Samsung 511 Service manual

DVD PLAYER

DVD-611/611B/615 DVD-511

SERVICE

1. Precautions

2. Reference Information

3. Product Specification

4. Disassembly and Reassembly

5. Circuit Descriptions

6. Troubleshooting

7. Exploded Views and Parts List

8. Electrical Parts List

9. Block Diagrams

10. PCB Diagrams

11. Wiring Diagram

12. Schematic Diagrams

Manual

DVD PLAYER CONTENTS

SERVICE MANUAL DVD-611/611B/615/511

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DVD-611/611B/615

DVD-511

ELECTRONICS

Printed in Korea

AH68-00462A

Samsung Electronics 1-1

1. Precautions

1-1 Safety Precautions

1) Before returning an instrument to the customer, always make a safety check of the entire instrument, including, but not limited to, the following items:

(1) Be sure that no built-in protective devices are

defective or have been defeated during servicing. (1)Protective shields are provided to protect both the technician and the customer. Correctly replace all missing protective shields, including any remove for servicing convenience. (2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place all protective devices, including, but not limited to, nonmetallic control knobs, insulating fish papers, adjustment and compartment covers/shields, and isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and functioning.

(2) Be sure that there are no cabinet openings through

which adults or children might be able to insert their fingers and contact a hazardous voltage. Such openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back cover.

(3) Leakage Current Hot Check-With the instrument

completely reassembled, plug the AC line cord directly into a 120V AC outlet. (Do not use a isolation transformer during this test.) Use a leakage current tester or a metering system that complies with American National Standards institute (ANSI) C101.1 Leakage Current for Appliances and Underwriters Laboratories (UL) 1270 (40.7). With the instrument’s AC switch first in the ON position and then in the OFF position, measure from a known earth ground (metal water pipe, conduit, etc.) to all exposed metal parts of the instrument (antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis.

Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1.

Any measurements not within the limits specified herein indicate a potential shock hazard that must be eliminated before returning the instrument to the customer.

Fig. 1-1 AC Leakage Test

(4) Insulation Resistance Test Cold Check-(1) Unplug

the power supply cord and connect a jumper wire between the two prongs of the plug. (2) Turn on the power switch of the instrument. (3) Measure the resistance with an ohmmeter between the jumpered AC plug and all exposed metallic cabinet parts on the instrument, such as screwheads, antenna, control shafts, handle brackets, etc. When an exposed metallic part has a return path to the chassis, the reading should be between 1 and 5.2 megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is not within the limits specified, there is the possibility of a shock hazard, and the instrument must be re-pared and rechecked before it is returned to the customer. See Fig. 1-2.

Fig. 1-2 Insulation Resistance Test

DEVICE UNDER

TEST

(READING SHOULD

NOT BE ABOVE

0.5mA)

LEAKAGE CURRENT

TESTER

EARTH

GROUND

TEST ALL

EXPOSED METER

SURFACES

ALSO TEST WITH

PLUG REVERSED

(USING AC ADAPTER

PLUG AS REQUIRED)

2-WIRE CORD

Antenna Terminal

Exposed Melal Part

ohm

ohmmeter

Precautions

1-2 Samsung Electronics

2) Read and comply with all caution and safety related notes non or inside the cabinet, or on the chassis.

3) Design Alteration Warning-Do not alter of add to the mechanical or electrical design of this instrument. Design alterations and additions, including but not limited to, circuit modifications and the addition of items such as auxiliary audio output connections, might alter the safety characteristics of this instrument and create a hazard to the user. Any design alterations or additions will make you, the service, responsible for personal injury or property damage resulting therefrom.

4) Observe original lead dress. Take extra care to assure correct lead dress in the following areas: (1) near sharp edges, (2) near thermally hot parts (be sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage, and (5) antenna wiring. Always inspect in all areas for pinched, out-of-place, or frayed wiring, Do not change spacing between a component and the printed-circuit board. Check the AC power cord for damage.

5) Components, parts, and/or wiring that appear to have overheated or that are otherwise damaged should be replaced with components, parts and/ or wiring that meet original specifications. Additionally, determine the cause of overheating and/or damage and, if necessary, take corrective action to remove any potential safety hazard.

6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics which are often not evident from visual inspection, nor can the protection they give necessarily be obtained by replacing them with components rated for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading, an ( )or a ( )on schematics and parts lists. Use of a substitute replacement that does not have the same safety characteristics as the recommended replacement part might created shock, fire and/or other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.

Precautions

Samsung Electronics 1-3

1-2 Servicing Precautions

CAUTION : Before servicing Instruments covered by this service manual and its supplements, read and follow the Safety Precautions section of this manual.

Note : If unforseen circument create conflict between the following servicing precautions and any of the safety precautions, always follow the safety precautions. Remember: Safety First.

1-2-1 General Servicing Precautions

(1) a. Always unplug the instrument’s AC power cord

from the AC power source before (1) re-moving or reinstalling any component, circuit board, module or any other instrument assembly, (2) disconnecting any instrument electrical plug or other electrical connection, (3) connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

b. Do not defeat any plug/socket B+ voltage inter-

locks with which instruments covered by this service manual might be equipped.

c. Do not apply AC power to this instrument and

/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

d. Always connect a test instrument’s ground lead

to the instrument chassis ground before connecting the test instrument positive lead. Always remove the test instrument ground lead last.

Note : Refer to the Safety Precautions section ground lead last.

(2) The service precautions are indicated or printed on

the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.

(3) The components used in the unit have a specified

flame resistance and dielectric strength. When replacing components, use components which have the same ratings. Components i-entified by shading, by( ) or by ( ) in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them with the exact replacement components.

(4) An insulation tube or tape is sometimes used and

some components are raised above the printed wiring board for safety. The internal wiring is sometimes clamped to prevent contact with heating components. Install such elements as they were.

(5) After servicing, always check that the removed

screws, components, and wiring have been installed correctly and that the portion around the serviced part has not been damaged and so on. Further, check the insulation between the blades of the attachment plug and accessible conductive parts.

1-2-2 Insulation Checking Procedure

Disconnect the attachment plug from the AC outlet and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment plug. The insulation resistance between each blade of the attachment plug and accessible conductive parts(see note) should be more than 1 Megohm.

Note : Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.

Precautions

1-4 Samsung Electronics

1-3 ESD Precautions

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.

(1) Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.

(2) After removing an electrical assembly equipped

with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

(3) Use only a grounded-tip soldering iron to solder or

unsolder ESD devices.

(4) Use only an anti-static solder removal devices.

Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESD devices.

(5) Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ESD devices.

(6) Do not remove a replacement ESD device from its

protective package until immediately before your are ready to install it.(Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials).

(7) Immediately before removing the protective ma-

terials from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

(8) Minimize bodily motions when handling unpack-

aged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).

Precautions

Samsung Electronics 1-5

1-4 Handling the optical pick-up

The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from clothing and your body.

The following method is recommended. (1) Place a conductive sheet on the work bench (The

black sheet used for wrapping repair parts.)

(2) Place the set on the conductive sheet so that the

chassis is grounded to the sheet.

(3) Place your hands on the conductive sheet(This

gives them the same ground as the sheet.)

(4) Remove the optical pick up block

(5) Perform work on top of the conductive sheet. Be

careful not to let your clothes or any other static sources to touch the unit.

 Be sure to put on a wrist strap grounded to the

sheet.

 Be sure to lay a conductive sheet made of copper etc.

Which is grounded to the table.

Fig.1-3

(6) Short the short terminal on the PCB, which is in-

side the Pick-Up ASS’Y, before replacing the PickUp. (The short terminal is shorted when the PickUp Ass’y is being lifted or moved.)

(7) After replacing the Pick-up, open the short termi-

nal on the PCB.

THE UNIT

WRIST-STRAP FOR GROUNDING

CONDUCTIVE SHEET

Precautions

1-6 Samsung Electronics

1-5 Pick-up disassembly and reassembly

1-5-1 Disassembly

1) Remove the power cable.

2) Switch SW3 on deck PCB to “OFF” before removing the FPC. ( Inserted into Main PCB DCN1. See Fig. 1-4)

3) Disassemble the deck.

4) Disassemble the deck PCB.

1-5-2 Assembly

1) Replace the Pick-up.

2) Assemble the deck PCB.

3) Reassemble the deck.

4) Insert FPC into Main PCB DCN1 and switch SW3 on deck PCB to “ON”. (See Fig 1-4)

FPC

TO MAIN PCB

(DCN1)

Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.

Fig. 1-4

Samsung Electronics 2-1

2. Reference Information

2-1 IC Descriptions

2-1-1 AIC1 (AK4393 ; Digital-to-Analog Converter)

Serial

Input

Interface

De-emphasis

Control

De-emphasis

Soft Mute

De-emphasis

Soft Mute

Left Channel

Right Channel

Interpolator

Multi-bit ˘•

Modulator

Multi-bit ˘•

Modulator

Switched

Capacitor Filter

Switched

Capacitor Filter

Control

Double

Speed Select

Soft Mute

Power Down

Serial Data

Bit Clock

Left/Right Clock

Serial

Input Control

Clock Divider

Master Clock Clock Control

Left Output -

Left Output +

Right Output -

Right Output +

DVSS DVDD MCLK

BICK

SDATA

LRCK

SMUTE

DFS DEM0 DEM1

DIF0

1 2 3 4 5 6 7 8 9 10 11 12

DIF1

DIF2

CKS2 CKS1 CKS0 P/S VCOM AOUTL+ AOUTLAOUTR+ AOUTRAVSS AVDD VREFH VREFL BVSS

28 27 26 25 24 23 22 21 20 19 18 17 16 15

No. Pin Name I/O Pin Function and Description

1 DVSS - Digital Ground. Digital ground is 0V. 2 DVDD - Digital Supply. 3.3V or 5.0V nominal. 3 MCLK I Master Clock Input. 4 PD I Power-down and Reset. When low the AK4393 is in Power-down Mode and held in reset.

The AK4393 should always be reset after power-up. 5 BICK I Audio Serial Data Clock Input. A clock input of 64fs or more is recommended. 6

SDATA I

Serial Data Input. 7 LRCK I Left/Right Clock Input. Defines the sampling rate, F

8 SMUTE

(or CS

)

I Soft Mute Input or Chip Select Input. If the P/S

pin (pin 25) is high, SMUTE controls the

soft mute function as follows:

- When SMUTE goes high, the soft mute cycle is initiated.

- When SMUTE goes low, the output mute is slowly released.

If the P/S

pin is low, SMUTE is the Chip Select Input for the Serial Control Mode. Chip

select is active when SMUTE is low. 9 DFS I Double Sampling Speed Input. When low, this pin defines the Normal Speed Mode, and

128 x F

oversampling is implemented. When high, the DFS pin defines the Double Speed

Mode, implemented with 64 x F

oversampling. This pin features an internal pull-down.

10 DEM0

(or CCLK)

I De-emphasis Enable #0 or Control Data Clock Input. If the P/S

pin (pin 25) is high, DEM0 is used to select the De-emphasis Mode according to Table 3. If the P/S pin os low DEM0 is the clock input for the Serial Control Mode.

11 DEM1

(or CDTI)

I De-emphasis Enable #1 or Control Data Input. If the P/S

pin (pin 25) is high, DEM1 is used to select the De-emphasis Mode according to Table 3. If the P/S pin is low, DEM1 is the control data input for the Serial Control Mode.

12 DIF0 I Digital Input Format Select #0. 13 DIF1 I Digital Input Format Select #1. 14 DIF2 I Digital Input Format Select #2. 15 BVSS - Substrate Ground Pin. Substrate ground is 0V. 16 VREFL I Low Level Voltage Reference Input. Normally connected to analog ground. 17 VREFH I High Level Voltage Reference Input. Normally connected to analog supply. 18 AVDD - Analog Supply. Analog supply is 5V nominal. 19 AVSS - Analog Ground. Analog ground is 0V. 20 AOUTR- O Right Channel Negative Output. 21 AOUTR+ O Right Channel Positive Output. 22 AOUTL- O Left Channel Negative Output.

23 AOUTL+ O Left Channel Positive Output. 24 VCOM O Common Voltage Output. Common voltage output is 2.6V nominal. 25 P/S

I Parallel/Serial Control Mode Select Input. If Low, the Serial Control Mode is

implemented. If High, the Parallel Control Mode is selected. This pin has an internal pull-up.

26 CKS0 I Master Clock Select #0. 27 CKS1 I Master Clock Select #1. 28 CKS2 I Master Clock Select #2.

Reference Information

2-2 Samsung Electronics

2-1-2 DIC1 (KS1453 ; Data Processor)

DVD CLV/CAV

16-8

DEMO D

32BIT SR

X-tal & Timing

Generator

Frame Sync

DET/PROT /INS

(17.57KHz)

VCO Timing

Generator

MICOM I/F

(208,192,17)

(182,172,11)

ECC

Descrambler

(6,4,3)

efmwr ID ECC

EDC

17.58KHz= 26.16M/1488

RFCK 17.58/7.35KHz

26.16MHz

676.08Hz

To MICOM (15)

MDAT[7:0]_BI, MRZA_IN, ZCS_IN, MWR_IN,

MRD_IN, ZIRQZD_OUT, ZWAIT_OUT, ZRST_IN

To DRAM

256K*16

(32)

DD[15:0]_BI

DADR[8:0]_OUT

ZRAS_OUT

ZUCAS_OUT

ZLCAS _ OUT

ZOE[1 :0]_OUT

ZWE[1:0]_OUT

To AV (13)

SDATA[0]_OUT/

CDATA

SDATA[1]_OUT/LRCK

SDATA[2]_OUT/BCLK

SDATA[3]_OUT/C2PO

SDATA[4]_OUT/SQDT

SDATA[5]_OUT/WFSY

SDATA[6]_OUT/S0S1

SDATA[7]_BI /SQCK

DATREQ_IN

CSTROBE_OUT

DTER_OUT

DATACK_OUT

TOS_OUT

Mon i tor (9)

GFS_OUT, F R SYZ_OUT, TX_ OUT, EFMO_ OUT,

WFCK_OUT, RFCK_OUT, CK16M_OUT, DEMPHA_OUT

CLVLOCK_OUT

ECSY

CD CLV/CAV

23BIT SR

Frame Sync

DET/PROT /INS

(7.35KHz)

VCO Timing

Generator

WFCK 17.58/7.35KHz

(32,28,5)

(28,24,5)

CIRC

EFM

DEMO D

SUBCO DE I/F

75Hz

7.35KHz= 4.3 218M/588

DVDP ,

SQ-VCD

CD-G

(6,4,3)

trans ID E CC

Deinterle ave

RAM Control

V-CD ,CD-DA

To RF (9)

PWMO[ 7:0]_OUT, BCARZ_IN

Pow er (34)=VDD(11)+GND(23)

Test Pin (3

)

TEST0_IN, TEST1_IN, TEST2_IN

Fr om

Servo (3)

EFMI_IN

PLCK_IN

FG_IN

Servo (6)

MON_OUT

MDP_OUT

MDS_OUT

FSW_OUT

PLLLOCK_

OUT

SERLOCK_

OUT

X-t al (4)

XTI_IN

XTO_OUT

CK33MI_IN

CK33MO_OUT

Reference Information

Samsung Electronics 2-3

No. Pin Name Description I/O Notes

Notes

1 DVSS Digital GND (0 V)

2 ZCS_IN Chip Select (Active Low) I MICOM

3 MRZA_IN Micom Register Select (L

4 DVSS Digital GND (0 V)

5 MDAT7_BI MICOM Data Bus B MICOM

6 MDAT6_BI MICOM Data Bus B MICOM

7 MDAT5_BI MICOM Data Bus B MICOM

8 MDAT4_BI MICOM Data Bus B MICOM

9 MDAT3_BI MICOM Data Bus B MICOM

10 MDAT2_BI MICOM Data Bus B MICOM

11 MDAT1_BI MICOM Data Bus B MICOM

12 MDAT0_BI MICOM Data Bus B MICOM

13 DVDD Digital Power (+5V)

14 XTI_IN System Clock Input for 26.16 MHz I XTAL

15 XTO_OUT System Clock Output for 26.16 MHz O XTAL

16 DVSS Digital GND (0 V)

17 DD15_BI DRAM Data Bus B DRAM

18 DD0_BI DRAM Data Bus B DRAM

19 DD14_BI DRAM Data Bus B DRAM

20 DD1_BI DRAM Data Bus B DRAM

21 DVSS Digital GND (0 V)

22 DD13_BI DRAM Data Bus B DRAM

23 DD2_BI DRAM Data Bus B DRAM

24 DD12_BI DRAM Data Bus B DRAM

25 DD3_BI DRAM Data Bus B DRAM

26 DVDD Digital Power (+5 V)

27 DD11_BI Digital Data Bus B DRAM

28 DD4_BI Digital Data Bus B DRAM

29 DD10_BI Digital Data Bus B DRAM

30 DD5_BI Digital Data Bus B DRAM

31 DVSS Digital GND (0 V)

32 DD9_BI DRAM Data Bus B DRAM

33 DD6_BI DRAM Data Bus B DRAM

34 DD8_BI DRAM Data Bus B DRAM

35 DD7_BI DRAM Data Bus B DRAM

36 DVSS Digital GND (0 V)

37 ZLCAS_OUT DRAM Low Column Address Strobe O DRAM

38 ZUCAS_OUT DRAM Upper Column Address Strobe O DRAM

39 ZWE1_OUT DRAM Write Enable 1 (8M ONLY) O DRAM

40 ZWE0_OUT DRAM Write Enable 0 (4M, 8M, 16M) O DRAM

41 ZOE1_OUT DRAM Output Enable 1 (16M MODE DADR9) O DRAM

42 DVDD Digital Power (+5 V)

43 ZOE0_OUT DRAM Output Enable 0 O DRAM

44 ZRAS_OUT DRAM Row Address Strobe O DRAM

45 DADR8_OUT

DRAM Address Bus

O DRAM

65 SDATA5_OUT DVD Data/Subcode Frame Sync (WFSY) O AV Decoder

66 SDATA6_OUT DVD Data/Subcode Block Sync (S0S1) O AV Decoder

67 SDATA7_BI DVD Data/Subcode Serial Clock (SQCK) B AV Decoder

68 DVSS Digital GND (0 V)

69 CSTROBE_OUT Data Strobe (Clock) Output O AV Decoder

70 DATREQ_IN Data Request from A/V Decoder or ROM Decoder I AV Decoder

71 DTER_OUT DVD Data Error Output O AV Decoder

72 DVSS Digital GND (0 V)

73 PWMO7_OUT PWM Output Signal O RF

74 PWMO6_OUT PWM Output Signal O RF

75 PWMO5_OUT PWM Output Signal O RF

76 PWMO4_OUT PWM Output Signal O RF

77 DVDD Digital Power (+5 V)

78 PWMO3_OUT PWM Output Signal O RF

79 PWMO2_OUT PWM Output Signal O RF

80 PWMO1_OUT PWM Output Signal O RF

81 PWMO0_OUT PWM Output Signal O RF

82 DVSS Digital GND (0 V)

83 DVSS Digital GND (0 V)

84 DVSS Digital GND (0 V)

85 DVDD DIGITAL Power (+5 V)

86 DVDD DIGITAL Power (+5 V)

87 DVSS Digital GND (0 V)

88 DVSS Digital GND (0 V)

89 DVSS Digital GND (0 V)

90 DVSS Digital GND (0 V)

91 FRSYZ_OUT Frame Sync Out O Monitor

92 TX_OUT Digital Out O Monitor

No. Pin Name Description I/O

46 DADR7_OUT DRAM Address Bus O DRAM

47 DVSS Digital GND (0 V)

48 DADR0_OUT DRAM Address Bus O DRAM

49 DADR6_OUT DRAM Address Bus O DRAM

50 DADR1_OUT DRAM Address Bus O DRAM

51 DADR5_OUT DRAM Address Bus O DRAM

52 DADR2_OUT DRAM Address Bus O DRAM

53 DADR4_OUT DRAM Address Bus O DRAM

54 DADR3_OUT DRAM Address Bus O DRAM

55 DVSS Digital GND (0 V)

56 DVSS Digital GND (0 V)

57 TOS_OUT Top of Sector O AV Decoder

58 DATACK_OUT Data Acknowledge Signal Output O AV Decoder

59 DVDD DIGITAL Power (+5 V)

60 SDATA0_OUT DVD Data/CD Data Bit Stream (CDATA) O AV Decoder

61 SDATA1_OUT DVD Data/CD Data L/R Clock (LRCK) O AV Decoder

62 SDATA2_OUT DVD Data/CD Data Bit Clock (BLCK) O AV Decoder

63 SDATA3_OUT DVD Data/CD Data Error Flag (C2PO) O AV Decoder

64 SDATA4_OUT DVD Data/Subcode Serial Data (SQDT) O AV Decoder

93 GFS_OUT Good Frame Sync Detection State Output (OK at H) O Monitor

94 DVSS Digital GND (0 V)

95 CK33MI_IN System Clock Input for 33.8688 MHz I X-tal

96 CK33MO_OUT System Clock Output for 33.8688 MHz O X-tal

97 DVDD Digital Power (+5 V)

98 TEST0_IN Test Mode Selection Terminal I

99 TEST1_IN Test Mode Selection Terminal I

100 TEST2_IN Test Mode Selection Terminal I

101 EFMO_OUT EFM Out O Monitor

102 WFCK_OUT Write Frame Pulse O Monitor

103 RFCK_OUT Reference Frame Pulse O Monitor

104 PLCK_IN Phase Locked Clock I Servo

105 DVSS Digital GND (0 V)

106 PLLLOCK_OUT Lock Signal for PLL O Servo

107 CLVLOCK_OUT Lock Signal for CLV O Monitor

108 SERLOCK_OUT Lock Signal for SERVO O Servo

109 MDP_OUT Spindle Motor Phase Control Signal (3-STATE) O Servo

110 MDS_OUT Spindle Motor Speed Control Signal (3-STATE) O Servo

111 DVSS Digital GND (0 V)

11 2 DVSS Digital GND (0 V)

11 3 MON_OUT Spindle Motor Output Filter Switching Output O Servo

114 FG_IN Reference Signal for CAV I Servo

11 5 FSW_OUT Spindle Motor Output Filter Switching Output (3-STATE) O Servo

11 6 EFMI_IN EFM/EFM+ Signal Input I Servo

117 DVDD Digital Power (+5 V)

118 DVDD Digital Power (+5 V)

119 DVDD Digital Power (+5 V)

120 CK16M_OUT CK33Ms 2 Division Clock / 16.9344 MHz O Monitor

121 DEMPHA_OUT HIGH, when on Deemphasis O Monitor

122 BCARZ_IN BCA Input Signal I RF

123 DVSS Digital GND (0 V)

124 ZRST_IN Hardware Reset (Active Low) I MICOM

125 ZWAIT_OUT Micom Read / Write Access Wait (Wait at L) O MICOM

126 ZIRQZD_OUT Interrupt Request to Micom O MICOM

127 MRD_IN Micom Read Strobe (Active Low) I MICOM

128 MWR_IN Micom Write Strobe (Active Low) I MICOM

Notes

Reference Information

2-4 Samsung Electronics

2-1-3 DIC2 (KM416C254D ; CMOS 4M DRAM)

CASL CAS

CASH

D0 D1

D2 D3 D4

D5 D6

D7 D8

RAS

NO.2 CLOCK

GENERATOR

CONTROL

LOGIC

COLUMN

DECODER

SENSE AMPLIFIERS

VO GATING

ROW

DECODER

512x512x16

MEMORY

ARRAY

512

DATA-IN BUFFER

DATA-OUT

BUFFER

REFRESH

CONTROLLER

REFRESH COUNTER

NO.1CLOCK

GENERATOR

ROW.

ADDRESS

BUFFERS(9)

COLUMN

ADDRESS

BUFFER

Vcc Vss

IO0

IO15

512x16

Reference Information

Samsung Electronics 2-5

PIN NO. SYM. TYPE DESCRITION

16~19, 22~26 A0~A8 Input Address Input

14 RAS Input Row Address Strobe 28 CASH Input Column Address Strobe/Upper Byte Control 29 CASL Input Column Address Strobe/Lower Byte Control 13 WE Input Write Enable 27 OE Input Output Enable

2~5, 7~10, 31~34, 36~39 I/O0~I/O15 Input/Output Data Input/Output

1, 6, 20 Vcc Supply Power, 5V

21, 35, 40 Vss Ground Ground

11, 12, 15, 30 NC - No Connect

Reference Information

2-6 Samsung Electronics

2-1-4 MIC1 (TMP95C265 ; Main Micom)

AND~AN2

(PA0~PA2)

AN3/ADTRG

(PA3)

AN4~AN7

(PA4~PA7)

VREFH

VREFL

AVCC

AV55

TxD0(P80)

RxD0(P81)

SCLK0/CT50(P82)

TxD1(P83)

RxD1(P84)

SCLK1/CT51(P85)

TxD2(P86)

RxD2(P87)

SCLK2/CT52(P57)

DAOUT0,1

10BIT 8CH

A/D

CONVERTER

8BIT 2CH

A/D

CONVERTER

SERIAL I/O

(CH. 1)

SERIAL I/O

(CH. 0)

SERIAL I/O

(CH. 2)

8BIT TIMER

(TIMER 0)

8BIT TIMER

(TIMER 1)

8BIT TIMER

(TIMER 2)

8BIT TIMER

(TIMER 3)

8BIT TIMER

(TIMER 4)

8BIT TIMER

(TIMER 5)

8BIT TIMER

(TIMER 6)

8BIT TIMER

(TIMER 7)

Not included in

TMP95C265

64KB ROM

2KB ROM

WATCHDOG

TIMER

XWA XBC XDE XHL XIX XIY XIZ XSP

900/H CPU

BC DE

OSC

PORT0

PORT1

PORT2

PORT3

PORT4

PORT5

CS/WAIT

CONTROLLER

(4-BLOCK)

INTERRUPT

CONTROLLER

16BIT TIMER

(TIMER 8)

16BIT TIMER

(TIMER 9)

IY IZ

32bit

VCC [3] VSS[3]

X1 X2

(P00~P07) D0~D7 *

(P10~P17) D8~D15

(P20~P27) A15~A23 *

(P30~P37) A8~A15 *

(P40~P47) A0~A7 *

WAIT(P55) C50(P60) C51(P61) C52(P62) C53(P63)

T18/INT5(P90) T19/INT6(P91) TO8(P92) TO9(P93) TIA/INT7(P94) TIB/INT8(P95) TOA/TOB(P96)

NIMI INTO(P56)

RD(P50)* WR(P51)* HWR(P52) BUSRQ(P53) BUSAK(P54)

CLK AM8/16 EA RESET

T10/INT(P70)

TO3/INT2(P72)

T14/INT3(P73)

TO7/INT4(P75)

TO1(P71)

TO5(P74)

Reference Information

Samsung Electronics 2-7

NO PORT NAME ASSIGNED NAME DESCRIPTION TYPE REMARK

51 D6 HAD6 Data6 I/0

52 D7 HAD7 Data7 I/0

53 P10 CLSW Close Switch I DECK

54 P11 OPSW Open Swithc I DECK

55 P12 MTP8 Reserved I/0 0 NC

56 P13 MTP9 Reserved I/0 0 NC

57 P14 MTP10 Reserved I/0 0 NC

58 P15 MTP11 Reserved I/0 0 NC

59 P16 MTP12 Reserved I/0 0 NC

60 P17 MTP13 Reserved I/0 0 NC

61 AM8/16 AM8 Address Mode(H:8 BIT MODE) I VCC

62 Vss DGND - GND

63 Vcc 5D - VCC

64 A23 HA23

SERVO /RD Strobe Mask Signal

0 74HCOO(5)

65 P26/A22 MRP14 Reserved Address Port 0 NC

66 P25/A21 MRP15 Reserved Address Port 0 NC

67 P24/A20 MRP16 Reserved Address Port 0 NC

68 A19 HA19 Address 19 0

EPROM, SRAM ADDRESS

69 A18 HA18 Address 18 0

EPROM, SRAM ADDRESS

70 A17 HA17 Address 17 0

EPROM, SRAM ADDRESS

71 A16 HA16 Address 16 0

EPROM, SRAM ADDRESS

72 A15 HA15 Address 15 0

EPROM, SRAM ADDRESS

73 A14 HA14 Address 14 0

EPROM, SRAM ADDRESS

74 A13 HA13 Address 13 0

EPROM, SRAM ADDRESS

75 A12 HA12 Address 12 0

EPROM, SRAM ADDRESS

76 A11 HA11 Address 11 0

EPROM, SRAM ADDRESS

77 A10 HA10 Address 10 0

EPROM, SRAM, Zlva Adrs

78 A9 HA9 Address 9 0

EPROM, SRAM, Zlva Adrs

79 A8 HA8 Address 8 0

EPROM, SRAM, Zlva Adrs

80 A7 HA7 Address 7 0

EPROM, SRAM ADDRESS

81 A6 HA6 Address 6 0

EPROM, SRAM ADDRESS

82 A5 HA5 Address 5 0

EPROM, SRAM ADDRESS

83 A4 HA4 Address 4 0

EPROM, SRAM ADDRESS

84 A3 HA3 Address 3 0

EPROM, SRAM ADDRESS

85 A2 HA2 Address 2 0

EPROM, SRAM ADDRESS

86 A1 HA1 Address 1(SERVO DAB) 0

EPROM, SRAM ADDRESS

87 A0 HA0 Address 0(DSP DAB) 0

EPROM, SRAM ADDRESS

88 /RD /RD /Read Strobe 0 /Read

89 /WR /WR /Write Strobe 0 /Write

90 P52 RSTB RF&Servo IC Reset 0 KS1461 (73), KS1452 (9)

91 Vss DGND - DGND

92 PA0 RFRP

Tracking Lock monitir from SERVO

I KS1452 (7)

93 PA1 TILTO Monitor signal I KS1452 (69)

94 PA2 MTP17 Reserved I I NC

95 PA3 SENSE SENSE monitor from SERVO I KS1452 (22)

96 PA4 FR

Spindle direcrion from SP Driver

I BA6849FP (20)

97 PA5 SLOCK LOCK monitor from DSP I KS1453 (108)

98 PA6 FOKB Focus lock monitor from RF I KS1461 (48)

99 PA7 RFO RF sum signal (Analog Lnput) I RFO

100 VREFH 5D A/D Ref Input (H) I 5D

NO PORT NAME ASSIGNED NAME DESCRIPTION TYPE REMARK

1 VREFL DGND A/D Ref Input(L) I DGND

2 AVss DGND A/D Ref Input - DGND

3 AVcc 5D A/D VCC Input - 5D

4 DAOUT0 MTP1 0 NC

5 DAOUT1 MPT2 0 NC

6 /NMI - PULL-UP I

7 P53 CSB D. Servo IC Chip Select 0 KS1452(10)

8 P54/BUSAK MTP3 0

9 /WAIT /MWAIT /Wait(ZiVA, DSP) I /MWait

10 P56 DVD/CD DVD/CD RF AGC Gain Select 0 RF(KS1461)

11 SCLK2 SCLK Serial Data Clock I FRONT

12 P80/TXD0 MD RF Contrl Data 0 KS1461(69)

13 P81/RXD0 STB RF Data Latch I/0 KS1461(71)

14 P82/SCLKO MC RF Control Clock 0 KS1461(70)

15 P83/TXD1 MTP5 0 NC

16 P84/RXD1 MTP6 0 NC

17 P85/SCLK1 MTP4 0 NC

18 TXD2 RXD Serial Data Output 0 FRONT

19 RXD2 TXD Serial Data Input I FRONT

20 CSO /CSO EPROM(M27C801) Select 0 EPROM(M27C801)

21 CS1 /CS1 SRAM(KM681000) Select 0 SRAM(KM681000)

22 CS2 /DVD1CS AVDecoder(ZiVA4) Select 0 AVDecoder(ZiVA4)

23 CS3 /DSPCS

Data Processor(KS1453) Select

0 Data Processor(KS1453)

24 CLK CLK

CLOCK OUTPUT (System Clock 2)

0 fc/2

25 Vcc 5D - VCC

26 Vss GDND GND - GND

27 X1 X1 High Frequency OSC in I

28 X2 X2 High frequency OSC out 0

29 /EA /EA Internal ROM Less Mode I GND

30 /REST /MRST Master reset from FRONT I FRONT, IC

31 INT1 SRQ Interrupt from Front Micom I FRONT

32 P71 RRQ Request to Front Micom 0 FRONT

33 P72 SCL EEPROM CLOCK 0 KS24C020(6)

34 P73 SDA EEPROM DATA I/O 0 KS24C020(5)

35 P74 OPEN Tray Out Motor Control Output 0 DRIVER(0PIN-, 16)

36 P75 CLOSE Tray In Motor Control Output 0 DRIVER(0PIN-, 17)

37 INT5 FGINT

Interrupt from Spindle Motor FG

I DRIVER(FG, 2)

38 P91 ACT MUTE Driver IC MUTE(Actuator) 0 DRIVER(MUTE4, 37)

39 P92 M/D MUTE Driver IC MUTE(Spindle) 0 DRIVER(MUTE3, 38)

40 P93 ZRST DSP H/W reset 0 KS1453(124)

41 INT7 /DVDINT Interrupt from AV-DEC I INV(ZiVA-4(51))

42 INT8 /DSPINT Interrupt from DSP I INV(KS1453(126))

43 P96 ZIVA_RST

AV Decoder Reset(Active H:4.0, L:4.1)

0 ZiVA-4(52)

44 Vcc 5D

45 D0 HAD0 Data 0 I/0

46 D1 HAD1 Data 1 I/0

47 D2 HAD2 Data 2 I/0

48 D3 HAD3 Data 3 I/0

49 D4 HAD4 Data 4 I/0

50 D5 HAD5 Data 5 I/0

20MHz

Reference Information

2-8 Samsung Electronics

2-1-5 MIC2 (M27C801 ; 8Mbit (1Mbx8) UVEPROM and OTP EPROM)

NAME

A0-A19

Q0-Q7

OVpp

Vcc Vss

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16

A16 A15 A12

A7 A6 A5 A4 A3 A2 A1

A0 Q0 Q1 Q2

Vss

Vcc

A17 A14 A13 A8 A9 A11 GV

A10 E Q7 Q6 Q4 Q4 Q3

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

TOP VIEW

Vcc

Vss

LOGIC DIAGRAM

FUNCTION

Address Inputs

Chip Enable

Data Outputs

Output Enable/Program Supply Supply Voltage

Ground

A19

A18

GVpp

A0-A19 A0-Q7

Reference Information

Samsung Electronics 2-9

2-1-6 MIC3 (W24256A ; 32K x 8 High Speed CMOS Static RAM)

1 2 3 4 5 6 7 8 9 10 11 12 13 14

28-pin

DIP

28 27 26 25 24 23 22 21 20 19 18 17 16 15

WE A13 A8 A9 A11

A10

CS I/O8 I/O7 I/O6 I/O5 I/O4

A14 A12

A6 A5 A4 A3

A1 A0

I/O1

I/O2 I/O3

. .

A14

I/O1

I/O8

. .

DATA I/O

DECODER

CONTROL

CORE

ARRAY

SYMBOL DESCRIPTION

A0-A14

Address Inputs

I/O1-I/O8

Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input

Power Supply

Ground

TOP VIEW

BLOCK DIAGRAM

Reference Information

2-10 Samsung Electronics

2-1-7 FIC1 (LC86P6232 ; Front Micom)

Interrupt Control

Stand-by Control

BUS

ACC

Bus InterfaceBase Timer

SIO 0

SIO 1

Timer 0

Timer 1

VFD Controller

ADC

INT0-3 Noise Filter

Real Time Service

XRAM (128 bytes)

High Voltage Output

Port 1

Port 7

Port 8

Port 2

Port 3

Port 4

Port 5

PWM 1

B Reg

PSW

RAR

RAM

Stack Pointer

PORT 0

Watch Dog Timer

C Reg

ALU

ROM

IR PLA

Clock Generator

X’tal

Reference Information

Samsung Electronics 2-11

NO PORT NAME TYPE ASSIGNED NAME DESCRIPTION REMARK

51 S18 - SEG7 FLT SEGMENT CONTROL FLT

52 S19 - SEG8 FLT SEGMENT CONTROL FLT

53 S20 - SEG9 FLT SEGMENT CONTROL FLT

54 S21 0 SEG10 FLT SEGMENT CONTROL FLT

55 S22 0 SEG11 FLT SEGMENT CONTROL FLT

56 S23 0 SEG12 FLT SEGMENT CONTROL FLT

57 S24 0 SEG13 FLT SEGMENT CONTROL FLT

58 S25 0 SEG14 FLT SEGMENT CONTROL FLT

59 S26 0 SEG15 FLT SEGMENT CONTROL FLT

60 S27 0 SEG16 FLT SEGMENT CONTROL FLT

61 S28 0 SEG17 FLT SEGMENT CONTROL FLT

62 S29 0 SEG18 FLT SEGMENT CONTROL FLT

63 S30 0 SEG19 FLT SEGMENT CONTROL FLT

64 S31 0 SEG20 FLT SEGMENT CONTROL FLT

65 P00 I MODE4 HARDWARE MODE SELECT MARKET CODE

66 P01 I MODE3 HARDWARE MODE SELECT MARKET CODE

67 P02 I MODE2 HARDWARE MODE SELECT MARKET CODE

68 P03 I MODE1 HARDWARE MODE SELECT MARKET CODE

69 P04 I MODE0 HARDWARE MODE SELECT MARKET CODE

70 P05 - TP10 NC

71 P06 - TP11 NC

72 P07 -- NC

73 P10/S0 0 0 TXD SERIAL DATA OUT SERIAL DATA OUT

74 P11/S1 0 I RXD SERIAL DATA IN SERIAL DATA IN

75 P12/SC K0 0 SCLK SERIAL CLOCK SERIAL CLOCK

76 P13/S0 1 - TP12 NC

77 P14/SI 1 - TP13 NC

78 P15/SC K1 - TP14 NC

79 P16/BU Z - TP15 NC

80 P17/PW MO - TP16 NC

81 P30 I S1 SHUTTLE DATA JOG/SHUTTLE

82 P31 I S2 SHUTTLE DATA JOG/SHUTTLE

83 P32 I S3 SHUTTLE DATA JOG/SHUTTLE

84 P33 I S4 SHUTTLE DATA JOG/SHUTTLE

85 P34 I J1 JOG DATA JOG/SHUTTLE

86 P35 I J2 JOG DATA JOG/SHUTTLE

87 P36 I AT VIDEO OUT SEL. VIDEO SELECT(OPEN)

88 P37 I AD VIDEO OUT SEL. VIDEO SELECT

89 VSS - +5V

90 VDD - GND

91 P40 0 RGBCTL SCART CONTROL SCART JACK

92 P41 0 SCON_B SCART CONTROL SCART JACK

93 P42 - TP28 NC

94 P43 0 WIDE SCART CONTROL SCART JACK

95 P44 0 SRQ request to main micom NC

96 P45 0 SAVE POWER SAVE MODE POWER

97 P46 0 AMUTE1 REAR MUTE AUDIO

98 P47 0 AMUTE0 FRONT MUTE AUDIO

99 P50 0 LED STANDBY LED LED

100 P51 0 ON/OFF POWER ON/OFF CONTROL POWER

NO PORT NAME TYPE ASSIGNED NAME DESCRIPTION REMARK

1 P52 0 MRST Front end reset RESET

2 PWM1 - TP1 NC

3 P20 0 CS1 Chip Select 1 AK4393

4 P21 0 CCLK Control Data Clock AK4393/AK4356

5 P22 0 CDTI Control Data AK4393/AK4356

6 P23 0 CS2 Chip Select 2 AK4356

7 P24 0 DARST PD(Power Down) AK4393

8 P25 0 DARST 1 PD(Power Down) AK4356

9 P26 0 VMUTE0 BA7660 MUTE(VIC2) VIDEO(RESERVED)

10 P27 0 VMUTE1 BA7660 MUTE(VIC1) VIDEO(RESERVED)

11 TEST1 - TP4 NC

12 *RES I *RES Reset

13 XT1 - GND Low Frequency OSC in

14 XT2 - TP5 Low Frequency OSC out

15 VSS - GND

16 CF1 I - High Frequency OSC in

17 CF2 0 - High Frequency OSC out

18 VDD - VDD

19 ANO/P8 0 I ECHO_VR ECHO volume A/D input KARAOKE

20 AN1/P8 1 I MIC_DET MIC detect KARAOKE

21 AN2/P8 2 - TP19 NC

22 AN3/P8 3 I KEY0 KEY SCAN TACT SW

23 AN4/P8 4 I KEY1 KEY SCAN TACT SW

24 AN5/P8 5 I KEY2 KEY SCAN TACT SW

25 AN6/P8 6 - NC

26 AN7/P8 7 - NC

27 P70/IN TO I RRQ Request to Front Micom MAIN MICOM

28 P71/IN T1 - TP25 NC

29 P72/IN T2 - TP26 NC

30 P73/IN T3 I REMOCON REMOCON data in REMOCON EYE

31 S0/T0 0 GRID11 FLT GRID CONTROL FLT

32 S1/T1 0 GRID10 FLT GRID CONTROL FLT

33 S2/T2 0 GRID9 FLT GRID CONTROL FLT

34 S3/T3 0 GRID8 FLT GRID CONTROL FLT

35 S4/T4 0 GRID7 FLT GRID CONTROL FLT

36 S5/T5 0 GRID6 FLT GRID CONTROL FLT

37 S6/T6 0 GRID5 FLT GRID CONTROL FLT

38 S7/T7 0 GRID4 FLT GRID CONTROL FLT

39 S8/T8 0 GRID3 FLT GRID CONTROL FLT

40 S9/T9 0 GRID2 FLT GRID CONTROL FLT

41 S10/T10 0 GRID1 FLT GRID CONTROL FLT

42 S11/T11 0

43 S12/T12 0 SEG1 FLT SEGMENT CONTROL FLT

44 S13/T13 0 SEG2 FLT SEGMENT CONTROL FLT

45 S14/T14 0 SEG3 FLT SEGMENT CONTROL FLT

46 S15/T15 0 SEG4 FLT SEGMENT CONTROL FLT

47 VOD - +5V

48 VP - -28V

49 S16 0 SEG5 FLT SEGMENT CONTROL FLT

50 S17 0 SEG6 FLT SEGMENT CONTROL FLT

Reference Information

2-12 Samsung Electronics

2-1-8 RIC1 (KS1461 ; RF Signal Processor)

Equalizer

ALPC

D1 B1

DCD1

DDVD1

BDVD1

ADVD1 CDVD1

BCD1 CCD1

ACD1

MUX

TESEL(00H)

AUTO

OFSTCTL

TE3B

RFCT

MIRR

DPDVCC

LDODVD

ABCDN

15 16

100 98 94 92 89 8591 76848788 8293

GCA

TBAL(01H)

TEOFST(04H)

GAIN_TE3(02H)

18 19

FOKTH

DFCT_CP2

CC1

DGND

80 77787981

RFRP

ABCDI

ENV

CD1

+ + +

RF SUM

&AGC

GAIN_EQ(02H)

ENVELOPE FOK DEFECT

AVCC

PDVD

PDLIMITRES

ABCD

SUB

MUX

97 959699 86

VREFEQ

73 72

CLOCK DATA

VREFDPD

toDPD

BLO CK

to RF EQ

TUNING BLOCK

FOFST

LDOCD

PDCD

DVCC

BCA

FAULTOUT

AGND

STB

DPDGND

MUX

BCAI

DPDEQ 2 DPDEQ 1

DFCT2

TE3OFST

ANALOG

VC AMP

VREFA

DFCT_CP1

VREFLP_BGI

CC2

DPD

VC AMP

TEN

DFCT1

PLLCTL

TE1RES

MIRR

DPDMUTE

OSC

FOKB

FOFST

AB CD

SUM

OFSTHOLD

FEN

DFCTTH2

DFCTTH1

ENVP

ENVB

RESET

BCAO

AGC_D ET

RFAGCO

AGCLEVEL

AGCI

EQVCC

RFEQO

PLLF

BCATH

EQF

RDPF

VZOCTL

AGCC

RFCT

EQGND

CP1

MIRRI

RFRPN

CP2

CB2

RFRP

AGCP

AGCB

CB1

MROFST

EQIN

RREFDLY

VREF

GENERATOR

RREFBF

RREF

RREFEQ

EQ VC

AMP

S/ I F BLOCK

CD1 S12 DVD1 DVD2 LDONB FLT_CTL CDRSEL TESEL AGC HOLD TBAL GAIN_TE3 ENV_ SE L DVCTL_SEL DPD_MUTE GAIN_EQ GAIN_FE GAIN_ABCD TE_OFST FE_OFST ABCD_ OFST DELAY_CD DELAY_AB PDL IM I T ga_RFSUM HOLD_CTL ga_PLLDP ga_PLLDN

BCA

BLOCK

BCA

MUX

EQIN

AGC-HOLD(00H)

ENV_SEL(02H)

LDONB(00H)

COM

DPDEQ 1

DPDEQ 2

COM

DELAY

DELAY_AB(07H) DELAY_CD (07H ) PLLCTL

TEOFST(04H)

PD,LPF

PD_LIMIT(08H)

DELAY _SEL(00H) PLL CTL TBAL( 01H)

DELAY_SEL(00H) PLL CTL

FAULTOUT

TE1RES

TE1_LIMIT

PDLIMITRES

GA_PLLDN(09 H) GA_PLLDP(09 H )

+ +

CDRSEL(00H)

MUX

ACD

CCD DCD

BCD

6 7

ADVD

CDVD DDVD

BDVD

2 3 4

D D

MUX3

DVCTL_SEL(02H)

GCA

ga_R FSUM(08H)

HOL D_CTL( 0 8 H) DPDMUTE DPD_MUTE( 02H) SEOFHOLD FL T_CT L(00 H) CAL_ ENDB(02H)

CDRSEL(00H)

OFSTHOLD

GAIN_FE(03H)

OFSTHOLD

CDRSEL(00H)

OFSTHOLD

S12

GAIN_ABCD(00 H)

ABCD _ OFST(06H)

FE_OFST(05 H )

9 10 11

Ab normal waveform Detection circuit

GCA

31 42 43 4644 5026 27 40 41 47 4839 453428 32 3329 30 36 37 3835 49

EQG

Reference Information

Samsung Electronics 2-13

Pin No.

Pin Name I/O Description Related Block

Part

1 ACD I Optical main beam A, AC Coupling input terminals for CD of RF

block

PRE AMP P/U

2 BCD I Optical main beam B, AC Coupling input terminals for CD of RF

block

PRE AMP P/U

3 CCD I Optical main beam C, AC Coupling input terminals for CD of RF

block

PRE AMP P/U

4 DCD I Optical main beam D, AC Coupling input terminals for CD of RF

block

PRE AMP P/U

5 ADVD I Optical main beam A, AC Coupling input terminals for DVD of RF

block

PRE AMP P/U

6 BDVD I Optical main beam B, AC Coupling input terminals for DVD of RF

block

PRE AMP P/U

7 CDVD I Optical main beam C, AC Coupling input terminals for DVD of RF

block

PRE AMP P/U

8 DDVD I Optical main beam D, AC Coupling input terminals for DVD of RF

block

PRE AMP P/U

9 RREFBF - RF AMP I/O buffer bias resistance connection terminal RF AMP 10 RREFEQ - RF EQ BIAS resistance connection terminal RF EQ 11 RREF - Analog Block bias resistance connection terminal ANALOG 12 VREFEQ - CAP connection terminal for RF EQ Center voltage EQ VC AMP 13 E I CD Optical sub beam E input terminal for Servos TE 3B P/U 14 F I CD Optical sub beam F input terminal for Servos TE 3B P/U 15 ADVD1 I Optical main beam A input terminal for DVD of Servo block SERVO AMP P/U 16 BDVD1 I Optical main beam B input terminal for DVD of Servo block SERVO AMP P/U 17 CDVD1 I Optical main beam C input terminal for DVD of Servo block SERVO AMP P/U 18 DDVD1 I Optical main beam D input terminal for DVD of Servo block SERVO AMP P/U 19 ACD1 I Optical main beam A input terminal for CD of Servo block SERVO AMP P/U 20 BCD1 I Optical main beam B input terminal for CD of Servo block SERVO AMP P/U 21 CCD1 I Optical main beam C input terminal for CD of Servo block SERVO AMP P/U 22 DCD1 I Optical main beam D input terminal for CD of Servo block SERVO AMP P/U 23 AVCC P Power voltage input terminal for Analog Part ANALOG 24 VREFA I/O CAP connection terminal for Analog Part center voltage

Uses an external block

ANA VC AMP SERVO

25 FOFST - CAP connection terminal (open) for Focus Auto Offsets FE AMP 26 OFSTHOLD I On/Off terminal for Auto Offset Block.

(L: Auto Offset Adjustments, H: Serial Offset Adjustments)

OFSTCTL MICOM

27 VREFLP_BGI I Band gap voltage input block for ALPC ALPC 28 LDODVD O

Optical Laser Diodes operation voltage output terminal for DVD

ALPC P/U

29 PDDVD I

Optical Laser Monitor Diode voltage input terminal for DVD

ALPC P/U

30 LDOCD O

Optical Laser Diode operating voltage output terminal for CD

ALPC P/U

31 PDCD I

Optical Laser Monitor Diode voltage input terminal for CD

ALPC P/U

32 AGND P

Power GND terminal for Analog Part

ANALOG -

33 FE O

FE AMP output terminal

FE AMP DSSP

34 FEN I

Input terminal for selecting FE AMP Gain

FE AMP -

35 TEN I

Input terminal for selecting TE AMP Gain

TE AMP -

36 TE O

TE AMP output terminal

TE AMP DSSP

37 PDLIMTRES -

Bias resistance terminal for PDLIMIT

DPD -

38 ABCDN I

ABCD AMP for selecting Gain (

- ) input terminal

ABCD AMP -

39 ABCD O

ABCD AMP output terminal

ABCD AMP -

40 ABCDI I

ABCD AC Coupling input terminal for servo monitor

SERVO MONIT -

41 ENVP -

CAP connection terminal for selecting the RC value of Peak Hold for detecting RF Envelopes

RF ENV -

42 ENVB -

CAP connection terminal for selecting the RC value of Bottom Hold for detecting RF Envelopes

RF ENV -

43 ENV O

RF Envelope Detect Output terminal

RF ENV DSSP

44 DGND P

Power GND input terminal for digital circuits

DIGITAL -

45 FOKTH I

Focus OK comparating level input terminal

FOKB -

46 FOKB O

Focus OK comparator output terminal (L: Focus OK)

FOKB DSSP

47 DFCT_CP1 -

Connection terminal for RC value of Peak Hold, for selecting the maximum time for Servo signal

DFCT -

48 DFCT_CP2 -

Connection terminal for RC value of Peak Hold, for selecting the minimum defect time for PLL

DFCT -

49 CC1 O

Peak Hold Output terminal for selecting the minimum Defect time for Defect

DFCT -

50 CC2 I

Peak Hold AC Coupling Input terminal for Defect

DFCT -

51 DVCC P

Power voltage input terminal for digital circuit

DIGITAL -

52 DFCTTH2 -

Resistance connection terminal for selecting the Defect Comparating Level for PLL

DEFECT -

53 DFCTTH1 -

Resistance connection terminal for selecting the Defect Comparating Level for Servo

DEFECT -

54 DFCT1 O

Defect output terminal for Servo

DEFECT DSSP

55 DFCT2 O

Defect output terminal for PLL

DEFECT PLL

56 DPDVCC P

Power voltage input terminal for DPD TE

DPD -

57 MIRR O

Mirror output terminal

MIRR DSSP

58 BCA O

BCA output terminal

BCA DSP

59 TE3OFST -

Cap connection terminal (open) for 3B TE Offset

3B TE AMP -

60 DPDEQ1 O

DPD EQ (A+C) output terminal

DPD -

61 DPDEQ2 O

DPD EQ (B+D) output terminal

DPD -

62 FAULTOUT O

DPD abnormal wave form output terminal (monitor)

DPD -

63 DPDMUTE I

DPD TE MUTE control terminal (H: Mute)

DPD MICOM

64 PLLCTL I

DPD TE PLL variable input terminal

DPD SERVO

65 TE1RES I

DPD TE PLL variable bias resistance

DPD -

66 DPDGND P

Power GND input terminal for DPD TE

DPD -

67 VREFDPD O

CAP connection terminal for DPD TE center voltage

DPD VC AMP -

68 RREFDLY -

Bias resistance connection terminal for Delay Block

Delay Block -

69 DATA I

Data input terminal

Serial Interface MICOM

70 CLOCK I

Clock input terminal

Serial Interface MICOM

71 STB I

Data Enable input terminal

Serial Interface MICOM

72 OSC

Input terminal for RC value of OSC, for Auto Offset Block

Auto OFSTCTL -

73 RESET I

Reset input terminal (L: Reset) for Auto Offset Block

Auto OFSTCTL MICOM

74 BCAI I

BCA Filter1

BCA -

75 BCAO O

BCA Filter2

BCA -

76 RFCT O

RF Ripple Center voltage output terminal for Mirror

MIRROR DSSP

77 CB2 -

CAP connection terminal of RC value of Bottom Hold, for RFCT generation

MIRROR -

78 CP2 -

CAP connection terminal of RC value of Peak Hold, for RFCT generation

MIRROR -

79 RFRP O

RF Ripple Amp output terminal for Mirror

MIRROR DSSP

80 RFRPN I

Input terminal for selecting RFRP Amp gain

MIRROR -

81 MROFST I

RF Ripple Offset control terminal for Mirror

MRROR -

82 CB1 -

RC connection terminal of RC value of Bottom Hold, for RFRP generation

MRROR -

83 CP1 -

RC connection terminal of RC value of Peak Hold, for RFRP generation

MRROR -

84 MIRRI I

Input terminal for MIRR signal generation

MRROR -

85 EQVCC P

Power voltage input signal for RF EQ

RF EQ -

86 RFEQ0 0

RF EQ output terminal

RF EQ PLL

87 BCAT H I

BCA Comparating Level control terminal

BCA DSP

88 EQIN I

RFAGCO input terminal for RF EQ

RFEQ,RFENV DSSP

89 RFAGCO O

RF AGC AMP output terminal

RF AGC -

90 AGCC -

CAP connection terminal for time constant of AGC

RF AGC -

91 AGCI I

AGC voltage input terminal while in AGC hold

RF AGC -

Pin No.

Pin Name I/O Description Related Block

Part

92 EQGND P

Power GND input terminal for RF EQ

RF EQ -

93 AGCLEVEL I

AGC Level control voltage input terminal (3.5 V) while in AGC hold off

RF AGC -

94 AGCB -

RC connection terminal for RC value of Bottom Hold, for RF AGC

RF AGC -

95 AGCP -

RC connection terminal for RC value of Peak Hold, for RF AGC

RF AGC -

96 RDPF -

Bias resistance connection terminal for selecting RF EQ frequency

RF EQ -

97 EQG I

RF EQ Boost Gain control voltage input terminal

RF EQ DSSP

98 EQF I

RF EQ Peak Frequency control voltage input terminal

RF EQ DSSP

99 PLLF I

Wide-band PLL compatible RF EQ Peak Frequency Control terminal

RF EQ DSSP

100 VZOCTL I

RF EQ zero control terminal

RF EQ DSSP

Reference Information

2-14 Samsung Electronics

2-1-9 SIC1 (KS1452 ; Servo Processor)

TIMING

GENERATOR

TR ACK COUNTER

VREF

FOD

TRD

SL D

SPD

FBAL

TBAL

A/D

CONVERTER

BLOC K

ENV

SME

D/A

CONVERTER

BLOC K

COUT

FLKB

TLKB

SSTOP/PS0

PS1

LOCK

SMON

MIRR

FOKB

DFCT

I/O I NTER FACE BLOCK

DAB

CSB

MDAT A[ 7:0]

MWRB

SENSE

SYSCON

INTERFACE

BLOCK

ROM

DSP CORE

FOR

DIGITAL SERVO

PL CK

RVCO

VCTRL

EQC TL

WIDE CAPTURE

RANGE PLL

LDONB

PSB

RSTB

TEST

TZCA

MRDB

EFM ASYMM ETRY

RFI

ASYCD

XOUT

TILTI

TILTO

EFM

EFMR TD

RPD

PLLLOCK

MDOUT[3:0]

DIRC

ASYDVD

EFMI

DVCTL

MAGIC0

INT0_224

PL LHD

RFD

PHI1

EFMOA

FDCTL

TZCO

Reference Information

Samsung Electronics 2-15

41 PVDD P PLL logic block VDD power supply pin

42 PLCK O PLCK

43 PLLLOCK O Frequency lock detect output (H: lock, L: unlock)

44 EFMRTD O Latched EFM output signal

45 PVSS P PLL logic block VSS power supply pin

46 RVCO I Resistor pin for VCO gain

47 RFD I Gain adjust resister for frequency detector

48 RPD I Gain adjust resister for phase detector

49 VCTL I control voltage for VCO

50 MAGIC0 I Input for controlling hysteresis of the FD output (for testing)

51 EFMOA I EFM offset adjustment pin

52 TZCO O Tracking zero cross output pin

53 SVDD P Servo CPU VDD power supply pin

54 EQCTL O EQ control signal

55 EFMI I EFM signal for test

56 EFMO O EFM signal

57 LPFDVD I Asymmetric input signal for DVD

58 LPFCD I Asymmetric input signal for CD

59 RFI I Rf input signal

60 SVSS P Servo CPU VSS power supply pin

61 AVSS P Analog block VSS power supply pin

62 SME I Spindle error input pin

63 VREF I Reference voltage input pin

64 TE I Tracking error signal input pin

65 FE I Focus error signal input pin

66 ENV I RF envelope input pin

No Name I/O Description

67 TILTI I TILT in (reserved)

68 AVDD P Analog block VDD power supply pin

69 TILTO O TILT out (reserved)

70 DVCTL O Depth variation control signal output pin

71 TBAL O Tracking balance signal output pin

72 FBAL O Focus balance signal output pin

73 SLD O Sled motor drive signal output pin

74 SPD O Spindle motor drive signal output pin

75 FOD O Focus actuator drive signal output pin

76 TRD O Tracking actuator drive signal output pin

77 TZCA I TE signal for tracking zero cross input pin

78 MDOUT0 O Mode data0 out controlled by micom

79 MDOUT1 O Mode data1 out controlled by micom

80 MDOUT2 O Mode data2 out controlled by micom

No Name I/O Description

1 MDOUT3 O Mode data3 out controlled by micom

2 SSTOP/PS0PS1 I Limit switch/sled position sensor input pin0

3 PS1 I Sled motor position sensor input pin1

4 TEST I Test pin (L: normal H: test)

5 COUT O Counter clock

6 FLKB O Focus servo lock signal output pin

7 TLKB O Tracking servo lock signal output pin

8 PSB I 0: 1 Bit, 1: 8 Bit

9 RSTB I System reset signal input pin

10 CSB I MICOM chip select pin

11 DAB I MICOM data/addrs select pin

12 MWRB I MICOM write clock signal input pin

13 MRDB I MICOM read clock signal input pin

14 MDATA0 I/O MICOM data pin0

15 MDATA1 I/O MICOM data pin1

16 MDATA2 I/O MICOM data pin2

17 MDATA3 I/O MICOM data pin3

18 MDATA4 I/O MICOM data pin4

19 MDATA5 I/O MICOM data pin5

20 MDATA6 I/O MICOM data pin6

21 MDATA7 I/O MICOM data pin7

22 SENSE O Internal status monitor pin

23 DVDD P Servo logic & ROM VDD power supply pin

24 XI I System clock signal input pin

25 XO O System clock signal output pin

26 XOUT O Clock out (33.9688MHz) to DSP

27 DVSS P Servo logic & ROM VSS power supply pin

28 SQCK O Clock output pin for subcode data read

29 SQSI I Subcode data input pin

30 SCOR I Timing detection input pin for subcode data read

31 SMON I Motor ON signal input pin

32 LOCK I Lock signal input pin

33 DIRC I

Direct jump control (for 1 track jump)

34 FOKB I Focus OK signal input pin

35 FDCTL I PLL frequency detect control input pin

36 LDONB O Laser diode ON signal output pin

37 DFCT I Defect detection signal input pin

38 MIRR I Mirror signal input pin

39 PLLHD I PLL hold signal from micom

40 INT0_224 O Servo interrupt monitor pin

Reference Information

2-16 Samsung Electronics

2-1-10 SIC4 (KA3017 ; Motor & Actuator Driver)

123654789101112

25 26 27 28 29 30 31 32 33 34 35 36

Hall bias

Comparator

Absolute

Values

TSD

Detector

Direction Detector

Hall amp matrix

Direction select

Power

Save

Short vrake

Lower

Distributor

Upper

Distributor

MUTE MUTE MUTE

10k

PWRGND

OPIN +

OPIN

OPOUT

VCC1

AVM12

DI4

DI3

DI2

FIN (GND)

H3+

H2+

H1+

BTLSGND

BIAS

AVM4

MUTE12

MUTE3

MUTE4

DI1

DO1

DO1 +

DO2

DO2 +

BTLPGND1

BTLPGND2

DO3

DO3 +

AVM3

DO4

DO4 +

FIN (GND)

DIR

CS1

SIGGND

PC1

VCC2

ECR

FIN (GND)

Reference Information

Samsung Electronics 2-17

No. Symbol I/O Description

1 VH I HALL BIAS 2 FG O FG SIGNAL OUTPUT 3 ECR I TORQUE CONTROL REFERENCE 4 EC I TORQUE CONTROL SIGNAL 5 VCC2 — SUPPLY VOLTAGE 6 PC1 — PHASE COMPENSATION CAPACITOR 7 SIGGND — SIGNAL GROUND 8VM— MOTOR SUPPLY VOLTAGE

9 CS1 I CURRENT SENSOR 10 S/S I START/STOP 11 DIR O 3-PHASE ROTATIONAL DIRECTION OUTPUT 12 SB I SHORT BRAKE 13 PWRGND — POWER GROUND 14 A3 O 3-PHASE OUTPUT 3 15 A2 O 3-PHASE OUTPUT 2 16 A1 O 3-PHASE OUTPUT 1 17 OPIN+ I OP AMP INPUT (+) 18 OPIN- I OP AMP INPUT (-) 19 OPOUT O OP AMP OUTPUT 20 VCC1 — SUPPLY VOLTAGE 21 AVM12 — BTL CH-1, 2 MOTOR SUPPLY VOLTAGE 22 DI4 I BTL DRIVE INPUT 4 23 DI3 I BTL DRIVE INPUT 3 24 DI2 I BTL DRIVE INPUT 2 25 DI1 I BTL DRIVE INPUT 1 26 DO1- O BTL DRIVE 1 OUTPUT (-) 27 DO1+ O BTL DRIVE 1 OUTPUT (+) 28 DO2- O BTL DRIVE 2 OUTPUT (-) 29 DO2+ O BTL DRIVE 2 OUTPUT (+) 30 BTLPGND1 — BTL POWER GROUND 1 31 BTLPGND2 — BTL POWER GROUND 2 32 DO3- O BTL DRIVE 3 OUTPUT (-) 33 DO3+ O

BTL DRIVE 3 OUTPUT (+) 34 AVM3 — BTL CH3 MOTOR SUPPLY VOLTAGE 35 DO4- O BTL DRIVE 4 OUTPUT (-) 36 DO4+ O BTL DRIVE 4 OUTPUT (+) 37 MUTE4 I BTL DRIVE MUTE CH 4 38 MUTE3 I BTL DRIVE MUTE CH 3 39 MUTE12 I BTL DRIVE MUTE CH 1, 2 40 AVM4 — BTL CH 4 MOTOR SUPPLY VOLTAGE 41 BIAS — BTL BIAS VOLTAGE 42 BTLSGND — BTL DRIVE SIGNAL GROUND 43 H1- I HALL1(-) INPUT 44 H1+ I HALL1(+) INPUT 45 H2- I HALL2(-) INPUT 46 H2+ I HALL2(+) INPUT 47 H3- I HALL3(-) INPUT 48 H3+ I

HALL3(+) INPUT

Reference Information

2-18 Samsung Electronics

2-1-11 ZIC1 (ZIVA 4.1 ; A/V Decoder)

Digital Audio Input

SDRAM

Interface

Audio

DSP

Digital

Audio

Interface

Program

Stream

Decoder

Host

Interface

Audio

Interface

DVD/CD

Interface

MPEG Video

Decoder

Subpicture

Decoder

OSD

Decoder

CD-DA and LPCM

Decoder

Dolby Digital Audio

Decoder

MPEG Audio

Decoder

Memory

Controller

Host

Interface

Control Logic

SecureView

CSS

Descrambling

Bus Key

Authentication

(optional)

Video

Mixer

Video

Out

Digital

Video

Encoder

Reference Information

Samsung Electronics 2-19

Pin No . Pin Name I/O Voltage I/O Type

1RD

3.3V I

2R/W

3.3V I

3 VDD_3.3 3.3V

4 WAIT

3.3V O, OD, PU

5RESET3.3V I

6 VSS GROUND

7 VDD_3.3 3.3V

8INT

3.3V O, OD, PU

9 NC No Connect O

10 NC No Connect O

11 NC No Connect O

12 NC No Connect O

13 VDD_2.5 2.5V

14 VSS GROUND

15 NC No Connect O

16 NC No Connect O

17 NC No Connect O

18 NC No Connect O

19 VSS GROUND

20 VDD_3.3 3.3V

21 VDATA0 3.3V O

22 VDATA1 3.3V O

23 VDATA2 3.3V O

24 VDAT

A3 3.3V O

25 VDATA4 3.3V O

26 VDATA5 3.3V O

27 VDATA6 3.3V O

28 VDATA7 3.3V O

29 VSYNC

3.3V I/O

30 HSYNC

3.3V I/O

31 VSS GROUND

32 VDD_3.3 3.3V

33 RESERVED 3.3V I

34 RESERVED 3.3V I

35 RESERVED 3.3V I

36 VDD_2.5 2.5V

37 VSS GROUND

38 RESERVED 3.3V I

39 RESERVED 3.3V I

40 RESERVED 3.3V I

41 RESERVED 3.3V I

42 RESERVED 3.3V I

43 PIO0 3.3V I/O

44 VSS GROUND

45 VDD_3.3 3.3V

46 PIO1 3.3V I/O

47 PIO2 3.3V I/O

48 PIO3 3.3V I/O

49 PIO4 3.3V I/O

50 PIO5 3.3V I/O

51 PIO6 3.3V I/O

52 PIO7 3.3V I/O

53 MDATA0 3.3V I/O

54 MDATA1 3.3V I/O

55 VDD_3.3 3.3V

56 VSS GROUND

57 MDATA2 3.3V I/O

58 MDATA3 3.3V I/O

59 MDATA4 3.3V I/O

60 MDATA5 3.3V I/O

61 MDATA6 3.3V I/O

62 MDATA7 3.3V I/O

63 MDAT A 15 3.3V I/O

64 VDD_3.3 3.3V I/O

65 VSS GROUND I/O

66 MDAT A 14 3.3V I/O

67 VDD_2.5 2.5V

68 VSS GROUND

69 MDAT A 13 3.3V I/O

70 MDAT A 12 3.3V I/O

71 MDAT A 11 3.3V I/O

72 MDAT A 10 3.3V I/O

73 MDATA9 3.3V I/O

74 VDD_3.3 3.3V

75 VSS GROUND

76 MDATA8 3.3V I/O

77 LDQM 3.3V O

78 SD-CLK 3.3V O

79 CLKSEL 3.3V I

80 MADDR9 3.3V O

81 MADDR8 3.3V O

82 VDD_3.3 3.3V

83 VSS GROUND

84 MADDR7 3.3V O

85 MADDR6 3.3V O

86 MADDR5 3.3V O

87 VDD_2.5 2.5V

88 VSS GROUND

89 MADDR4 3.3V O

90 MWE

3.3V O

91 SD-CAS

3.3V O

92 VDD_3.3 3.3V

93 VSS GROUND

94 SD-RAS

3.3V O

95 SD-CS0

3.3V O

96 SD-CS1

/MADDR11 3.3V O

Pin No . Pi n Name I/O Voltage I/O Ty pe

97 SD-BS

3.3V O

98 MADDR10 3.3V O

99 MADDR0 3.3V O

100 VDD_3.3 3.3V

101 VSS GROUND

102 MADDR1 3.3V O

103 MADDR2 3.3V O

104 MADDR3 3.3V O

105 RESERVED ANALOG GND

106 NC No connect O

107 NC No connect O

108 RESERVED 3.3V I

109 NC No connect O

110 RESERVED 3.3V I

111 RESERVED 3.3V ANALOG

112 RESERVED 3.3V I

113 DAI-LRCK 3.3V I/O

114 DAI-BCK 3.3V I/O

115 VDD_3.3 3.3V

116 VSS GROUND

117 DAI-DATA 3.3V I/O

118 DA-DATA3 3.3V O

119 DA-DATA2 3.3V O

120 DA-DATA1 3.3V O

121 DA-DATA0 3.3V O

122 DA-LRCK 3.3V O

123 VDD_3.3 3.3V

124 VSS GROUND

125 DA-XCK 3.3V I/O

126 DA-BCK 3.3V O

127 DA-IEC 3.3V O

128 VDD_2.5 2.5V

129 VSS GROUND

130 NC No Connect O

131 VSS_DAC ANALOG GND

132 VSS_VIDEO ANALOG GND

133 CVBS + sync 3.3V ANALOG O

134 VDD_DAC 3.3V ANA LOG O

135 VDD_VIDEO 3.3V ANALOG

136 NC No Connect O

137 VSS_DAC ANALOG GND

138 VSS_VIDEO ANALOG GND

139 CVBS/G/Y 3.3V ANALOG O

140 VDD_DAC 3.3V ANA LOG

141 VDD_VIDEO 3.3V ANALOG

142 NC No Connect O

143 VSS_DAC ANALOG GND

Pin No . Pin Name I/O Voltage I/O Type

144 VSS_VIDEO ANALOG GND

145 Y/B/U 3.3V ANAL OG O

146 VDD_DAC 3.3V ANALOG

147 VDD_VIDEO 3.3V ANALOG

148 NC No Connect O

149 VSS_DAC ANALOG GND

150 VSS_VIDEO ANALOG GND

151 C/R/V 3.3V ANALOG O

152 VDD_DAC 3.3V ANALOG

153 VDD_VIDEO 3.3V ANALOG

154 VSS_RREF ANALOG GND

155 RREF 3.3V ANALOG O

156 VDD_RREF 3.3V ANALOG

157 A_VSS GROUND

158 SYSCLK 3.3V I

159 VCLK 3.3V I

160 A_VDD 3.3V ANALOG

161 DVD-DATA0/CD-DATA 3.3V I

162 DVD-DATA1/CD-L RCK 3.3V I

163 DVD-DATA2/CD-BCK 3.3V I

164 DVD-DATA3/CD-C2P0 3.3V I

165 DVD-DAT A4/CDG-SDATA 3.3V I

166 VSS GROUND

167 VDD_3.3 3.3V

168 DVD-DATA5/CDG-VFSY 3.3V I

169 DVD-DATA6/CDG-S0S1 3.3V I

170 DVD-DATA7/CDG-SCLK 3.3V I

171 VDACK 3.3V I

172 VREQUEST 3.3V O

173 VSTROBE 3.3V I

174 ERROR 3.3V I

175 VDD_3.3 3.3V

176 RESERVED GROUND

177 VDD_3.3 3.3V

178 VSS GROUND

179 NC No connect O

180 NC No connect O

181 NC No connect O

182 HADDR0 3.3V I

183 HADDR1 3.3V I

184 HADDR2 3.3V I

185 RESERVED 3.3V I

186 RESERVED 3.3V I

187 RESERVED 3.3V I

188 VSS GROUND

189 VDD_2.5 2.5V

190 RESERVED 3.3V I

Pin No. Pin Name I/O Voltage I/O Type

Reference Information

2-20 Samsung Electronics

191 VSS GROUND

192 VDD_3.3 3.3V

193 RESERVED 3.3V I

194 RESERVED 3.3V I

195 RESERVED 3.3V I

196 RESERVED 3.3V I

197 HDA TA7 3.3V I/O

198 VSS GROUND

Pin No . Pin Name I/O Voltage I/O Type

199 HDATA6 3.3V I/O

200 HDATA5 3.3V I/O

201 HDATA4 3.3V I/O

202 HDATA3 3.3V I/O

203 HDATA2 3.3V I/O

204 VDD_3.3 3.3V

205 VSS 3.3V

206 HDATA1 3.3V I/O

207 HDATA0 3.3V I/O

208 CS

3.3V I

Pin No . Pi n Name I/O Voltage I/O Ty pe

Reference Information

Samsung Electronics 2-21

2-1-12 ZIC2/ZIC3 (KM416S1120D ; CMOS 16M SDRAM)

Bank Select

Data Input Register

512K x 16

Sense AMP

Output BufferI/O Control

Column Decoder

Latency & Burst Length

Programming Register

Address Register

Row Buffer

Refresh Counter

Row Decoder Col. Buffer

LRAS

LCBR

LCKE

LRAS LCBR LWE LDQM

CLK CKE CS

RAS CAS WE L(U)DQM

LWE

LDQM

DQi

CLK

ADD

LCAS LWCBR

Timing Register

VDD DQ0 DQ1

SSQ

DQ2 DQ3

DDQ

DQ4 DQ5

SSQ

DQ6 DQ7

DDQ

LDQM

WE CAS RAS

CS BA

A10/AP

A0 A1 A2 A3

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26

VSS DQ15 DQ14 V

SSQ

DQ13 DQ12 V

DDQ

DQ11 DQ10 V

SSQ

DQ9 DQ8 V

DDQ

N.C/RFU UDQM CLK CKE N.C A9 A8 A7 A6 A5 A4 V

Pin Name Input Function

CLK System Clock Active on the positive going edge to sample all inputs. CS

Chip Select

Disables or enables device operation by masking or enabling all inputs except CLK, CKE and L(U)DQM

CKE Clock Enable

Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby.

0 ~ A10/AP Address

Row / column addresses are multiplexed on the same pins. Row address : RA

0 ~ RA10, column address : CA0 ~ CA7

BA Bank Select Address

Selects bank to be activated during row address latch time. Selects bank for read/write during column address latch time.

RAS

Row Address Strobe

Latches row addresses on the positive going edge of the CLK with RAS

low.

Enables row access & precharge.

CAS

Column Address Strobe

Latches column addresses on the positive going edge of the CLK with CAS

low.

Enables column access.

Write Enable

Enables write operation and row precharge. Latches data in starting from CAS

, WE active.

L(U)DQM Data Input/Output Mask

Makes data output Hi-Z, t

SHZ after the clock and masks the output.

Blocks data input when L(U)DQM active.

0 ~ 15 Data Input/Output Data inputs/outputs are multiplexed on the same pins.

DD/VSS Power Supply/Ground Power and ground for the input buffers and the core logic.

DDQ/VSSQ Data Output Power/Ground

Isolated power supply and ground for the output buffers to provide improved noise immunity.

N.C/RFU

No Connection/ Reserved for Future Use

This pin is recommended to be left No Connection on the device.

Reference Information

2-22 Samsung Electronics

MEMO

Samsung Electronics 3-1

3. Product Specifications

Power Requirements AC 110 - 240V, 50/60Hz

Power Consumption 17W

GENERAL

Weight 3.1kg

Dimensions W 430mm X D 280mm X 89mm

Operating Temperature Range +5°C ~ +35°C

Operating Humidity Range 10% to 75%

DVD Reading Speed : 3.49 m/sec

(Digital Versatile Disc)

Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.

CD : 12Cm Reading Speed : 1.2 to 1.4 m/sec

DISC

(Compact Disc) Maximum Play Time : 74min.

CD : 8Cm Reading Speed : 1.2to 1.4 m/sec.

(Compact Disc) Maximum Play Time : 20min.

VCD : 12Cm

Reading Speed : 1.2 to 1.4 m/sec. Maximum Play Time : 74min. (Video + Audio)

Composite Video 2 channel : 1.0Vp-p (75ohm load)

R(Red) : 0.714 Vp-p (75ohm load) G(Green) : 0.714 Vp-p (75ohm load)

Video Output

Scart Jack B(Blue) : 0.714 Vp-p (75ohm load)

Composite Video : 0.714 Vp-p (75ohm load) Color Signal : 0.286 Vp-p (75ohm load)

S-Video

Luminance Signal : 1Vp-p (75ohm load) Color Signal : 0.286Vp-p (75ohm load)

Scart Jack 2 Channel : L(1.L), R(2/R)

2 Channel L (1/L), R (2/R)

* Frequency Response

48KHz Sampling : 4Hz to 22 KHz

Audio Output

96KHz Sampling : 4Hz to 44KHz

* S/N Ratio 115dB

* Dynamic Range 105dB

* Total Harmonic Distortion 0.003%

* : Nominal specification

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