Samsung DDR3 User Manual

General Information DDR3 SDRAM

DDR3 SDRAM Product Guide

October 2009

Memory Division

October 2009

General Information DDR3 SDRAM

1. DDR3 SDRAM Component Ordering Information

1 2 3 4 5 6 7 8 9 10 11

K 4 B X X X X X X X - X X X X

SAMSUNG Memory

DRAM

DRAM Type

Density

Bit Organization

1. SAMSUNG Memory : K

2. DRAM : 4

3. DRAM Type

B : DDR3 SDRAM

4. Density

51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb

7. Interface ( V

6 : SSTL (1.5V, 1.5V)

8. Revision

: 1st Gen.

M

: 2nd Gen.

A

: 3rd Gen.

B

: 4th Gen.

C

: 5th Gen.

D

: 6th Gen.

E

: 7th Gen

F

: 8th Gen

G

: 9th Gen

H

DD, VDDQ)

Speed

Temp & Power

Package Type

Revision

Interface (V

# of Internal Banks

DD, VDDQ)

5. Bit Organization

04 : x 4 08 : x 8 16 : x16

6. # of Internal Banks

3 : 4 Banks 4 : 8 Banks 5 : 16 Banks

9. Package Type

: FBGA (Lead-free)

Z

: FBGA (Halogen-free & Lead-free)

H

: FBGA (Lead-free, DDP)

J

: FBGA (Halogen-free & Lead-free, DDP)

M

10. Temp & Power

: Commercial Temp.( 0°C ~ 85°C) & Normal Power

C

: Commercial Temp.( 0°C ~ 85°C) & Low Power

L

: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

Y

11. Speed

: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

F7

: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

F8

: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

H9

: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

K0

October 2009

General Information DDR3 SDRAM

2. DDR3 SDRAM Component Product Guide

Density Banks Part Number

K4B1G0446D HC(L)F7/F8/H9 256M x 4

1Gb D-die 8Banks

1Gb E-die 8Banks

1Gb F-die 8Banks

2Gb B-die 8Banks

2Gb C-die 8Banks

DDP 2Gb D-die 8Banks

DDP 2Gb E-die 8Banks

DDP 4Gb B-die 8Banks

K4B1G0846D HC(L)F7/F8/H9 128M x 8

K4B1G1646D HC(L)F7/F8/H9 64M x 16

K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4

K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8

K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16

K4B1G0446E HYF7/F8/H9/K0 256M x 4

K4B1G0846E HYF7/F8/H9/K0 128M x 8

K4B1G0446F HC(L)F8/H9 256M x 4

K4B1G0846F HC(L)F8/H9 128M x 8

K4B1G0446F HY(L)F8/H9 256M x 4

K4B1G0846F HY(L)F8/H9 128M x 8

K4B2G0446B HC(L)F7/F8/H9 512M x 4

K4B2G0846B HC(L)F7/F8/H9 256M x 8

K4B2G1646B HC(L)F7/F8/H9 128M x 16

K4B2G0446B HYF7/F8/H9 512M x 4

K4B2G0846B HYF7/F8/H9 256M x 8

K4B2G0446C HC(L)F8/H9 512M x 4

K4B2G0846C HC(L)F8/H9 256M x 8

K4B2G0446C HY(L)F8/H9 512M x 4

K4B2G0846C HY(L)F8/H9 256M x 8

K4B2G0446D MC(L)F7/F8/H9 512M x 4

K4B2G0846D MC(L)F7/F8/H9 256M x 8

K4B2G0446E MC(L)F7/F8/H9 512M x 4

K4B2G0846E MC(L)F7/F8/H9 256M x 8

K4B4G0446B MC(L)F7/F8/H9 1G x 4

K4B2G0846B MC(L)F7/F8/H9 512M x 8

* Note : 1.35V product is 1.5V operatable.

Package & Power,

Tem p.

(-C/-L) & Speed

Org. VDD Voltage PKG Avail. Note

78 + 4 ball

1.5V

1.35V

1.5V

1.35V

1.5V

1.35V

1.5V

1.35V

1.5V

FBGA

96 + 4 ball

FBGA

78 ball

FBGA

96 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

96 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

Now

October 2009

General Information DDR3 SDRAM

3. DDR3 SDRAM Module Ordering Information

1 2 3 4 5 6 7 8 9 10 11 12

M X X X B X X X X X X X - X X X

Memory Module

DIMM Type

Data bits

DRAM Component Type

Depth

# of Banks in Comp. & Interface

Bit Organization

Temp & Power

PCB Revision

Component Revision

Speed

Package

1. Memory Module : M

2. DIMM Type

3 : DIMM 4 : SODIMM

3. Data Bits

: x64 204pin Unbuffered SODIMM

71 78 : x64 240pin Unbuffered DIMM 91 : x72 240pin ECC unbuffered DIMM 92 : x72 240pin VLP Registered DIMM 93 : x72 240pin Registered DIMM

4. DRAM Component Type

B : DDR3 SDRAM (1.5V VDD)

5. Depth

: 32M 33 : 32M (for 128Mb/512Mb)

32 64 : 64M 65 : 64M (for 128Mb/512Mb) 28 : 128M 29 : 128M (for 128Mb/512Mb) 56 : 256M 57 : 256M (for 512Mb/2Gb) 51 : 512M 52 : 512M (for 512Mb/2Gb) 1G : 1G 1K : 1G (for 2Gb) 2G : 2G 2K : 2G (for 2Gb)

6. # of Banks in comp. & Interface

7 : 8Banks & SSTL-1.5V

8. Component Revision

:

M 1st Gen. A 2nd Gen.

:

B 3rd Gen. C 4th Gen.

:

D 5th Gen. E 6th Gen. F : 7th Gen. G 8th Gen.

9. Package :

Z FBGA(Lead-free)

:

H FBGA(Lead-free & Halogen-free)

:

J FBGA(Lead-free, DDP)

:

M FBGA(Lead-free & Halogen-free, DDP)

10. PCB Revision

0 : None 2 : 2nd Rev. 4 : 4th Rev.

11. Temp & Power

C Y: Commercial Temp.( 0°C ~ 85°C) & Normal Power

: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)

12. Speed

: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

F7

: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

F8

: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

H9

: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

K0

Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)

: : : :

1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer

7. Bit Organization

0 : x 4 3 : x 8 4 : x16

October 2009

General Information DDR3 SDRAM

4. DDR3 SDRAM Module Product Guide

4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)

240Pin DDR3 Unbuffered DIMM

Org. Density Part Number Speed Raw Card Composition

128Mx 64 1GB

128Mx 72 1GB

256Mx 64 2GB

256Mx 72 2GB

512Mx 64 4GB

512Mx 72 4GB

M378B2873DZ1 CF8/H9

M378B2873EH1 CF8/H9/K0 128M x 8 * 8 pcs 1Gb E-die

M378B2873FHS CF8/H9 128M x 8 * 8 pcs 1Gb F-die

M391B2873DZ1 CF8/H9

M391B2873EH1 CF8/H9/K0 128M x 8 * 9 pcs 1Gb E-die

M391B2873FH0 CF8/H9/K0 128M x 8 * 9 pcs 1Gb F-die

M378B5673DZ1 CF8/H9

M378B5673EH1 CF8/H9/K0 128M x 8 * 16 pcs 1Gb E-die

M378B5673FH0 CF8/H9/K0 128M x 8 * 16 pcs 1Gb F-die

M378B5773CHS CF8/H9/K0 A(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1

M391B5673DZ1 CF8/H9

M391B5673EH1 CF8/H9/K0 128M x 8 * 18 pcs 1Gb E-die

M391B5673FH0 CF8/H9/K0 128M x 8 * 18 pcs 1Gb F-die

M391B5773CH0 CF8/H9/K0 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 1

M378B5273BH1 CF8/H9

M378B5273CH0 CF8/H9/K0 256M x 8 * 16 pcs 2Gb C-die

M391B5273BH1 CF8/H9

M391B5273CH0 CF8/H9/K0 256M x 8 * 18 pcs 2Gb C-die

A(1Rx8)

D(1Rx8)

B(2Rx8)

E(2Rx8)

B(2Rx8)

E(2Rx8)

128M x 8 * 8 pcs 1Gb D-die

128M x 8 * 9 pcs 1Gb D-die

128M x 8 * 16 pcs 1Gb D-die

128M x 8 * 18 pcs 1Gb D-die

256M x 8 * 16 pcs 2Gb B-die

256M x 8 * 18 pcs 2Gb B-die

Comp.

Versi on

Internal

Banks

Rank PKG Height Avail. Note

81

82

8

82

2

78 + 4 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

30mm Now

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

240Pin DDR3 Unbuffered DIMM

Org. Density Part Number Speed Raw Card Composition

128Mx 72 1GB

256Mx 72 2GB

512Mx 72 4GB

M391B2873EH1 YF8/H9

M391B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die

M391B5673EH1 YF8/H9

M391B5773CH0 YF8/H9 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 8 1

M391B5273BH1 YF8/H9

M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die

* Note : 1.35V product is 1.5V operatable.

D(1Rx8)

E(2Rx8)

128M x 8 * 9 pcs 1Gb E-die

128M x 8 * 18 pcs 1Gb E-die

256M x 8 * 18 pcs 2Gb B-die

Comp.

Versi on

Internal

Banks

Rank PKG Height Avail. Note

81

82

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

30mm Now

30mm NowM391B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die

30mm Now

October 2009

General Information DDR3 SDRAM

4.3 204Pin DDR3 SoDIMM (1.5V Product)

204Pin DDR3 SODIMM

Org. Density Part Number Speed Raw Card Composition

M471B2874DZ1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb D-die 8 2

128Mx 64 1GB

256Mx 64 2GB

512Mx 64 4GB

M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1

M471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball

M471B2873FHS CF8/H9 B(1Rx8) 64M x 16 * 8 pcs 1Gb F-die 8 1

M471B5673DZ1 CF8/H9

M471B5673EH1 CF8/H9 128M x 8 * 16 pcs 1Gb E-die

M471B5673FH0 CF8/H9 128M x 8 * 16 pcs 1Gb F-die

M471B5773CHS CF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1

M471B5273BH1 CF8/H9

M471B5273CH0 CF8/H9 256M x 8 * 16 pcs 2Gb C-die

F(2Rx8)

128M x 8 * 16 pcs 1Gb D-die

256M x 8 * 16 pcs 2Gb B-die

Comp.

Vers ion

Internal

Banks

Rank PKG Height Avail. Note

82

96 + 4 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 ball

FBGA

30mm Now

4.4 204Pin DDR3 SoDIMM (1.35V Product)

204Pin DDR3 SODIMM

Org. Density Part Number Speed Raw Card Composition

M471B2873EH1 YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1

128Mx 64 1GB

M471B2873FHS YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb F-die 8 1

M471B5673EH1 YF8/H9

256Mx 64 2GB

M471B5773CHS YF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1

512Mx 64 4GB

M471B5273BH1 YF8/H9

M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die

* Note : 1.35V product is 1.5V operatable.

F(2Rx8)

128M x 8 * 16 pcs 1Gb E-die

256M x 8 * 16 pcs 2Gb B-die

Comp.

Vers ion

Internal

Banks

Rank PKG Height Avail. Note

82

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

30mm NowM471B2874EH1 YF8/H9 A(1Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball

30mm NowM471B5673FH0 YF8/H9 128M x 8 * 16 pcs 1Gb F-die

30mm Now

October 2009

General Information DDR3 SDRAM

4.5 240Pin DDR3 Registered DIMM (1.5V Product)

240Pin DDR3 Registered DIMM

Org. Density Part Number Sp eed Raw Card Composition

128Mx 72 1GB

256Mx 72 2GB

512Mx 72 4GB

1Gx 72 8GB

2Gx 72 16GB

M393B2873DZ1 CF8/H9

M393B2873EH1 CF8/H9 128M x 8 * 9 pcs 1Gb E-die

M393B2873FH0 CF8/H9 128M x 8 * 9 pcs 1Gb F-die

M393B5673DZ1 CF8/H9

M393B5673EH1 CF8/H9 128M x 8 * 18 pcs 1Gb E-die

M393B5673FH0 CF8/H9 128M x 8 * 18 pcs 1Gb F-die

M393B5670DZ1 CF8/H9

M393B5670EH1 CF8/H9 256M x 4 * 18 pcs 1Gb E-die

M393B5670FH0 CF8/H9 256M x 4 * 18 pcs 1Gb F-die

M393B5173DZ1 CF7/F8

M393B5173EH1 CF7/F8 128M x 8 * 36 pcs 1Gb E-die

M393B5173FH0 CF7/F8 128M x 8 * 36 pcs 1Gb F-die

M393B5170DZ1 CF8/H9

M393B5170EH1 CF8/H9 256M x 4 * 36 pcs 1Gb E-die

M393B5170FH0 CF8/H9 256M x 4 * 36 pcs 1Gb F-die

M393B5273BH1 CF8/H9

M393B5273CH0 CF8/H9 256M x 8 * 18 pcs 2Gb C-die

M393B5270BH1 CF8/H9

M393B5270CH0 CF8/H9 512M x 4 * 18 pcs 2Gb C-die

M393B1G70DJ1 CF7/F8

M393B1G70EM1 CF7/F8

M393B1K73BH1 CF7/F8

M393B1K73CH0 CF7/F8 256M x 8 * 36 pcs 2Gb C-die

M393B1K70BH1 CF8/H9

M393B1K70CH0 CF8/H9 512M x 4 * 36 pcs 2Gb C-die

M393B2K70BM1 CF7/F8

M393B2K70CM0 CF7/F8

A(1Rx8)

B(2Rx8)

C(1Rx4)

H(4Rx8)

E(2Rx4)

B(2Rx8)

C(1Rx4)

F(4Rx4)

H(4Rx8)

E(2Rx4)

F(4Rx4)

128M x 8 * 9 pcs 1Gb D-die

128M x 8 * 18 pcs 1Gb D-die

256M x 4 * 18 pcs 1Gb D-die 1

128M x 8 * 36 pcs 1Gb D-die

256M x 4 * 36 pcs 1Gb D-die 2

256M x 8 * 18 pcs 2Gb B-die

512M x 4 * 18 pcs 2Gb B-die

DDP

x 4 * 36 pcs 1Gb D-die

512M

DDP

x 4 * 36 pcs 1Gb E-die

512M

256M x 8 * 36 pcs 2Gb B-die

512M x 4 * 36 pcs 2Gb B-die

DDP

x 4 * 36 pcs 2Gb B-die

1G

DDP

x 4 * 36 pcs 2Gb C-die

1G

Comp.

Ver si on

Internal

Banks

Rank PKG Height Avail. Note

81

2

8

1

4

8

84

2

1

4

2

78 + 4 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 + 4 ball

FBGA

78 ball

FBGA

78 ball

FBGA

78 ball

FBGA

30mm Now

October 2009