Page 1
-
FACSIMILE
SF1 IOT
sEF?vlcE
Manua’-
1.
Precautions
2.
Specification
3.
Operating Instructions
4.
Disassembly and Reassembly
5.
Circuit Description
6.
Troubleshooting
7.
Exploded Views and Parts List
8.
Electrical Parts List
9. PCB
10.
11.
12.
Diagrams
Block Diagram
Wiring Diagram
Schematic Diagrams
Page 2
t
"c
1 Precautions
Follow these safety,
l-l Safety Precautions
ESD,
and servicing precautions to prevent personal injury and equipment damage.
Be sure that all built-in protective devices are
in place. Restore any missing protective
shields.
Make sure there are no cabinet openings
through which people- particularly children-
might insert fingers or objects and contact
dangerous voltages.
When re-installing chassis and assemblies, be
3.
sure to restore all protective devices, including
control knobs and compartment covers.
4.
Design Alteration Warning:
Never alter or add to the mechanical or
electrical design of this equipment, such as
auxiliary connectors, etc. Such alterations and
modifications will void the manufacturer’s
warranty.
5
Components, parts, and wiring that appear to
have overheated or are otherwise damaged
should be replaced with parts which meet the
original specifications. Always determine the
cause of damage or overheating, and correct
any potential hazards.
7.
Product Safety Notice:
Some electrical and mechanical parts have
special safety-related characteristics which
might not be obvious from visual inspection.
These safety features and the protection they
provide could be lost if a replacement
component differs from the original. This
holds true, even though the replacement may
be rated for higher voltage, wattage, etc.
Components critical for safety are indicated in
the parts list with symbols A A . Use only
replacement components that have the same
ratings, especially for flame resistance and
dielectric specifications. A replacement part
that does not have the same safety
characteristics as the original may create
shock, fire, or other safety hazards.
6.
Observe the original lead dress, especially near
sharp edges, AC, and high voltage power
supplies. Always inspect for pinched, out-of-
place, or frayed wiring. Do not change the
spacing between components and the printed
circuit board.
Samsung
Electronics
l-l
Page 3
Precautions
1-2 ESD
Certain semiconductor devices can be easily
damaged by static electricity. Such components are
commonly called “Electrostatically Sensitive (ES)
Devices”, or
integrated circuits, some field effect transistors,
and semiconductor “chip” components.
The techniques outlined below should be followed
to help reduce the incidence of component damage
caused by static electricity.
CAUTION: Be sure no power is applied to the
Precautions
ESDs.
Examples of typical
ESDs
are:
chassis or circuit, and observe all other
safety precautions.
1.
Immediately before handling a semiconductor
component or semiconductor-equipped
assembly, drain off any electrostatic charge on
your body by touching a known earth ground.
Alternatively, employ a commercially
available wrist strap device, which should be
removed
applying power fo the unit under fesf.
2.
After removing an electrical assembly
equipped with
conductive surface, such as aluminum or
copper foil, or conductive foam, to prevent
electrostatic charge buildup in the vicinity of
the assembly.
Use only a grounded-tip soldering iron to
3.
solder or desolder
for
your personal
safety reasons
ESDs,
place the assembly on a
ESDs.
prior
fo
Use only an “anti-static” solder removal device.
4.
Some solder removal devices not classified as
“anti-static” can generate electrical charges
sufficient to damage
Do not use Freon-propelled chemicals. When
5.
sprayed, these can generate electrical charges
sufficient to damage
Do not remove a replacement ESD from its
6.
protective packaging until immediately before
installing it. Most replacement
packaged with all leads shorted together by
conductive foam, aluminum foil, or a
comparable conductive material.
7.
Immediately before removing the protective
shorting material from the leads of a
replacement
to the chassis or circuit assembly into which
the device will be installed.
Maintain continuous electrical contact between
8.
the
ESD
installed, until completely plugged or soldered
into the circuit.
Minimize bodily motions when handling
9.
unpackaged replacement
motions, such as the brushing together of
clothing fabric and lifting one’s foot from a
carpeted floor, can generate static electricity
sufficient to damage an
ESD,
and the assembly into which it will be
ESDs.
ESDs.
ESDs
are
touch the protective material
ESDs.
Normal
ESD.
I-3
Lithium Battery Precautions
1.
Exercise caution when replacing a Lithium
battery. There could be a danger of explosion
and subsequent operator injury and/or
equipment damage if incorrectly installed.
2.
Be sure to replace the battery with the same or
equivalent type recommended by the
manufacturer.
1-2
3.
Lithium batteries contain toxic substances and
should not be opened, crushed, or burned for
disposal.
Samsung Electronics
Page 4
t
-c
2 Specification
2-1
Transmitter
?
cc
Parameter
Document Size
Document Thickness
Scan Line Length
Effective Scanning Width
Scanning Method
Resolution
1
Normal
Max.
Min.
, I
Horizontal
Vertical
Horizontal Flat-bed scanning using
Vertical Stepping motor
Horizontal
Vertical Fine:
2lOx297mm
216
x
1500
mm
l52x76mm
0.085
x
0.115
mm
A4 paper,1 728
208 mm
203 pels/in (8
Standard:
Super Fine:
dots/mm)
3.85
7.7
15.4
scan elements along
lines/mm
lines/mm
lines/mm
Specification
CIS
(98
lines/in)
(196
lines/in)
(392
lines/in)
216
line length
I
2-2
Receiver
Parameter
Coding Scheme
Recording Paper Size
Effective Recording Width
Recording Method
Resolution
MH
(Modified
216
mm x 30 m, core
208 mm
Solid state Thermal Printing Head
Horizontal
Vertical Fine:
8 dots/mm
Standard:
Suoer
Fine:
Huffman)
12.7
(203 pels/in)
3.85
lines/mm
7.7
lines/mm
15.4
lines/mm
Specification
mm
diametre
(98
lines/in)
(196
lines/in)
(392
lines/in)
Samsung
Electronics
2-l
Page 5
Specifications
2-3
Line Control Block
Parameter Specification
Communication Facility
Line Coupling
Transmission Speed
Modem
Carrier Frequency
Control
Sianal
Output Level
Input Sensitivity
Input & Output Impedance
Public Switched Telephone Network
Direct
9600,7200,4800,2400 bps
QAM, DPSK
1 (V.29, V.27ter
I
1 1700
Hz
1 1800
Hz
1 1100
Hz
2100
Hz
300
bps
0
dBm
0
dBm
600
ohm f
and
with fall back function and
(9600/7200
(4800/2400
(CNG)
(CED)
(FSK)
to - 15
to - 43
30%
FSK
bps)
bps)
dBm +O.O I-3 dBm,
dBm
and -5
dBm
to
(PSTN)
V.21)
adjustable in 1 dB steps
-48 dBm
2-4
Others
r
Dialling
Dialling
Signal
Method
Parameter
Memory Capacity
Power Requirement
Power Consumption
(
Temperature
1
Relative Humidity
Dimension
Stand-by
In use
1
Width
Depth
Height
Weight
Specification
DP/DTMF
Memory
dialling, Redialling
5 memory dial (power on)
Check power label attached near the power cord connection.
7 Watt
Max.
115
Watt
150to95”F (lO”Cto35”C)
I20
to 80 % RH (Non-Condensing)
1 290
mm
(11.4
in)
245
mm
(9.64
in)
109
mm
(4.29
in)
3.0
kg
1
I
2-2
Samsung Electronics
Page 6
P
w
3.
Operating Instructions
3-1
How To Enter Service Mode
In service mode (tech) mode, the technician can check the machine and perform various test to isolate the
cause of a malfunction.
P
To enter service mode, press MENU, #,
confirm that the machine has entered service (tech) mode. While in service mode, the machine still performs
all normal operations. To return to normal user mode, press ‘MENU, #,
the power switch off, then on by plugging the power cord out, then in.
Options changed while in service mode do not remain changed, unless you first clear machine memory.
3-2
Changing Options
3-2-l
Selectable Options
GRAY SCALE LEVEL REMOTE RECEIVE CODE
Choose either 16 or 32
selected level is also used in the photo sending
mode. If you select 32 levels, transmission time is
longer, however the result at the receiving end will
be superior. This mode works only when the
remote machine is capable of super-fine mode.
CONFIRMATION REPORT PRINTOUT
gaey
scale levels. The
1,9,3,4
in sequence, and ‘TECH’ will be displayed in the LCD to
1,9,3,4’
This code can be used only with a phone extension
connected to the FAX machine. The user can
initiate FAX receive mode by entering a remote
receiving code on the extension phone. The code is
factory preset to * 9 * , and the middle digit may
be changed to any digit between 0 and
AUTO
IOURNAL
in sequence again, or turn
9.
Select whether a confirmation report prints each
time a user sends a fax.
YES: The machine prints out the report
automatically after each fax sent.
ERROR : The machine prints a report only when
there is an error.
NO: The machine does not print the report
automatically. User can print the list on
demand.
RING BEFORE ANSWER
Select the number of rings the machine allows
before it answers a call in
mode.
automa
tic receiving
The fax machine prints the TX/RX journal
automatically after every 50 fax sessions.
MODEM SPEED
Select baud rate of
The lower the baud rate, the larger the acceptable
error rate.
bps in the protocol mode. When the TX speed is
set to
V.29
or
2400
T30
9600
or
or
V.27 ter.
bps, the RX speed will be V.27
9600,7200,4800,
protocol has a fixed speed of
7200
bps, the RX speed will be either
When the TX speed is set to
or
2400
ter.
bps.
300
4800
Samsung
Electronics
3-l
Page 7
Operating Instructions
CALL TRANSFERRING
This feature allows the fax machine to transfer
incoming caller’s message to a specified remote
location.
Choose YES to turn on this feature. The LCD
display asks to enter the telephone number you
want to be transferred.
Choose NO to turn off the feature.
CALL MONITORING
This feature enables you to hear callers leaving
messages on the machine.
Choose YES to turn on this feature.
Choose NO to turn off this feature.
CHARGE SAVER
This feature lets the user dial into this machine
from a remote phone and check whether anyone
has left a message without being charged for a
charge call. When charge saver is on and there are
messages waiting to be heard, the machine
answers on the number of rings you specify in the
ring count option. If there are no messages, the
machine answers on the second ring after the
number specified. This gives the user time to hang
up the phone before the machine answers - and
saves the price of the call.
REMOTE PASSWORD
You can change the three-character password used
to access your machine from a remote phone. The
password is preset to
nine pound) at the factory. The first and the last
##‘s
are fixed, but you can change the middle
numbers from 0 to 9. The machine doesn’t accept
double character codes
passwords, because line conditions can
occasionally make the machine fail to recognize a
double digit code.
Enter the characters you want to use, then press
START.
“#139#”
(pound one three
(ex
119,229 etc.> as
BATTERY ALARM
You can turn on the battery alarm feature. With
this feature on, the machine displays the low
battery message in the LCD and sounds beeps to
alert you low battery condition.
Choose YES to turn on the battery alarm feature.
Choose NO to turn off the battery alarm feature.
CHECK BATTERY
If you want to check the remains of the battery,
press START button. The machine displays the
remaining capacity of the battery in the LCD.
Choose YES to turn on charge saver.
Choose NO to turn off charge saver.
MESSAGE RECORDING TIME
You can select the maximum time allowed for
caller messages and memos.
If you choose YES, the LCD display shows you the
time limits available : 0 second, 30 seconds,
seconds or 90 seconds. Choose the proper time. If
you choose 0, it allows callers to hear the greeting
message but doesn’t permit them to leave
messages.
60
3-2
LINE MONITOR
You can hear line signals through a tone speaker.
The volume is adjustable.
Choose YES to monitor the line signal.
Choose NO to turn off this feature. Speaker will be
active only for dialing, the starting part of the
phase B of CCITT, and key tones.
TRANSMISSION LEVEL
You can set the transmission level to between
0 and
-15
dBm in 1 dB steps using the control
panel keypad.
Accuracy is + 0
/-3 dBm.
Samsung
Electronics
Page 8
Operating Instructions
RECEPTION LEVEL
*
Reception level may be too low due to cable losses.
If set to
between 0 and
If set to
between -5 and
-43
dBm, reception sensitivity will be
-43 dBm.
-48
dBm, reception sensitivity will be
-48 dBm.
CABLE EOUALISZR
Copper telephone wire attenuates low frequencies
less than high frequencies. The longer a cable is,
the more pronounced the effect. To compensate for
this attenuation you may need to set the machine
to match the cable length currently used. Select
short or long.
BUSY ON DROP OUT TIME
While checking busy on time, if any signal noise is
detected, the machine will ignore the signal noise
unless it is greater than a specified time.
RING ON CHECK TIME
The machine must receive a ring signal with a
specified active time from a telephone exchange in
automatic reception mode. In this case, the
detection time that the machine agrees to be valid
the
inputed
option. If the activation time of ring signal is below
of the set value of the ring on check time, the
machine can not detect this ring signal.
ring signal is changeable by this
RING OFF CHECK TIME
The machine have to receive a ring signal with
specified inactive time as well as active time. This
option is able to change the inactive time. If the
inactive time of ring signal is above of the set
value of the ring off check time and below of the
set value of the “ring check maximum time”, the
machine can detect this ring signal off
(Ol-99,1=10 msec)
RING CHECK MAXIMUM TIME
e
w
BUSY OFF DROP OUT TIME
While checking busy off time, if any signal noise is
detected, the machine will ignore the signal noise
unless it is greater than a specified time.
FLASH TIME
This feature allows you to change the flash time.
BUSY TONE DETECTION LEVEL
While checking tone in ANS/FAX mode, If any
signal which is great than set level is detected for a
few seconds the machine will disconnect the line.
PAUSE TIME
Adjust the period of pause time to wait for a
second dial tone in a PABX or mobile paging
system. You can adjust the time from 1
(1
to
9).
set
to 9 set
This option is able to change the inactive
maximum time. If the inactive time of ring signal
is above of the set value of the “ring off check
time” and below off the set value of the ring check
maximum time, the machine can detect this ring
signal off. If the time is above of the set value of
the ring check maximum time the previous ring
counter is cleared.
(Ol-99,1=100
msec)
3-2-2 Changing Options
Press MENU, 3, START/COPY in sequence. Press
)
or 4 to select the desired option item. When
the desired option item appears, press START and
use ) or 4 to change the status of a selected
function.
Samsung
Electronics
3-3
Page 9
Operating instructions
3-3
Test Mode
Test mode is used to test machine functions. To enter test mode, press MENU, 0, START/COPY buttons in
sequence.
TPH TEST
You can print a
sample test pattern.
TPH
test pattern and check the heating element of
Figure
3-1: TPH
Test Pattern
TPH
with this test pattern. Figure
3-1
is a
CIS TEST
You can check the scanning elements of the CIS (Contact Image Sensor) and print a shading waveform
graphically with dots. The graph waveform will resemble figure
3-2,
below.
CIS TEST
i
i
Figure
3-2: CIS
Shading Waveform
I
3-4
Samsung Electronics
Page 10
Operating Instructions
w
“c
MODEM TEST
The modem will send various transmit signals on
the telephone line. You can check the following:
l
FSK
test
l tones:
l
3-4
A number of useful reports can be printed in service mode. One of these lists is the protocol list, which
contains detailed information which may be required when contacting technical support. To print this list,
press MENU, 4, START/COPY in sequence.
1100
Hz,
1650
Hz,
G3
training:
9600,7200,4800,2400
Report Printout
1850
Hz,
2100
bps
Hz
ROM TEST
Tests machine ROM (Read Only Memory). The
result and the software version appear in the LCD
in the following format:
CHKSUM= XX, VXX, OK
MEMORY CLEAR
Erases contents of RAM. When memory is cleared,
the machine returns to default settings.
c
c
c
CI
m
*
When a report name appears in the display, scroll through the list of reports by pressing ) or 4. When a
desired report is selected, press START/COPY.
CONFIRMATION REPORT
Shows the last transmission result.
VOICE STATUS REPORT
Shows the status of the recorded voice messages.
TRANSMISSION
Shows information about faxes sent.
RECEPTION
Shows information about faxes received.
TELEPHONE NUMBER LIST
Lists all numbers stored in the machine’s onetouch and speed
TOURNAL
IOURNAL
dialling
memory.
SYSTEM DATA LIST
Shows all options that were set in user mode and
service mode.
PROTOCOL LIST
This list is available in the service mode only, and
shows the sequence of the CCITT group 3
protocol during the most recent TX or RX
operation. You can check for send and receive
errors with this list.
If a communication error occurs while the machine
is in service mode, the protocol list will print
automatically.
HELP LIST
This report illustrates the machine’s basic
functions and commands. Use as a quick reference
guide.
T.30
Samsung
Electronics
3-5
Page 11
Operating Instructions
3-5
LCD
Disdav
3-5-l During communication
In user mode, the LCD shows the remote
machine’s TTI number, communication type,
(send or receive), and page number.
In service mode, the display shows the
communication type, abbreviations for the CCITT
Group 3
type
and line time.
T.30
(G3),
coding type
protocol as they occur, the protocol
(MH),
baud rate in kbps,
3-5-2
If a communication problem
occurs:
In user mode, the display shows one of the
following reasons: PAPER JAM, SEND ERROR,
or RECEIVE ERROR.
In service mode, the display shows all error
messages available in user mode, as well as
additional error messages not available in user
mode.
Error messages shown in service mode only are as
follows:
PRE-MESSAGE ERROR:
problem occurred during phase B of session
MESSAGE ERROR:
problem occurred during phase C of session
POST-MESSAGE ERROR:
problem occurred during phase D of session
LINE ERROR:
machine cannot connect or has lost connection
with the remote machine
Additional messages, not shown above, will
appear in the transmission and reception journals
printed in service mode.
3-6
Samsung
Electronics
Page 12
1c
4.
Disassembly and Reassembly
Note: Make sure power is OFF, and unplug the power cord from the wall outlet.
4-l
Handset
Disconnect the handset cord modular plug from
l
the machine.
l Remove the two rubber dummies from the
holes and loosen the two screws.
Push the upper cover in the direction of arrow
l
to remove.
c
w
4-2
TX Guide & White Roller
l Open the operation unit assembly.
l Disengage the stopper.
l Remove TX guide.
l Remove white roller.
Figure
Figure
4-1
4-2
Samsung
Electronics
4-l
Page 13
Disassembly instruction
4-3. TOD
l
Loosen the six screws fastening the top cover.
l Carefully lift the top cover as shown in the
Cover
direction of the arrow.
Figure
4-3
4-4. OPE
l Disconnect the harnesses from the Main
l Loosen the two screws fastening the Main
l Disconnect the harnesses from the
l Remove the OPE unit from the base unit.
Unit
LIU PBA.
PBA.
PBA.
Main PCB
Figure
4-4
4-2
Samsung Electronics
Page 14
Disassembly Instruction
w
4-4-l. OPE
l Loosen the seven screws fastening the OPE
unit.
l Carefully lift the OPE cover in the direction of
the arrow as shown.
Cover
Figure
4-5
4-5.
Main Frame
l Loosen the screw fastening the power supply
and earth harness.
l Loosen the five screws fastening the main frame
assembly.
l Lift the main frame assembly and D.DET sensor
PBA.
Figure
4-6
Samsung
Electronics
4-3
Page 15
Disassembly Instruction
4-6. LIU PBA &
l Loosen the six screws fastening the
POWER SUPPLY
and Power Supply unit.
l Lift the
LIU PBA
and Power Supply unit.
LIU
PBA
Figure
4-7
4-4
Samsung Electronics
Page 16
5.
Circuit Description
c
+
*
*
5-I General
The main circuit board consists of memory, MODEM, TX- and RX-related circuitry, TAD, and the Integrated
Facsimile Controller
(IFC),
which includes the CPU and I/O device drivers and controls the system.
5-2 IFC
This circuit consists of the data and address bus, real time clock
controller, Thermal Print head controller,
IFC
including I/O port, and system reset circuit.
5-2-l Memory Map
The external memory of the CPU is divided into
32kB
RAM
(FFOOOOH
FFFFFF
(OOOOH
through
ROMcsn
through
FFFFFFH).
SOOOH)
and
64kB
ROM
(RTC),
,#,’
,**’
,*’
image sensor, motor driver
:
,,*’
”
Reserved
Setup
Registers
Operational
Registers
OOFEFF
OOFEEO
OOFE80
c
c
FOOOOO
OFFFFF
000000
Not
Available
CSOn
Figure
5-1: XFC
:
-jiyq;
Memory Map
DBCMC
Buffer
Dither Table
OOFEOO
OOFDFF
OOFDCO
OOFD80
OOFDOO
F B80
OOEOOO
Samsung
Electronics
5-l
Page 17
Circuit Description
5-2-2
Data & Address Bus Control
5-2-3
System Clock
/RD
and
/WR
signals are active in the low state,
with TSTCLK high, and an internal wait state
occurs in the TSTCLK (6 MHz). These signals are
sent to the
/RD
and
/WR
ports of RAM , ROM,
and the MODEM in order to read or write data
when a chip select line is active.
/CSO:
RAM chip select active (low)
/ROMCS:
/MCS:
DO -
A0 - A19:
ROM chip select active (low)
MODEM chip select active (low)
D7:
8 bit data bus
address bus
COMMUNICATION
STB O-3
I
PRINTER
DATA
CONTROL
AND
SENSORS
PDAT
1
PCLK
-
PLAT
THADI
The 6 MHz internal clock frequency is generated
by dividing the 12 MHz system clock from
MODEM by two inside the MODEM.
IFC(XFC-6)
IROMCS
IRAMCS
IRDIWR
DO-D7
AO-A17
RTC
CRYSTAL
c
)
EXTERNAL
BUS
Figure
5-2: XFC
IRDIWR
DO-D7
AO-A4
IMCS
IMIRQ
SYSCLK
IPWRDWN
REST0
IBATRST
Hardware interface Signals
MODEM
w
5-2
Samsung
Electronics
Page 18
Circuit Description
5-2-4
Real Time Clock
(RTC)
minutes, seconds, year, month, and day.
A battery maintains operation when power is off.
XFC-B
co=6~~~
I
can up-track 32 years, beginning with
co=12
LEAP YEAR
DECODER
co=6k[z
7
5 BIT
I
CO=24
1
DRIVER
I(r
c
This circuit receives clock pulses from an external
32.768 kHz
crystal, which it divides into hours,
5BIT
1Hz
H
SECONDS
CO=28,29,
30,0r
32768 KHz
-
BUSY FLAG CLEAR BUSY FLAG
:
15
BIT
PRESCALER
-
6 BIT 1
31
4 BIT
MONTHS YEARS
1992.
1
5-2-5
Print Control
The
PCLK
and
print data to the
PDAT
signals synchronise serial
TPH.
PLAT latches TPH serial
Figure
5-3: RTC
print data to the TPH from a shift register through
PDAT.
STBl - STB4 enable TPH printing in four
sequential intervals.
Print
Cmd
A
(MSINT
PrintLine
Cary-out)
Shifi
Data
Shift
Clk
n
Sh
D
Sh
C
IIIIlIIIIIIIIllI
Block Diagram
This system has a
determines
STB
High/Low enable status
according to the STBPOL signal.
Print
Cmd
A
n
I
I
wiiiiiiiiir
lOms/Line
Sh
printing format and
D
Sh
C
llllllllulllllll
Samsung
STBl
STB2
Electronics
I
Figure
5-4:
Printer Timing
5-3
Page 19
Circuit Description
5-2-6 TPH
The
ADC
filter, and 9 bit up/down counter. The 6
A/D Converter
is composed of a 6 bit DAC, comparator,
MSBs
of
the 9 bit counter generate a reference signal to the
comparator. TPH temperature or DTAD back-up
voltage is sensed by comparing
THDI
DAC
output
DAC
out
Comparator
t
voltage to the comparator with the thermistor
input voltage
output signal from the
proper strobe pulse to the
input voltage
(THDI),
(THDI)
which originates as an
TPH.
It then supplies the
TPH.
The thermistor
operates within a range of 1
to 4v.
Counter
Clock-------i
%
m
m
B
0
6
MSBs
c
Battery
I I
Approximate values
Figure
(TPH
5-5: ADC
Block Diagram
I
Temperature) of
R28
and
R29
can be calculated
from the following formulas:
R28 = 0.25
R29 = (15Rth
x
(R29
(Tl) x
x
Rth (Tl)} / (R29
Rth
(T2)}/
{Rth
+
(Tl)
Rth
(Tl)}
-16Rth (T2))
Where Tl = minimum temperature, T2 = maximum temperature.
THDl
GND5
5-4
Figure
5-6:
THD Connection Circuit
Samsung Electronics
Page 20
c
*
5-2-7
Operation Panel Control
Communication
A Synchronous/ Asynchronous
Receiver/Transmitter
transmission between the main circuit board and
the operator panel.
(SART)
CPU Bus
controls serial data
SclkCtrlLo
+
SclkCtrlHi
Circuit Description
c
9
Band
Gen (8x)
Tx/Rx Control
IRQ
control
t
SARTCmd
4
+
Figure
-
-
5-7:
SART Block Diagram
) SartlRQ
RxShift Reg
(SARTData)
RxBuffer
---)(j SCLK
4
1
4
RXD
Samsung
Electronics
Page 21
Circuit Description
5-2-8
Image Sensor
The shading wave is formed by scanning the white
roller prior to a document. The slice level is
determined by the shading wave, and
Shading Correction
0
‘+,,-I
Inversion
a
Mutiplier
enhancement
Table
a
8x6
k
’
--p=’
Shade
RAM-
FADC
-*--------------------i---------~------------------------------O
Q
! _ _ _ _ -#A _
6
Gray Scale
Image
I
compensates for shading distortion according to
the
CIS
characteristics. The wave format from the
CIS
is converted into a 6 bit digital value in the
image processor, and then processed in B/W or
intermediate mode.
0
____________
a
Texf
mode image
1
I
External
IFC
0
Inversion Table
@
Shading Enabled (ShadeEnb)
@
Edge Enhancement Enabled (EdgeEnhEnb)
@
Dynamic Background and Contrast Control
Enabled (DBCCErr~
Enabled
Figure
(ShTbEnb)
5-8:
Scanner Image Processing Block Diagram
-
- - - - -
Primary Paths
Secondary (optional) Paths
External
Video
Processing
Data Input
5-6
Samsung
Electronics
Page 22
Circuit Description
5-2-9 CIS
Input Processor
Processing to compensate for
CIS
shading
distortion is controlled with MUXA ‘low’ and
*
To process the B/W input signal, maximum
(+VREF)
and minimum (-
VREF)
values of the CIS
input signal are controlled by calibrating MUXA
and
MUXB
in the high state for the maximum
MUXB ‘high’. For B/W mode, MUXA should be
‘high, and MUXB ‘low’. For half-tone, MUXA is
‘low’, and
MUXB
is ‘high’.
level, and setting them to earth for the minimum
level.
XFC-B
Scanner Image
Processing
[
External Circuits
. . . . . . . . . . . . . . . . . . ,
!
Shading RAM
z................;
: External
;
RAM :
i....*...........(
{
Line Buffer
. RAM
*.................
!
i
i
i
J
Scanner
r--l
5-2-10 CIS
The
CIS
driver clock frequency is
Figure
Driver
5-9:
250 kHz.
Scanner Interface Block Diagram
A
75%
duty cycle is used to lengthen the charging time. A
250 KHZ (L:DUTY 75%)
CLOCK
SI
-
4------------------------------------------------*:
1 LINE
start signal is provided every 10 ms to match the
line scanning time. Actual image signal is
provided in less than
6.8
ms, using the
250 kHz
clock and taking A4 paper size into consideration.
Samsung
Electronics
5-7
Page 23
Circuit Description
5-2-11 l/O
Port Table
I/O
0
0
0
I
I
0
MODE DETECT SENSOR OPEN
I
I
0
0
0
SIO
SIO
SIO
0
I
0
ACTIVE STATE
SPEAKER DISABLE SPEAKERENABLE
CML
RELAY ON (FAX)
DSP
HIGH BYTE SELECT
MODEM TX PATH DSP OGM
TPH TEMPARATURE
MIC.
OFF
ICM
RECORD PATH
OPE MICOM
DSP
RESET
DSP
DATA PUMP DISABLE
TPH
POWER
CHECK
TX
(+24 V)
(H)
ON
ACTIVE STATE
CML RELAY OFF (TEL)
DSP
LOW BYTE SELECT
RING DETECT
DSP
ACKNOWLEDGE
TX PATH
MODE DETECT SENSOR CLOSE
DTAD
BACK-UP BATTERY CHECK
MIC.
OFF
ICM
RECORD PATH
OPE MICOM
DSP
DATA PUMP ENABLE
TPH
POWER
TX
(+24 V)
(L)
OFF
116
115
106
105
104
103
GPO2 VOL-B
GPO 3
GPO 4
GPO 5
GPO 6
GPO 7
VOL-c
MPA
MPB
/MPA
/MPB
0
0
0
0
0
0
0
MOTOR PHASE A
MOTOR PHASE B
MOTOR PHASE - A
MOTOR PHASE - B
5-8
Samsung
Electronics
Page 24
c
c
5-2-l
2 Motor Controller
The
SFllOT
performs sending, receiving, and
printing functions utilising a single 24 volt motor.
This motor has a
150
ohm winding resistance.
Three drive strobe pulses operate the motor.
Table
5-l 1:
Motor Functions
Circuit Description
5-2-l
3 Miscellaneous Signals
The key click consists of an
800
Hz tone of 20
duration.
/REST0
drives MODEM
(/PORI),
UART
and serves to reset the MODEM, UART.
/MIRQ
is the MODEM interrupt signal.
ms
(/POR)
i’+
Motor Function Drive Strobe
Swing Gear Control
Document Out 1oopps
Super Fine Mode
/
Other
1
I
XOUT
BATRSTn j
100 pps
1oopps
1oopps
~
1
2 phase
ok (TSTCLK)
Watchdog Reset
(1-2 Reset clocks)
Lockout
2 phase
l-2
phase
5-2-l 4 Reset
Two power resets and a watchdog timer in the
comprise the elements of this circuit. Battery
power reset
(
battery-powered logic, and primary power reset
(/PWRDWN) initialises non-battery-powered
logic when system power is supplied.
to battery (BadwpConllg)
(/BATRST)
t
Power up Delay 2
(8
TSTCLKS)
TO
~ntemal logic -
Clock enable
register reset
loCkout
IFC
is used to initialise the
RESETn
-:
R-S”
w
b
set mstate
Figure
5-12:
POWER MONITOR
If 5V power to
and
4.35V
indicated and the output of
(GND).
This causes the
(‘low’=reset).
IFC/RESET terminal to be reset. The output
terminal of
configuration, and is connected to
10k
pull-up resistor.
Samsung
KIA7045P
(typically
The
IFC
KIA7045P
Electronics
drops to between
4.5V),
power failure will be
KIA7045P
IFC
to become active
will go ‘low’
reset causes the MODEM
is an open-drain
PFC
through a
Trlstate
t
Control
-
Power Reset Block Diagram
WATCH DOG TIMER
4.65
This programmable counter in the
every 2
ms.
automatically reset and switches to initialise mode.
BATTERY POWER RESET
When battery power (VB) is applied to
time, VB
causing a reset to occur.
CUrrent
t
If not reset after
ESLIltS in
/BATRST going ‘low’,
250 ms,
IFC
is reset
the system is
IFC
the first
5-9
Page 25
Circuit Description
5-3
Memory
System memory consists of
64kB
ROM and
32kB
RAM. Ail of RAM is backed up. ROM and RAM are
selected by chip select lines, and data is accessed by the units position of the byte.
c5V power is applied to RAM through
lk
resistor in series with the positive battery terminal is for battery protection.
5-4
Modem and TX- and RX- Related Circuits
These circuits control signal transmission between the internal MODEM and the
VB.
The
SFllOT
model facsimile machine uses a Li(thium) battery. A
LIU
or a remote MODEM.
The R96DFXL MODEM is a single-chip fax-MODEM having features to detect and generate
TX OUT is the MODEM output port, and RX IN is the input port.
MODEM initialisation at system power on. DO - D7 are data buses.
signals which determine the mode.
/MCS
is the chip select signal,
control signals. RLSD is used for v.24 interface-related signals and
Refer to Figure
PIN NO PIN NAME
100
1
2
3
4
5
63
61
75
76
94
93
91
GP
02
GP 03
GP
04
GP
05
GP
06
GP
07
GP
11
GP
13
GP
16
GP
17
GP
19
GP
20
GP
21
5-14
for available R96DFXL I/O ports.
CIRCUIT NAME
HT-BI
HOOKDET2 I
OFF-RST
RX-CTRL
-GLED
I/O
0
0
I
I
0
0
I
I
I
I
I
I
ACTIVE STATE
HALFTONE MODE
OPE
RESET
RX PATH
CIS LED ON
/PORI
is the
IFC
signal which enables
RSO-
RS4 are internal register select
/RD
and
/WR
are the read and write
/MIRQ
(H)
is the MODEM interrupt.
DESCRIPTION
BINARY MODE
EXTERNAL TEL. IN USE
REMOTE PATH
CIS LED OFF
DTMF
tones.
5-10
Samsung
Electronics
Page 26
Circuit Description
f-
F
5-4-I Transmit Circuit
This circuitry controls transmission of analog In receive mode, analog signals from the
signals from the MODEM. Output voltage from
the MODEM is buffered through the
and OP amp after signal smoothing and filtering,
and finally output to the line.
5-5
TAD
TAD circuit consists of a voice coprocessor to record and play voice messages in voice memory.
LIU
board and smoothing filter.
5-5-l Recording Path
R55
provides power to the condenser microphone.
Voice signal from the microphone is passed
through active filter
to clear
and amplifying the signal. Q5 and Q2 compose
ALC
(U22)
converts the digital signal from voice coprocessor
into analog for line output.
aliasing
(Automatic Level Control) circuit. CODEC
converts the voice signal to digital and
U15, R117
noise occuring while sampling
and
C96, R82, C58
5-4-2
Receive Circuit
board are transferred to RX IN through the
5-5-3
Line Input and Play Path
Incoming signals from line are stored in the voice
memory (4 M DRAM) through CODEC and
DRAM controller. When played,
the data stored in voice memory and sends it out
to
LIU
through CODEC and
through the speaker,
speaker through
amp.
R108,
DSPG
MUX
DSPG
R108.
To playback
sends the signal to
(U12, U14),
LIU
BPF
DSPG
processes
and op
5-5-2 Mic
Transmit path functions as
Outgoing messages and memo messages from
CODEC
DRAM) through the
Input Path
MIC
input path.
are stored in the voice memory (4 M
DSPG
DRAM controller.
5-5-4 DSPG
This circuit consists of Host Interface, Memory
Interface, CODEC Interface, and
Interface sends and receives data to and from
Memory Interface sends and receives the
compressed voice data to and from DRAM to play
back and record voice data.
communicates with host
Interface.
5-5-5
Voice Backup
+5V
is supplied for voice memory through VBT
when power is on. When power is off,
supplied from the 9V backup battery.
IFC
DSP
core. Host
DSP
core
through Host
+5V
IFC.
is
Samsung
Electronics
5-11
Page 27
Circuit Description
5-6 LIU PBA
The
LIU
(Line Interface Unit) interfaces the MODEM and telephone to the telephone line. The FAX and
telephone portions of the
telephone circuitry operates, powered by telephone line voltage. The FAX portion of
interface between MODEM and telephone line, and the circuits for DC loop feeding, DP signal, loop current,
and ring detect. The telephone portion is divided into ringer,
Schemetic and Wiring Diagram sections of this manual. Refer to
LIU
are active with machine power on. When machine power is off, only the
LIU
consists of the
dialling,
and speech circuits. Refer to the
LIU
circuit and Block Diagrams.
5-6-l FAX section
MODEM/ LINE INTERFACE
This is the path for data and remote control
signals.
l
CML201
FAX and telephone circuits.
l
U201
Single ended input from transformer
l
U201
Output for driving transformer
AC impedance larger than 10 kohm.
l
C202: DTMF
kohm winding under idle conditions and DC
blocking for 20 kohm winding.
l AC impedance: The AC impedance of
LIU)
(C215)
input) port. With external resistor
pin 34
ohm.
output) port is an N-channel open-drain output
to control the external high power shunt
transistor for synthesizing AC and DC
impedances.
l DC conditions: Normal operating mode is from
15 mA
reduced performance is 5 mA to 15 mA. In the
line hold range from 0 mA to 5
in a power down mode and the voltage at
pin 37 LI (Line Input) port is reduced to a
maximum of 3.5 V. The DC characteristic is
determinedby the voltage at
and a
Pin 39 LS port. It can be calculated by the
equation:
VL~
relay: switches telephone line between
pin 3 TIT (Telephone Input Transformer):
(T202).
pin 3 ROT (Receive Output Transformer):
(T203)
with an
and CNG detect path to
T20120
U201 (I-
is set to
at
U201
to
1000
ohm by external capacitor
U201
pin 8 CI (Complex Impedance
(R249)
AC1
port it can be programmed to
pin 35 CS (Current Shunt control
100 mA.
An operating mode with
mA,
at
600
the device is
U201
U201
pin 37 LI port
R215
=
resistor between
VLI
+
ILINE
x
R215
U201
pin 37 LI and
U201
RING DETECT
U201
pin 28 (MO) is the ring tone output port and
drives
Q207,
which drives FET202 and the
buzzer. The driving signal of the
applied to photo coupler
LLC
(Line Loss Compensation)/LOOP
U204.
piezo
piezo
buzzer is
CURRENT DETECT
l The
LLC
is a pin option. When activated, the
transmit and receive gains for input and output
are decreased by 6
when
U201
pin 31
dB.
Line current is 20
LLC
is connected to
AGND
and 75 mA when this pin is connected to
The
LLC
is deactivated when
connected to
l When the
Vss.
CML201
relay or hook switch
switches to telephone line,
LLC
U201
pin is
on the
LIU
board and U6 on the Main board start
communication.
U201
sends
<Ack>
message
which contains line current information. Using
this line current information, Main CPU can
recognize a parallel phone.
SERIAL INTERFACE
U201
pin 11 RXD : Schmitt
triger
input
(threshold = 2.5 V) to serial interface.
U201
pin 29 TXD : Open-drain output from
serial interface.
The communication is via a standard
Baud Rate
9600
UART:
Start Bit 1
Stop Bit 1
Date Bits 8
Parity Bit None
LSB
is transferred prior to
MSB
mA
Vcc.
5-12
Samsung Electronics
Page 28
Circuit Description
c+
p*
f-9
*\
5-5-2
Telephone Section
RINGER CIRCUIT
l When a ringing voltage is sensed on the line,
Vcc
of
U201 (I-LIU)
path. When operating voltage is reached, the
oscillator starts and
frequency. After a valid ring frequency is
applied to the
Discrimination) port, the ring tone generator of
U201
sends out a
MO (Ring Melody Output) port.
l
U201: I-LIU
l Ring frequency passes through DC blocking
capacitor
and associated components.
C201
Austria) and
Switzerland or Austria) to
port.
l Line ring AC voltage passes through DC
blocking capacitor
R203,
diode bridge
switch to
FET202 (BS170) pin3,
R226.
l The ring frequency discriminator of
assures that only signals with a frequency
between 13 Hz and 70 Hz are regarded as valid
ring signals.
*
When a valid ring signal is present for 73 ms
continuously, the ring melody generator (pin
MO) is activated and remains active as long as a
valid ring signal is present.
l
U201
filters the ring signal and applies it to
output pin 28 (MO). This is the
drive signal.
l The 3 basic melody frequencies are:
F2
=
1067
Hz and F3 =
rate is set to 4 which means that the sequence of
Fl, F2, F3, Fl, F2, F3
second.
is charged via an external
U201
detects the ring
U201
pin 25 RFD (Ring Frequency
3-tone
melody via
or
C234
(for Switzerland or
zener
diode ZD205 or
U201
pin 25 RFD
C201,
current limit resistor
BD201,
CML relay and hook
C217,ZD207 and
piezo
1333Hz.
The repetition
is repeated 4 times per
U201
ZD209
U201
buzzer
Fl
=
pin
880
(for
28
28,
Hz,
Current Sense Input).
DP
DIAL
l
U201
pin 2
(DMS)
is set to
(40/60)
l Dial pulses originate at
which toggles
by R227 or
Q205,
R228.
Vcc (33/67)
U201
driving
pin 27
Q201.
The resulting
or Vss
(DPn),
intermittent voltage interrupts the telephone
line.
l Pulse MB ratio is set by
Vcc
=
33~67,
and
Vss
l
U201
pin 35 CS port: Modulation and shorting
the line during make period of pulse
=
U201
40160.
pin 2
MDS
dialling.
port.
SPEECH CIRCUIT
l
U201 (STI9510)
l Handset transmitter circuit
and associated components.
Transmit (condenser mic.) of handset is filtered
by
R213, R242, R243, R244, C221, C223, C224,
C225, C231, C232
by
U201
pins 32 and 33 (Ml,
and
C246,
and then amplified
M2).
. Handset receiver circuit
Dynamic
C226, C227, C228
U201
l
U201
recever
pin 1
pin 39
of handset is filtered by
and
C248,
and then applied to
(ROH).
(LS)
is audio output to telephone
R245,
line.
SIDETONE CIRCUIT
l Sidetone audio characteristics are controlled by
R217, R218, C212,
pin 7
STB.
and
C214,
connected to
U201
MF
DIAL
l
U201
pin 2
DMS
(Dial Mode Selection) port is
set by
T/P
switch
l
MF
signal appears (tone level of low group:
typical
-14 dBm)
Generator Output). This signal is
‘9
c
R248, R250
pin 9
l Line dial signals appear at
Samsung
and
MFI (DTMF
Electronics
(SW202).
at
U201
pin 4 MFO
C235,
then to Amplifier
Amplifier Input).
U201
(DTMF
levelled
by
U201
pin 39 LS (Line
5-13
Page 29
Circuit Description
5-7 OPE PBA
OPE PBA
Refer to OPE Circuit and Block Diagrams.
l Signals from the key matrix are delivered to
l Connector
l
U300
l Display from controller is received at
l LCD drive signals are
l Machine status LED drive signals are
.
Paper empty sensor staturs delivers to
consists of
P4
pin 4 (RX DATA) is UART data to MAIN
U300 (MICOM Z8601),
is NPO (No Power Operation) key matrix output.
U300
U300 P2-X
UART
pin group, connector pin
U300
U300
MICOM
Z-8601
i
2
/ )
LCD, key matrix, LED indicators, and the paper empty sensor.
U300
X/Y input pin group @‘l-X).
PBA.
pin 5 (TX DATA).
P2-1 - P2-3.
PO-X pin group.
pin
39.
(High: paper empty, Low: paper exists).
4
/
a
+;
(qz+iiq
Connector
Reset
Figure
J-q
T
5-13 OPE
Block Diagram
5-14
Samsung Electronics
Page 30
T
6.
Troubleshooting
6-1.
Overall Troubleshooting Flow
Plug in the power
cord
f
Load document in
feeder
OGM
Recording
Push ‘START Key
Call machine from
another phone
Samsung
Electronics
6-l
Page 31
Troubleshooting
6-2
Samsung Electronic
Page 32
6-2.
Check Power Supply
Troubleshooting
Check AC socket
Connect as required
Replace Cord Replace Fuse
Check Ul waveform
Notify customer
Check
Cl2
Voltage
Replace Fuse
d
Check Ul output
waveform
~
IF”?
Samsung
Electronics
Remove short
Replace
Ul
6-3
Page 33
Troubleshooting
6-2-l
No
+5V
Check CON 1
Check
U2
Input voltage
Check PCB Pattern
6-2-2.
No + 12 V
Replace
U2
Check
CON1
Check PCB Pattern
6-4
Replace
U3
Samsung Electronics
Page 34
6-2-3
No
-12
V
Check
U4
Input voltage
Troubleshooting
f-7
Remove short
Check PCB Pattern Replace
6-2-4
No +
24V
U4
Replace
Check
D4
CON1
pii---)
Samsung
Electronics
Remove short
Replace
Check
D3
CON1
Cl2
Discharged
*(x---)
Page 35
Troubleshooting
6-2-5
+ 24 V TPH
(y-c---)-
i
Doesn’t output
Remove short
1
6-6
Samsung
Electronics
Page 36
6-3.
System Not Initialized
Start
7
f
Check
vcc 2 4.75
Pl-10 (+5V)
Pl-11,12 (GND5)
v
N
Replace
Voltage detector
U3
Troubleshooting
IC
Clock
Ul-133
Clock
UlO-69
Replace
Xl
XTAL
Samsung
Electronics
6-7
Page 37
Troubleshooting
Continued
6-8
End
23
Samsung Electronics
Page 38
6-4
Document Not Loading
w
Start
Insert Document
I
rourxesnoorlny
Replace D-DET PBA
Replace
I
Ul
I
See Section
6-2
Samsung
Electronics
6-9
Page 39
Troubleshooting
6-5
No Copy Mode Operation
(--yL--)
Reloading Document
Replace
Replace
Ul
U4
Replace
U2
Replace Main
See Section
PBA
6-2
Replace
Ul
6-10
Samsung Electronics
Page 40
Continued
Troubleshooting
rcplrirlll
i
See Section
Replace CIS
6-2
I
Samsung
Electronics
6-11
Page 41
Troubleshooting
6-6. OGM
Y
Not Playing Back
Speaker On
Replace
Mic.
Replace main
board
I
7
END
Y
v
Replace speaker
Replace
U20
6-l
2
Samsung
Electronic
Page 42
Troubleshooting
6-7. ICM
Call machine
from other phone
Not Recording
N
)
Check
LIU
board
J
Samsung
Electronics
End
CT3
6-l
3
Page 43
Troubleshooting
6-8.
Malfunction in Auto Answer
Start
7
*
Call machine from
another phone
Replace
Q
LIU
I
board
h
Replace
Ul
D
D
6-14
Samsung
Electronic:
Page 44
6-9.
Malfunction in Manual Receiving
Lift handset from
Check hook
switch in
CONN
board
Troubleshooting
Y
W
Check
LIU
board
Replace main
board
)
Replace
LIU
board
l
l
Samsung
Electronics
6-15
Page 45
Troubleshooting
6-10.
Automatic Receive Malfunction
Call fax
/
machine
4
Y
Auto Answer ?
Y
Machine to
N
0
“Manual Receive
Replace:
Main Board
i
I
6-l
6
Samsung Electronics
Page 46
6-11.
Troubleshooting
No Dial Tone
Press
OHDIV.REQ.
OK
I
check service at
NG
Lift Handset
G
Check I Replace:
b
H
l
Request
Telephone
Service
Main Board
U2
Samsung
Electronics
Check/Replace:
Hook Switch
P7 &
Wiring
LIU u201
6-l
7
Page 47
Troubleshooting
6-12.
Transmit Failure
Start
0
Load document
e
Dial Receiving
Machine
1.
6-l
8
Samsung
Electronics
Page 48
7 Electrical Parts List
7-1
MAIN
1
Ref. No.
I
I
I
Cl Ceramic, Chip,
c2
c3
I
lC4
I
Ic5
C6 Ceramic, Chip,
c7
1 C8
c9
Cl0
Cl1
Cl2
Cl3
Cl4
I I
Cl5
1 1
Cl6
I I
Cl7
1 1 Cl8
I I
Cl9
I I
c20
c21
c22
C23
C24 Ceramic,
1 1
C25
C26
C27 Ceramic, Chip,
C28
c29
c30
I I
c31
1 C32
1
I I
C33
PBA
1
PBA, PCB
- Cauacitors -
Ceramic, Chip,
Ceramic,
1
Ceramic, Chip,
I Ceramic,
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
Ceramic,
I
Ceramic, Chip,
I
Ceramic, Chip,
I Ceramic, Chip,
I
Ceramic, Chip, 100
I
Ceramic, Chip, 100
I
Ceramic,
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
I
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
Ceramic,
Ceramic,
I
Ceramic, Chip,
1
Ceramic, Chip,
1
Ceramic, Chip,
Assembly, MAIN
680
680
Chip,
680
680
Chip,
680 pF,
100 pF,J,50
100
680 pF,
680
100
100
100
100
Chip,
100
100
100 nF, Z, 50
100 nF, Z, 50
Chin,
100 nF, Z, 50 V
100 nF, Z, 50 V 2203-000192
100 nF, Z, 50 V 2203-000192
100 nF, Z, 50 V 2203-000192
Chip,
100
100
100 nF,Z,50 V 2203-000192
100 nF, Z, 50 V 2203-000192
100 nF, Z, 50 V 2203-000192
Chip, 100 nF, Z, 50 V 2203-000192
Chip, 100 nF, Z, 50 V 2203-000192
100 nF, Z, 50
100 nF, Z, 50
100 nF, Z, 50
Capacitor / Resistor tolerance:
D:0.5%,F:l%,G:2%,J:5%,K:lO%,M:20%,Z:+80%,-20%
Description
pF, J,
50 V 2203-001132
pF, J,
50 V 2203-001132
pF,
J,
50 V 2203-001132
pF,
J,
50
V
J,
50 V
V
pF,
J, 50 V 2203-000239
J, 50 V
pF,J, 50 V
nF,Z, 50 V
nF,Z, 50 V
nF,Z, 50 V
nF,
Z, 50 V
nF,
Z, 50 V 2203-000192
nF, Z, 50 V
V
V
nF,
Z, 50 V
nF,
Z, 50 V
nF,
Z, 50 V 2203-000192
nF, Z, 50 V
V
V
V
SEC Code
/ 2203-001132 1
1 2203-001132 I
2203-000239
2203-001132
2203-001132
2203-000192
2203-000192
2203400192
2203-000192
I 2203-000192 I
I 2203-000192
I
2203-000192
I
2203-000192
I
2203-000192
I
2203-000192
I
2203-000192
I
2203-000192
2203-000192
I
I
I
I
I
I
I
Remark
Samsung
Electronics
7-l
Page 49
Electrical Parts List
7-2
Samsung Electronics
Page 50
Electrical Parts List
Cl14 Ceramic, Chip,
Cl15
Cl16
Cl17
Samsung
Electronics
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
680 pF,
100 nF, Z, 50
100
100
J, 50 V
nF,Z, 50 V
nF, Z, 50
V
V
2203-001132
2203400192
2203-000192
2203400192
7-3
Page 51
Electrical Parts List
Ref.
No.
Cl18
Cl19
Cl20
Ceramic, Chip,
Ceramic, Chip,
Ceramic, Chip,
-
Pl
P2
P3
P4
P5
I’6
P7
I’8
P9
SOKl
Header, Box, 12 Pin
Header,
Header,
Header,
Header,
Header,
Header,
Header, 3 Wall, 3
Header, 3 Wall, 2
Socket,
-
Dl
D2
D3
D4
D5
D6
D7
D8
D9
DlO
ZDl
ZD2
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Switching, MMSD914Tl
Zener,
Zener, PTZ5.1B, 5.1V
Connectors
Box,
3 Wall,10 Pin
3 Wall,12 Pin
3
Wall,8Pin
3
Wall,6Pin
3
Wall, 4 Pin
IC;
32 Pin
Diodes
-
PTZ!%lB, 5.lV
Description SEC Code Remark
100 nF,
100 nF,
100 nF,
Z,
50 V
Z, 50 V
Z, 50
2203-000192
2203-000192
V
2203-000192
-
13711-000657
14
Pin
Pin
Pin
3711-002815
3711-000398
3711-000411
3711-000517
3711-000496
3711-000470
3711-000452
3711-000443
3704-000255
0401-000116
0401-000116
0401-000116
0401-000116
0401-000116
0401-000116
0401-000116
0401-000116
0401-000116
0401-000116
0403-000464
0403-000464
7-4
u9
UlO
Ull
u12
u13
u14
Op amp,
MODEM, R96DFXL
Op
Analog Switch,
OP amp,
Analog Switch, MC140538
amp,
4558
4558
MC14053B 1001-000172
4558
1201-000189
1205-000246
1201-000189
1201-000189
1001-000170
Samsung Electronics
Page 52
Electrical Parts List
Ref. No.
u15
U16
u17
U18
u19
u20
u21
u22
I I
U23
Rl
R2
R3
R4
I
Im
I
IR6
1
1R7
R8
R9
RlO
Rll
R12
R13
R14
R15
R16
1
R17
I
IR18
1 IR19
I I=J
I
Iw1
I
R22 Chip, 15 kohm, J,
R23
R24 Chip, 82 kohm, J,
R25
R27 Chip, 10 kohm, J,
R28
lx29
R30
1
1R31
1
R32
OP amp,
Audio amp, MC34119
CMOS Logic, 74HC245
CMOS Logic, 74HC32
CMOS Logic,
DSP, 16
DRAM,
CODEC,
1
Analog Switch, TC4S66FT
-
Resistors
Chip, 10 kohm, J,
Chip, 10 kohm, J,
Chip, 10 kohm, J,
Chip, 10 kohm, 1,
1
Chip,
1
Chip, 10 kohm, J,
1
Chip,
Chip, 10 kohm, J,
Chip,
Chip, 10 kohm, J,
Chip,
Chip, 1 kohm, J,
Chip, 10 kohm, J,
Chip, 20 ohm, J,
Chip, 10 kohm, J,
Cl-k, 10
1
Chip, 10 kohm, J,
1
Chip, 10 kohm, J,
1
Chip,
1
Chip,
I
Chip, 47 kohm, J,
Chip, 10 kohm, J,
Chip,
1
Chip,
Chip, 20 kohm, J,
Chip, 46.4 kohm, F,
Chip,
1
Chip,
1
Chip,
4558
bit,
D6305BllAQA
44C1000,lM
TI’3054J
-
100
kohm, J,
10
kohm, J,
10
kohm, J,
10
kohm, J,
^
kohm,
10
kohm, J,
10
kohm, J,
*
10
kohm, J,
10
kohm, J,
220
ohm, J,
220
ohm,
220
ohm, J, l/10 W
Description
74HCOO
x 4 bit
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
W
l/10
l/4
W
l/10
T,
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
l/10
J,
l/10
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
SEC Code
1201-000189
1205-000105
0801-000696
0801-000411
0801-000792
0904001068
1105-000133
1205-000120
I 1001-000133 I
2007-000300
2007-000300
2007-000300
2007-000300
1 2007-000282 1
1 2007-000300 1
1 2007-000300 1
2007-000300
2007-000300
2007-000300
2007-000300
2007-000468
2007-000300
2007-001289
2007-000300
2007-000300
1 2007-000300
1 2007-000300 1
1 2007-000300 1
1 2007-000300 1
I
2007-000941
2007-000409
2007-000300
2007-001208
2007-000300
1 2007-000300 1
2007-000300
2007-000546
2007-000917
2007-000572
1 2007-000572 1
1 2007-000572
I
Remark
1
I
I
1
I
Samsung
Electronics
Page 53
Electrical Parts List
R69
R70
R71
R72
R73
R74 Chip,
R75
R76
Chip, 39 kohm, J,
Chip, 7.5 kohm, J,
Chip, 6.2 kohm, J,
Chip,
Chip,
Chip,
Chip, 1 Mohm, J,
1.2
kohm,
330
kohm, J,
330
kohm, J,
220
ohm, J,
l/10
J,
l/10
l/10
l/10
l/10
l/low
l/10
l/10
W
W
W
W
W
W
W
2007-000830
2007-001141
2007-001055
2007-000221
2007-000757
2007-000757
2007-000572
2007-000477
Samsung Electronics
Page 54
Electrical Parts List
Samsung
Electronics
7-7
Page 55
Electrical Parts List
R120
R121
R122
Ql
Q2
43
Q4
Q5
I I
I
IL1
I
IL2
r-3
Xl
x3
x4
BAT
PCB
Ref. No.
Description
Chip, 33
Chip, 15
Chip,
-
Transistors
Small Signal,
Small Signal,
Small Signal,
Small Signal,
Small Signal,
-
Miscellaneous
I
Inductor,
(
Resistor,
Resistor, Chip, 0 ohm, J,
Crystal,
Crystal,
Crvstal,
Battery-LI,
PCB,
kohm, J,
kohm,
220
ohm, J,
1
/lO
J, l/10
l/10
-
KSAll82,
KSC2982,
KSC5019,
KSAll82,
KSAll82,
-
SMD,
3.3
PH,
Chip, 0 ohm,
0.032768M 2801-001498
24.00014M
29.4912M
3V,
210mA
MAIN, Blank
SEC Code
W
W 2007-000409
W
PNP
NPN
NPN
PNP
PNP
K
J, l/10
W
l/10
W
2007-000774
2007-000572
0501-000279
0501-000342
0501-000385
0501-000279
0501-000279
( 2703-000185 (
I2007-000029
2007-000029
2801-001528
2801-001530
4301-000108
Remark
I
I
I
7-8
Samsung Electronics
Page 56
7-2. OPE PBA
Electrical Parts List
I I
I
ho1
I
II3302
I
ho3
R304 Chip, 0 ohm,
R305
I
1 R306
I
IR307
1
k3@3
I
km9
I
JR310
I
I
Ix311
I
1
R312
1 1 R313
1 1
R314
1 1 R315
1 R316
Samsung
-
Resistors
1
Chip, 22
1
Chip, 22
1
Chip,
Chin 22
1 Chiu,22kohm,T,1/8W
(
Chip, 22 kohm,
)
Chip,
1
Chip, 22
I Chip, 22
I
I
Chip, 10 kohm, T, l/8
1
Chin. 22
1
Chip,
I
Chip, 22
1
Chip,
1
Chip,
Electronics
kohm, J, l/8
kohm, J, l/8
200
ohm,
kohm, T,
10 kohm, J, l/8
kohm, J, l/8
kohm, T,1/8
A
kohm,
200
ohm,
kohm, J, l/8
680
ohm,
330
ohm, J,
J, l/8
J, l/8
J, l/8
T. l/8
J,
J, l/8
l/8
l/8
l/8
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
7-9
Page 57
Electrical Parts List
Q301
Q302
Q302
I I
-
Transistors
Small Signal, NPN,
Small Signal, NPN,
Small Signal, NPN,
-
- Miscellanceous -
KSA1182-Y
KSA1182-Y
KSA1182-Y
0501-000279
0501-000279
0501-000279
I
7-10
Harness, Wire
Connector, Header,
Harness, Wire
IC-Micom, Mask
3.Wall,2
Pin
JF39-41037A
3711-000438
JF39-41038A
JF09-10052A
Samsung Electronics
Page 58
7-3.
1 1
I
L
HOOK
Ref. No. I Description
PCB
I
I
Pl
1 P2
PBA
Assembly, HOOK
I PCB, Blank, HOOK
I
Switch, Hook, 48 V, 200
I
I Connector, Header,
I
Connector, Header, 2 Pin
7-4. D.DET PBA
Ref. No.1 Description
Assembly,
I
1 1 IJCB
1 SENl
I
IPl
PCB, Blank, D.DET
Interrupter
1
Harness. Wire
D.DET
11
mA
Pin
1
SEC Code
1 3409-000118 I
I
1 371
l-000402
I3711-000815
1
SEC Code
I I
10604-000230
1 TF39-40826A 1
Electrical Parts Lit
I
Remark
JF92-00778A
I
[
Remark
I
I
I
I
I
7-5. P.EMPTY PBA
Ref. No. 1 Description
Assembly,
PCB
PCB, Blank, D.DET
Switch, Detector
Harness, Wire
P.EMPTY
1
SEC Code
3409-000172
1
JF39-40986A
1
Remark
Samsung
Electronics
7-11
Page 59
Electrical Parts List
7-6.
HANDSET
Ref. No. 1Description
PCB
ZDl
MIC
Rx
7-7.
OTHERS
PBA
ASSEMBLY, HANDSET PCB
PCB, Blank, Handset
Diode, Zener, lN4736A
Mic,
Condensor
Audio, Receiver
1
SEC Code
0403-000142
3003-000103
3009-000154
I
Remark
7-12
Samsung Electronics
Page 60
7-8
Power Supply (Input Voltage :
Electrical Parts List
220 V)
Location No
Q1
Q2
Ul
u2
u3
u4
PC1
BDl
Dl
D2
D3
D4
D5
D6
D7
D8
ZDl
ZD2
ZD3
ZD4
Description
FET
8OOV,5A
Transistor, NPN
6Ov, 150rnA
PWM Control
DIP 8Pin
IC
Regulator
+5V,l.OA,Min
IC
Regulator
-12V,05A
IC Regulator
+
12V,O.5 A
Photo Coupler
5.0
kVAac,
50
Diode-Bridge
6OOV,4A
Diode-FR
1
kV,
1 A, 75
Diode-FR
2OOV,l A
Diode-FIX
200 V, 10
Diode-FR
2OOV,l A
DiodeSchottky
60V,3A
Diode-SW
75 V, 0.15
Diode-SW
75 V, 0.15
Diode-FR
200 V,
Diode-Zener
0.5 w, 20
Diode-Zener
0.5 W, 6.2
Diode-Zener
0.5 w, 18
Diode-Zener
1
W,27V
ns
A
A, 4
A, 4
1 A, 35
v
V
v
IC
mA, CRT50-400%
ns
ns
ns
Part No
2SK1537 SHINDENGEN
KTC3198Y(C1815Y) KEC
KSC945C-Y
FA5311P
KA7552
LM2940T-50
L494OV5
KA78M12CT
NJM78M12FA
KA79M12CT
NJM79M05FA
TCDTllOlG
PC111
D3SBA60
RBV406
BYIll-1000
BYV26E
UF4003
DlNL20U
DlOLC20U
BYQ28-200
UF4003
DlNL20U
S3S6M
SB360
lN4148
lN4148
lN4148
lN4148
UF4003
DlNL20U
MTZ20B
lN5250B
MTZ6.2B
lN5234B
MTZ18C
lN5248B
TZP27B
lN4750A
Vendor
SEC
FUJI
SEC
NS
S-T
SEC
JRC
SEC
JRC
TELEFUNKEN
SHARP
SHINDENGEN
SANKEN
S/T
PHILIPS
GI
SHINDENGEN
SHINDENGEN
PHILIPS
GI
SHINDENGEN
SHINDENGEN
GI
ROHM-KOREA
TELEFUNKEN
ROHM-KOREA
TELEFUNKEN
GI
SHINDENGEN
ROHM-KOREA
TELEFUNKEN
ROHM-KORE
TELEFUNKEN
ROHM-KOREA
TELEFUNKEN
ROHM-KOREA
TELEFUNKEN
A
SEC Code
996-201354AA
996203413AA
996203254AA
996203254AC
996203005AD
996203151AD
996203201AB
996-203307AD
996-203005AC
Samsung
Electronics
7-13
Page 61
Electrical Parts List
/
Cl0
Cl1
Cl2
r
t--p---
Cl4
Cl5
F
I
I
I I
I
Cl6
I
Cl8
Cl9
c20
c21
C24
Description Part No
ZAP-X,
(
!2onF,25ov
;
XP-x,
(
100 nF, 125
1
Z-CERAMIC
(
2.2 nF, 400
(
Z-CERAMIC
2.2 nF, 400
t
CAP-Y,
1.7 nF, 400
I
C-CERAMIC
4.7 nF, 400
,
C-ELECTROLYTIC HD2GVB127MHA
C-CERAMIC HCYE2G472MAA
4.7
(
:
(
1
kV, 100
t
C-CERAMIC
470 pF, 50
I
C-ELECTROLYTIC
33@,35V
,
C-MYLAR
4.7 nF, 50
C-MYLAR TSlHRB473KAN
47
lnF,lkV
C-ELECTROLYTIC
1000pF,35v
C-ELECTROLYTIC RGlVJB336M
33pF,35v
C-ELECTROLYTIC
100 pF, 35
C-ELECTROLYTIC
680$,16V
C-ELECTROLYTIC RYlCHB687M
68OpF,16V
nF, 400
nF, 50
v
V
V
V
V
v
pF
VDC
V/100 V
V/100 V
v
2222-335-10224M
1
KNB1530-0.22-250VAC
2222-335-10104M
KNB1530-O.l-250VAC
I
1
HCYE2G222MAA
DE7100F222MVAl-KC
HCYE2G222MAA
DE71OOF222MVAl-KC
I
HCYE2G472MAA
)
DE7150F472MVAl-KC
I
HCYE2G472MAA
DE7150F472MVAl-KC
KMH2GVNSN121M22F
DE7150F472MVAl-KC
HCYB3AlOlKDB
SR215A471KAA
CR051BCOH471 J
RXlVJB336M
SXElWB33OMMC
TSlHRB472KAN
TSlHRB472JAN
1
TSlHRB473JAN
HCYB3A102KDB
RGlVHB108M
SXElWB102MMC
SMSlWB33OMMC
RGlVJB107M
SXElWBlOlMMC
RYlCHB687M
SXElCVB681MMC
SXElCVB681MMC
Vendor
PHILIPS
ISKRA
PHILIPS-KOREA
ISKRA
SEM
MURATA
SEM
MURATA
SEM
MURATA
SEM
MURATA
SAMHWA
SAMYOUNG
SEM
MURATA
SAMHWA
SHINSHIN
SAMHWA
SEM
AVX
SAMHWA
SAMHWA
SAMYOUNG
SAMHWA
SAMHWA
SAMHWA
SAMHWA
SGS-T
SAMHWA
SAMHWA
SEM
SAMHWA
SAMYOUNG
SAMHWA
SAMYOUNG
SAMHWA
SAMYOUNG
SAMHWA
SAMYOUNG
SAMHWA
SAMYOUNG
SEC Code
7-14
Samsung
Electronics
Page 62
Electrical Parts List
Location No
C25
I
1
C27
C29
C34
C38
c40
VRl
Rl
R2
R3
R4
R5
R6
R7
R8
R9
RlO
Rll
R12
R13
Description Part No
C-ELECTROLYTIC RGlVJB107M
100 LlF, 35
C-ELECTROLYTIC
I
)
C-ELECTROLYTIC
33pF,35v
C-ELECTROLYTIC RGlHJB105M
l)lF,5OV
C-ELECTROLYTIC RGlVJB336M
33@,35V
C-CERAMIC
100 nF, 50 w
C-CERAMIC
100 nF, 50
R-VARIABLE
0.5
R-CARBON
l/2 W, 560 kO,
R-METAL OXIDE
lW, 100 kQ,
R-METAL OXIDE
lW,lookQ,5%
R-METAL OXIDE
2W, 100 kQ,
R-CARBON
1/4W,27 kQ5%
R-WIRE WOUND
1 w,
R-CARBON
1/4W,22Q 5%
R-METAL OXIDE
1/4w,
R-METAL OXIDE
1/4w,
R-METAL OXIDE
2W,
R-CARBON
1/4W,2.2kQ 5%
R-CARBON
1/4W,12kS2 5%
R-CARBON
l/8 W, 1.0 kn
v
SXElWBlOlMMC
t
1
RGlVJB336M
SMSl WB330MMC
SMSlHVBOlOMMC
SMSl WB330MMC
CGFlH104ZFK SAMHWA
CCYVlH104ZF
CGFlHlaQZFK SAMHWA
v CCYVlH104ZF
EVN-DJAA03BlK
W, 1 k Top
ADJ
25PRlK
RD1/2W
560KJ
5 %
RSSlW22OKJ
5 %
RSSlW220KJ
RSS2WlOOKJ
5 %
RD1/4W27KJ
RWlW0.15F
0.15 Q,
1%
RD1/4W22J
RSl/4W120F ROHM-KOREA
120 a,
1% DOOWON
RS1/4W2OOF
200
a, 1% DOOWON
RS1/8W5.6F
5.6 kQ 1% DOOWON
RD1/4W 2.2KJ
RDl/4W12KJ ROHM-KOREA
RD1/8W68OJ
5 %
Vendor
SAMHWA
SAMYOUNG
SAMHWA
SAMYOUNG
SAMHWA
SAMYOUNG
SEM
SEM
MATSUSHITA
BECKMAN
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
HANMI
ROHM-KOREA
DOOWON
ROHM-KOREA
ROHM-KOREA
ROHM-KOREA
DOOWON
DOOWON
ROHM-KOREA
DOOWON
SEC Code
Samsung
Electronics
7-15
Page 63
Electrical Parts List
Location No
R14 R-CARBON
R15
R16
R17 R-CARBON
R18
R19 R-CARBON
R20
R21
R25
LFl
LF2
Ll
Tl
A
Bl
B2
B3
TNRl
NT1
RLl
A
Fl
A
CON1
INLET
Description
RD1/8W4.7KJ
l/8 W,
4.7 kQ 5 %
R-CARBON
l/8 W,
6.8 kQ 5 %
R-CARBON
l/8
W, 2.2 kR 5 %
1/4W,lOkQ 5%
R-METAL OXIDE
2 W,
820 52‘5
%
1/4W,22Q 5%
R-CARBON
1/4w,150n 5%
R-METAL OXIDE RSSlW4.7J
lW,4.7sz 5%
R-CARBON
l/4 W, 390 kSZ
COIL
COIL
COIL
TRANS-MAIN
EER 28/34
BEAD
BEAD
BEAD
Surge Absorber
140
VAC,
Thermistor
10
ohm
Relay,
Fuse Glass
250 V,
2 A
HARNESS, 12 PIN
IN LET,
0.6
250 V,
5 %
A
6 A
RDl/8W6.8KJ
RD1/8W2.2KJ
RD1/4WlOKJ
RSS2W82OJ
RD1/4W22J
RDl/4W15OJ
RD1/4W390KJ
4L19-0792-HO20
4L19-0792-HO20
4LO4-1415
4T21-0918-HO20
BFD3550R2F
BFD3512R2F
BFD3550R2F
D6921ZOV301RA09
INR14D471K
lOD-9
KLO9LOlO
KM1
l-M24F
50T020H
T50020H
SK-HN-0739
EAC-409-030
ACR303BlO
Part No
Vendor
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
ROHM-KOREA
DOOWON
FINE
DUCKSAN
FINE
DUCKSAN
FINE
DUCKSAN
FINE
DUCKSAN
SAMHWA
SAMHWA
SAMHWA
MAIDA
ILJIN
DOSHIN
SANGSHIN
CHUNGWON
TRIAD
SAMJOO
DAESUNG
S-CRAFT
TSC
SEC Code
7-16
Samsung Electronics
Page 64
Page 65
Page 66
Page 67
Page 68
Page 69
Page 70
Page 71
Page 72
Page 73
Page 74
Page 75
Page 76
Page 77
Page 78
Page 79
Page 80
Page 81
Page 82
Page 83
Page 84
Page 85
Page 86
Page 87
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