SAIFUN SA25C1024HEMNX, SA25C1024HEN, SA25C1024HENX, SA25C1024HMN, SA25C1024HMNX Datasheet

Features

•= Saifun NROM™ Flash Cell

•= Serial Peripheral Interface (SPI) Compatible

•= Supports SPI Modes 0 (0,0) and 3 (1,1)

•= Byte and Page Write Modes (up to 128 bytes)

•= Single Supply Voltage:

– 2.7V to 3.6V (L)
– 4.5V to 5.5V (H)

•= 10MHz Clock Rate

•= Block Write Protection:

– Protect ¼, ½, or Entire Array

•= Write Protect Pin and Write Disable Instructions of both Hardware and
Software Data Protection

•= Self-timed Write Cycle (10mS max)

•= 100,000 Write Cycles (Minimum)

•= 20 Year Data Retention

•= Low-power Standby Current (less than 1µµµµA)

•= 8-SOIC Narrow Package (0.150” Wide Body, JEDEC SOIC)

•= Temperature Range:

– Industrial: -40°C to +85°C
– Commercial: 0°C to +70°C

General Description

SA25C1024

Data Sheet

1Mb EEPROM SPI

with 10MHz and Low

Standby

SA25C1024 is a 1Mb CMOS non-volatile serial EEPROM,
organized as a 128K x 8-bit memory. The SA25C1024 is
available in a space-saving, 8-lead narrow SOIC package. In
addition, it is available in a wide range of voltages – 2.7-3.6 V
and 4.5-5.5 V.

The SA25C1024 is enabled through the Chip Select (CSb) pin
and is accessed via a 3-wire interface consisting of Serial Data
Input (SI), Serial Data Output (SO) and Serial Data Clock
(SCK). All write cycles are completely self-timed, and no
separate ERASE cycle is required before write.

(continued)

http://www.saifun.com

Saifun NROMTM is a trademark of Saifun Semiconductors Ltd.

This Data Sheet states Saifun's current technical specifications regarding the Products described herei n. This Data Sheet
may be revised by subsequent versions or modifications due to changes in technical specifications.

Publication# 1910 Rev: 1.1 Amendment: 1
Issue Date: January 27, 2003

SA25C1024 Data Sheet

SAIFUN

2

Table of Contents

Features......................................................................... 1

General Description ...................................................... 1

Ordering Information .................................................... 5

Product Specifications ................................................. 6

Absolute Maximum Ratings..................................... 6

Latch Up Specifications........................................... 6

ESD Specifications.................................................. 6

Operating Conditions............................................... 6

DC Characteristics ........................................................ 7

AC Test Conditions ....................................................... 8

Serial Interface Description.......................................... 9

Master..................................................................... 9

Slave....................................................................... 9

Transmitter/Receiver ............................................... 9

Serial Opcode ......................................................... 9

Invalid Opcode ........................................................ 9

Chip Select (CSb).................................................... 9

HOLDb.................................................................... 9

Write Protect ........................................................... 9

Functional Description ............................................... 10

Write Enable (WREN) ........................................... 10

Write Disable (WRDI)............................................ 10

Read Status Register (RDSR)............................... 11

Write Status Register (WRSR).............................. 11

Read Sequence (READ) ....................................... 11

Write Sequence (WRITE)...................................... 12

Timing Diagrams......................................................... 13

Physical Dimensions .................................................. 16

Life Support Policy...................................................... 19

List of Figures

Figure 1. SOIC 8 – Narrow/PDIP Package (Top View) .... 4

Figure 2: SA25C1024 Ordering Information..................... 5

Figure 3. AC Measurements I/O Waveform..................... 8

Figure 4. SPI Serial Interface ........................................ 10

Figure 5. SPI Mode 0 (0,0) Timing................................. 13

Figure 6. SPI Mode 0 (0,0) and 3 (1,1) Timing............... 13

Figure 7. HOLDb Timing ............................................... 14

Figure 8. Read Timing................................................... 14

Figure 9. Write Timing................................................... 14

Figure 10. Write Status Register Timing........................ 15

Figure 11. Read Status Register Timing........................ 15

Figure 12. 8-pin SOIC Package..................................... 16

Figure 13. 8-pin Molded Small Outline Package (MN),

0.150” Wide Body, JEDEC SOIC......................... 17

Figure 14. Molded Dual-in-line Package (N) Package

Number N08E...................................................... 18

List of Tables

Table 1. Pin Names......................................................... 4

Table 2. DC Characteristics............................................. 7

Table 3. AC Measurements............................................. 8

Table 4. AC Characteristics............................................. 8

Table 5. Instruction Set ................................................. 10

Table 6. Status Register Format.................................... 10

Table 7. Block Write Protect Bits................................... 11

Table 8. WPBEN Operation .......................................... 11

Table 9. Read Status Register Definition....................... 12

SA25C1024 Data Sheet

SAIFUN

General Description

(continued)

Programming the status register with top
¼, top ½ or entire array write protection
enables BLOCK WRITE protection.
Separate program enable and program
disable instructions are provided for
additional data protection. Hardware data
protection is provided via the WPb pin to
protect against inadvertent write attempts
to the status register. The HOLDb pin may
be used to suspend any serial
communication without resetting the serial
sequence.

3

SA25C1024 Data Sheet

SAIFUN

Connection Diagrams

4

CSb

SO

1

2

8

7

V

CC

HOLD

SA25C1024

WPb

GND

Figure 1. SOIC 8 – Narrow/PDIP Package (Top View)

Pin Name Function

CSb Chip Select

SCK Serial Data Clock

SO Serial Data Output

GND Ground

VCC Power Supply

WPb Write Protect

HOLDb Suspend Serial Input

3

4

Table 1. Pin Names

SI Serial Data Input

6

5

SCK

SI

SA25C1024 Data Sheet

SAIFUN

Ordering Information

5

XYYELXXC25SA Letter

Blank
X

Package

Temp. Range

Voltage Operating Range

Density

Interface

Figure 2: SA25C1024 Ordering Information

N
MN

Blank
E

L
H

1024

C

25

SA

Description

Tube
Tape and Reel

8-pin DIP
8-pin SOIC (SO8, 150 mil width)

o

0 to 70

C

-40 to +85

2.7 V to 3.6 V

4.5 V to 5.5 V

1024 Kb with Write Protect

CMOS Technology

SPI-2 Wires

Saifun Non-Volatile
Memory

o

C

SA25C1024 Data Sheet

SAIFUN

Product Specifications

Absolute Maximum Ratings

6

Ambient Storage Temperature

All input or output voltages with
respect to Ground

Lead Temperature
(Soldering, 10 seconds)

-65 °C to +150 °C

4.5 V to -0.3 V (L)

6.5 V to -0.3 V (H)

+235 °C

Latch Up Specifications

Latch Up

100 mA on all pins, +125°C

ESD Specifications

Human Body Model Per MIL-STD 883 Method 3015.7

Voltage Levels

Machine Model Per JEDEC standard JESD22-A115

Voltage levels

500 V to 5 KV, in increments of 500 V;
proceed to 8000 V or until failure

50 V to 300 V, in increments of 50 V;
proceed to 500 V or until failure

Operating Conditions

Ambient Operating Temperature:

SA25C1024
SA25C1024E

Positive Power Supply:

SA25C1024L
SA25C1024H

0 °C to +70 °C

-40 °C to +85 °C

2.7 V to 3.6 V

4.5 V to 5.5 V