Samsung C3010 Service Manual

GSM TELEPHONE
GT-C3010
GSM TELEPHONE
CONTENTS
Safety Precautions
1.
Specification
2.
Product Function
3.
Array course control
4.
Exploded View and Parts list
5.
6.
Block Diagrams
7.
PCB Diagrams
8.
Chart of Troubleshooting
9.
Reference data
10.
Disassembly and Assembly
11. Instructions
Safety Precautions
1.
Repair Precaution
1-1.
Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
Be careful to useakind of magnetic object or tool,
because performance of parts is damaged by the influence of manetic force.
Surely useastandard screwdriver when you disassemble this product,
otherwise screw will be worn away.
Useathicken twisted wire when you measure level.
thicken twisted wire has low resistance, therefore error of measurement is few.
A
Repair after separate Test Pack and Set because for short danger(for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
Take specially care of soldering, because Land of PCB is small and weak in heat.
Surely tune on/off while using AC power plug, becausearepair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
Don't use as you pleases after change other material than replacement registered on SEC
System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
ESD(Electrostatically Sensitive Devices) Precaution
1-2.
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
Use earthed soldering steel when you connect or disconnect ESD.
Use soldering removing tool to break static electricity.,otherwise ESD will be damaged by
static electricity.
Don't unpack until you set up ESD on product. Because most of ESD are packed by box
and aluminum plate to have conductive power,they are prevented from static electricity.
You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place oracircuit board.
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Specification
2.
GSM General Specification
2-1.
GSM900
Phase 1
Freq.
Band[MHz]
Uplink/Downlink
ARFCN range
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period
Time Slot
Period/Frame
Period
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
880~915 925~960
0~124 & 975~1023
270.833kbps
3.692us
576.9us
4.615ms
DCS1800
Phase 1
1710~1785 1805~1880
512~885
270.833kbps
3.692us
576.9us
4.615ms
Power Class 5pcl ~ 19pcl 0
Sensitivity -102dBm -102dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km
pcl
~15
pcl
2-1
Speclflcation
GSM Tx Power Class
2-2.
TX Power
control level
533±3
631±3
729±3
827±3
925±3
10 23±3
11 21±3
GSM900
dBm
dBm
dBm
dBm
dBm
dBm
dBm
TX Power
control level
030±3
128±3
226±3
324±3
422±3
520±3
618±3
DCS1800
dBm
dBm
dBm
dBm
dBm
dBm
dBm
12 19±3
13 17±3
14 15±3
15 13±3
16 11±5
17 9±5
18 7±5
19 5±5
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
716±3
814±3
912±4
10 10±4
11 8±4
12 6±4
13 4±4
14 2±5
15 0±5
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
2-2
GSM EDGE TX power class
2-3.
Speclflcation
Only in Master
TX Power
control level
8 27±3
9 25±3
10 23±3
11 21±3
12 19±3
13 17±3
14 15±3
GSM900
dBm
dBm
dBm
dBm
dBm
dBm
dBm
TX Power
control level
226±3
324±3
422±3
520±3
618±3
716±3
812±3
DCS1800
dBm
dBm
dBm
dBm
dBm
dBm
dBm
15 13±3
16 11±5
17 9±5
18 7±5
19 5±5
dBm
dBm
dBm
dBm
dBm
2-3
910±3
10 14±3
11 12±4
12 10±4
13 8±4
14 6±4
15 4±4
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Operation Instruction and Installation
3.
Main Function
VGA(CMOS) Camera
-
QQVGA
-
SMS/MMS(OMA v1.2)/EMS(Read only)
­WAP
­MP3/WMA/WAV/IMY/MMF/MIDI/MID/AAC/M4A/AMR
­Dual Band(EGSM900/DCS/EDGE Rx only)
-
MicroSD Card Support
-
External Memory
-
USB v2.0, Bluetooth v2.0+EDR
­FM Radio Support,Radio Data System
-
2.0
inch
2.0
Browser
256k
TFT
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Array course control
4.
Software Adjustments
4-1.
Test Jig(GH99
RF Test Cable(GH
-36900
39-00985
A)
A)
Test Cable(GH
Adapter(GH
39-011600
99-38251
A)
A)
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Array course control
Software Downloading
4-2.
4-2-1.
4-2-2.
Pre-requsite for Downloading
Downloader Program(
Optiflash Version
4.17_
HK1 )
GT-C3010 Mobile Phone
Data Cable
S3 file, TFS file,CSC file
S/W Downloader Program
To make USB connection between your PC and the Mobile phone.
Press and hold
Both of PC and Mobile phone must be in Power off state)
(
key then connect the Data cable to Mobile phone.
'*'
Load the binary download program by executing the
Optiflash Version
"
4.17_
HK1
and select
"
Settings
in
Options
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Select Customer
.
1
T: Stratus(Intel Sibley
512/128,
Array course control
USB)
Check
Debug Mode
and
Erase All Unused Regions.
Select the
.
2
COM port
that the mobile phone is connected to
.
.
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Array course control
3
Click
.
Browse
and Select S3 file.
.
4
Click Browse and Select CSC file.Check S-Record with Contents
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Array course control
5
6
Click
.
Click
.
Flash
OK
and Type
'YES'
and the downloading process will be started.
in capital letters on the pop-up
WARNING
!!!
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Array course control
Wait until the message
.
7
Confirm the downloaded version name and etc.
.
8
'All is well.'
displayed
*#1234#
Full Reset
:
*2767*3855#
:
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Exploded View and Parts List
5.
5-1.
Cellular phone Exploded View
QMW01
QLC01
QIF01
QFR01
QVO01
QKP01
QME00
QVK01
QSP01
QMO01
QCA01
QRE01
QMP01
QAN02
QCR92
QCW01
QCR60
QBA01
QBA00
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Exploded View and Parts List
5-2.
Cellular phone Parts list
Design LOC Description SEC CODE
QAN02 INTENNA-GT_C3010 GH42-01983A
QBA00 PMO COVER-BATTERY GH72-52898A
QBA01 INNER BATTERY PACK-800MAH,BLK,UNI,MAIN GH43-03241A
QCA01 ASSY CAMERA-GT_C3010 VGA GH96-03766A
QCR60 SCREW-MACHINE
QCR92 SCREW-MACHINE
6001-002005
6001-002261
QKP01 ASSY KEYPAD-(SER/MKA) GH98-12888A
QLC01 ASSY LCD-2.0" QQVGA C3010 LCD ASSY GH96-03664A
QME00 ASSY MODULE-GT_C3010 KEY PBA+SHIELDCAN GH96-03913A
QMO01 MOTOR DC-SGH_P250 GH31-00454A
QMP01 ASSY PBA MAIN-GT_C3010 GH92-05386A
QMW01 ASSY COVER-WINDOW MAIN GH98-12213A
QSP01 MODULE-GT_C3010 SPK GH59-07598A
QVK01 KEY FPCB-GT_C3010 SIDE GH59-07282A
QVO01 PMO KEY-VOLUME GH72-52900A
QFR01 ASSY CASE-FRONT GH98-12215A
QIF01 PMO COVER-IF GH72-52899A
QRE01 ASSY CASE-REAR GH98-12216A
QCW01 PMO WINDOW-CAMERA GH72-52894A
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MAIN Electrical Parts List
6.
SEC CODE Design LOC Description
0401-001141
0403-001547
0406-001241
0406-001288
0406-001329
0801-003024
0801-003139
1201-002731
1201-002764
1203-003643
1203-005658
1203-005687
1204-002746
1205-003409
1205-003517
1205-003563
1205-003650
D500 DIODE-SWITCHING
ZD502 DIODE-ZENER
ZD503,ZD505 DIODE-TVS
ZD506 DIODE-TVS
ZD500 DIODE-TVS
U201 IC
U301 IC
PAM100 IC
U400 IC
U601 IC
U300 IC
U600 IC
U401 IC
U200 IC
U100 IC
RFT100 IC
UCD300 IC
1108-000263
1205-003749
1404-001165
2007-000138
2007-000138
2007-000138
2007-000139
2007-000140
2007-000140
2007-000141
2007-000143
2007-000147
2007-000148
2007-000153
2007-000157
2007-000157
2007-000162
UCP200(UP) IC
UCP200 IC
TH300 THERMISTOR
R207,R208,R209,R210 R-CHIP
R211,R212,R220,R315 R-CHIP
R605 R-CHIP
R100,R219 R-CHIP
R501,R502,R503,R504 R-CHIP
R505 R-CHIP
R407,R419,R601,R602 R-CHIP
R214 R-CHIP
R205,R206 R-CHIP
R101 R-CHIP
R414 R-CHIP
R104,R201,R213,R313 R-CHIP
R500,R600 R-CHIP
R312,R410,R411 R-CHIP
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Main Electrical Parts List
SEC CODE Design LOC Description
2007-000168
2007-000172
2007-000242
2007-001119
2007-001292
2007-001316
2007-002965
2007-003010
2007-003015
2007-007148
2007-007308
2007-007314
2007-008780
2203-000233
2203-000254
2203-000254
2203-000254
R604 R-CHIP
R218 R-CHIP
R202 R-CHIP
R408 R-CHIP
R203,R204 R-CHIP
R423 R-CHIP
R400,R401 R-CHIP
R421,R422 R-CHIP
R102,R200 R-CHIP
R308 R-CHIP
R301 R-CHIP
R305 R-CHIP
R417,R420 R-CHIP
C126,C423 C-CERAMIC,CHIP
C129,C134,C205,C215 C-CERAMIC,CHIP
C305,C319,C320,C321 C-CERAMIC,CHIP
C331,C405,C407,C414 C-CERAMIC,CHIP
2203-000278
2203-000330
2203-000386
2203-000386
2203-000627
2203-000812
2203-000812
2203-001124
2203-001153
2203-002487
2203-005057
2203-005281
2203-005382
2203-005393
2203-005483
2203-006048
2203-006048
C105 C-CERAMIC,CHIP
C324,C325 C-CERAMIC,CHIP
C128,C403,C404,C503 C-CERAMIC,CHIP
C504 C-CERAMIC,CHIP
C115 C-CERAMIC,CHIP
C110,C122,C123,C124 C-CERAMIC,CHIP
C347,C620,C621,C622 C-CERAMIC,CHIP
C310 C-CERAMIC,CHIP
C101,C102 C-CERAMIC,CHIP
C103 C-CERAMIC,CHIP
C114 C-CERAMIC,CHIP
C135,C137 C-CERAMIC,CHIP
C136 C-CERAMIC,CHIP
C118 C-CERAMIC,CHIP
C420,C422 C-CERAMIC,CHIP
C100,C112,C127,C200 C-CERAMIC,CHIP
C201,C202,C204,C206 C-CERAMIC,CHIP
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Main Electrical Parts List
SEC CODE Design LOC Description
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006137
2203-006190
2203-006208
2203-006260
2203-006260
2203-006348
2203-006399
2203-006399
2203-006399
2203-006399
2203-006399
C207,C208,C210,C211 C-CERAMIC,CHIP
C212,C213,C214,C217 C-CERAMIC,CHIP
C218,C300,C301,C302 C-CERAMIC,CHIP
C303,C304,C308,C314 C-CERAMIC,CHIP
C322,C332,C345,C346 C-CERAMIC,CHIP
C424,C502,C619 C-CERAMIC,CHIP
C505 C-CERAMIC,CHIP
C601,C602 C-CERAMIC,CHIP
C327 C-CERAMIC,CHIP
C111,C341,C342,C406 C-CERAMIC,CHIP
C410 C-CERAMIC,CHIP
C307 C-CERAMIC,CHIP
C108,C116,C216,C311 C-CERAMIC,CHIP
C317,C323,C326,C344 C-CERAMIC,CHIP
C400,C401,C402,C417 C-CERAMIC,CHIP
C418,C421,C425,C501 C-CERAMIC,CHIP
C606,C613,C614 C-CERAMIC,CHIP
2203-006474
2203-006562
2203-006872
2203-006872
2203-006872
2203-006872
2203-006872
2203-006890
2404-001496
2703-001701
2703-002198
2703-002200
2703-002203
2703-002204
2703-002206
2703-002268
2703-002367
C316,C500 C-CERAMIC,CHIP
C409,C600 C-CERAMIC,CHIP
C109,C130,C131,C203 C-CERAMIC,CHIP
C309,C313,C315,C328 C-CERAMIC,CHIP
C334,C335,C336,C338 C-CERAMIC,CHIP
C339,C340,C603,C604 C-CERAMIC,CHIP
C605,C607,C608 C-CERAMIC,CHIP
C113,C330,C419 C-CERAMIC,CHIP
TA500 C-TA,CHIP
L109,L110 INDUCTOR-SMD
L115 INDUCTOR-SMD
L114 INDUCTOR-SMD
L102,L111,L112 INDUCTOR-SMD
L106 INDUCTOR-SMD
L402,L403 INDUCTOR-SMD
L105 INDUCTOR-SMD
L113 INDUCTOR-SMD
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Main Electrical Parts List
SEC CODE Design LOC Description
2703-002589
2703-002872
2801-004466
2801-004683
2904-001792
2909-001283
3301-001342
3301-001659
3301-001879
3301-001912
3303-001138
3705-001503
3708-002222
3709-001465
3710-002568
3711-006882
3711-006910
L500 INDUCTOR-SMD
L301 INDUCTOR-SMD
OSC300 CRYSTAL-UNIT
OSC100 CRYSTAL-UNIT
F100 FILTER-SAW
F101 FILTER-DUPLEXER
L600 CORE-FERRITE BEAD
L405,L406,L501,L502 CORE-FERRITE BEAD
L300 CORE-FERRITE BEAD
L404 CORE-FERRITE BEAD
MIC400 MIC
RFS100 CONNECTOR-COAXIAL
HDC601 CONNECTOR-FPC/FFC/PIC
SIM600 CONNECTOR-CARD EDGE
IFC500 CONNECTOR-SOCKET
HDC600 CONNECTOR-HEADER
BTC500 CONNECTOR-HEADER
3711-006923
4202-001453
HDC500 CONNECTOR-HEADER
ANT101 ANT
Please consult the GSPN website(Samsung Portal) for the most recent version of the product's part list.
6-4
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Block Diagrams
7.
7-1.
Block Diagram
7-1
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Block Diagrams
7-2.
RF Blcok Diagram
7-2
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Block Diagrams
7-4. Display (LCD) Block
7-3
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Block Diagrams
7-5. Camera Block
7-2
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