Samsung E1100 Service Manual
GSM TELEPHONE
GT-E1100
GSM TELEPHONE
CONTENTS
Safety Precautions
1.
Specification
2.
Product Function
3.
Array course control
4.
Exploded View and Parts list
5.
MAIN Electrical Parts List
6.
Block Diagrams
7.
PCB Diagrams
8.
Chart of Troubleshooting
9.
Reference data
10.
Disassembly and Assembly
11.
Instructions
Safety Precautions
1.
Repair Precaution
1-1.
Repair in Shield Box, during detailed tuning.
●
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
Be careful to useakind of magnetic object or tool,
●
because performance of parts is damaged by the influence of manetic force.
Surely useastandard screwdriver when you disassemble this product,
●
otherwise screw will be worn away.
Useathicken twisted wire when you measure level.
●
thicken twisted wire has low resistance, therefore error of measurement is few.
A
Repair after separate Test Pack and Set because for short danger(for example an
●
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
Take specially care of soldering, because Land of PCB is small and weak in heat.
●
Surely tune on/off while using AC power plug, becausearepair of battery charger is
●
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
Don't use as you pleases after change other material than replacement registered on SEC
●
System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
1-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Safety Precautions
ESD(Electrostatically Sensitive Devices) Precaution
1-2.
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
Remove static electricity remained your body before you touch semiconductor or parts with
●
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
Use earthed soldering steel when you connect or disconnect ESD.
●
Use soldering removing tool to break static electricity.,otherwise ESD will be damaged by
●
static electricity.
Don't unpack until you set up ESD on product. Because most of ESD are packed by box
●
and aluminum plate to have conductive power,they are prevented from static electricity.
You must maintain electric contact between ESD and place due to be set up until ESD is
●
connected completely to the proper place oracircuit board.
1-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Specification
2.
GSM
2-1.
Band[MHz]
Uplink/Downlink
ARFCN range
Tx/Rx spacing
Mod. Bit rate/
Period/Frame
Modulation
900/
Freq.
Bit Period
Time Slot
Period
DCS1800 General Specification
EGSM 900
Phase 2
880~915
925~960
0~124 & 975~1023 512~885
45MHz 95MHz
270.833kbps
3.692us
576.9us
4.615ms
0.3GMSK 0.3GMSK
DCS1800
Phase 1
1710~1785
1805~1880
270.833kbps
3.692us
576.9us
4.615ms
MS Power
Power Class
Sensitivity
TDMA Mux
Cell Radius
33dBm~5dBm 30dBm~0dBm
pcl
5
-102dBm -100dBm
pcl
~19
88
35Km 2Km
pcl
0
~15
pcl
2-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Specification
GSM TX power class
2-2.
TX Power
control level
533±2
631±2
729±2
827±2
925±2
10 23±2
11 21±2
GSM900
dBm
dBm
dBm
dBm
dBm
dBm
dBm
TX Power
control level
030±3
128±3
226±3
324±3
422±3
520±3
618±3
DCS1800
dBm
dBm
dBm
dBm
dBm
dBm
dBm
12 19±2
13 17±2
14 15±2
15 13±2
16 11±3
17 9±3
18 7±3
19 5±3
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
716±3
814±3
912±4
10 10±4
11 8±4
12 6±4
13 4±4
14 2±5
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
15 0±5
dBm
2-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Product Function
3.
Main Function
Simple and modern bar design
-
Speaker Phone Function
-
Mobile Tracker, My Menu, Living world
-
3-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Array course control
4.
Software Adjustments
4-1.
Test Jig(GH99
RF Test Cable(GH
-36900
39-00985
A)
A)
Test Cable(GH
Adapter(GH
39-01160
99-38251
A)
A)
4-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Array course control
Software Downloading
4-2.
4-2-1.
•2
–
–
4-2-2.
•
•
•
•
•
•
Downloading Binary Files
binary files for downloading E1100.
E1100
ZMHxx.cla
E1100ZMHxx.tfs
Pre-requsite for Downloading
Downloader Program(PNX4900 Downloader v1.0 Lite.exe
E1100 Mobile Phone
JIG BOX
Test Cable
Serial Cable
Binary files
)
4-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Array course control
4-2-3.
1.
Lite.exe
S/W Downloader Program
Load the binary download program by executing the“PNX4900 Downloader v1.0
”.
Select the Port, Baud Rate and Mode
2.
.
4-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Array course control
Select the binary fileswhat you want to download
3.
4-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
ress the"Start" button and connect the Handset.
4. P
ThenPress the"Download" butto
n.
Array course control
4-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Exploded View and Parts List
5.
5-1.
Cellular phone Exploded View
QMP01
QKP01
QMW02
QFR01
QME01
QLC01
QMO01
QSP01
QMI01
QSH01
QAN02
QRE01
QBA01
QBA00
5-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Exploded View and Parts List
5-2.
Cellular phone Parts list
Design LOC Description SEC CODE
QAN02 INTENNA-GT-E1100 GH42-01878A
QBA00 PMO COVER-BATT GH72-51381A
QBA01 INNER BATTERY PACK-750MAH/EU/M GH43-03122A
QKP01 RMO KEY-PAD MAIN GH73-12432A
QLC01 ASSY LCD-MODULE ASSY(GT-E1100) GH96-03565A
QME01 DOME SHEET-GT-E1100 MAIN GH59-06751A
QMI01 MICROPHONE-ASSY-GT-E1100 GH30-00566A
QMO01 MOTOR DC-SCH-S369 GH31-00392A
QMP01 A/S ASSY-GT-E1100 PBA MAIN GH82-03441A
QRE01 ASSY CASE-REAR GH98-11201A
QSH01 ICT SHIELD-CAN GH70-04601A
QSP01 SPEAKER
3001-002476
QFR01 ASSY CASE-FRONT GH98-11200A
QMW02 PCT WINDOW-MAIN GH72-51378A
5-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
MAIN Electrical Parts List
6.
Design LOC SEC CODE Description
D200,D201 0401-001110 DIODE-SWITCHING
ZD200 0403-001547 DIODE-ZENER
ZD303 0406-001286 DIODE-TVS
D300,D301,D302,D303 0406-001288 DIODE-TVS
D304 0406-001306 DIODE-TVS
LED300,LED301,LED302 0601-002674 LED
LED303,LED304,LED305 0601-002674 LED
TR100 1003-001440 IC
UME200 1108-000239 MEMORY
PAM102 1201-002829 IC
U201 1203-005498 IC
U301 1203-005512 IC
U101 1203-005686 IC
UCP200 1205-003679 IC
TH200 1404-001221 THERMISTOR
R304 2007-000139 R-CHIP
R301,R308,R311,R314 2007-000141 R-CHIP
C315,R221,R222 2007-000148 R-CHIP
R118 2007-000151 R-CHIP
R108,R210 2007-000162 R-CHIP
R207,R317,R318,R319 2007-000172 R-CHIP
R320,R321 2007-000172 R-CHIP
R302,R303 2007-000173 R-CHIP
R310 2007-000174 R-CHIP
R211 2007-001301 R-CHIP
R213 2007-001333 R-CHIP
R107 2007-003025 R-CHIP
R212 2007-007698 R-CHIP
R205 2007-008500 R-CHIP
C128 2203-000278 C-CERAMIC,CHIP
C227,C231,C308,C309 2203-000425 C-CERAMIC,CHIP
C310 2203-000425 C-CERAMIC,CHIP
C111,C112 2203-000438 C-CERAMIC,CHIP
C303,C305,C306 2203-000679 C-CERAMIC,CHIP
C107,C108,C121,C229 2203-000812 C-CERAMIC,CHIP
C327,C328,C329 2203-000812 C-CERAMIC,CHIP
C325 2203-000995 C-CERAMIC,CHIP
C218,C219,C220,C221 2203-001153 C-CERAMIC,CHIP
C236,C318 2203-001153 C-CERAMIC,CHIP
6-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Main Electrical Parts List
Please consuit the GSPN website(Samsung Portal) for the most recent version of the product's part list.
C317 2203-001239 C-CERAMIC,CHIP
C223 2203-001405 C-CERAMIC,CHIP
C230,C234,C235 2203-002709 C-CERAMIC,CHIP
C129 2203-003054 C-CERAMIC,CHIP
C113,C115 2203-005158 C-CERAMIC,CHIP
C114,C116 2203-005281 C-CERAMIC,CHIP
C105 2203-005288 C-CERAMIC,CHIP
C232,C302,C304,C314 2203-005482 C-CERAMIC,CHIP
C316 2203-005482 C-CERAMIC,CHIP
C120,C203,C204,C216 2203-006048 C-CERAMIC,CHIP
C206,C207 2203-006208 C-CERAMIC,CHIP
C224 2203-006348 C-CERAMIC,CHIP
C202,C205,C208,C209 2203-006399 C-CERAMIC,CHIP
C210,C211,C319,C320 2203-006399 C-CERAMIC,CHIP
C109,C311,C312 2203-006562 C-CERAMIC,CHIP
C212,C213 2203-006824 C-CERAMIC,CHIP
C222 2203-006841 C-CERAMIC,CHIP
C228,TA301 2404-001377 C-TA,CHIP
TA101 2404-001381 C-TA,CHIP
TA300 2404-001430 C-TA,CHIP
C110 2703-001181 INDUCTOR-SMD
L306,L307 2703-001723 INDUCTOR-SMD
R101 2703-001729 INDUCTOR-SMD
L103,L110 2703-002198 INDUCTOR-SMD
L301,L302 2703-002201 INDUCTOR-SMD
L104 2703-002204 INDUCTOR-SMD
L106,L107 2703-002208 INDUCTOR-SMD
L100 2703-002269 INDUCTOR-SMD
L105 2703-002281 INDUCTOR-SMD
L308,L309 2703-002309 INDUCTOR-SMD
L201 2703-003297 INDUCTOR-SMD
OSC200 2801-003856 CRYSTAL-UNIT
OSC201 2801-004552 CRYSTAL-UNIT
F100 2904-001879 FILTER-SAW
L200 3301-001158 CORE-FERRITE BEAD
L303,L304,L305 3301-001756 CORE-FERRITE BEAD
RFS100 3705-001503 CONNECTOR-COAXIAL
SIM200 3709-001384 CONNECTOR-CARD EDGE
IFC300 3710-002683 CONNECTOR-SOCKET
BTC200 3711-006228 CONNECTOR-HEADER
6-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Loading...