SAMSUNG DVD_907K Service Manual Cover

DIGITAL VERSATILE DISC PLAYER

DVD-907K
DVD-808K
DVD-807K
DVD-9901A

SERVICE

1. Precautions

2. Reference Information

3. Product Specification

4. Operating Instructions

5. Disassembly and Reassembly

6. IC Descriptions

7. Circuit Descriptions

8. Troubleshooting

9. Exploded Views and Parts List

10. Packing Diagram

11. Electrical Parts List

12. Block Diagram

13. PCB Diagrams

14. Wiring Diagram

15. Schematic Diagrams

Manual

DIGITAL VERSATILE DISC PLAYER CONTENTS

SERVICE MANUAL DVD-907K/808K/807K/DVD-9901A

ELECTRONICS

© Samsung Electronics Co., Ltd. MAR. 1999

Printed in Korea

AH68-00089A

Samsung Electronics 1-1

1. Before returning an instrument to the customer,
always make a safety check of the entire instru­ment, including, but not limited to, the following
items:

(1) Be sure that no built-in protective devices are

defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any remove
for servicing convenience. (2) When reinstalling the
chassis and/or other assembly in the cabinet, be
sure to put back in place all protective devices,
including, but not limited to, nonmetallic control
knobs, insulating fishpapers, adjustment and
compartment covers/shields, and isolation resis­tor/capacitor networks. Do not operate this instru­ment or permit it to be operated without all protec­tive devices correctly installed and functioning.

(2) Be sure that there are no cabinet openings

throught which adults or children might be able to
insert their fingers and contact a hazardous volt­age. Such openings include, but are not limited to,
excessively wide cabinet ventilation slots, and an
improperly fitted and/or incorrectly secured cabinet
back cover.

(3) Leakage Current Hot Check-With the instrument

completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use a isola­tion transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute(ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal waterpipe, conduit, etc.)
to all exposed metal parts of the instrument (anten­nas, handle brackets, metal cabinets, screwheads,
metallic overlays, control shafts, etc.), especially
any exposed metal parts that offer an electrical
return path to the chassis.

Any current measured must not exceed 0.5 mil­lamp. Reverse the instrument power cord plug in
the outlet and repeat the test. See Figure 1-1.

Fig. 1-1 AC Leakage Test

Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be ellminated before returning the instrument to the
customer.

(4) Insulation Resistance Test Cold Check-(1) Unplug

the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on
the power switch of the instrument. (3) Measure
the resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chas­sis, the reading must be infinite. If the reading is not
within the limits specified, there is the possibility of
a shock hazard, and the instrument must be
repared and rechecked before it is returned to the
customer. See figure 1-2.

Device

Under

Test

(Reading should
not be above

0.5mA)
Leakage

Current
Tester

Earth
Ground

Test all

exposed metal

surfaces

Also test with
plug reversed
(using AC adapter
plug as required)

2-Wire Cord

1. Pre cautions

1-1 Safety Precautions

Precautions

1-2 Samsung Electronics

Fig.1-2 Insulation Resistance Test

2. Read and comply with all caution and safety related
notes non or inside the cabinet, or on the chassis.

3. Design Afteration Warning-Do not alter of add to the
mechanical or electrical design of this instrument.
Design alterations and additions, including but not
limited to, circuit modifications and the addition of
items such as auxiliary audio output connections,
might alter the safety characteristics of this instru­ment and create a hazard to the user. Any design
alterations or additions will make you, the servicer,
responsible for personal injury or property damage
resulting therefrom.

4. Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:(1)
near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch ther­mally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a componect and the
printed-circuit board. Check the AC power cord for
damage.

5. Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/or
wiring that meet original specifications. Additionally,
determine the cause of overheating and/or damage
and, if necessary, take corrective action to remove
any potential safety hazard.

6. Product Safety Notice-Some electrical and mechan­ical parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have
special safety characteristics are identified by shad­ing, an ( x )or a ( )on schematisc and parts lists.
Use of a substitute replacement that does not have
the same safety characteristics as the recommend­ed replacement part might created shock, fire
and/or other hazards. Product safety is under
review continuously and new instructions are
issued whenever appropriate.

Antenna
Terminal

Exposed
Melal Part

ohm

ohmmeter

Samsung Electronics 1-3

CAUTION: Before servicing Instruments covered by
this service manual and its supplements, read and fol­low the Safety Precautions section of this manual.

Note: If unforseen circument create conflict between
the following servicing precautions and any of the
safety precautions, always follow the safety precau­tions. Remember: Safety First.

1-2-1 General Servicing Precautions

(1) a. Always unplug the instrument’s AC power cord

from the AC power source before (1) removing
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capaci­tor in the instrument.

b. Do not defeat any plug/socker B+ voltage inter-

locks with which instruments covered by this
service manual might be equipped.

c. Do not apply AC power to this instrument and/or

any of its electrical assemblies unless all solid­state device heat sinks are correctly installed.

d. Always connect a test instrument’s ground lead

to the instrument chassis ground before con­necting the test instrument positive lead. Always
remove the test instrument ground lead last.

Note: Refer to the Safety Precautions section ground
lead last.

(2) The service precautions are indicated or printed on

the cabinet, chassis or components. When servic­ing, follow the printed or indicated service precau­tions and service materials.

(3) The components used in the unit have a specified

flame resistance and dielectric strength. When
replacing components, use components which
have the same retings. Components identified by
shading, by( x ) or by ( ) in the circuit diagram
are important for safety or for the characteristics of
the unit. Always replace them with the exact
replacement components.

(4) An insulation tube or tape is sometimes used and

some components are raised above the printed wil­ing board for safety. The internal wiring is some­times clamped to prevent contact with heating com­ponents. Install such elements as they were.

(5) After servicing, always check that the removed

screws, corponents, and wiring have been installed
correctly and that the portion around the serviced
part has not been damaged and so on. Further,
check the insulation between the blades of the
attachment plug and accessible conductive parts.

1-2-2 Insulation Checking Procedure

Disconnect the attachment plug from the AC outlet and
turn the power ON. Connect the insulation resistance
meter (500V) to the blades of the attachment plug. The
insulation resistance between each blade of the
attachment plug and accessible conductive parts(see
note) should be more than 1 Megohm.

Note: Accesible conductive parts include metal pan­els, input terminals, earphone jacks, etc.

1-2 Servicing Precautions

1-4 Samsung Electronics

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be
damaged easily by static electricity.
Such components commonly are called Electro stati­cally Sensitive Devices(ESD). Examples of typical
ESD devices are integrated circuits and some fieldef­fect transistors and semiconductor chip components.
The following techniques should be used to help
reduce the incidence of component damage caused
by static electricity.

(1) Immediately before handling any semiconductor

component or semiconductor-equipped assembly,
drain off any electrostatic aharge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available dis­charging wrist strap device, which should be
removed for potential shock reasons prior to apply­ing power to the unit under test.

(2) After removing an electrical assembly equipped

with ESD devices, place the assembly on a con­ductive surface such as aluminum foil, to prevent
electrostatic charge buildup or exposure of the
assembly.

(3) Use only a grounded-tip soldering iron to solder or

unsolder ESD devices.

(4) Use ouly an anti-static solder removal devices.

Some solder removal devices not classified as
“anti-static” can generate electrical charges suffi­cient to damage ESD devices.

(5) Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damge
ESD devices.

(6) Do not remove a replacement ESD device from its

protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically short­ed together by condutive foam, aluminum foil or
comparable conductive materials).

(7) Immediately before removing the protective mate-

rials from the leads of a replacement ESD device,
touch the protective material to the chassis or cir­cuit assembly into which the device will be
installed.

CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.

(8) Minimize bodily motions when handling unpack-

aged replacement ESD devices. (Otherwise harm­less motion such as the brushing together of your
clothes fabric or the lifting of your foot from a car­peted floor can generate static electrictity suffcient
to damage an ESD device).

1-3 ESD Precautions

Samsung Electronics 1-5

* The laser diode in the optical pick up may suffer elec-

trostatic breakdown because of potential static elec­tricity from clothing and your body.

The following method is recommended.
(1) Place a conductive sheet on the work bench (The

black sheet used for wrapping repair parts.)

(2) Place the set on the conductive sheet so that the

chassis is grounded to the sheet.

(3) Place your hands on the conductive sheet(This

gives them the same ground as the sheet.)
(4) Romove the optical pick up block
(5) Perform work on top of the conductive sheet. Be

careful not to let your clothes or any other static

sources to touch the unit.

* Be sure to put on a wrist strap grounded to the

sheet.

* Be sure to lay a conductive sheet made of copper

etc. Which is grounded to the table.

Fig.1-3

(6) Short the short terminal on the PCB, which is inside

the Pick-Up ASS’Y, before replacing the Pick-Up.
(The short terminal is shorted when the Pick-Up
Ass’y is being lifted or moved.)

(7) After replacing the Pick-up, open the short terminal

on the PCB.

1-4 Handling the optical pick-up

THE UNIT

WRIST-STRAP
FOR GROUNDING

1M

1M

CONDUCTIVE SHEET

1-6 Samsung Electronics

1-5-1 Disassembly

1) Remove the power cable.

2) Switch LD SW3 on deck PCB to ‘S’ before remov­ing the FPC

( inserted into Main PCB CN1. See Fig 1-4.)

3) Disassemble the deck.

4) Disassemble the deck PCB.

5) Replace the Pick-up.

1-5-2 Assembly

1) Replace the Pick-up.

2) Assemble the deck PCB.

3) Reassemble the deck.

4) Switch LD SW3 on deck PCB to ‘O’ and insert
FPC into Main PCB CN1 (See Fig 1-4).

1-5 Pick-up disassembly and ressembly

Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.

Fig. 1-4

Samsung Electronics 2-1

2. Reference Information

2-1 Semiconductor Base Diagram

Fig. 2-1

RQ1

SS9012

S9012
G-634

E B C

D G S

K184

Y 6A

SQ1

K184

2-2 Samsung Electronics

2-2 Chip Replacement

1) Do not touch the part body directly with the sol­dering iron. ICs, especially TSOP, are easily dam­aged by heat.

2) Use care regarding soldering iron tip and avoid
repidly heating parts. Some parts can be damaged
by sudden heating. Preheat the part at about
100°… for several minutes before installing it.

3) Use soldering tip temperature of about 240°… or
larger parts, use a slightly higher temperature
(about 280°…).

4) The thin(0.3mm)solder for miniature parts does
not contain adequate flux. Supplementary flux is
thus needed in most cases.

5) Use care not to damage the circuit pattern, espe­cially when removing.

6) Because of the many pins, cleanliness of the pat­tern is extremely important after removing the IC.

7) Use care to avoid solder bridges. Remove any that
occurs.

8) Position the part carefully. They will also affect the
soldering operation. Be very precise in positioning
the IC. Soldering opposite pins first holds the IC in
place and makes soldering the other pins easier.

9) Do not reuse removed parts.

10) Check for solder joints, especially miniature parts
with small lead.

11) A defective trimming resistor cannot be adjusted
externally. Replace with an ordjnary variable resis­tor.

12) It is important to inspect the work with a magnifier.
Check after installing (cold solder joints, etc.).

2-2-1 Precaution for the chip Replacement

The tools for the chip replacement are as follows:

1) Thin tip type soldering iron

2) Small flat-blade tip-type soldering iron

3) Special desoldering tip iron

4) Airblower unit

5) Flat Package Pick-up

6) Flux can be cleaned by water

7) 0.3mm thin solder can be cleaned by water

8) Desoldering wire

9) Tweezers

2-2-2 Tools for the Chip Replacement

2-2-3 Chip Resistors and Chip Capacitors

-- Kind of the Part
The kind of chip resistors and chip capacitors as follows:d

1) Think Film Chip Resistors

2) Carbon Film Chip Resistors

3) Metal Film Chip Resistors

4) Chip Ceramic Capacitors

5) Chip Trimming Resistors

-- Removing the Part

1) Using two soldering irons:

Use thin tip soldering irons.
Use soldering tip temperature of about 280°….
Simultaneously heat both ends of the part.
While heating, grasp the part with the tips of the

soldering irons and remove it.

Use desoldering wire to completely remove the old

solder from the part location of the board.

A clean pattern for installing the new part is very

important.

Fig 2-2

-- Installing the Part

1) Use desoldering wire to remove the previous solder.

2) Clean the location.

3) Apply flux.

4) Position the IC and solder two pins at opposite sides.

5) Use a sharp tipped soldering iron and carefully
solder each Pin.(After gaining experience, a thicker
tip can be used for better work efficiency.)

6) Remove any solder bridges with desoldering wire.

7) Inspect the work with a magnifier.

1

2

3

4

5

6

Precautions

Samsung Electronics 2-3

-- Kind of the Part
The kind of the part is as follows:

1) Chip VRs.

2) Chip Trimmer Capacitors

3) Diode

4) Transistors

-- Removing the Part

1) Using two soldering irons:
Use small flat-blade tips.
Heat the leads of the part simultaneously.
When the solder melts, grasp and remove the part
with the soldering iron tips.
Remove the old solder with desoldering wire.

2-2-4 Diodes and Tr.

-- The kind of the Chip ICs

The kind of the chip ICs are as follows:

1) SOP(Small Outline Package)IC

2) SSOP(Shrink Small Outline Package)IC

3) VSOP(Very Small Outline Package)IC

4) QFP(Quad Flat Package)IC

5) VQFP(Very Quad Flat Package)IC

6) PLCC(Plastic Leaded Chip Carrier)IC

7) TSOP(Thin Small Outline Package)IC

2-2-5 Chip ICs

-- Removing the Part

1) Using special desoldering iron:
Selet the tip according to the size and shape of the IC.

“Tin” the tip with a small amount of the IC leads.

Set the tip squarely over the IC leads.
When the solder melts, carefully twist the iron.
Raise and remove the IC.

2) Using shaped airblower unit:

Select the correct nozzle.
Select the temperature and airblow(suggested:
temperature:7, airblow:4)
Engage the IC removing tool.

Use the airblow to preheat the IC for about 5
seconds, then heat with the nozzle until the IC
remover lifts the part from the board.

IC

Fig 2-4

-- Installing the Part

1) Use desoldering wire to remove the previous solder.

2) Clean the location.

3) Apply flux.

4) Position the IC and solder two pins at opposite sides.

5) Use a sharp tipped soldering iron and carefully sol
der each Pin.(After gaining experience, a thicker tip

can be used for better work efficiency.)

6) Remove any solder bridges with desoldering wire.

7) Inspect the work with a magnifier.

Fig 2-3

-- Installing the Part

1) Clean the area where the new part is to be mounted.

2) Apply flux.

3) Set part correctly into position, prevent it from shifting.

4) Use sharp soldering iron tip. Bring close to the
part contact without actually touching it. Melt thin
solder between the tip and part si that it flows into
the part contact.

1

234

123

45123

4

Precautions

2-4 Samsung Electronics

MEMO

Samsung Electronics 6-1

6. IC Descriptions

List

6-1
6-2
6-3
6-4
6-5
6-6
6-7
6-8

15-1-3 Data Processor

15-1-1 Micom

MIC1
MIC2

TMP93CS41

MAIN MICOM
4Megabit(512K 8-bit) CMOS EPROM
128K 8 bit CMOS SRAM
RF IC
DPD IC
3-PHASE MOTOR DRIVER
SERVO & CD DATA PROCESSOR
DVD DATA PROCESSOR
512K 8 bit CMOS DRAM
AUDIO/VIDEO DECODER
EPROM
CMOS DRAM
DIGIT AL-TO ANALOG CONVERTER
DIGIT AL-TO ANALOG CONVERTER

DIGITAL VIDEO ENCODER
FRONT MICOM
ECHO SOUND PROCESSOR

Am27C040
KM681000
TA1236F
TA1253F
BA6840
TC9420F
TC90A19F
KM48C512
ZiVA D6-L
AM27C4096
KM416C254DJ
AK4324
PCM1720
PCM1723
SAA7128
LC86P6232
ES56033

MIC3
RIC1
RIC2
SIC5
SIC7
DIC1
DIC2
BIC1
BIC2

AIC1
AIC2
AIC3
VIC1
FIC1
KIC1

15-1-2 Servo

15-1-4 A/V Decoder

15-1-5 Audio

15-1-6 Video
15-2 Front Board
15-4 Karaoke Board

6-9
6-10
6-11
6-12

BIC3,BIC4,BIC5,BIC6,BIC7

6-13
6-14
6-15

DIGITAL-TO ANALOG CONVERTER WITH PLL

6-16
6-17
6-18

SCHEMATIC

LOCATION DEVICE FUNCTION

6-2 Samsung Electronics

6-1 MAIN MICOM (MIC1 : TMP93CS41)

PAO~PA6

PA7(SCOUT)

P50 to P57

(ANO to AN7)

AVCC

AVSS
VREFH
VREFL

(TXD0)P90
(RXD0)P91

(SCLK0/CTS0)P92

(TXD1)P93
(RXD1)P94

(SCLK1)P95

(PG 00)P60
(PG 01)P61
(PG 02)P62
(PG 03)P63
(PG 10)P64
(PG 11)P65
(PG 12)P66
(PG 13)P67

(T10)P70

(T01)P71

(T02)P72

(T03)P73

(INT4/T14)P80
(INT5/T15)P81

(T04)P82
(T05)P83

(INT6/T16)P84
(INT7/T17)P85

(T06)P86

(INTO)P87

VCC[3]
VSS[3]

X1
X2

CLK

XT1
XT2
AM8/16
EA
RESET
ALE
TEST2,1

NMI

WDTOUT

P00 to P07
(AD0 to AC7)

P10 to P17
(AD8 to AD15/A8 toA15

P20 to P27
(A0 to A7/A16 to A23)

P30(RD)
P31(WR)
P32(HWR)
P33(WAIT)
P34(BUSRQ)
P35(BUSAK)
P36(R/W)
P37(RAS)

P40(CS0/CAS0)
P41(CS1/CAS1)
P42(CX2/CAS2)

cPORT A

High

Frequency

OSC

Low

Frequency

OSC

INTERRUPT

CONTROLLER

WATCH-DOG

TIMER

PORT 0

PORT 2

PORT 3

CS/WAIT

CONTROLLER

(3-BLOCK)

PORT 1

10-BIT 8CH

A/D

CONVERTER

SERIAL I/O

(CH,0)

SERIAL I/O

(CH,1)

PATTERN

GENERATOR

(CH,0)

PATTERN

GENERATOR

(CH,1)

16BIT TIMER

(TIMER 4)

16BIT TIMER

(TIMER 5)

8BIT TIMER

(TIMER 0)

8BIT TIMER

(TIMER 1)

8BIT PWM
(TIMER 2)

8BIT PWM
(TIMER 3)

900L-CPU

2KB RAM

XWA
XBC
ADE

XHL

XIX
XIY
XIZ

XSP

W

B
D
H

IX
IY
IZ

SP

A
C
E
L

32bit

FSR

P C

BLOCK DIAGRAM

IC Descriptions

6-3Samsung Electronics

PIN ASSIGNMENT

IC Descriptions

6-4 Samsung Electronics

VSS
VCC

A16
A17
A18
A19
A20
A21
A22
A23
/RD

/WR

ML0/DIF0

WAIT
/BUSRQ
/BUSAK

ED_K

ED_T

/CS0
/CS1
/CS2

DVD_SEL

OPEN

CLOSE

S/D_SEL

SDA

SCL

BASS

SLEDGS

WDTO

V

SS

V

CC

A16
A17
A18
A19
A20
A21
A22
A23
P30
P31
P32
P33
P34
P35
P36
P37
P40
P41
P42
P60
P61
P62
P63
P64
P65
P66
P67

61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90

I/O

O
O
O
O
O
O
O
O
O
O
O

I

I
O
O
O
O
O
O
O
O
O
O
O
O
O
O

GND(0V)
+5V
Address Bus 16
Address Bus 17
Address Bus 18

Address Bus 20
Address Bus 21
Address Bus 22
Address Bus 23
Strobe for Reading External Momory
Strobe for Writing Data AD0 to AD7

Audio DAC Data Latch 0
/AKM4324 Control(“L”=16/24bit, “H”=20bit)

Address Bus 19

Request CPU Bus Wait
Bus Request
Bus Acknowledge
EEPROM Trans. Clock(I2S)
EEPROM Trans. Data(I2S)
Chip Select 0
Chip Select 1
Chip Select 2
DVD/CD Mode Control(DVD=”Low”)
Door Open Motor Control
Door Close Motor Control
Single/Dual Disc Select(Single=”Low”)
Video Encoder Trans. Data(l

2

C)

Video Encoder Trans. Clock(l

2

C)
Bass Redirection Control(“L”=SW On, “H”=SW Off)
Sled Gain Select

FUNCTION

PIN I/O NAME

FUNCTION

PIN I/O NAME

VSS

FEI

SPFG

/SECAM

/PAL

/NTSC
OP-SW
CL-SW
VREFH

V

SS

P50
P51
P52
P53
P54
P55
P56
P57

VREFH

91
92
93
94
95
96
97
98
99

100

I
I
I
I
I
I
I
I
I

GND
Focus Error Input

Spindle FG Input
SECAM=”H”
PAL =”H”
NTSC=”H”
Door Open SW
Door Close SW
Reference Voltage Input to A/DC(¡ H¡–)

PIN ASSIGNMENT

6-5Samsung Electronics

6-2 4Megabit (512K, 144 x 8-bit) CMOS EPROM (MIC2 ; Am27C040)

NAME

A0-A17

CE (E)

DQ0-DQ7

OE (G)

PGM (P)

Vcc
Vpp
Vss

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16

Vpp
A16
A15
A12

A7
A6
A5
A4
A3
A2
A1

A0
DQ0
DQ1
DQ2

Vss

Vcc
PGM (P)
A17
A14
A13
A8
A9
A11
OE (G)
A10
CE (E)
DQ7
DQ6
DQ4
DQ4
DQ3

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

TOP VIEW

Output Enable

Chip Enable and

Prog Logic

Output Buffers

Y

Gating

2,097,152-Bit

Cell Matrix

Y

Decoder

A0-A17

Address

Inputs

OE

.
.
.
.
.

.
.

X

Decoder

Data Outputs

DQ0-DQ7

CE

Vpp

Vcc
Vss

CE/PCM

BLOCK DIAGRAM

FUNCTION

Address Inputs

Chip Enable Input

Data Input/Outputs

Output Enable Input

Program Enable Input

Vcc Syply Voltage

Program Voltage Input

Ground

PIN ASSIGNMENT

CE/PGM

8

4,194,304-Bit

CE (E)/PGM (P)

A18

18

CE (E)/PGM (P)

Chip Enable/Program Enable Input

6-6 Samsung Electronics

6-3 128K 8 bit CMOS SRAM (MIC3 ; KM681000B)

BLOCK DIAGRAM

Clk gen

Row
select

Data
cont

I/O

1

I/O8

CS1
CS2

WE

OE

I/O Circuit

Column select

A0 A1 A2 A3 A8 A9 A10 A11

Data
cont

Control
logic

Precharge circuit

Memory array
512 rows
256 8 columns

A4
A5
A6

A7
A12
A13
A14
A15
A16

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

32-DIP

32-SOP

N.C
A16
A14
A12

A7
A6
A5
A4
A3
A2
A1
A0

I/O1
I/O2

I/O3

VSS

VCC

A15

CS2

WE

A13
A8
A9

A11

OE

A10
CS1

I/O7

I/O8

I/O6

I/O5

I/O4

TOP VIEW PIN ASSIGNMENT

NAME

CS

1, CS2

FUNCTION

Chip Select Inputs

OE

Output Enable Input

WE

Write Enable Input

A0 ~ A16

Address Inputs

I/O1 ~ I/O8

Data Inputs/Outputs

Vcc

Power

Vss

Ground

N.C

No Connection

6-7Samsung Electronics

6-4 RF IC (RIC1 ; TA1236F)

BLOCK DIAGRAM

IC Descriptions

6-8 Samsung Electronics

LOGIC DIAGRAM

HADDR[2:0]

CS

R/W (M Mode)/WR (I Mode)

RD (I Mode)

HDATA[7:0]

WAIT

INT

Host

Interface

Signals

Video

Interface

Signals

DVD/CD

Interface

Signals

Audio
Interface
Signals

DRAM/ROM
Interface
Signals

Global
Interface
Signals

DA-DATA[2:0]

*

DA-LRCK

DA-BCK

DA-XCK

IEC958

MADDR[8:0]/MROMA[8:0]

MADDRH4

MADDRH1

MDATA[31:0]

MDATA[47:32]/MROMDATA[15:0]

MDATA[60:48]/MROMA[21:9]

MDATA[63:61]

MRAS1

MRAS0

MCAS[1:0]

MWE

MCE

SYSCLK

VDD

VSS

A_VSS

A_VDD

VDD5MAX

RESET

VDATA[7:0]

HSYNC

VSYNC

VCK

DVD-DATA[0]/CD-DATA

DVD-DATA[1]/CD-LRCK

DVD-DATA[2]/CD-BCK

DVD-DATA[3]/CD-C2PO

DVD-DATA[4]

DVD-DATA[5]

DVD-DATA[6]

DVD-DATA[7]

REQUEST

CSTROBE

ERROR

DACK

6-9Samsung Electronics

6-5 DPD IC (RIC2 ; TA1253F)

AGND

BIN1

N.C.

VREF

CIN1

N.C.
IREF
DIN1

DSEL
PDFIL1
PDFIL2

DVCC
DGND

TEOUT

DEFECT

TEST2
BDDC
TEST1

ACDC
BACTL
DPCTL

N.C.

AIN1

AVCC

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24

NAME FUNCTION

Ground
Four division detector B inpt
No connection
Reference voltage input
Four division detector C input
No connection

Current source setting current input for phase
difference current conversion

Four division detector D input
Phase difference signal off-set compensation

polarity selection input
Phase difference current voltage time constant

setting external capacitor
Phase difference current voltage time constant

setting external capacitor
Power (+5V) input

Grond
Tracking error signal ouput
Mute control input
For test

BD channel HPF time constant setting external
capacitor

For test
AC channel HPF time constant Setting external

capacitor
Tracking error balance control input
Phase difference signal off-set compensation

control input
No Connection

Four division detector A input
Power (+5V) input

PIN

PIN ASSIGNMENT

6-10 Samsung Electronics

6-6 3-PHASE MOTOR DRIVER (SIC5 ; BA6840 BFP)

BLOCK DIAGRAM

PIN ASSIGNMENT

NAME

Pin

FIN

3
4
5
6
7

9
10
13
14
15
16
17
20

GND

FUNCTION

Ground pin

A

3

Output pin

A

2

Output pin

Rnl

Current detector output pin

A

1

Output pin

GND

Ground pin

H1+

Hall signal input pin

H1-

Hall signal input pin

H2+

Hall signal input pin

H2-

Hall signal input pin

H3+

Hall signal input pin

H3-

Hall signal input pin

V

H

Hall bias pin

C

NF

Capacitor for phase compensation connection pin

NAME

Pin

21
22
23
24
25
26

E

CR

FUNCTION

Standard output current control pin

E

C

Output current control pin

ST/SP

Start/stop switch pin

REV

Reverse pin

V

cc

Power supply pin

V

M

Motor power supply pin

6-11Samsung Electronics

6-7 SERVO & CD DATA PROCESSOR (SIC7 ; TC9420F)

BLOCK DIAGRAM

IC Descriptions

6-12 Samsung Electronics

PIN ASSIGNMENT

IC Descriptions

6-13Samsung Electronics

IO2(DMOP)
IO2(DMON)

/DMOUT

/CKSE
/DACT
TESIN

TESIO1

V

SS

PXI
PXO
V

DD

XVSS

XI

XO

XV

DD

DVDO

RO

DV

SS

DVR

LO

DV

DD

TEST1
TEST2
TEST3

BUS0

66
67

68

69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90

Wide use I/O port
Wide use I/O port

Mode setting to output binary PWM signals of field
equalizer from IO0 and IO1 terminals and of disc
equalizer from IO2 and IO3 terminals

X¡fltal selection
DAC test mode
Test input (external VCO clock input)
Test I/O
Digital ground
DPS system clock oscillation circuit input
DPS system clock oscillation circuit output
Digital + power supply
Ground for system clock oscillation circuit
System clock oscillation circuit input
System clock oscillation circuit output

+ power supply for system clock oscillation
circuit

D/A converting section power supply
R channel data forward rotation output
D/A converting section ground
D/A converting section reference voltage
L channel data forward rotation output
D/A converting section power supply
Test mode terminal
Test mode terminal
Test mode terminal
Data I/O (for microcomputer interface)

BUS1
BUS2
BUS3

V

DD

V

SS

BUCK

/CCE

TEST4

/TSMOD

/RST

91
92
93
94
95
96
97
98
99

100

Chip enable signal input for microcomputer
interface

Data I/O (for microcomputer interface)
Data I/O (for microcomputer interface)
Data I/O (for microcomputer interface)
Digital + power supply
Digital ground
Clock input for microcomputer interface

Test mode terminal
Local test mode selection
Reset signal input

NAME FUNCTION

PIN

NAME FUNCTION

PIN

PIN ASSIGNMENT

6-14 Samsung Electronics

6-8 DVD DATA PROCESSOR (DIC1 ; TC90A19F)

BLOCK DIAGRAM

IC Descriptions

6-15Samsung Electronics

PIN ASSIGNMENT

IC Descriptions

6-16 Samsung Electronics

PIN ASSIGNMENT

MA4
MA3
MA2
MA1
MA0

DV

SS2

DV

DD2

MD7
MD6
MD5
MD4
MD3
MD2
MD1
MD0
SD7
SD6
SD5
SD4

DV

SS1

DV

DD1

SD3
SD2
SD1
SD0

66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90

External RAM address bus output

External RAM address bus output

External RAM address bus output
External RAM address bus output
External RAM address bus output
Digital ground
Digital power supply
External RAM data bus I/O
External RAM data bus I/O
External RAM data bus I/O
External RAM data bus I/O
External RAM data bus I/O
External RAM data bus I/O
External RAM data bus I/O
External RAM data bus I/O
MPEG data output
MPEG data output
MPEG data output
MPEG data output
Digital ground
Digital power supply
MPEG data output
MPEG data output
MPEG data output
MPEG data output

SERR
SBGN
SENB
SDCK
DV

SS1

SREQ
RSTN
DV

DD1

STDA

STCK

Digital power supply

MPEG data reliability flag output
(data error:L)

MPEG output secter synchronous signal output
(secter top:L)

MPEG data effective flag output (effective:L)
MPEG data transfer clock output
Digital ground
MPEG data request flag input(request:L)
Hard reset input (reset:L)

Operation monitor data output
(Output is carried out in synchronization
with the falling edge of SDCK)

Operation monitor synchronous signal
output (data top bit:L)

91
92
93
94
95
96
97
98

99

100

NAME FUNCTION

PIN

NAME FUNCTION

PIN

6-17Samsung Electronics

6-9 512 8 bit CMOS DRAM (DIC2 ; KM48C 512D)

PIN ASSIGNMENT

NAME

A0 ~ A9

FUNCTION

Address Input

DQ0 ~ 7

Data In/Out

Vss

Ground

RAS

Row Address Strobe

CAS

Column Address Strobe

W

Read/Write Input

OE

Data Output Enable

Vcc

Power(+5V)
Power(+3.3V)

N.C

No Connection

RAS

OE

CAS

W

Control
Clocks

VBB Generator

Vcc
Vss

Data in

Buffer

Data out

Buffer

Row Decoder

Refresh Timer

Refresh Control

Refresh Counter

Row Address Buffer

Col. Address Buffer

A0 - A9

A0 - A8

Memory Array

524,288 x8

Cells

Column Decoder

Sense Amps & I/O

DQ0

to

DQ7

1 28

27
26
25

2
3
4

24

5

23

6

22

7

21

8

20

9

19

10

18

11

17

12

16

13

15

14

Vcc

Vcc Vss

Vss

DQ0 DQ7

DQ6
DQ5
DQ4

DQ1
DQ2
DQ3

N.C
W
RAS

A9
A0
A1
A2
A3

A8
A7
A6
A5
A4

CAS

OE
N.C

BLOCK DIAGRAM

TOP VIEW

6-18 Samsung Electronics

6-10 AUDIO/VIDEO DECODER (BIC1 ; ZiVA D6-L)

Memory

Controller

OSD

Decoder

Video

Mixer

Video

Interface

Audio

Interface

Sync

Generator

Subpicture

Decoder

MPEG

Video

Decoder

Dolby Digital

Audio

Decoder

MPEG
Audio

Decoder

Host

Interface

Control Logic

Program

Stream

Decoder

DRAM/

ROM

Interface

Host

Interface

DVD/CD

Interface

ZZii VV AA DD eeccoo dd eerr

BLOCK DIAGRAM

Digital Audio

and

IEC-958

Interface

IC Descriptions

6-19Samsung Electronics

LOGIC DIAGRAM

HADDR[2:0]

CS

R/W (M Mode)/WR (I Mode)

RD (I Mode)

HDATA[7:0]

WAIT

INT

Host

Interface

Signals

Video

Interface

Signals

DVD/CD

Interface

Signals

Audio
Interface
Signals

DRAM/ROM
Interface
Signals

Global
Interface
Signals

DA-DATA[2:0]

*

DA-LRCK

DA-BCK

DA-XCK

IEC958

MADDR[8:0]/MROMA[8:0]

MADDRH4

MADDRH1

MDATA[31:0]

MDATA[47:32]/MROMDATA[15:0]

MDATA[60:48]/MROMA[21:9]

MDATA[63:61]

MRAS1

MRAS0

MCAS[1:0]

MWE

MCE

SYSCLK

VDD

VSS

A_VSS

A_VDD

VDD5MAX

RESET

VDATA[7:0]

HSYNC

VSYNC

VCK

DVD-DATA[0]/CD-DATA

DVD-DATA[1]/CD-LRCK

DVD-DATA[2]/CD-BCK

DVD-DATA[3]/CD-C2PO

DVD-DATA[4]

DVD-DATA[5]

DVD-DATA[6]

DVD-DATA[7]

REQUEST

CSTROBE

ERROR

DACK