Samsung E1170i Service Manual

GSM TELEPHONE

GT-E1170i

GSM TELEPHONE

CONTENTS

Safety Precautions

1. Specification

2. Product Function

3. Exploded View and Parts list

4. MAIN Electrical Parts List

5. Level1Repair

6. Level2Repair

7. Level3Repair

8.

Reference data

9.

Notice All functionality, features, specifications and other product information provided in this document inclu ding, but not limited to, the benefits, design, pricing, components, performance, availability, and capabiliti

es of the product are subject to change without

-

notice or obligation. Samsung reserves the right to make changes to this document and the product described herein, at anytime, without obligation on Samsung to provide notification of such change.

:

Safety Precautions

1.

Repair Precaution

1-1.

Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because

―

specipicty of cellular phone is sensitive for surrounding interference(RF noise).

Be careful to useakind of magnetic object or tool, because performance of parts is damaged by

―

the influence of magnetic force.

Surely useastandard screwdriver when you disassemble this product, otherwise screw will be

―

worn away.

Useathicken twisted wire when you measure level.

―

thicken twisted wire has low resistance, therefore error of measurement is few.

A

Repair after separate Test Pack and Set because for short danger(for example an overcurrent

―

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

Take specially care of soldering, because Land of PCB is small and weak in heat.

―

Surely tune on/off while using AC power plug, becausearepair of battery charger is dangerous

―

when tuning ON/OFF PBA and Connector after disassembling charger.

Don't use as you pleases after change other material than replacement registered on SEC System.

―

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

ESD(Electrostatically Sensitive Devices) Precaution

1-2.

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

(

You can prevent from ESD damage by static electricity.

Remove static electricity remained your body before you touch semiconductor or parts with

―

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

Use earthed soldering steel when you connect or disconnect ESD.

―

Use soldering removing tool to break static electricity.,otherwise ESD will be damaged by static

―

electricity.

Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

―

aluminum plate to have conductive power,they are prevented from static electricity.

You must maintain electric contact between ESD and place due to be set up until ESD is

―

connected completely to the proper place oracircuit board.

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Specification

2.

GSM General Specification

2-1.

GSM900

Phase 1

Freq.

Band[MHz]

Uplink/Downlink

ARFCN range 0~1023 512~885

Tx/Rx spacing 45MHz 95MHz

Mod. Bit rate/

Bit Period

Time Slot Period/Frame

Period

Modulation 0.3GMSK 0.3GMSK

MS Power 33dBm~5dBm 30dBm~0dBm

890~889.8 935~934.8

270.833kbps

3.692us

576.9us

4.615ms

DCS1800

Phase 1

1710~1785 1805~1880

270.833kbps

3.692us

576.9us

4.615ms

Power Class 5pcl ~ 19pcl 0

Sensitivity -102dBm -100dBm

TDMA Mux 8 8

Cell Radius 35Km 2Km

pcl

~15

pcl

2-1

Speclflcation

GSM Tx Power Class

2-2.

TX Power

GSM

control level

533±3

631±3

729±3

827±3

925±3

10 23±3

11 21±3

900

dBm

TX Power

control level

030±3

128±3

226±3

324±3

422±3

520±3

618±3

DCS1800

dBm

12 19±3

13 17±3

14 15±3

15 13±3

16 11±5

17 9±5

18 7±5

19 5±5

dBm

716±3

814±3

912±4

10 10±4

11 8±4

12 6±4

13 4±4

14 2±5

15 0±5

dBm

2-2

Operation Instruction and Installation

3.

Main Function

GSM

•

•1.52"

SMS, MMS

•

•64

Noise Cancellation

•

900/1800

CSTN

Poly Melody

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Exploded View and Parts List

4.

Cellular phone Exploded View

4-1.

QFR01

QMW02

QKP01

QLC01

QSP01

QRE01

QCR89

QME01

QMI01

QMP01

QMO01

QIF01

QBA01

QBC00

4-1

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Exploded View and Parts List

Cellular phone Parts list

4-2.

Design LOC Description SEC CODE

QSP01 SPEAKER

QCR89 SCREW-TAPPING

3001-002509

6002-001428

QMI01 MICROPHONE-ASSY-GT-E1170 GH30-00649A

QMO01 MOTOR DC-SCH-S369 GH31-00392A

QBA01 INNER BATTERY PACK-1000MAH,BLK,ENG,EU GH43-03184A

QME01 DOME SHEET-GT-E1170 GH59-09033A

QMP01 A/S ASSY-PBA MAIN(COMM)GT-E1170I,DBT,SV GH82-05497A

QLC01 ASSY LCD-MODULE ASSY(GT-E1100) GH96-03565A

QBC00 ASSY COVER-BATT GH98-16533A

QKP01 ASSY KEYPAD-(EU/BLACK) GH98-16834A

QFR01 ASSY CASE-FRONT GH98-16038A

QMW02 PCT WINDOW-MAIN GH72-57916A

QRE01 ASSY CASE-REAR GH98-16039A

QIF01 PMO COVER-IF(VE);GT-E1170,POLY URETHAN,B GH72-59961A

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MAIN Electrical Parts List(2010.12.28)

5.

Design LOC SEC CODE Description

D200,D201

ZD200

ZD301

TR200

LED301,LED302,LED303

LED304

TR100

UME200

PAM100

U101

UCP200

TH200

R301

R300,R306,R312

R208

R200,R202

R109

R303,R304,R305,R307

R308

R309,R310

R311

R209

R210

R106

R204

U302

C225,C227

C107

C302

C106

C111,C112,C114,C312

C313

C220,C321,U301

C105,C110

C113,C115,C116,C117

C224

0401-001110

0403-001688

0406-001286

0505-002223

0601-002846

1003-001440

1108-000389

1201-003190

1203-006203

1205-003923

1404-001221

2007-000139

2007-000141

2007-000144

2007-000148

2007-000151

2007-000172

2007-000173

2007-000174

2007-001301

2007-001333

2007-003025

2007-008500

2203-000386

2203-000425

2203-000627

2203-000679

2203-000696

2203-000812

2203-001153

2203-005057

2203-005281

2203-005344

DIODE

TR-SMALL SIGNAL

LED

IC

POWER AMP

IC

THERMISTOR

R-CHIP

C-CERAMIC,CHIP

CERAMI

C-

C-CERAMIC,CHIP

C,CHIP

5-1

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Main Electrical Parts List

Design LOC SEC CODE Description

C209,C210,C211,C212

C215,C229,C231,C301

C303,C319,C323

C203,C204,C226,C320

C202,C205,C206,C207

C208,C214,C315,C316

C109,C314

C200,C201

C108,C308

C223

L103

L100,L106

L107

L104

L302,L303,L304,L305

L306,L307,L308,L309

L105

L108

L201

OSC201

OSC200

F100

L200

RFS100

SIM200

IFC300

BTC200

2203-006048

2203-006208

2203-006399

2203-006562

2203-006824

2203-007279

2203-007425

2703-001733

2703-002170

2703-002176

2703-002199

2703-002201

2703-002203

2703-002204

2703-003184

2801-004882

2801-005011

2904-001879

3301-001158

3705-001503

3709-001488

3710-002683

3711-006808

C-CERAMIC,CHIP

INDUCTOR-SMD

OSCILLATOR

FILTER

SWITCH-TACT

CONNECTOR

SC102,SC103,SC104 GH70-03276A COMP-SMD

SC105,SC106,SC107 GH70-03276A COMP-SMD

SC108,SC109 GH70-03276A COMP-SMD

Please consult the GSPN website(Samsung Portal) for the most recent version of the product's part list.

5-2

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Level

6.

S/W Download

6-1.

Repair

1

6-1-1.

Pre-requsite for S/W Downloading

Downloader Program(

•

GT-E1170i Mobile Phone

•

Data Cable

•

JIG BOX(GH99-36900A)

•

RF Test Cable(GH39-00985A)

•

JIG Cable(GH39-01160A)

•

Adapter(GH99-38251A)

•

Serial Cable

•

Binary files

•

Settings

※

Connect to ANYWAY JIG BOX

PNX4850 Downloader

Lite For Maple)

0.3

JIG CABLE(Phone to JIG)

&

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Level1Repair

6-1-2.

S/W Downloader Program

Load the binary download program by executing the

■

PNX4850 Downloader

"

Select the connected serial port and the rate of speed

.

1

Lite For Maple

0.3

"

enter this file.

←

.

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Select the D/L Mode

.

2

Level1Repair

.

Select the Binary

.

3

TFS file.

&

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Level1Repair

ress the"Start" button and connect the Handset.

.P

4

When downloading is complete, automatically the small window was showed up.

.

5

6-4

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Confirm the downloaded version name and etc.

.

6

*#1234#

Level1Repair

:

Full Reset

*2767*3855#

:

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Level

7.

Disassembly and Assembly Instructions

7-1.

Repair

2

7-1-1.

1)

Disassembly

1 2

Be careful not to make scratch and molding damage!

Release Screw2Point at rear

Disjoint Hook on the top of the rear

Be careful not to make scratch and molding damage!

1)

3

Be careful not to make scratch and molding damage!

1)

Disjoint hook on the right side of the rear

4

Be careful not to make scratch and molding damage!

1)

Disjoint hook on the left side of the rear

7-1

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Level2Repair

7.

5

Pull the REAR by lifting it from top to bottom

6

Press front side hook to release Main PBA.

Be careful not to make scratch and molding damage

1)

7

Disassemble Main PBA from the FRONT.

. 1)

Be careful not to damage to LCD Module.

8

Disassemble Main PBA from the FRONT

.

Be careful not to make damage to MIC FPCB

1)

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7-2

Level2Repair

7.

7-1-1.

1

Assembly

SetaPBA and front.

2

Assemble PBA to the front

Press front side hook to lock Main PBA.

3

and insert MIC to front carefully

Be careful not to damage to LCD Module.

1)

4

Assemble the hooks on the bottom of the rear

Be careful not to make damage to MIC FPCB

1)

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Beware that you do not damage MIC F-PCB.

1)

7-3