Samsung DVD-HR750, DVD-HR749, DVD-HR753, DVD-HR754, DVD-HR755 Service Manual

...
DVD-RECORDER
Œ Multi format Recording
DVD-RW/DVD+RW/DVD-R/DVD+R/DVD RAM
´ Multi format playback
DVD/DVD-RW/DVD+RW/DVD-R/DVD+R/ DVD RAM/MP3/JPEG/DIVX
ˇ Recording mode
XP(1Hour) / SP(2Hour) / LP(4Hour) / EP(6~8Hour)
¨ Progressive scan ˆ Automatic Chapter product on Ø 59mm Slim Design
DVD-RECORDER
Merit & Character regarding Product
SERVICE MANUAL
DVD-HR749/ DVD-HR750/ DVD-HR753/ DVD-HR754/ DVD-HR755/ DVD-HR756/ DVD-HR757
© Samsung Electronics Co., Ltd. FEB. 2007
Printed in Korea
AK82-01208A
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
international and/or domestic law.
SERVICE
Manual
Chassis : Nexus (4rd Generation)
BASIC : DVD-HR755 Application Models:
DVD-HR749 / DVD-HR750 /
DVD-HR753 / DVD-HR754 / DVD-HR755 / DVD-HR756 / DVD-HR757
Application Areas:
AFR, AND, AUS, CHN, EUR, HAC, NWT, RAD, SAM, SED, SEO, SMR, TAW, UMG, XEB, XEC, XEE, XEF, XEG, XEH, XEN, XEO, XER, XET, XEU, XFA, XSA, XSE, XSG, XSH, XSS, XST, XSV, XTL
ELECTRONICS
1. Precautions 1-1 ~ 1-6
1-1 Safety Precaution (1-1) 1-2 Servicing Precautions (1-3) 1-3 ESD Precautions (1-4) 1-4 Handling the optical pick-up (1-5)
2. Product Specification 2-1 ~ 2-8
2-1 Product Specification (European model) (2-1) 2-2 Product Specification (Asia and Austrailia model) (2-2) 2-3 Chassis Product Specification (European model) (2-3) 2-4 Chassis Product Specification (Asia and Austrailia model) (2-5) 2-5 Option Product Specification (2-7)
3. Software Update 3-1 ~ 3-4
3-1 Drive Firmware Update (3-1) 3-2 Flash Update (3-3)
4. Disassembly and Reassembly 4-1 ~ 4-8
4-1 Cabinet and PCB (4-1) 4-2 PCB Location (4-8)
5. Trouble Shooting 5-1 ~ 5-14
6. Exploded View and Parts List 6-1 ~ 6-4
6-1 Cabinet Assembly (6-2)
7. Electrical Parts List 7-1 ~ 7-20
7-1 Electrical Part List (7-1)
8. Block Diagrams 8-1 ~ 8-4
8-1 All Block Diagram (8-2) 8-2 PIC1 (TSB4AB1) Block Diagram (8-3) 8-3 VIC1 (SAA7138) Block Diagram (8-4)
9. Wiring Diagram 9-1 ~ 9-2
10. PCB Diagrams 10-1 ~ 10-10
10-1 S.M.P.S. PCB (10-2) 10-2 Main PCB (10-4) 10-3 Jack PCB (10-6) 10-4 HDMI PCB (10-8) 10-5 Function PCB (10-9)
11. Schematic Diagrams 11-1 ~ 11-22
Block Identification of Main PCB (11-2) 11-1 S.M.P.S (SMPS PCB) (11-3) 11-2 Main Connector (Main PCB) (11-4) 11-3 DRAM (Main PCB) (11-5) 11-4 ATAPI (Main PCB) (11-6) 11-5 DV Interface (Main PCB) (11-7) 11-6 MS9400 Codec (Main PCB) (11-8) 11-7 Power (Main PCB) (11-9) 11-8 SAA7138 Video Decoder (Main PCB) (11-10) 11-9 USB Interface (Main PCB) (11-11) 11-10 CEC (Jack PCB) (11-12) 11-11 System Control (Jack PCB) (11-13) 11-12 TM (Jack PCB) (11-14) 11-13 Power (Jack PCB) (11-15) 11-14 Connection (Jack PCB) (11-16) 11-15 I/O Jack (Jack PCB) (11-17) 11-16 I/O_Switching (Jack PCB) (11-18) 11-17 Display Key (Jack PCB) (11-19) 11-18 Display Key (Function PCB) (11-20) 11-19 HDMI Connector (HDMI PCB) (11-21)
12. Operating Instructions 12-1 ~ 12-10
13. Circuit Operating Descriptions 13-1 ~ 13-12
13-1 Power (13-1) 13-2 SERVO (DVP Multi Drive) (13-4) 13-3 Video In/out Block (13-6) 13-4 Audio (13-9) 13-5 Tuner (13-10) 13-6 IF (13-11)
14. Reference Information 14-1 ~ 14-12
14-1 Introduction to DVD (14-1) 14-2 DVD-Video Fromat (14-3) 14-3 About IEEE1394 (14-9)
If you want to know additional information which is not included on this Service Manual, Please refer to the SKP (Samsung Knowledge Portal) web site.
URL ; http://service.samsungportal.com -------North America URL ; http://latin.samsungportal.com-----------Latin America URL ; http://cis.samsungportal.com -------------CIS URL ; http://europe.samsungportal.com--------Europe URL ; http://china.samsungportal.com----------China URL ; http://asia.samsungportal.com -----------Asia URL ; http://mea.samsungportal.com -----------Mideast & Africa
Samsung Electronics 1-1
1. Precautions
1-1 Safety Precaution
1) Before returning an instrument to the customer, always make a safety check of the entire instrument, including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing. (1)Protective shields are provided to protect both the technician and the customer. Correctly replace all missing protective shields, including any removed for servicing convenience. (2)When reinstalling the chassis and/or other as­sembly in the cabinet, be sure to put back in place all protective devices, including, but not limited to, nonmetallic control knobs, insulating fish papers, adjustment and compartment covers/shields, and isolation resistor/capacitor networks. Do not oper­ate this instrument or permit it to be operated with­out all protective devices correctly installed and functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert their fingers and contact a hazardous voltage. Such openings include, but are not limited to, excessive­ly wide cabinet ventilation slots, and an improper­ly fitted and/or incorrectly secured cabinet back cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord directly into a European model 230V(220V ~ 240V), Asia and Austrailia model (110V ~240V) AC outlet. (Do not use an isolation transformer during this test.) Use a leakage current tester or a metering sys­tem that complies with American National Standards institute (ANSI) C101.1 Leakage Current for Appliances and Underwriters Laboratories (UL) 1270 (40.7). With the instrument’s AC switch first in the ON position and then in the OFF posi­tion, measure from a known earth ground (metal water pipe, conduit, etc.) to all exposed metal parts of the instrument (antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis.
Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the out­let and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified herein indicate a potential shock hazard that must be eliminated before returning the instrument to
the customer.
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire between the two prongs of the plug. (2) Turn on the power switch of the instrument. (3) Measure the resistance with an ohmmeter between the jumpered AC plug and all exposed metallic cabinet parts on the instrument, such as screwheads, antenna, control shafts, handle brackets, etc. When an exposed metallic part has a return path to the chassis, the reading should be between 1 and 5.2 megohm. When there is no return path to the chas­sis, the reading must be infinite. If the reading is not within the limits specified, there is the possibil­ity of a shock hazard, and the instrument must be repaired and rechecked before it is returned to the
customer. See Fig. 1-2.
DEVICE UNDER
TEST
TEST ALL
EXPOSED METER
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
LEAKAGE CURRENT
TESTER
(READING SHOULD
NOT BE ABOVE
0.5mA)
EARTH
GROUND
Antenna Terminal
Exposed Metal Part
ohm
ohmmeter
Precautions
1-2 Samsung Electronics
2) Read and comply with all caution and safety re­lated notes on or inside the cabinet, or on the chas­sis.
3) Design Alteration Warning-Do not alter or add to the mechanical or electrical design of this instru­ment. Design alterations and additions, including but not limited to, circuit modifications and the addition of items such as auxiliary audio output connections, might alter the safety characteristics of this instrument and create a hazard to the user. Any design alterations or additions will make you, the servicer, responsible for personal injury or property damage resulting therefrom.
4) Observe original lead dress. Take extra care to assure correct lead dress in the following areas: (1) near sharp edges, (2) near thermally hot parts (be sure that leads and components do not touch ther­mally hot parts), (3) the AC supply, (4) high voltage, and (5) antenna wiring. Always inspect in all areas for pinched, out-of-place, or frayed wiring, Do not change spacing between a component and the printed-circuit board. Check the AC power cord for damage.
5) Components, parts, and/or wiring that appear to have overheated or that are otherwise damaged should be replaced with components, parts and/ or wiring that meet original specifications. Additionally, determine the cause of overheating and/or damage and, if necessary, take corrective action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechani­cal parts have special safety-related characteristics which are often not evident from visual inspection, nor can the protection they give necessarily be obtained by replacing them with components rated for higher voltage, wattage, etc. Parts that have spe­cial safety characteristics are identified by shading, an ( )or a ( )on schematics and parts lists. Use of a substitute replacement that does not have the same safety characteristics as the recommended replacement part might create shock, fire and/or other hazards. Product safety is under review con­tinuously and new instructions are issued whenev­er appropriate.
Precautions
Samsung Electronics 1-3
1-2 Servicing Precautions
CAUTION : Before servicing units covered by this service manual and its supplements, read and follow the Safety Precautions section of this manual.
Note : If unforseen circumstances create conflict between the following servicing precautions and any of the safety precautions, always follow the safety pre­cautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving or reinstalling any component, circuit board, module or any other instrument assembly, (2) disconnecting any instrument electrical plug or other electrical connection, (3) connecting a test substitute in parallel with an electrolytic capaci­tor in the instrument.
b. Do not defeat any plug/socket B+ voltage inter-
locks with which instruments covered by this service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all solid-state device heat sinks are correctly in­stalled.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connect­ing the test instrument positive lead. Always remove the test instrument ground lead last.
Note : Refer to the Safety Precautions section ground lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servic­ing, follow the printed or indicated service precau­tions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength. When replacing components, use components which have the same ratings. Components identi­fied by shading, by( ) or by ( ) in the circuit dia­gram are important for safety or for the characteris­tics of the unit. Always replace them with the exact replacement components.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed wiring board for safety. The internal wiring is sometimes clamped to prevent contact with heat­ing components. Install such elements as they were.
(5) After servicing, always check that the removed
screws, components, and wiring have been in­stalled correctly and that the portion around the serviced part has not been damaged and so on. Further, check the insulation between the blades of the attachment plug and accessible conductive parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn the power ON. Connect the insulation resi­stance meter (500V) to the blades of the attachment plug. The insulation resistance between each blade of the attachment plug and accessible conductive parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal pan­els, input terminals, earphone jacks, etc.
Precautions
1-4 Samsung Electronics
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be dam­aged easily by static electricity. Such components commonly are called Electrostati­cally Sensitive Devices(ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available dis­charging wrist strap device, which should be removed for potential shock reasons prior to apply­ing power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conduc­tive surface such as aluminum foil, to prevent elec­trostatic charge buildup or exposure of the assem­bly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as “anti-static” can generate electrical charges suffi­cient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your are ready to install it.(Most replacement ESD devices are packaged with leads electrically short­ed together by conductive foam, aluminum foil or comparable conductive materials).
(7) Immediately before removing the protective ma-
terials from the leads of a replacement ESD device, touch the protective material to the chassis or cir­cuit assembly into which the device will be installed.
CAUTION : Be sure no power is applied to the ch­assis or circuit, and observe all other safety precau­tions.
(8) Minimize bodily motions when handling unpack-
aged replacement ESD devices. (Otherwise harm­less motion such as the brushing together of your clothes fabric or the lifting of your foot from a car­peted floor can generate static electricity sufficient to damage an ESD device).
Precautions
Samsung Electronics 1-5
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer elec­trostatic breakdown because of potential static elec­tricity from clothing and your body.
The following method is recommended. (1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static sources to touch the unit.
Be sure to put on a wrist strap grounded to the sheet. Be sure to lay a conductive sheet made of copper etc. Which is grounded to the table.
Fig.1-3
(6) Short the short terminal on the PCB, which is in-
side the Pick-Up ASS’Y, before replacing the Pick­Up. (The short terminal is shorted when the Pick­Up Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short termi-
nal on the PCB.
Precautions
1-6 Samsung Electronics
MEMO
Samsung Electronics 2-1
Power requirements AC 220~240V ,50Hz Power consumption 2.7Watts (Tandby Power), 32Watts (Recording & Playback Simultaneously)
General
Weight 3.9 Kg Dimensions 430mm(W) x 300mm(D) x 59mm(H) Operating temp +5°C to +35°C Other conditions Keep level when operating. Less than 75% operating humidity Video Composite Video : 1.0 V p-p at 75ohm load, sync negative Audio Max. Audio input level : 2Vrms DV Input IEEE 1394(4p) compatible jack
Input Receivable Channels PAL B/G, DK, I
Scart Jack
AV1 (Scart TV) Video : Composite, Audio : analogue
AV2 (Scart Ext) Video : Composite, RGB Audio : analogue
Audio
Analogue output jacks X 2 Optical/coaxial digital audio output Composite Video : Video output jack X 1
Output
Video S-Video output X 1 (Y: 1.0Vp-p, C:0.286Vp-p at 75 ohm load)
Component output X 1 (Y: 1.0Vp-p ,Pb:0.70Vp-p, Pr:0.70Vp-p at 75ohm load) HDMI DVI (576P) Scart Jack AV1 (Scart TV) Video : Composite, RGB Audio : analogue Picture compression format MPEG-II Audio compression format Dolby digital 2ch/256kbps, MPEG-II
Recording
Recording Quality
XP (about 8.5 Mbps), SP (about 4.5 Mbps), LP (about 2.5 Mbps),
EP (about 1.6 Mbps or about 1.2 Mbps), FR (about 1.2 Mbps to 8Mbps) Audio frequency characteristics 20 Hz ~ 20 KHz
2. Product Specification
2-1 Product Specification (European model)
Product Specification
2-2 Samsung Electronics
Power requirements AC 110~240V ,50Hz Power consumption 2.7Watts (Tandby Power), 32Watts (Recording & Playback Simultaneously)
General
Weight 3.9 Kg Dimensions 430mm(W) x 300mm(D) x 59mm(H) Operating temp +5°C to +35°C Other conditions Keep level when operating. Less than 75% operating humidity Video Composite Video : 1.0 V p-p at 75ohm load, sync negative Audio Max. Audio input level : 2Vrms DV Input IEEE 1394(4p) compatible jack
Input Receivable Channels PAL B/G, B/B
AV1 (Rear) Video : Composite, S-Video Audio : analogue AV2 (Front) Video : Composite Audio : analogue
Audio
Analogue output jacks X 2
Optical/coaxial digital audio output
Output
Composite Video : Video output jack X 1 Video S-Video output X 1 (Y: 1.0Vp-p, C:0.286Vp-p at 75 ohm load)
Component output X 1 (Y: 1.0Vp-p ,Pb:0.70Vp-p, Pr:0.70Vp-p at 75ohm load) HDMI DVI (576P) Picture compression format MPEG-II Audio compression format Dolby digital 2ch/256kbps, MPEG-II
Recording
Recording Quality
XP (about 8.5 Mbps), SP (about 4.5 Mbps), LP (about 2.5 Mbps),
EP (about 1.6 Mbps or about 1.2 Mbps), FR (about 1.2 Mbps to 8Mbps) Audio frequency characteristics 20 Hz ~ 20 KHz
2-2 Product Specification (Asia and Austrailia model)
Product Specification
Samsung Electronics 2-3
2-3 Chassis Product Specification (European model)
General Model Name
DVD-HR735/HR737
DVD-HR750/HR751/HR753 DVD-HR755/HR756/HR757
INPUT SELECT (DV/AV1/AV2/AV3/PR) PR/AV1/AV2/AV3 DV/AV1/AV2/AV3/PR DV/AV1/AV2/AV3/PR Scart Jack-1 A/V Input/Output Rear - AV1 AV1 RGB Output with Scart AV 1 Rear - Yes Yes Scart Jack-2 A/V with RGB Input Rear - AV2 AV2 CVBS Output - RCA Jack Rear - x1 x1 Audio Output -RCA Jack Rear Yes x 1 x2 ( L,R) x2 ( L,R) S-Video Output Rear Yes x 1 x1 x1 Component Video out Rear Yes x1(Y,Pb,Pr) x1(Y,Pb,Pr) Digital Audio Out (Optical) Rear Yes x 1 x1 x1 Digital Audio Out (Coaxial) Rear Yes x 1 x1 x1
Rear - - -
Front Yes (AV3) x1(AV3) x1(AV3)
Rear - - -
Front - x ( L,R / AV3) x1 ( L,R / AV3)
Rear - - -
Front - - ­DV Input Front Yes x1 x1 Aerial Input Rear Yes x 1 x1 x1 RF Out Rear - x1(w/o Modulator) x1(w/o Modulator) HDMI Output Rear Yes - / - / x1 x1 USB2.0 Mass Storage Host Front - - - / - / x1 DVD-Video Yes Yes Yes DVD-RAM - Yes Yes DVD-RW O Yes Yes DVD-R O Yes Yes DVD+RW - Yes Yes DVD+R - Yes Yes VCD - Yes (w/o Logo) Yes (w/o Logo) SVCD - Yes (w/o Logo) Yes (w/o Logo) MPEG4 (DivX3.1/DivX 4/DivX 5/DivX6) - Yes Yes DVD-Audio - - ­SACD - - ­CD - Yes Yes CD-R/RW O/O Yes Yes MP3 - Yes Yes JPEG - Yes(1000 folder) Yes Hard Disc (HDD) - Yes Yes DVD-RAM - Yes Yes DVD-RW - Yes Yes DVD-R - Yes Yes DVD+RW - - Yes DVD+R - - Yes DUAL LAYER RECORDING - -R only Yes Hard Disc (HDD) - Yes Yes VHS - - ­VIDEO MPEG-2 MPEG-2 MPEG-2 AUDIO 2ch Dolby2/0 Dolby2/0 DVD-Video - Yes Yes DivX (MPEG4) - - -
CVBS Input - RCA Jack
Audio Input - RCA Jack
S-Video Input
TERMINALS (Input/Output)
PLAYABLEME MEDIA &
FORMA T
RECORDING Disc Media
Recording Format
OPEN/CLOSE
DVD HDD PROG REC
OPEN/CLOSE
DVD HDD PROG REC
Product Specification
2-4 Samsung Electronics
General Model Name
DVD-HR735/HR737
DVD-HR750/HR751/HR753 DVD-HR755/HR756/HR757
RGB Recording - Yes Yes CD-DA - - ­MODE - XP/SP/LP/EP/SEP XP/SP/LP/EP/SEP Drive Speed - x2 x2 MPEG2 (XP/SP/LP/EP) - 1/2/4/8 1/2/4/8 VIDEO (NTSC3.58) REC/PB - No/Q-PAL No/Q-PAL
(PAL) REC/PB - Yes/Yes Yes/Yes
(SECAM) REC/PB - PAL Recording & Playback PAL Recording & Playback Broadcast System - PAL,SECAM -B/G,D/K,I PAL,SECAM -B/G,D/K,I Audio ( Stereo System ) - A2/NICAM A2/NICAM
HDD Capacity - 160G 250G/250G/320G
RECORDING TIME/MODE
COLOR SYSTEM
TUNER
Recording Format
Product Specification
Samsung Electronics 2-5
2-4 Chassis Product Specification (Asia and Austrailia model)
General Model Name
DVD-HR735/HR737
DVD-HR753/HR755/HR757
INPUT SELECT (DV/AV1/AV2/AV3/PR) PR/AV1/AV2/AV3 DV/AV1/AV2/PR Scart Jack-1 A/V Input/Output Rear - ­RGB Output with Scart AV 1 Rear - - Scart Jack-2 A/V with RGB Input Rear - ­CVBS Output - RCA Jack Rear - x 1 Audio Output -RCA Jack Rear Yes x 1 x 2 ( L,R) S-Video Output Rear Yes x 1 x 1 Component Video ou Rear Yes x 1(Y,Pb,Pr) Digital Audio Out (Optical) Rear Yes x 1 x 1 Digital Audio Out (Coaxial) Rear Yes x 1 x 1
Rear - x 1(AV1)
Front Yes (AV3) x 1(AV2)
Rear - x 1 ( L,R / AV1)
Front - x 1 ( L,R / AV2)
Rear - x 1
Front - ­DV Input Front Yes x 1 Aerial Input Rear Yes x 1 x 1 RF Out Rear - x 1 (w/o Modulator) HDMI Output Rear Yes x 1 USB2.0 Mass Storage Host Front - - / x 1 DVD-Video Yes Yes DVD-RAM - Yes DVD-RW O Yes DVD-R O Yes DVD+RW - Yes DVD+R - Yes VCD - Yes SVCD - Yes MPEG4 (DivX3.1/DivX 4/DivX 5/DivX6) - Yes DVD-Audio - ­SACD - ­CD - Yes CD-R/RW O/O Yes MP3 - Yes JPEG - Yes Hard Disc (HDD) - Yes DVD-RAM - Yes DVD-RW - Yes DVD-R - Yes DVD+RW - - / Yes / Yes DVD+R - - / Yes / Yes DUAL LAYER RECORDING - -R only / Yes / Yes Hard Disc (HDD) - Yes VHS - ­VIDEO MPEG-2 MPEG-2 AUDIO 2ch Dolby2/0 DVD-Video - Yes DivX (MPEG4) - -
CVBS Input - RCA Jack
Audio Input - RCA Jack
S-Video Input
TERMINALS (Input/Output)
PLAYABLEME MEDIA &
FORMA T
RECORDING Disc Media
Recording Format
OPEN/CLOSE
DVD HDD PROG REC
Product Specification
2-6 Samsung Electronics
General Model Name
DVD-HR735/HR737
DVD-HR753/HR755/HR757
RGB Recording - / - / ­CD-DA - ­MODE - XP/SP/LP/EP/SEP Drive Speed - x2 MPEG2 (XP/SP/LP/EP) - 1/2/4/8 VIDEO (NTSC3.58) REC/PB - No/Q-PAL
(PAL) REC/PB - Yes/Yes
(SECAM) REC/PB - PAL Recording & Playback Broadcast System - PAL,SECAM -B/G,D/K,I Audio ( Stereo System ) - A2/NICAM
HDD Capacity - 160G / 250G /320G
RECORDING TIME/MODE
COLOR SYSTEM
TUNER
Recording Format
Product Specification
Samsung Electronics 2-7
2-5 Option Product Specification
Description Fig Description Parts No Remark
Remote
Control
Batteries for
Remote Control
AK59-00062E
4301-001035
Model Standard of
DVD-HR755/XEU
Model Standard of
DVD-HR755/XEU
S.N.A
Model Standard of
DVD-HR755/XEU
Model Standard of
DVD-HR755/XEU
S.N.A
Model Standard of
DVD-HR755/XEU
Model Standard of
DVD-HR755/XEU
-
-
AC39-42001R
AC39-00017A
Instruction Manual
Quick Guide
Video/Audio
Cable
RF Cable
for TV
Product Specification
2-8 Samsung Electronics
MEMO
Samsung Electronics
3-1
3. Software Update
3-1 Drive Firmware Update
3-1-1 Introduction
When you can not record and play on specific recording media (especially on newly available DVD-RW or DVD-R).
3-1-2 How to make an update disc
• Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (http://europe.samsungportal.com)
2) Write the file to disc using the CD-RW of your computer.
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Extension name : “*.SMD”
- Multisession : No Multisession
- File name lenght : Max. of 11 = 8 + 3
- Format : Mode 1
- Character set : ISO 9660 or Joliet Format
- CD Close & Dise at once
N O T E
Very important : please read the notice below before updating your unit. The following events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
! Unplugging the power cord. @ Power Outage. # Dirt or Scratches on the disc. $ Opening a disc tray during processing.
WARNING
3-2
Software Update
Samsung Electronics
Fig. 3-1
* If you don’t see the message above, try another disc. Generally, this is caused by disc quality and by disc creating problem.
4) Press the OK button on the remote control (Fig. 3-1).
Fig.3-3
5) It takes about 1~2 minutes to complete the update. The message below will be displayed in the screen after update is completed and the tray will open automatically.
Fig. 3-4
6) After removing the update disc, turn off the unit with power button. Turn on the power again the tray will then close. The drive firmware is now complete.
Atfer checking old and new version, select “Yes” or “No” with ” or “ on the remote control.
* The Version is indicated by “XX.X modelname”
You will see “LOAD” on FLT Display.
Fig. 3-5
1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label facing up.
3) Press OPEN/CLOSE to close the disc tray.
* It takes about 1~2 minites before the mesage below appears.
Fig. 3-2 Remote Control
Drive Update
Do you want to update drive-firmware?
Version: Xx.X.HR755 -> XX.X.HR755
Yes
No
Drive Update
Now, processing...
Please, do not turn off the power.
Drive Update
Drive firmware is successfully
updated.
Software Update
3-3
Samsung Electronics
3-2 Flash Update
3-2-1 Introduction
When you encounter the problem which is not related in drive firmware necessity.
3-2-2 How to make an update disc
Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (http://europe.samsungportal.com)
2) Write the file to disc using the CD-RW of your computer.
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Multisession : No Multisession
- CD close & disc at once
- ISO 9660 or joliet format
- Extension name : “*.RUF”
• In order to increase disc playability, add a dummy file (over 100MB) together with the latest program. (The dummy file can be any kind of file except MP3 file etc which can be played in the unit and we recommend to use a file whose
extension name as “*.dmy”, which can be changed from original one.)
N O T E
Very important : please read the notice below before updating your unit. The followong events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
! Unplugging the power cord. @ Power Outage. # Dirt or Scratches on the disc. $ Opening a disc tray during processing.
WARNING
3-4
Software Update
Samsung Electronics
Fig. 3-6
* If you don’t see the message above, try another disc.
Generally, this is caused by disc quality and by disc creating problem.
4) Press the OK button on the remote control (Fig. 3-6).
Fig. 3-8
5) It takes about 5 minutes to complete the update. The message below will be displayed in the screen after update is completed and the tray will open automatically.
Fig. 3-9
6) After removing the update disc, turn off the unit with power button. Turn on the power again and the tray will then close. The Flash update is now complete.
* If the message to the left isn’t displayed after 10minutes
and the unit is no longer functioning properly, contact a samsung authorized service center.
Atfer checking old and new version, select “Yes” or “No” with ” or “ on the remote control.
* The Version is indicated by “YYMMDD.xx modelname”
1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label facing up.
3) Press OPEN/CLOSE to close the disc tray.
Fig. 3-7 Remote Control
Flash Update
Do you want to update flash memory?
Version: YYMMDD.xx.HR755
-> YYMMDD.xx.HR755
Yes
No
Flash Update
Now, processing...
Please, do not turn off the power.
Flash Update
Flash memory is successfully
updated.
Samsung Electronics
4-1
4. Disassembly and Reassembly
4-1 Cabinet and PCB
4-1-1 Top Cabinet Removal
1) Remove 5 Screws Œ, ´, ˇ.
2) Lift up the Top Cabinet ¨ in direction of arrow.
Fig. 4-1 Top Cabinet Removal
Note : Reassembly in reverse order.
´ 1 SCREW
(3 x 10 B)
Œ 3 SCREWS
(3 x 10 B)
ˇ 1 SCREW
(3 x 10 B)
¨ TOP CABINET
4-2
Samsung Electronics
Disassembly and Reaasembly
Fig. 4-2 Ass’y Front-Cabinet Removal
4-1-2 Ass’y Front-Cabinet Removal
1) Release 6 Hooks Œ, ´, ˇ, ¨ and Ass’y Front-Cabinet ˆ.
Œ 1 HOOK
¨ 2 HOOKS
ˇ 2 HOOKS
´ 1 HOOK
ˆ ASS’Y FRONT-CABINET
Disassembly and Reaasembly
Samsung Electronics
4-3
4-1-3 Hard Disk Removal
1) Remove 8 Screws Œ, ´, ˇ from the Hard Disk ¨ and lift it up.
Fig. 4-3 Hard Disk Removal
´ 2 SCREWS
(NC 8 4 . 2 Y)
Œ 4 SCREWS
(2.6 x 4 Y)
ˇ 2 SCREWS
(6-32 UNC 8 4 . 2 Y)
¨ HARD DISK
4-4
Samsung Electronics
Disassembly and Reaasembly
4-1-4 Ass’y Deck Removal
1) Remove 4 Screws Œ, ´ from the Ass’y Deck ˇ and lift it up.
Fig. 4-4 Ass’y Deck Removal
´ 2 SCREWS
(3 x 10 Y)
Œ 2 SCREWS
(3 x 8 Y)
ˇ ASS’Y DECK
Disassembly and Reaasembly
Samsung Electronics
4-5
Fig. 4-5 HDMI PCB, Main PCB and S.M.P.S. PCB Removal
4-1-5 HDMI PCB, Main PCB and S.M.P.S. PCB Removal
1) Remove 1 Screw Œ from the HDMI PCB ´ and lift it up.
2) Remove 2 Screws ˇ from the Main PCB ¨ and lift it up.
3) Remove 4 Screws ˆ from the S.M.P.S. PCB Ø and lift it up.
Œ 1 SCREW
(3 x 10 B)
´ HDMII PCB
ˇ 2 SCREWS
(3 x 10 Y)
¨ MAIN PCB
ˆ 4 SCREWS
(3 x 6 Y)
Ø SMPS PCB
4-6
Samsung Electronics
Disassembly and Reaasembly
4-1-6 Jack PCB Removal
1) Remove 6 Screws Œ, ´ from the Jack PCB ˇ and lift it up.
Fig. 4-6 Jack PCB Removal
Œ 4 SCREWS
(3 x 6 Y)
ˇ JACK PCB
´ 2 SCREWS
(5 x 14 Y)
Disassembly and Reaasembly
Samsung Electronics
4-7
4-1-7 DC FAN Removal
1) Remove 2 Screws Œ, from the DC Fan ´ and lift it up.
Fig. 4-7 DC FAN Removal
´ DC FAN
Œ 2 SCREWS
(5 x 14 Y)
4-8
Samsung Electronics
Disassembly and Reaasembly
4-2 PCB Location
Fig. 4-8 PCB Location
MAIN PCB
S.M.P.S PCB
HDMI PCB
JACK PCB
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