SA SA WMS356 Service Manual
SA-WMS356/WMS556
SERVICE MANUAL
Ver 1.0 2004.05
• SA-WMS356/WMS556 are the subwoofer
section in SA-VE356T/VE556H.
SPECIFICATIONS
Speaker system Active subwoofer,
magnetically shielded
Speaker unit Woofer: 15 cm × 2, cone type
Enclosure type Acoustically loaded
Bass Reflex
Reproduction frequency range
28 Hz - 200 Hz
Amplifier section
Continuous RMS power output
SA-WMS356:
120 W (6 ohms, 100 Hz,
10 % THD)
SA-WMS556:
150 W (6 ohms, 100 Hz,
10 % THD)
AEP Model
UK Model
9-877-843-01
2004E0478-1
© 2004.05
Inputs
INPUT (input pin jack)
General
Power requirements
230 - 240 V AC, 50/60 Hz
Power consumptions
120 W
1 W (standby mode)
Dimensions (w/h/d)
Approx. 180 × 405 × 501 mm,
including front grille
Mass Approx. 12 kg
Design and specifications are subject to change
without notice.
SUBWOOFER
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
SA-WMS356/WMS556
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. DIAGRAMS
1-1. Printed Wiring Board – MAIN Section –........................ 5
1-2. Schematic Diagram – MAIN Section –........................... 6
1-3. Printed Wiring Board – CONTROL Section – ................ 7
1-4. Schematic Diagram – CONTROL Section – ................... 8
2. EXPLODED VIEWS
2-1. Front Panel Section ......................................................... 9
2-2. Rear Cover Section.......................................................... 10
2-3. Bottom Panel Section ...................................................... 11
3. ELECTRICAL PARTS LIST .................................. 12
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHO WN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
2
SA-WMS356/WMS556
SECTION 1
DIAGRAMS
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Schematic Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except f or electrolytics and
tantalums.
• All resistors are in Ω and 1/
specified.
• f : internal component.
• C : panel designation.
Note: The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
•Voltages and wavef orms are dc with respect to ground under no-signal (detuned) conditions.
no mark: Power on
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage v ariations ma y be noted due to normal production
tolerances.
• Signal path.
F : AUDIO
4
W or less unless otherwise
For Printed Wiring Boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
• Circuit Boards Location
POWER SWITCH board
CONTROL board
MAIN board
LED board
POWER AMP board
POWER SUPPLY board
3
SA-WMS356/WMS556
• IC Block Diagram
– POWER AMP Board –
IC701 STK404-140S
1 2 3 4 5 6 7 8 9 10 11 12 13
4
SA-WMS356/WMS556
1-1. PRINTED WIRING BOARD — MAIN SECTION —
1
234567891011 12 13 14
A
B
T202
CN904
C902
RY901
D901
C
D
E
• Semiconductor
Location
F
G
H
Ref. No.
D202 I-3
D301 H-8
D302 H-8
D303 H-8
D304 I-8
D305 H-9
D306 H-9
D400 F-12
D401 E-8
D531 H-12
D532 G-13
D533 I-12
D701 B-9
D702 B-9
D703 B-8
D805 F-8
D901 E-4
IC530 H-13
IC701 C-10
Q101 H-11
Q102 H-11
I
Q103 H-11
Q104 I-12
Q105 H-11
Q301 H-9
Q302 H-9
Q401 F-11
Q402 E-11
Q403 F-12
Q404 E-12
Q531 G-13
Q532 I-12
Q533 H-13
Q534 I-12
Q535 I-11
Q701 C-8
Q702 C-12
Location
BC202
C201
S201
• See page 3 for Circuit Boards Location. :Uses unleaded solder.
T102
BC903
051
JW
052
JW
C901
BC902
CN1
BC901
F11
053
JW
F901
F12
D202
811
JW
BC201
R711
Q701
G1
C805
BC801
C806
JW301
JW302
BC802
C301
R710
C705
C302
D301
D302
D303
D304
C304
R401
C803
C804
C305
D703
R709
D401
D805
C306
R303
R707
JW807
C303
55
C716
C710
JW802
708
C706
JW
R714
Q302
Q301
JW808
D701
D702
R708
801
JW
805
JW
JW804
D306
R304
809
JW
R713
R705
C704
C702
R800
810
C308
JW
R541
R704
D305
JW704
C801
BC803
C712
C307
705
JW
CN702
R712
C707
JW703
C802
(Page 7)
C709
702
JW
R706
IC701
JW827
R402
R403
828
JW
JW812
829
JW
R540
R542
707
JW
R702
C401
Q401
Q101
817
JW
C703
R404
R104
Q103
JW816
R101
Q535
CN701
C701
R400
CN804
R106
R102
Q402
R405
C402
JW813
JW837
Q105
Q102
834
JW
709
JW
C708
(Page 7)
C102
R103
C715
JW830
C101
R105
Q534
Q404
Q403
818
JW
Q104
701
JW
JW833
C711
C714
C403
819
JW
711
JW
JW832
JW814
C531
JW820
D533
Q702
D400
JW821
Q532
R531
R532
R703
C713
BC401
R406
Q531
D531
JW822
JW823
R535
R534
R701
RY400
JW825
R536
R715
CN805
R716
JW835
C532
IC530
824
JW
R717
G2
JW826
Q533
D532
R538
R539
R533
R537
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