product on an unstable stand or table. The product may fall, causing serious damage to the product.

3.Use this product in a well-ventilated place.

4.Slots are provided for ventilation. Never push objects of any kind into this product through these slots as they may result in a fire or electric shock. Never spill liquid of any kind on the product.

5.Power-supply cords should be routed so that they are not likely to be walked.

6.Use this product in a place big enough to support printers.

7.Install this product within 180cm from the computer and 150cm from the power outlet.

8.This product should be operated only from the type of power source indicated on the marking label.

9.If you use extension cords, be sure they have three-wire grounding-type power outlets. Do not overload wall outlets and extension cords. Never load one wall outlet with over 15 ampere.

10.Unplug this product from the wall outlet before cleaning. Do not use liquid cleaners or aerosol cleaners. Use a dry cloth for cleaning.

11.Use only standard paper, OHP film, andapproved envelopes.

1-2 Servicing Precautions

Please read these instructions carefully and completely.

1.Unplug this product from the wall outlet before you disassemble it.

2.Replace defective parts with the same parts as them.

3.Check the insulation of electricity-conducting parts (metal plate or input terminal) that can easily contact AC plug blades.

4.How to check insulation: Pull the AC plug out of the outlet and measure insulation resistance of each blade.

5.Insulation resistance of AC plug blades against electricity-conducting parts should be 1 megaohm or over.

6.Always use it after connecting the ground of measuring instruments to the ground of chassis. And after you use it, separate the ground of the measuring instruments lastly.

Samsung Electronics

1-1

1-3 Static Electricity Precautions

Semi-conductors are easily damaged by static electricity. They are usually called electrostatically sensitive devices (ESD). For example, there are IC, FET, and semi-conductor chips.

1)Before you handle semi-conductor parts, be sure to discharge electricity by touching earth connection or putting on a wristband. (Before you turn on the product, put off the wristband to prevent electric shock.)

2)Remove the static electricity protective device and then place the assembly on the surface of electric conductors such as aluminum foil to prevent static electricity from accumulating.

3)Do not use chemicals like Freon. These chemicals produce static electricity that may damage parts.

4)Solder ESD parts with a grounded soldering iron.

5)Use static electricity protective solder. Solder not marked ‘static electricity protective’ may accumulate static electricity that damages ESD parts.

6)Do not get rid of the static electricity protective cover of ESD parts until you are ready to replace them. Most of ESD parts are packed, with electricity conducting materials in contact with ESD parts leads.

7)Make static electricity protective materials contact the chassis or the circuit where parts will be mounted, before you remove the materials from ESD parts to be replaced.

8)Minimize your motion when you handle the ESD parts from which static electricity protective materials have been removed. Static electricity is generated when your clothes are frictionized or you walk on the carpet.

9)Be careful not to bend pins when you handle IC. 10) Pay attention to directions when you mount

parts on PCB.

11)Overheat during soldering may damage the parts completely. Heat affects all the parts.

1-2	Samsung Electronics

2. Referential Information

2-1 Abbreviations & Acronyms

Abbreviations	Definition
MFP	Multi Function Peripheral
I/F	INTERFACE
UART	Universal Asynchronous Receiver/Transmitter
ECP	Expended Capasilities port : 8bits Data
CR	Carriage Return
LF	LINE FEED
CIP	COLOR IMAGE PROCESSOR
CCD	Charge Coupled Device
A/D	ANALOG TO DIGITAL
D/A	DIGITAL TO ANALOG
LIU	Line Interface Unit
TIT	Transformer Input from Transformer
ROT	Receive Output Transformer
LI	Line Input

Samsung Electronics

2-1

2-2 Location & Outline of Pins of Electrical Parts

		LOGIC AND CONNECTION
		DIAGRAMS DIP (TOP VIEW)
Vcc	E	B1	B2	B3	B4	B5	B6	B7	B8		J SUFFIX
											CERAMIC
20	19	18	17	16	15	14	13	12	11	CASE 732-03
									20
									1
											N SUFFIX
											PLASTIC
1	2	3	4	5	6	7	8	9	10	CASE 738-03
DIR	A1	A2	A3	A4	A5	A6	A7	A8 GND
									20
									1
										DW SUFFIX
											SOIC
									20	CASE 751D-03
									1
TO-220
											C
									B
1									.
									R1=10K. Ω
2									.
									R2=0. .6KΩ
3									R1	R2
1. Gate			2. Drain			3. Source					E
SOT-23									SOT-89
							3
	1
				2					1
	1. Base		2. Emitter			3. Collector				2	3
									1. Base	2. Collector	3. Emitter
2-2										Samsung Electronics

BLOCK DIAGRAM

8 DIP

8 SOP

Vcc Q6 Q6

Q2Q3

IN(-)

Q1 Q4

IN(+)

Q8 Q9

OUT 1	1		8	Vcc
IN1(- )	2	_	7	OUT 2
		+
IN1(+ )	3		6	IN2 (- )
			_
			+
GND	4		5	IN2 (+)

Q12

	Q17
		Q19
C1		Q20
		R1
	Q18
		R2
		OUT
Q11	Q15	Q21

Q10	Q14
	Q13

Samsung Electronics

2-3

PIN CONNECTIONS
			8
CD 1	8	Vo2	1
FC2 2	7	Gnd	P SUFFIX
FC1 3	6	Vcc	PLASTIC PACKAGE
Vin 4	5	Vo1	CASE 626
	(Top View)

									8
Block Diagram Simplified Application									1
				Rf					D SUFFIX
									PLASTIC PACKAGE
				75k
Cj	Ri			6	Vcc				CASE 751
		Vin	4	_					(SO-8)
Audio	3.0k
0.1
Input		FC1	3	#1		5	Vo1	Speaker
				+
	C1
	1.0uF
		C2*		50k	_	8	Vo2		8
		5.0uF
			2	125k	#2
					+
		FC2		50k	Bias	1	CD	Chip	1
					Circuit			Disable
				MC34119
					7				DTB SUFFIX
					GND

Differential Gian=2 x Rf			PLASTIC PACKAGE
*=Optional
	Rj	This device contains 45 active transistors.	CASE 948J
			(TSSOP)

14DIP	BLOCK DIAGRAM
	OUT2	1			14
	OUT1	2			13
1	Vcc	3			12
		_	+	_	+
	IN1(-)	4			11
14SOP
	IN1(+)	5			10
1	IN2(-)	6			9
	IN2(+)	_	+	_	+
		7			8

2-4	Samsung Electronics

PIN CONFIGURATION (Top Views)

	KM416C/V10(2)00BJ							KM416C/V10(2)00BT
VCC					Vss	Vcc			1	44			Vss
		1	42			DQ0			2	43			DQ15
DQ0					DQ15	DQ1			3	42			DQ14
		2	41
DQ1					DQ14	DQ2			4	41			DQ13
		3	40
DQ2					DQ13	DQ3			5	40			DQ12
		4	39
DQ3					DQ12	Vcc			6	39			Vss
		5	38
VCC		6	37		Vss	DQ4			7	38			DQ11
DQ4		7	36		DQ11	DQ5			8	37			DQ10
						DQ6			9	36			DQ9
DQ5		8	35		DQ10	DQ7			10	35			DQ8
DQ6		9	34		DQ9	N.C			11	34			N.C
DQ7		10	33		DQ8
N.C					N.C
		11	32
N.C					UCAS
		12	31						12	33			N.C
W					UCAS	N.C
		13	30
RAS					OE	N.C			13	32			UCAS
		14	29
						W			14	31			UCAS
*A11(N.C)		15	28		A9	RAS			15	30			OE
*A10(N.C)		16	27		A8	*A11(N.C)			16	29			A9
A0					A7
		17	26			*A10(N.C)			17	28			A8
A1					A6	A0			18	27			A7
		18	25
A2					A5	A1			19	26			A6
		19	24
A3					A4	A2			20	25			A5
		20	23
						A3			21	24			A4
VCC		21	22		Vss	Vcc			22	23			Vss

				A15	1	48	A16
				A14	2	47	BYTE
				A13	3	46	Vss
				A12	4	45	DQ15/A-1
				A11	5	44	DQ7
	TO-92			A10	6	43	DQ14
				A9	7	42	DQ6
				A8	8	41	DQ13
				NC	9	40	DQ5
				NC	10	39	DQ12
				WE	11	38	DQ4
				RESET	12	37	Vcc
				NC	13	36	DQ11
				NC	14	35	DQ3
				RY/BY	15	34	DQ10
				NC	16	33	DQ2
				A17	17	32	DQ9
				A7	18	31	DQ1
				A6	19	30	DQ8
				A5	20	29	DQ0
				A4	21	28	OE
				A3	22	27	Vss
				A2	23	26	CE
				A1	24	25	A0
1	2 3			A16	1	48	A15
				BYTE	2	47	A14
				Vss	3	46	A13
				DQ15/A-1	4	45	A12
	1.Emitter	2.Base	3.Collector	DQ7	5	44	A11
				DQ14	6	43	A10
				DQ6	7	42	A9
				DQ13	8	41	A8
				DQ5	9	40	NC
				DQ12	10	39	NC
				DQ4	11	38	WE
				Vcc	12	37	RESET
				DQ11	13	36	NC
				DQ3	14	35	NC
				DQ10	15	34	RY/BY
				DQ2	16	33	NC
				DQ9	17	32	A17
				DQ1	18	31	A7
				DQ8	19	30	A6
				DQ0	20	29	A5
				OE	21	28	A4
				Vss	22	27	A3
				CE	23	26	A2
				A0	24	25	A1

Samsung Electronics

2-5

			OUTPUT B		1		16	SENSE RESISTOR
			PULSE TIME		2		15	OUTPUT A
				Vs(B)	3		14	Vs(A)
				GND	4		13	GND
Powerdip 12+2+2				GND	5		12	GND
(Plastic Package)				Vss	6		11	REFERENCE
ORDER CODE:PBL3717A			INPUT 1		7		10	COMPARATOR INPUT
			PHASE		8		9	INPUT
Powerdip			SO-20				MULTIWATT-15
12+2+2
ORDERING NUMBERS:		ORDERING NUMBERS:				ORDERING NUMBER : TEA3718SP
TEA3718SDP			TEA3718SFP
TEA3718DP
TEA3718SP				TEA3718SFP				TEA3718DP
(Multiwatt-15)				(SO-20)				TEA3718SDP
							(Powerdip 12+2+2)
15	Us
14	DUT B
13	SENSE		OUT B	1	20	SENSE
12	DUT A
11	PULSE TIME		PULSE TIME	2	19	OUT A
10	Us		Us	3	18	Us
9	N.C.		N.C.	4	17	N.C.	OUT B		1	16	SENSE
8	GND		GND	5	16	GND	PULSE TIME		2	15	OUT A
7	ALARM OUTPUT		GND	6	15	GND		Us	3	14	Us
6	REFERENCE		N.C.	7	14	PRE-ALARM OUT		GND	4	13	GND
5	COMPARATOR INPUT Uss			8	13	REFERENCE		GND	5	12	GND
4	IN0		IN1	9	12	COMPARATOR INPUT		Uss	6	11	REFERENCE
									7	10	COMPARATOR INPUT
3	PHASE		PHASE	10	11	IN0		IN1
							PHASE		8	9	IN0
2	IN1
1	Uss
Note:HEATSINK SURFACE CONNECTED TO PIN B
2-6										Samsung Electronics

		NC	NC	NC	GOP7/nIORD1 VCC8	GOP11 GOP6/nIOWR2	GOP10/FIREPULSE	GOP9/CLKOUT	GOP4/nRSTO GOP8/nIORD2	GOP3/TONE	GND9	EEDATA EECLK	NC	NC NC	NC	NC	GOP2/nXDACK NC	GIP4/nXDREQ	GIP2/nEINT1 GIP3/nEINT2	VCC7	GOP5/nIOWR1	GND7 MCLK GND8	nRESET	CLKSEL	GIP5/UCLK	TEST2	TEST1	GIP1/RXD2	GOP1/TXD2	GIP0/RXD1	GOP0/TXD1	nECS3
NC	1	160	159	158	156 157	154 155	153	152	150 151	149	148	146 147	145	143 144	142	141	139 140	138	136 137	135	134	131 132 133	130	129	128	127	126	125	124	123	122	121			nECS2							ADCDG	ADCDP				ADCAP ADCAG VSS		CLR-SCAN		CLK-M
																																120												pVref		nVref				SH CLK1 CLK2			VDD VSS
NC	2																															119			nECS1										Vin							VSS		D15 D14 D13	D12
NC	3																															118			nECS0
NC	4																															117			VCC6
NC	5																															116			nWBE1							80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
NC	6																															115			nWBE0
NC	7																															114			nWE
NC	8																															113			nOE				VDD		1														60	D11
NC	9																															112			nCAS1
																																						GPO0			2														59	D10
NC	10																															111			nCAS0
GND1	11																															110			nRAS1			GPO1			3														58	D9
																																			nRAS0
NC	12																															109						GPO2			4														57	D8
NC	13																															108			nRCS2
NC	14																															107			nRCS1			GPO3			5														56	VSS
NC	15																															106			nRCS0				VSS		6														55	D7
NC	16										KS32C6200																					105			GND6
NC	17																															104			ADDR21			GPO4			7														54	D6
NC	18																															103			ADDR20			GPO5			8														53	D5
NC	19											160 TQFP																				102			ADDR19			GPO6			9														52	D4
VCC1	20																															101			ADDR18														CIP1
NC	21																															100			ADDR17			GPO7			10														51	VDD
NC	22											(Top View)																					99		ADDR16				VDD		11								V2.1						50	D3
NC	23																																98		ADDR15
NC	24																																97		ADDR14				GPI0		12														49	D2
NC	25																																96		VCC5				GPI1		13														48	D1
NC	26																																95		ADDR13
NC	27																																94		ADDR12				GPI2		14														47	D0
NC	28																																93		ADDR11				GPI3		15														46	VSS
GND2	29																																92		ADDR10				VSS		16														45	ADDR4
GOP12	30																																91		ADDR9
NC	31																																90		ADDR8				GPI4		17														44	ADDR3
NC	32																																89		ADDR7				GPI5		18														43	ADDR2
NC	33																																88		ADDR6
NC	34																																87		GND5				GPI6		19														42	ADDR1
NC	35																																86		ADDR5				GPI7		20														41	ADDR0
NC	36																																85		ADDR4
GPIO0/TCK	37																																84		ADDR3							21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
GPIO1/TMS	38																																83		ADDR2							GPIO0	GPIO1	GPIO2	GPIO3	GPIO4	GPIO5	GPIO6 GPIO7	VSS	Xin Xout VSS	VDD	nXDREQ	TEST nXDACK	nRESET nCIPCS nRD	nWR
GPIO2/TDI	39																																82		ADDR1
GPIO3/nTRST	40	GPIO4/TDO 41	VCC2 42	nFAULT 43	BUSY 45 PERROR 44	SELECT 47 nACK 46	nINIT 48	nSLCTIN 49	nSTROBE 51 nAUTOFD 50	GND3 52	PPD7 53	PPD5 55 PPD6 54	PPD4 56	PPD2 58 PPD3 57	PPD1 59	PPD0 60	VCC3 62 245CLK 61	DATA0 63	DATA2 65 DATA1 64	DATA3 66	DATA4 67	DATA7 70 DATA6 69 DATA5 68	GND4 71	DATA8 72	DATA9 73	DATA10 74	DATA11 75	DATA12 76	DATA13 77	DATA14 78	DATA15 79	VCC4 80	81		ADDR0
																										GP02		SWGAINO		RCVO		GNDD	RLSD	RXDO	GP19	GP20	GNDD	GP21	SEPYO	GNDD	DAOUT	ADIN	SEPXO	SEPCLK	SEPCLKX	SEPWCLK	DCLK	GNDD
																										100		99		98		97	96	95	94	93	92	91	90	89	88	87	86	85	84	83	82	81
																						GP03		1																									80	GNDD
																						GP04		2																									79	TXDI
																						GP05		3																									78	CTS
																						GP06		4																									77	DGND
																						GP07		5																									76	GP17
																						GNDD		6																									75	GP16
																						GNDD		7																									74	SYNCIN2
																						D7		8																									73	DCLK
																						D6		9																									72	DVDD
																						D5		10																									71	YCLKO
																						D4		11																									70	XCLKO
																						D3		12																									69	XTALO
																						D2		13																									68	XTALI
																						D1		14																									67	PORI
																						D0		15											KS16116/7														66	DGND
																						GNDD		16																									65	EN85
																						GNDA		17																									64	RTS
																					RXAMPI			18																									63	GP11
																						NC		19																									62	NC
																						NC		20																									61	GP13
																						GNDA		21																									60	RS0
																						VDD		22																									59	RS1
																						GNDD		23																									58	RS2
																					SWGAINI			24																									57	RS3
																					ECLKIN1			25																									56	RS4
																					SYNCIN1			26																									55	READ-ø2
																						NC		27																									54 CS
																						NC		28																									53 WRITE-R/W
																						NC		29																									52 IRQ
																						GNDA		30																									51 NC
																										31		32		33		34	35	36	37	38	39	40	41	42	43	44	45	46	47	48	49	50
																										NC		NC		NC		DAIN	ADOUT	BYPASS	RCVI	TXATT3	TXATT2	TXATT1	NC	VREFN	VSSG	TXAO	RXAI	Vcc	GNDA	VC	AOUT	GNDD
Samsung Electronics																																																								2-7

2-3 Chip Replacement (SMD parts)

2-2-1. Precautions for Chip Replacement

1.See to it that the soldering iron does not touch parts directly. In particular, TSOP may be easily damaged by heat.

2.Handle the soldering iron with care and avoid using the same many times. Some parts can be damaged by sudden heat. Preheat parts for minutes at about 100°c before soldering them.

3.The temperature of the soldering iron should remain at about 240°c Use a 280°c iron for bigger parts.

4.Thin (0.3mm) solder used for chip parts does not contain enough flux. Use additional flux.

*For computers and OAsystems, water-soluble flux is used. Water-soluble flux and solder are also good for replacing parts and repairing this product. Improper flux may corrode the soldered part and cause serious defects to the system.

5.Be careful not to damage the circuit pattern when you disjoin soldering. The pattern should be clean because there are a lot of pins close together on IC.

6.Be careful not to cause a short circuit between close pins.

7.Locate parts in place. It has a great influence on soldering.

8.Do not use repaired parts again.

9.Check the soldered part.

10.Defective variable resistors are not adjustable. Be sure to replace them.

11.After finishing the job, check if there are cold soldered parts.

2-2-2. Tools to Replace Chips

The following tools are used to replace chip parts.

•iron with thin tip

•iron with small and flat tip

•solder remover

•ventilation device

•tools to lift flat parts

•flux that can be cleaned with water

•0.3mm thin solder that can be cleaned with water

•wire to remove solder

•tweezers

2-2-3. Chip Resistance & Chip Condenser

2-2-3 (a) Type

There are the following types of chip resistance and chip condensers.

•There are the following types of thin film and chip condensers.

•Carbon Film chip resistance

•Metal Film chip resistance

•Chip ceramic condenser

•Chip variable resistance

2-2-3 (b) Removal Use 2 soldering irons.

a.Use a thin-tip iron.

b.Keep about 280°c

c.Apply heat to both ends of a part at the same time.

d.Remove it with the tip of the iron while heating.

e.Remove the remaining solder on PCB completely with solder removing wire. It should be done to install a new part.

2-8

Samsung Electronics

2-2-3 (c) Installation

a.Clean the place where a new part will be located.

b.Apply water-soluble flux.

c.Set a part correctly in place. Prevent it from shifting.

d.Stick the part fast without contacting it directly with the soldering iron. Put 0.3mm solder between the iron and the part so that it can melt into the part.

e.Check the soldered part with a magnifier.

2-2-4. Chip Tantalum Condenser and Chip Filter

2-2-4 (a) Type

There are the following types of chip tantalum condenser and chip filter.

•Chip coil

•Chip tantalum condenser

•Chip tantalum electrolysis condenser

•Chip aluminum electrolysis condenser

•Chip transformer

•Chip filter

2-2-4 (b) Remoral

1.Use a special solder-removing iron.

a.Choose an iron tip that suits the size of the part.

b.Put the iron tip to the part to be soldered.

c.Remove the part when solder melts.

d.Remove the remaining solder completely with solder-removing wire.

2.Use two irons.

a.Use an iron with small flat tip.

b.Apply heat to both ends of the part at the same time.

c.Remove the part with the tip of the iron while melting.

d.Remove the remaining solder completely with solder removing wire.

2-2-4 (c) Installation

1.Clean the place where new parts will be installed.

2.Apply water-soluble flux.

3.Locate a part exactly in place. Be careful not to shift it.

4.Stick the part fast with a soldering iron not contacting it directly. Put 0.3mm solder between the iron and the part so that it can melt into the part.

5.Check the soldered part with a magnifier.

2-2-5. Chip Variable Resistance, Chip

Variable Condenser, Diode &

Transistor

Chip Variable Resistance, Chip Variable Condenser,

Diode & Transistor

2-2-5 (a) Type

There are the following types.

•Chip Variable Resistance

•Chip Variable Condenser

•Diode

•Transistor

2-2-5 (b) Removal

Use two soldering irons.

a.Use an iron with small flat tip.

b.Apply heat to both ends of a part at the same time.

c.Remove the part with the tip of the iron while solder melts.

d.Remove the remaining solder completely with solder removing wire.

Samsung Electronics				2-9

2-2-5 (c) Installation

1.Clean the place where new parts will be installed.

2.Apply water-soluble flux.

3.Locate a part exactly in place. Be careful not to shift it.

4.Stick the part fast with a soldering iron not contacting it directly. Put 0.3mm solder between the iron and the part so that it can melt into the part.

2-2-6. Chip IC

2-2-6 (a) Type

There are the following types of chip IC.

1.SOP (Small Outline Package) IC

2.SSOP (Shrink Small Outline Package) IC

3.VSOP (Very Small Outline Package) IC

4.QFP (Quad Flat Package) IC

5.VQFP (Very Quad Flat Package) IC

6.PLCC (Plastic Leaded Chip Carrier) IC

7.TSOP (Thin Small Outline Package) IC

2-2-6 (b) Removal

1.Use a special solder-removing iron.

a.Choose an iron tip that suits the shape and the size of IC.

b.Use ‘thin’ tip to contact legs of IC.

c.Put the tip right in front of the legs of IC.

d.Twist the iron carefully when solder melts.

e.Raise and remove IC.

2.Use a ventilation device.

a.Choose an injector that suits IC.

b.Choose the temperature and the ventilation speed. (normal: temperature - 7, speed - 4)

c.Use IC-removing tools.

d.Preheat it for about 5 seconds with the ventilation device. And apply heat with the injector until IC can be removed from the board with IC removing tools.

2-2-6 (c) Installation

1.Remove the remaining solder completely with sol- der-removing wire.

2.Clean the place to be soldered.

3.Apply water-soluble flux.

4.Put IC in place and solder the legs of opposite direction.

5.Solder each leg carefully with thin tip.

6.Remove solder with solder-removing wire if there is a short circuit.

7.Check the soldered part with a magnifier.

IC

2-10	Samsung Electronics

3. Specifications

3-1 Specifications

Specification & Features

1. Printer

1-A. Set

	Technology		Thermal Inkjet
			1-pen & print head swapping type
	Speed	Color	3PPM at draft mode (6005300 DPI)
		Mono	7PPM at draft mode (6005300 DPI)
	Resolution	Color	600 5 600DPI (120051200 DPI addressable)
		Mono	600 5 600DPI (120051200 DPI addressable)
	Printing Width		8 Inch
	Feeding	Automatic	100 sheets for normal cut sheets, coating paper
		Manual	Recommended for thick media, fashion paper, envolope,
	Method
			postcard, Banner paper
	Emulation		Host Based Printing (GDI)
	Printer Driver		Window 3.1/3.11 and Windows 95 drivers
	Interface		IEEE 1284 Compatible Parallel Interface (ECP)

1-B. Ink Cartridge Supply

	Mono Ink	Color Ink
Print Head	208 nozzles	192 nozzles
Ink Type	Pigment	Dye
Ink Color	Black	Color
Ink Yield	About 600 sheets	About 200 sheets

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3-1

2. Scanner

Technology		CCD
Scanner Type		Color/Mono
TWAIN Compatible		Yes
Pre-Scan		Using Carrier Sheet
Speed	Color	about 1 PPM
	Mono	about 2 PPM
Resolution	Color	300 X 300 DPI (for SmartJet-C only)
	Mono	300 X 300 DPI
Gray Scale		256 Level
Printing Width		8 lnch
Feeding	Manual	Yes
Interface		IEEE 1284 Compatible Parallel Interface (ECP)

3-2	Samsung Electronics

3-1. Facsimile

Compatibility	ITU-G3
Scan Method	CCD Shuttle Scanning Method
Scan Width	Max. 8.5 Inch, Effective : 8 Inch
Document Feeding Method	Manual Feeding Method
Guide	Document In-put Guide
Stacker	None
Handset	None
Keys on OPE	4EA (Ready, Cartridge, FF/STOP, START/COPY))
LEDs on OPE	3EA (Ready, Busy, Scan/Fax)
Real Time Clock	None
Fax Monitoring Speaker	Yes
Ring Volume Control Switch	None
Paper Tray	BIN Type, up to 100 sheets
Modem Speed	Max 9600 bps
Coding Method	MH, MR, MMR, Error Correction Mode
LCD	None
Answering Machine I/F	None
Extension Phone I/F	1-Jack, Extension Phone Transfer
PC Interface	IEEE 1284 Parallel Interface (ECP)
Fax Send Resolution	- Standard : 200 x 100 dpi
	- Fine : 200 x 200 dpi
	- Superfine : 300 x 300 dpi

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3-2. Facsimile

	Feature		Use Ext. Telephone	Use PC
Gray Scale			- Auto Contrast	- Auto Contrast
				- 256 level with
				Error diffusion
Memory Transmission			None	Yes
Memory Rx			Yes	Yes
Receive Mode			- Tel, Fax	- Fax
				- PC Rx
		One Touch Dial	*No	70 Numbers
		Speed Dial	*No
		Chain Dial	*No	No
		On Hook Dial	*No	No
		Last Number Redial	*No	No
Telephone		Auto Busy Redial	*No	No
		No Power Operation	*No	No
		Hold & Mute	*No	No
		Pause	*No	Yes
		Ring Volume Control	*No	No
		Flash	*No	No
		Tone/Pulse Switch	*No	Yes
		Sensors	No paper sensor, Paper jam sensor
		Error Indicator	Yes (On LED)	Yes (On PC Screen)
		Voice Request	No	No
Others		TTI	Yes
		Rx Terminal ID	No	No
		Polling	No	No
		DRPD	U.S.A : Yes, Other countries : No
		Mercury	No	No

* The marked “No” can be provided by telephone’s feature.

3-4	Samsung Electronics

	Feature		Use Ext. Telephone	Use PC
		Tx/Rx Journal	No	Yes
Report & List		Delayed Dial List	No	No
Print out		System Data	No	Yes
		Tel Number List	No	Yes
		Help List	No	No
		Copy	Yes (1-Page)	Yes (99-Page)
Copy		Gray Scale	No	Yes
		Reduction Copy	No	Yes
		Enlargement Copy	No	No

4. Electrical & Environment

Power Source	AC 220~240V, 0.3A, 50~60Hz
Dimension (W5D5H)	422(mm) 5 237(mm) 5 180(mm)
Weight	3.7kg

5. Accessories

Tel	Handset	No
	Curl Cord	No
	Tel Line	Yes
Power Cord		Yes
Software		1 CD-ROM
		(Manual, Printer Driver, PC-Fax)
Manual		1EA
Ink	Mono Ink	Yes
Cartridge	Color Ink	Yes

* Xerox’s OCR S/W and scanner editor are recommended for its own use.

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3-5

4. Disassembly & Assembly

4-1 Taking Off Front Cover

This section explains with illustrations how to disassemble the printer.

It does not explain how to assemble it, because it is the very reverse of disassembly.

Fig.4-1. Taking Off Front Cover -1

▲ Disconnect power cords and printer cable from the printer.

▲ Unscrew 1 screws on rear cover to separate ink cartridge storage.

▲ Push Guide Extension in the direction of the arrow symbol.

▲ Remove 2 screws between front cover and bottom cover.

Fig.4-1. Taking Off Front Cover -2

▲ Hold the upper part of front cover with both hands and lift the front cover, holding down rear cover.

▲ Separate front cover from rear cover in the direction of the arrow symbol.

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4-1

4-2 Taking off Rear Cover

▲ ▲ ▲ ▲ ▲

Push in the paper guide (“C”) of automatic sheet feeder and place it inside of A4 line. Push the guide manual(L) (“D”) left.

Unhook right and left hooks(“A”) on the upper part of rear cover.

Unhook right and the left hooks of bottom cover by pushing them in.

Separate rear cover in the same direction that

“A”

▲ ▲ ▲ ▲

Fig.4-3. Separating Automatic Sheet Feeder

Remove various wires fixed on the side of automatic sheet feeder. Unscrew 2 screws on automatic sheet feeder.

Push slightly and disconnect the hook (“A”) fixed to the main frame.

Separate automatic sheet feeder by pulling it in the direction of the arrow symbol.

4-2	Samsung Electronics

4-4 Separating Main Circuit Board

▲ ▲ ▲

Fig.4-4. Separating Main Circuit Board

Separate various connectors connected with the main board. Separate head cable connected with the main board.

Unscrew 3 screws fixed to the main board and separate the main board in the direction of the arrow symbol.

4-5 Separating Power Circuit Board

Fig.4-5. Separating Power Circuit Board

▲ ▲

Unscrew 2 screws that fix the right and left ground wire.

Press the hook (“A”) on the middle of the housing and separate power circuit board.

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4-3

4-6. Separating Printer Engine

▲ ▲

Fig.4-6. Separating Printer Engine

Remove 2 screws fixed to printer engine unless you unscrewed them at the previous

stage.

Push outside right and left hooks on the side of the engine, unhook them, and

separate the engine in the direction of the arrow symbol.

4-7. Separating Home Assembly

▲ ▲

Fig.4-7. Separating Home Assembly

Unscrew 1 screw fixed to the back of the engine and separate home assembly from the

engine.

Pull out the wiper and the cap in the direction of the arrow symbol to separate them.

4-4	Samsung Electronics

4-8. Separating Carrier Assembly

Idle Pulley

Carrier Shaft

Head Cable

Holder

Cable

Fig.4-8. Separating Carrier Assembly

▲ ▲ ▲ ▲ ▲

Separate FPC cable connected with the main board.

Separate the holder cable fixed to the main frame.

Remove 1 screw on the right of the engine and spring on the left of the engine.

Push the left idle pulley in and separate the right part of the timing belt from motor pulley.

Pull out carrier shaft and separate carrier Assembly.

4-9. Separating Frame Base Assembly

Actuator Feed

Roller Friction Assembly

Frame Base Assembly

Fig. 4-9. Separating Frame Base Assembly

▲ ▲ ▲

Refer to 4-8 to separate carrier Assembly first. Separate 4 roller friction Assembly on the back of the engine and then actuator feed.

Separate frame base Assembly by lifting the back.

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4-5

4-10 Separating Feed Roller Assembly

1

2

Feed Roller

Frame Support

Bearing Feed (R)

Fig.4-10. Separating Feed Roller Assembly

▲ ▲ ▲ ▲

Refer to 4-9 to separate frame base Assembly first.

Unscrew 1 screw fixed to the back of the engine and separate frame support from the

engine.

Turn the bearing feed (R) in the direction of the arrow symbol to separate it from

the main frame.

Push feed roller on the right to separate it from the main frame.

4-11 Separating Bracket Line Feed Assembly

Bracket Line Feed

▲ ▲

Fig.4-11. Separating Bracket Line Feed Assembly

Refer to 4-10 to separate feed roller Assembly. Unscrew 2 screws and separate bracket line feed Assembly.

4-6	Samsung Electronics

4-12 Separating Automatic Sheet Feeder

▲ ▲ ▲ ▲ ▲ ▲

Fig.4-12. Separating Automatic Sheet Feeder

Separate the manual plate from frame ASF.

Separate the cam pickup on the right and then unscrew the right screw to separate the finger part.

Pull out the clutch and then unscrew 1 left screw to separate the clutch part. Separate the guide finger from shaft pickup.

Push shaft pickup to the right to separate.

Bend plate-knockup slightly and then separate it from the frame ASF.

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4-13. Separating LIU board

▲ ▲ ▲ ▲

Fig.4-13. Separating LIU board

Refer to 4-12 to separate automatic sheet feeder from the engine. Separate the connector.

Unscrew 2 screws fixed to LIU board.

Separate LIU board from the engine in the direction of the arrow symbol.

4-8	Samsung Electronics

4-14. Separating Scan Assembly

Fig.4-14. Separating Scan Assembly

▲ ▲

Unscrew 1 screw.

Push up scan Assembly in the direction of the arrow symbol to separate it from the carriage.

4-15. Separating White Reference Sheet

▲ ▲

White Reference Sheet

Frame Base

Fig.4-15. Separating White Reference Sheet

Remove contaminated white reference sheet completely from the frame base. Ask for new white reference sheet.

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