For details on how to calculate the malfunction rate stemming from operation, see the tantalum solid state electrolytic
capacitors column in MIL-HDBK-217.
Malfunction rate as function of operating Malfunction rate as function of circuit resistance (Ω/V)
temperature and rated voltage
1.0
0.5
0.3
0.2
0.1
0.06
0.03
0.02
FAILURE RATE COEFFICIENT
0.01
Applied Voltage
Ratio =
Rated Voltage
20406085
OPERATING TEMPERATURE
1.0
0.7
0.5
0.3
0.1
(°C)
Fig.6
85°C
Rated Voltage
(V.DC)(V.DC)(V.DC)(V.DC)
4
6.3
10
16
20
Surge Voltage
Category VoltageSurge Voltage
5.2
8
13
20
26
6.0
4.0
(π)
2.0
1.0
0.8
0.6
RESISTANCE COEFFICIENT
0.4
0.10.20.60.43.01.02.0
RESISTANCE OF CIRCUIT
Fig.7
2.5
6.3
10
13
125°C
3.4
4
5
9
12
16
(Ω / V)
11/15
TCFG series
Tantalum capacitors
(5) External temperature vs. fuse blowout (6) Power vs. fuse blowout characteristics / Product sur face temperature
360
350
340
330
320
310
300
290
280
EXTERNAL TEMPERATURE (°C)
270
260
110100
TIME
No failed
(sec)
Fig.8
P case (2012)
A case (3216)
B case (3528)
Failed
Half failed
Note: Solder the chip at 300°C or less. If it is soldered using
a temperature higher than 300°C, open function built-in may operate.
(7) Maximum power dissipation
Warming of the capacitor due to ripple voltage balances with warming caused by Joule heating and by radiated heat.
Maximum allowable warming of the capacitor is to 5°C above ambient temperature. When warming exceeds 5°C, it can
damage the dielectric and cause a short circuit.
Power dissipation (P) = I
2
$ R
Ripple current
P : As shown in table at right
R : Equivalent series resistance
Notes:
1. Please be aware that when case size is changed, maximum allowable power dissipation is reduced.
2. Maximum power dissipation varies depending on the package. Be sure to use a case which will keep warming within
the limits shown in the table below.
Allowable power dissipation (W) and maximum temperature rising
100
90
80
70
(sec)
60
50
40
30
OPERATING TIME
20
10
0
024
No operating area
P case (2012)
A case (3216)
B case (3528)
Open-function charcteristic
Surface temp.
curve of the products
Operating area
681097531
ELECTRIC POWER
Fig.9
300
250
200
150
SURFACE TEMP. OF THE PRODUCT (°C)
(W)
Case
Ambient
temp.
+25°C+55°C+85°C+125°C
0.025P case (2012)0.0220.0200.010
0.070A case (3216)0.0630.0560.028
0.080B case (3528)0.0720.0640.032
5Max. temp. rise552
12/15
TCFG series
Tantalum capacitors
(8) Impedance frequency characteristics (9) ESR frequency characteristics
100000
10000
1000
(Ω)
100
10
IMPEDANCE
1
110010k1M500M100M
FREQUENCY
Fig.10
(10) Temperature characteristics
10
6
(%)
2
0
−2
CAP CHANGE
−6
CAP 120Hz
10V−1µF P case (2012)
4V−4.7µF A case (3216)
4V−33µF B case (3528)
A105
P case (2012)
G475
A case (3216)
C105
A case (3216)
C335
B case (3528)
(Hz)
100
10
(Ω)
ESR
1
0.1
110010k1M500M100M
FREQUENCY
A105
P case (2012)
G475
A case (3216)
C105
A case (3216)
C335
B case (3528)
(Hz)
Fig.11
DF 120Hz
10V−1µF P case (2012)
4V−4.7µF A case (3216)
4V−33µF B case (3528)
DF (%)
5
4
3
2
1
−10
−5525
TEMPERATURE
Fig.12
85125
(°C)
0
−5525
TEMPERATURE (°C)
Fig.13
85125
1000
100
(nA)
LC
10
0
−5525
LC 1WV
10V−1µF P case (2012)
4V−4.7µF A case (3216)
4V−33µF B case (3528)
TEMPERATURE
Fig.14
85125
(°C)
13/15
TCFG series
Tantalum capacitors
Inrush current
Beware of inrush current.
Inrush currents are inversely proportional to ESR. Large inrush currents can cause component failure.
100
10
1
INRUSH CURRENT (A)
0.1
0.1110100
33µF
33µF
15µF
4.7µF
Vpp = 10V limit = 20A
Pulse Width = 500µsec.
Power OP Amp Slew Rate = 10V / 6µs
Tantalum capacitor
Aluminum electrolyte
100µF
4.7µF
47µF
22µF
ESRΩ (100kHz)
Fig.16 Maximum inrush current and ESR
Inrush current can be limited by means of a protective resistor.
(11) Ultrasonic cleaning
Carry out cleaning under the mildest conditions possible. The internal element of a tantalum capacitor are larger than
those of a transistor or diode, so it is not as resistant to ultrasonic waves.
Example : water
Propagation speed 1500m / s
Solvent density 1g / cm
Frequency and wavelength
Frequency Wavelength
20kHz7.5cm
28kHz5.3cm
50kHz3.0cm
3
Precautions
14/15
TCFG series
Tantalum capacitors
1) Do not allow solvent to come to a boil (kinetic energy increases).
$ Ultrasonic output 0.5W / cm
$ Use a solvent with a high boiling point.
$ Lower solvent temperature.
2) Ultrasonic cleaning frequency
28 kHz or less
3) Keep cleaning time as short as possible.
4) Move item being cleaned.
Standing waves caused by the ultrasonic waves can cause stress to build up in part of the item being cleaned.
Reference
Kinetic energy = 2 x π x frequency x
2
or less
2 x ultrasonic output
propagation speed x solvent density
15/15
Appendix
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document use silicon as a basic material.
Products listed in this document are no antiradiation design.
Notes
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.0
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