General Information DDR3 SDRAM
DDR3 SDRAM Product Guide
October 2009
Memory Division
October 2009
General Information DDR3 SDRAM
1. DDR3 SDRAM Component Ordering Information
1 2 3 4 5 6 7 8 9 10 11
K 4 B X X X X X X X - X X X X
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
1. SAMSUNG Memory : K
2. DRAM : 4
3. DRAM Type
B : DDR3 SDRAM
4. Density
51 : 512Mb
1G : 1Gb
2G : 2Gb
4G : 4Gb
7. Interface ( V
6 : SSTL (1.5V, 1.5V)
8. Revision
: 1st Gen.
M
: 2nd Gen.
A
: 3rd Gen.
B
: 4th Gen.
C
: 5th Gen.
D
: 6th Gen.
E
: 7th Gen
F
: 8th Gen
G
: 9th Gen
H
DD, VDDQ)
Speed
Temp & Power
Package Type
Revision
Interface (V
# of Internal Banks
DD, VDDQ)
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
9. Package Type
: FBGA (Lead-free)
Z
: FBGA (Halogen-free & Lead-free)
H
: FBGA (Lead-free, DDP)
J
: FBGA (Halogen-free & Lead-free, DDP)
M
10. Temp & Power
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
C
: Commercial Temp.( 0°C ~ 85°C) & Low Power
L
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
Y
11. Speed
: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
F7
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
F8
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
H9
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
K0
October 2009
General Information DDR3 SDRAM
2. DDR3 SDRAM Component Product Guide
Density Banks Part Number
K4B1G0446D HC(L)F7/F8/H9 256M x 4
1Gb D-die 8Banks
1Gb E-die 8Banks
1Gb F-die 8Banks
2Gb B-die 8Banks
2Gb C-die 8Banks
DDP 2Gb D-die 8Banks
DDP 2Gb E-die 8Banks
DDP 4Gb B-die 8Banks
K4B1G0846D HC(L)F7/F8/H9 128M x 8
K4B1G1646D HC(L)F7/F8/H9 64M x 16
K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4
K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8
K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16
K4B1G0446E HYF7/F8/H9/K0 256M x 4
K4B1G0846E HYF7/F8/H9/K0 128M x 8
K4B1G0446F HC(L)F8/H9 256M x 4
K4B1G0846F HC(L)F8/H9 128M x 8
K4B1G0446F HY(L)F8/H9 256M x 4
K4B1G0846F HY(L)F8/H9 128M x 8
K4B2G0446B HC(L)F7/F8/H9 512M x 4
K4B2G0846B HC(L)F7/F8/H9 256M x 8
K4B2G1646B HC(L)F7/F8/H9 128M x 16
K4B2G0446B HYF7/F8/H9 512M x 4
K4B2G0846B HYF7/F8/H9 256M x 8
K4B2G0446C HC(L)F8/H9 512M x 4
K4B2G0846C HC(L)F8/H9 256M x 8
K4B2G0446C HY(L)F8/H9 512M x 4
K4B2G0846C HY(L)F8/H9 256M x 8
K4B2G0446D MC(L)F7/F8/H9 512M x 4
K4B2G0846D MC(L)F7/F8/H9 256M x 8
K4B2G0446E MC(L)F7/F8/H9 512M x 4
K4B2G0846E MC(L)F7/F8/H9 256M x 8
K4B4G0446B MC(L)F7/F8/H9 1G x 4
K4B2G0846B MC(L)F7/F8/H9 512M x 8
* Note : 1.35V product is 1.5V operatable.
Package & Power,
Tem p.
(-C/-L) & Speed
Org. VDD Voltage PKG Avail. Note
78 + 4 ball
1.5V
1.5V
1.35V
1.5V
1.35V
1.5V
1.35V
1.5V
1.35V
1.5V
1.5V
1.5V
FBGA
96 + 4 ball
FBGA
78 ball
FBGA
96 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
96 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
Now
Now
Now
Now
Now
Now
Now
Now
October 2009
General Information DDR3 SDRAM
3. DDR3 SDRAM Module Ordering Information
1 2 3 4 5 6 7 8 9 10 11 12
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
# of Banks in Comp. & Interface
Bit Organization
Temp & Power
PCB Revision
Component Revision
Speed
Package
1. Memory Module : M
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
: x64 204pin Unbuffered SODIMM
71
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM
4. DRAM Component Type
B : DDR3 SDRAM (1.5V VDD)
5. Depth
: 32M 33 : 32M (for 128Mb/512Mb)
32
64 : 64M 65 : 64M (for 128Mb/512Mb)
28 : 128M 29 : 128M (for 128Mb/512Mb)
56 : 256M 57 : 256M (for 512Mb/2Gb)
51 : 512M 52 : 512M (for 512Mb/2Gb)
1G : 1G 1K : 1G (for 2Gb)
2G : 2G 2K : 2G (for 2Gb)
6. # of Banks in comp. & Interface
7 : 8Banks & SSTL-1.5V
8. Component Revision
:
M 1st Gen. A 2nd Gen.
:
B 3rd Gen. C 4th Gen.
:
D 5th Gen. E 6th Gen.
F : 7th Gen. G 8th Gen.
9. Package
:
Z FBGA(Lead-free)
:
H FBGA(Lead-free & Halogen-free)
:
J FBGA(Lead-free, DDP)
:
M FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0 : None
2 : 2nd Rev.
4 : 4th Rev.
11. Temp & Power
C Y: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
12. Speed
: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
F7
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
F8
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
H9
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
K0
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
:
:
:
:
1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer
7. Bit Organization
0 : x 4
3 : x 8
4 : x16
October 2009
General Information DDR3 SDRAM
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Org. Density Part Number Speed Raw Card Composition
128Mx 64 1GB
128Mx 72 1GB
256Mx 64 2GB
256Mx 72 2GB
512Mx 64 4GB
512Mx 72 4GB
M378B2873DZ1 CF8/H9
M378B2873EH1 CF8/H9/K0 128M x 8 * 8 pcs 1Gb E-die
M378B2873FHS CF8/H9 128M x 8 * 8 pcs 1Gb F-die
M391B2873DZ1 CF8/H9
M391B2873EH1 CF8/H9/K0 128M x 8 * 9 pcs 1Gb E-die
M391B2873FH0 CF8/H9/K0 128M x 8 * 9 pcs 1Gb F-die
M378B5673DZ1 CF8/H9
M378B5673EH1 CF8/H9/K0 128M x 8 * 16 pcs 1Gb E-die
M378B5673FH0 CF8/H9/K0 128M x 8 * 16 pcs 1Gb F-die
M378B5773CHS CF8/H9/K0 A(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
M391B5673DZ1 CF8/H9
M391B5673EH1 CF8/H9/K0 128M x 8 * 18 pcs 1Gb E-die
M391B5673FH0 CF8/H9/K0 128M x 8 * 18 pcs 1Gb F-die
M391B5773CH0 CF8/H9/K0 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 1
M378B5273BH1 CF8/H9
M378B5273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die
M391B5273BH1 CF8/H9
M391B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die
A(1Rx8)
D(1Rx8)
B(2Rx8)
E(2Rx8)
B(2Rx8)
E(2Rx8)
128M x 8 * 8 pcs 1Gb D-die
128M x 8 * 9 pcs 1Gb D-die
128M x 8 * 16 pcs 1Gb D-die
128M x 8 * 18 pcs 1Gb D-die
256M x 8 * 16 pcs 2Gb B-die
256M x 8 * 18 pcs 2Gb B-die
Comp.
Versi on
Internal
Banks
Rank PKG Height Avail. Note
81
81
82
8
82
82
2
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
30mm Now
30mm Now
30mm Now
30mm Now
30mm Now
30mm Now
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
240Pin DDR3 Unbuffered DIMM
Org. Density Part Number Speed Raw Card Composition
128Mx 72 1GB
256Mx 72 2GB
512Mx 72 4GB
M391B2873EH1 YF8/H9
M391B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die
M391B5673EH1 YF8/H9
M391B5773CH0 YF8/H9 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 8 1
M391B5273BH1 YF8/H9
M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
* Note : 1.35V product is 1.5V operatable.
D(1Rx8)
E(2Rx8)
E(2Rx8)
128M x 8 * 9 pcs 1Gb E-die
128M x 8 * 18 pcs 1Gb E-die
256M x 8 * 18 pcs 2Gb B-die
Comp.
Versi on
Internal
Banks
Rank PKG Height Avail. Note
81
82
82
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
30mm Now
30mm NowM391B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die
30mm Now
October 2009
General Information DDR3 SDRAM
4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Org. Density Part Number Speed Raw Card Composition
M471B2874DZ1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb D-die 8 2
128Mx 64 1GB
256Mx 64 2GB
512Mx 64 4GB
M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1
M471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball
M471B2873FHS CF8/H9 B(1Rx8) 64M x 16 * 8 pcs 1Gb F-die 8 1
M471B5673DZ1 CF8/H9
M471B5673EH1 CF8/H9 128M x 8 * 16 pcs 1Gb E-die
M471B5673FH0 CF8/H9 128M x 8 * 16 pcs 1Gb F-die
M471B5773CHS CF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
M471B5273BH1 CF8/H9
M471B5273CH0 CF8/H9 256M x 8 * 16 pcs 2Gb C-die
F(2Rx8)
F(2Rx8)
128M x 8 * 16 pcs 1Gb D-die
256M x 8 * 16 pcs 2Gb B-die
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
82
82
96 + 4 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 ball
FBGA
30mm Now
30mm Now
30mm Now
4.4 204Pin DDR3 SoDIMM (1.35V Product)
204Pin DDR3 SODIMM
Org. Density Part Number Speed Raw Card Composition
M471B2873EH1 YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1
128Mx 64 1GB
M471B2873FHS YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb F-die 8 1
M471B5673EH1 YF8/H9
256Mx 64 2GB
M471B5773CHS YF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
512Mx 64 4GB
M471B5273BH1 YF8/H9
M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die
* Note : 1.35V product is 1.5V operatable.
F(2Rx8)
F(2Rx8)
128M x 8 * 16 pcs 1Gb E-die
256M x 8 * 16 pcs 2Gb B-die
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
82
82
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
30mm NowM471B2874EH1 YF8/H9 A(1Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball
30mm NowM471B5673FH0 YF8/H9 128M x 8 * 16 pcs 1Gb F-die
30mm Now
October 2009
General Information DDR3 SDRAM
4.5 240Pin DDR3 Registered DIMM (1.5V Product)
240Pin DDR3 Registered DIMM
Org. Density Part Number Sp eed Raw Card Composition
128Mx 72 1GB
256Mx 72 2GB
512Mx 72 4GB
1Gx 72 8GB
2Gx 72 16GB
M393B2873DZ1 CF8/H9
M393B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die
M393B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die
M393B5673DZ1 CF8/H9
M393B5673EH1 CF8/H9 128M x 8 * 18 pcs 1Gb E-die
M393B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die
M393B5670DZ1 CF8/H9
M393B5670EH1 CF8/H9 256M x 4 * 18 pcs 1Gb E-die
M393B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die
M393B5173DZ1 CF7/F8
M393B5173EH1 CF7/F8 128M x 8 * 36 pcs 1Gb E-die
M393B5173FH0 CF7/F8 128M x 8 * 36 pcs 1Gb F-die
M393B5170DZ1 CF8/H9
M393B5170EH1 CF8/H9 256M x 4 * 36 pcs 1Gb E-die
M393B5170FH0 CF8/H9 256M x 4 * 36 pcs 1Gb F-die
M393B5273BH1 CF8/H9
M393B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die
M393B5270BH1 CF8/H9
M393B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die
M393B1G70DJ1 CF7/F8
M393B1G70EM1 CF7/F8
M393B1K73BH1 CF7/F8
M393B1K73CH0 CF7/F8 256M x 8 * 36 pcs 2Gb C-die
M393B1K70BH1 CF8/H9
M393B1K70CH0 CF8/H9 512M x 4 * 36 pcs 2Gb C-die
M393B2K70BM1 CF7/F8
M393B2K70CM0 CF7/F8
A(1Rx8)
B(2Rx8)
C(1Rx4)
H(4Rx8)
E(2Rx4)
B(2Rx8)
C(1Rx4)
F(4Rx4)
H(4Rx8)
E(2Rx4)
F(4Rx4)
128M x 8 * 9 pcs 1Gb D-die
128M x 8 * 18 pcs 1Gb D-die
256M x 4 * 18 pcs 1Gb D-die 1
128M x 8 * 36 pcs 1Gb D-die
256M x 4 * 36 pcs 1Gb D-die 2
256M x 8 * 18 pcs 2Gb B-die
512M x 4 * 18 pcs 2Gb B-die
DDP
x 4 * 36 pcs 1Gb D-die
512M
DDP
x 4 * 36 pcs 1Gb E-die
512M
256M x 8 * 36 pcs 2Gb B-die
512M x 4 * 36 pcs 2Gb B-die
DDP
x 4 * 36 pcs 2Gb B-die
1G
DDP
x 4 * 36 pcs 2Gb C-die
1G
Comp.
Ver si on
Internal
Banks
Rank PKG Height Avail. Note
81
2
2
8
1
4
4
8
8
84
2
2
1
4
4
2
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
30mm Now
30mm Now
30mm Now
30mm Now
30mm Now
October 2009
General Information DDR3 SDRAM
4.6 240Pin DDR3 Registered DIMM (1.35V Product)
240Pin DDR3 Registered DIMM
Org. Density Part Number Sp eed Raw Card Composition
128Mx 72 1GB
256Mx 72 2GB
512Mx 72 4GB
1Gx 72 8GB
2Gx 72 16GB
M393B2873EH1 YF8/H9
M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die
M393B5673EH1 YF8/H9
M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die
M393B5670EH1 YF8/H9
M393B5773CH0 YF8/H9 A(1Rx8) 512M x 4 * 9 pcs 2Gb C-die
M393B5173EH1 YF7/F8
M393B5173FH0 YF7/F8 128M x 8 * 36 pcs 1Gb F-die
M393B5170EH1 YF8/H9
M393B5170FH0 YF8/H9 256M x 4 * 36 pcs 1Gb F-die
M393B5273BH1 YF8/H9
M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
M393B5270BH1 YF8/H9
M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die
M393B1G70EM1 YF7/F8
M393B1G70FM0 YF7/F8
M393B1K73BH1 YF7/F8
M393B1K73CH0 YF7/F8 256M x 8 * 36 pcs 2Gb C-die
M393B1K70BH1 YF8/H9
M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die
M393B2K70BM1 YF7/F8
M393B2K70CM0 YF7/F8
A(1Rx8)
B(2Rx8)
C(1Rx4)
H(4Rx8)
E(2Rx4)
B(2Rx8)
C(1Rx4)
F(4Rx4)
H(4Rx8)
E(2Rx4)
F(4Rx4)
128M x 8 * 9 pcs 1Gb E-die
128M x 8 * 18 pcs 1Gb E-die
256M x 4 * 18 pcs 1Gb E-die
128M x 8 * 36 pcs 1Gb E-die
256M x 4 * 36 pcs 1Gb E-die
256M x 8 * 18 pcs 2Gb B-die
512M x 4 * 18 pcs 2Gb B-die
DDP
x 4 * 36 pcs 1Gb E-die
512M
DDP
x 4 * 36 pcs 1Gb F-die Nov. ’09
512M
256M x 8 * 36 pcs 2Gb B-die
512M x 4 * 36 pcs 2Gb B-die
DDP
x 4 * 36 pcs 2Gb B-die
1G
DDP
x 4 * 36 pcs 2Gb C-die Nov. ’09
1G
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
81
82
81M393B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die
84
82
82
81
84
84
82
84
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
30mm Now
30mm Now
30mm Now
Now
30mm
Now
Now
30mm
* Note : 1.35V product is 1.5V operatable.
October 2009
General Information DDR3 SDRAM
4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
Org. Density Part Number Speed Raw Card Composition
128Mx 72 1GB
256Mx 72 2GB
512Mx 72 4GB
1Gx 72 8GB
M392B2873DZ1 CF8/H9
M392B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die
M392B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die
M392B5673DZ1 CF8/H9
M392B5673EH1 CF8/H9 128M x 8 * 18 pcs 1Gb E-die
M392B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die
M392B5670DZ1 CF8/H9
M392B5670EH1 CF8/H9 256M x 4 * 18 pcs 1Gb E-die
M392B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die
M392B5773CH0 CF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb F-die 1
M392B5170DJ1 CF8/H9
M392B5170EM1 CF8/H9
M392B5170FM0 CF8/H9
M392B5173FM0 CF7/F8 V(4Rx8)
M392B5273BH1 CF8/H9
M392B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die
M392B5270BH1 CF8/H9
M392B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die
M392B1K73BM1 CF7/F8
M392B1K73CM0 CF7/F8
M392B1K70BM1 CF8/H9
M392B1K70CM0 CF8/H9
K(1Rx8)
L(2Rx8)
M(1Rx4)
N(2Rx4)
L(2Rx8)
M(1Rx4)
V(4Rx8)
N(2Rx4)
128M x 8 * 9 pcs 1Gb D-die
128M x 8 * 18 pcs 1Gb D-die
256M x 4 * 18 pcs 1Gb D-die
DDP
x 4 * 18 pcs 1Gb D-die
512M
DDP
x 4 * 18 pcs 1Gb E-die
512M
DDP
x 4 * 18 pcs 1Gb F-die
512M
DDP
x 8 * 18 pcs 1Gb F-die 4
256M
256M x 8 * 18 pcs 2Gb B-die
512M x 4 * 18 pcs 2Gb B-die
DDP
x 8 * 18 pcs 2Gb B-die
512M
DDP
x 8 * 18 pcs 2Gb C-die
512M
DDP
x 4 * 18 pcs 2Gb B-die
1G
DDP
x 4 * 18 pcs 2Gb C-die
1G
Comp.
Versi on
Internal
Banks
Rank PKG Height Avai l. Note
81
2
8
1
2
8
2
1
4
8
2
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 + 4 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
18.75mm Now
18.75mm Now
Now
18.75mm
18.75mm Now
Dec. ’09
Now
October 2009
General Information DDR3 SDRAM
4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)
240Pin DDR3 VLP Registered DIMM
Org. Density Part Number Speed Raw Card Composition
128Mx 72 1GB
256Mx 72 2GB
512Mx 72 4GB
1Gx 72 8GB
M392B2873EH1 YF8/H9
M392B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die
M392B5673EH1 YF8/H9
M392B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die
M392B5670EH1 YF8/H9
M392B5773CH0 YF8/H9 K(1Rx8) 512M x 4 * 9 pcs 2Gb C-die
M392B5170EM1 YF8/H9 N(2Rx4)
M392B5173FM0 YF7/F8 V(4Rx8) 256M x 8 * 18 pcs 1Gb F-die 8 4
M392B5170FM0 YF8/H9 N(2Rx4) 512M x 4 * 18 pcs 1Gb F-die
M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
M392B5270BH1 YF8/H9
M392B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die
M392B1K73BM1 YF7/F8
M392B1K73CM0 YF7/F8
M392B1K70BM1 YF8/H9
M392B1K70CM0 YF8/H9
K(1Rx8)
L(2Rx8)
M(1Rx4)
L(2Rx8)
M(1Rx4)
V(4Rx8)
N(2Rx4)
128M x 8 * 9 pcs 1Gb E-die
128M x 8 * 18 pcs 1Gb E-die
256M x 4 * 18 pcs 1Gb E-die
DDP
x 4 * 18 pcs 1Gb E-die 8 2
512M
256M x 8 * 18 pcs 2Gb B-die
512M x 4 * 18 pcs 2Gb B-die
DDP
x 8 * 18 pcs 2Gb B-die
512M
DDP
x 8 * 18 pcs 2Gb C-die Nov. ’09
512M
DDP
x 4 * 18 pcs 2Gb B-die
1G
DDP
x 4 * 18 pcs 2Gb C-die Nov. ’09
1G
Comp.
Vers ion
Internal
Banks
Rank PKG Height Avail. Note
81
82
81M392B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die
82M392B5273BH1 YF8/H9
81
84
82
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
78 ball
FBGA
18.75mm Now
18.75mm Now
Now
Dec. ’09
18.75mm
Now
Now
18.75mm
Now
* Note : 1.35V product is 1.5V operatable.
October 2009
General Information DDR3 SDRAM
5. RDIMM RCD Information
5.1 RCD Identification in JEDEC Description in Module Label
5.2 Label Example
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0
0920
5.3 RCD Information
Made in Korea
M393B5170EH1-CH9
- Example
Vol tag e Vendor Revision Module P/N JEDEC Description On Label
1.5V
1.35V
Inphi GS04 B2 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-P0
IDT LV DDR3 B0 M393B5170EH1-CH9 4GB 2Rx4 PC3-10600R-09-10-E1-D2
Inphi LV GS02 C0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-P1
IDT LV DDR3 B0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-D2
October 2009
General Information DDR3 SDRAM
78 + 4Ball FBGA for 1Gb D-die (x4/x8)
(Datum A)
10 8765432111 9
A
B
(Datum B)
82 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
C
D
E
F
G
H
J
K
L
M
N
0.2 ABM
: Support Ball
9.00 ± 0.10
0.80 x 10 = 8.00
1.60
(0.95)
(1.90)
Bottom
4.000.80
A
#A1 INDEX MARK
4.80
0.80
0.80
MOLDING AREA
0.10MAX
#A1
B
11.00 ± 0.10
0.80 x 12 = 9.60
9.00 ± 0.10
11.00 ± 0.10
0.50 ± 0.05
0.35 ± 0.05
1.10 ± 0.10
Top
96 + 4Ball FBGA for 1Gb D-die (x16)
9.00 ± 0.10
0.80 x 10 = 8.00
4.000.80
(0.95)
MOLDING AREA
(1.90)
10 8765432111 9
(Datum A)
(Datum B)
100 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.2 ABM
1.60
Bottom
A
#A1 INDEX MARK
6.00
0.40
0.80 x 15 = 12.00
0.80
0.10MAX
#A1
B
13.30 ± 0.10
9.00 ± 0.10
0.50 ± 0.05
13.30 ± 0.10
0.35 ± 0.05
1.10 ± 0.10
Top
: Support Ball
October 2009
General Information DDR3 SDRAM
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
(Datum A)
A
B
(Datum B)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
C
D
E
F
G
H
J
K
L
M
N
0.2 ABM
7.50 ± 0.10
0.80 x 8 = 6.40
1.60
876543219
(1.90)
Bottom
3.200.80
(0.95)
A
#A1 INDEX MARK
4.80
0.80
0.80
MOLDING AREA
0.10MAX
B
11.00 ± 0.10
0.80 x 12 = 9.60
#A1
7.50 ± 0.10
0.50 ± 0.05
11.00 ± 0.10
0.35 ± 0.05
1.10 ± 0.10
Top
96Ball FBGA for 1Gb E-die (x16)
7.50 ± 0.10
0.80 x 8 = 6.40
3.200.80 1.60
876543219
0.2 ABM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
(0.95)
(1.90)
(Datum A)
(Datum B)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
A
#A1 INDEX MARK
6.00
0.40
0.80
MOLDING AREA
B
13.30 ± 0.10
0.80 x 15 = 12.00
#A1
7.50 ± 0.10
13.30 ± 0.10
0.10MAX
0.50 ± 0.05
0.35 ± 0.05
1.10 ± 0.10
Bottom
Top
October 2009
General Information DDR3 SDRAM
78Ball FBGA for 2Gb B-die (x4/x8)
(Datum A)
A
B
(Datum B)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
C
D
E
F
G
H
J
K
L
M
N
0.2 ABM
9.00 ± 0.10
1.60
876543219
(0.95)
(1.90)
BOTTOM VIEW
3.200.80
A
#A1 INDEX MARK
4.80
0.80
0.80
MOLDING AREA
0.10MAX
#A1
B
11.50 ± 0.10
0.80 x 12 = 9.60
9.00 ± 0.10
11.50 ± 0.10
0.35 ± 0.05
1.10 ± 0.10
TOP VIEW
96Ball FBGA for 2Gb B-die (x16)
9.00 ± 0.10
3.200.80
(0.95)
(1.90)
(Datum A)
(Datum B)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.2 ABM
1.60
876543219
A
#A1 INDEX MARK
6.00
0.40
0.80
MOLDING AREA
0.10MAX
#A1
B
13.30 ± 0.10
0.80 x 12 = 12.00
9.00 ± 0.10
13.30 ± 0.10
0.35 ± 0.05
1.10 ± 0.10
BOTTOM VIEW
TOP VIEW
October 2009
General Information DDR3 SDRAM
78Ball DDP for 1Gb D-die (x4)
(Datum A)
A
B
(Datum B)
82 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
C
D
E
F
G
H
J
K
L
M
N
0.2 ABM
10.50 ± 0.10
0.80 x 8 = 6.40
1.60
876543219
Bottom
A
4.000.80
#A1 INDEX MARK
4.80
0.80
0.80 x 12 = 9.60
0.80
#A1
B
11.00 ± 0.10
10.50 ± 0.10
11.00 ± 0.10
0.10MAX
0.35 ± 0.05
1.40 ± 0.10
Top
78Ball DDP for 1Gb E-die (x4/x8)
9.00 ± 0.10
0.80 x 8 = 6.40
(Datum A)
A
B
(Datum B)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
C
D
E
F
G
H
J
K
L
M
N
0.2 ABM
1.60
876543219
3.200.80
A
#A1 INDEX MARK
4.80
0.80
0.80 x 12 = 9.60
0.80
#A1
B
11.50 ± 0.10
9.00 ± 0.10
11.50 ± 0.10
0.10MAX
0.35 ± 0.05
1.40 ± 0.10
Bottom
Top
October 2009
General Information DDR3 SDRAM
78Ball DDP for 2Gb B-die (x4/x8)
(Datum A)
A
B
(Datum B)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
C
D
E
F
G
H
J
K
L
M
N
0.2 ABM
10.00 ± 0.10
0.80 x 8 = 6.40
1.60
876543219
Bottom
A
3.200.80
#A1 INDEX MARK
4.80
0.80
0.80 x 12 = 9.60
0.80
B
#A1
11.50 ± 0.10
10.00 ± 0.10
11.50 ± 0.10
0.10MAX
0.35 ± 0.05
1.40 ± 0.10
Top
October 2009
General Information DDR3 SDRAM
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
133.35 ± 0.15
128.95
(4X)3.00 ± 0.1
N/A
(for x64)
9.50
ECC
(for x72)
SPD
17.30
30.00 ± 0.15
(2)
2.50
5.00
54.675
47.00
2.30
A
B
Max 4.0
1.270 ± 0.10
2x 2.10 ± 0.15
N/A
(for x64)
ECC
(for x72)
3.80
71.00
0.80 ± 0.05
2.50 ± 0.20
0.2 ± 0.15
2.50
1.50±0.10
Detail A
1.00
Detail B
October 2009
General Information DDR3 SDRAM
x64 204pin DDR3 SDRAM Unbuffered SODIMM
Units : Millimeters
2X 1.80
0.10 ABM C
(OPTIONAL HOLES)
A
0.10 ABM C
63.60
SPD
B
39.00
Max 3.8
30.00 ± 0.15
6
1.00 ± 0.10
67.60
20.00
24.80
21.00
1.65
1.00 ± 0.10
4.00 ± 0.10
2X 4.00 ± 0.10
0.10 ABM C
0.60
0.45 ± 0.03
2.55
0.25 MAX
Detail BDetail A
October 2009
General Information DDR3 SDRAM
x72 240pin DDR3 SDRAM Registered DIMM
Units : Millimeters
133.35 ± 0.15
128.95
10.9
9.76 18.92 32.40 18.93 9.74
9.50
Register
C
(2X)3.00
Max 4.0
30.00 ± 0.15
2.50
54.675
47.00
5.00
2.50
Detail A
AB
1.50±0.10
3.80
71.00
2.50 ± 0.20
Detail B
1.00
0.80 ± 0.05
0.2 ± 0.15
1.27 ± 0.10
0
.5
0
R
1.0 max
10.9
0.4
2.30
17.30
Detail C
Register
Address, Command and Control lines
2x 2.10 ± 0.15
October 2009
General Information DDR3 SDRAM
Registered DIMM Heat Spreader Design
1. FRONT PART
Outside
9.26
4.65± 0.12
2
133.15 ± 0.2
130.45 ± 0.15
31.411. 9
127 ± 0.12
29.77
0.65 ± 0.2
R
0
.
2
0.15
23.6 ± 0.15
25.6 ± 0.15
1.3
2
1.3
R0.1
1
1+0/ -0.3
25.6 ± 0.15
2.6 ± 0.2
Inside
0.4
2. BACK PART
Outside
2 ± 0.1
Green Line : TIM Attatch Line
Reg. pedestal line
7.45
80.78
119.29
128.5
Inside
Green Line : TIM Attatch Line
October 2009
General Information DDR3 SDRAM
3. CLIP PART
39.3 ± 0.2
29.77
A
5
B
1.
R
4. DDR3 RDIMM ASS’Y View
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
Upper Bending
C
Tilting Gap
0.1 ~ 0.3
0.5
132.95 ± 133.45
1.27
* Dimension Index
1.05
39.3 ± 0.2
19 ± 0.1
K
text mark ’B’ or ’K’
punch press_stamp
Mono DDP Note
Min. Typ. Max. Min. Typ. Max.
D
19
E (Clip open size)
A - 43.9 - - 44.4 -
B 6.7 6.8 6.9 7.2 7.3 7.4
C -5.8- -6.3-
D 6.7 6.8 6.9 7.2 7.3 7.4
E (Clip open size) 2.5 - 3.6 2.6 - 3.8
October 2009
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