ROHM R6018ANX Technical data

Datasheet
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1/13
Nch 600V 18A Power MOSFET
Switching Power Supply
a
Features
Application
Outline
Inner circuit
Packaging specifications
V
R
(Max.)
I
DS(on)
P
DSS
D
D
600V
0.27 18A
50W
1) Low on-resistance.
2) Fast switching speed.
3) Gate-source voltage (V
) guaranteed to be ±30V.
GSS
4) Drive circuits can be simple.
5) Parallel use is easy.
6) Pb-free lead plating ; RoHS compliant
TO-220FM
Type
(1) (2) (3)
(1) Gate (2) Drain (3) Source
*1 Body Diode
Packing
Bulk Reel size (mm) Tape width (mm) ­Basic ordering unit (pcs)
500
-
Taping code Marking
Absolute maximum ratings (T
Parameter
Drain - Source voltage
Continuous drain current
Pulsed drain current Gate - Source voltage Avalanche energy, single pulse Avalanche energy, repetitive Avalanche current 9 Power dissipation (Tc = 25°C) Junction temperature
= 25°C)
T
= 25°C
c
Tc = 100°C
Symbol
V
DSS
*1
I
D
*1
I
D
I
D,pulse
V
GSS
*3
E
AS
*4
E
AR
*3
I
AR
P
D
T
j
Value
600
±18
±8.6
*2
±72 ±30
21.6
3.5
50
150
-
R6018ANX
Unit
V A A A
V mJ mJ
A
W
°C Range of storage tem per ature Reverse diode dv/dt
T
stg
*5
dv/dt
55 to +150 15
°C
V/ns
2012.01 - Rev.B
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Data Sheet
R6018ANX
2/13
Absolute maximum ratings
Parameter
Symbol Conditions Values
Drain - Source voltage slope dv/dt
Thermal resistance
Parameter
Symbol
Thermal resistance, junction - cas e Thermal resistance, junction - am bient Soldering temperature, wavesoldering for 10s
Electrical characteristi cs (Ta = 25°C)
R R
T
V T
thJC
thJA
sold
= 480V, ID = 18A
DS
= 125°C
j
Min.
-
-
-
Values
Typ.
- 70
-
50
Max.
2.5-
265
Unit
V/ns
Unit
°C/W °C/W
°C
Parameter
Drain - Source breakdown voltage
Drain - Source avalanche breakdown voltage
Zero gate voltage drain current
Gate - Source leakage curr ent Gate threshold voltage
Static drain - source on - state resistance
V
(BR)DSS
V
(BR)DS
I
DSS
I
GSS
V
GS (th)
R
DS(on)
*6
ConditionsSymbol
V
= 0V, ID = 1mA
GS
V
= 0V, ID = 18A
GS
V
= 600V, V
DS
T
= 25°C
j
= 125°C
T
j
V
= ±30V, V
GS
V
= 10V, ID = 1mA
DS
V
= 10V, ID = 9A
GS
= 25°C
T
j
= 125°C
T
j
GS
DS
= 0V
= 0V
Values
Min.
600
-
-
-
-
2.5
Typ.
-
700
0.1
-
-
-
- 0.21 0.27
- 0.42 -
Max.
-
-
100 1000 ±100
4.5
Unit
V
V
µA
nA
V
Gate input resistance
R
f = 1MHz, open drain - 8.4 -
G
2012.01 - Rev.B
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Data Sheet
R6018ANX
3/13
*1 Limited only by maximum temperature allowed.
*2 PW ≤ 10µs, Duty cycle ≤ 1%
DD
Electrical characteristi cs (Ta = 25°C)
Parameter Symbol Conditions
Values
Unit
Min. Typ.
*6
V
g
fs
= 10V, ID = 9.0A,
DS
6.5
13Transconductance
Max.
- S Input capacitance Output capacitance Reverse transfer capacitance
Effective output capacitance, energy related
Effective output capacitance, time related
Turn - on delay time Rise time Turn - off delay time Fall time
C C C
C
C
t
d(on)
t
t
d(off)
t
iss
oss
rss
o(er)
o(tr)
*6
r
*6
f
Gate Charge characteristics (Ta = 25°C)
V V
GS
DS
= 0V = 25V
- 2050 -
-
1400
f = 1MHz - 60 -
- 80 -
V
= 0V
GS
= 0V to 480V
V
DS
- 85
*6
V
*6
300V, V
DD
ID = 9A
= 33.3
R
L
R
= 10
G
GS
= 10V
-
-
-
155 310
-
-
-
-37
85
-
65 130
pF
pF
ns
Parameter
Total gate charge Gate - Source charge Gate - Drain charge
*3 L 500µH, V *4 L 500µH, V
= 50V, RG = 25Ω, starting Tj = 25°C = 50V, RG = 25Ω, starting Tj = 25°C, f = 10kHz
DD
Symbol
*6
Q
g
*6
Q
gs
*6
Q
gd
V
(plateau)VDD
*5 Reference measurement circuit s Fig .5-1. *6 Pulsed
Conditions
V
300V
DD
ID = 18A
= 10V
V
GS
300V, ID = 18A
Values
Min.
-
Typ.
55 -
- 10 -
-
- -
22 -
6.0
Unit
Max.
nC
VGate plateau voltage
2012.01 - Rev.B
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Data Sheet
R6018ANX
4/13
Body diode electrical characteristics (Source-Drain) (Ta = 25°C)
Parameter Symbol Conditions
Values
Min. Max.
Typ.
Unit
Inverse diode continuous, forward current
Inverse diode direct current, pulsed
Forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current
Peak rate of fall of reverse recovery current
IS
ISM
V
SD
t
rr
Q
I
rrm
di
rr
rr
*1
*2
*6
*6
*6
*6
/dt
Typical Transient Thermal Characteristics
Symbol Value Unit Unit
T
= 25°C
c
V
= 0V, IS = 18A
GS
= 18A
I
S
di/dt = 100A/µs
T
= 25°C
j
- -
-
-
-
-
-
484
- 6.8 -
- 28
-
730
Symbol Value
18
72
1.5 V
-
ns
µC
- A
-
A/µs
A
A
R
th1
R
th2
R
th3
0.106
0.636
2.13
K/W Ws/K
C
th1
C
th2
C
th3
0.00349
0.0478
0.516
2012.01 - Rev.B
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Data Sheet
R6018ANX
5/13
Electrical characteri st ic curves
Fig.1 Power Dissipation Derating Curve
120
100
max. [%]
80
D
/P
D
60
40
20
Power Dissipation : P
0
0 50 100 150 200
Junction Temperature : Tj [°C]
Fig.2 Maximum Safe Operating Area
100
Operation in this area is limited by R
10
[A]
D
1
0.1
Drain Current : I
Ta = 25ºC Single Pulse
0.01
0.1 1 10 100 1000
DS(ON)
PW = 100us
PW = 1ms
PW = 10ms
Drain - Source Voltage : VDS [V]
Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width
(t)
1000
100
0.01
0.001
0.0001
Normalized Transient T hermal Resistance : r
Ta = 25ºC Single Pulse
10
R R
th(ch-a)(t) th(ch-a)
=
(t)×Rth(ch-a)
= 70ºC/W
1
0.1 top D = 1
D = 0.5 D = 0.1 D = 0.05 D = 0.01 D = Single
0.0001 0.01 1 100
Pulse Width : PW [s]
2012.01 - Rev.B
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Data Sheet
R6018ANX
6/13
Electrical characteri st ic curves
Fig.4 Avalanche Current vs Inductive Load
12
Ta = 25ºC V
= 50V , RG = 25Ω
DD
10
[A]
AR
8
6
4
2
Avalanche Current : I
0
0.01 0.1 1 10 100
V
GF
= 10V , V
GR
= 0V
Coil Inductance : L [mH]
Fig.5 Avalanche Power Losses
5000 4500
[W]
4000
AR
3500 3000 2500 2000 1500 1000
500
Avalanche Power Losses : P
1.0E+04 1.0E+05 1.0E+06
Ta = 25ºC
0
Frequency : f [Hz]
Fig.6 Avalanche Energy Derating Curve vs Junction Temperature
120
100
max. [%]
80
AS
/ E
AS
60
40
20
0
Avalanche Energy : E
0 25 50 75 100 125 150 175
Junction Temperature : Tj [ºC]
2012.01 - Rev.B
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Data Sheet
R6018ANX
7/13
Electrical characteri st ic curves
5.0V
VGS= 4.5V
10V
5.5V
6.0V
5.5V
6.5V
7.0V
V
GS
= 4.5V
6.5V
10V
5.0V
6.0V
10V
6.0V
5.0V
Fig.7 Typical Output Characteristics(I)
18
15
12
[A]
D
9
6
Drain Current : I
3
0
6.0V Ta = 25ºC
Pulsed
0 10 20 30 40 50
Drain - Source Voltage : VDS [V]
Fig.8 Typical Output Characteristics(II)
18
Ta = 25ºC
15
12
[A]
D
9
6
Pulsed
Drain Current : I
3
0
0 1 2 3 4 5
Drain - Source Voltage : VDS [V]
10V
8.0V
5.0V
VGS= 4.5V
Fig.9 Tj = 150°C Typical Output Characteristics(I)
18
15
12
[A]
D
9
6
Drain Current : I
3
0
0 10 20 30 40 50
Drain - Source Voltage : VDS [V]
Ta = 150ºC Pulsed
5.5V
Fig.10 Tj = 150°C Typical Output Characteristics(II)
10
Ta = 150ºC Pulsed
8
[A]
D
6
4
Drain Current : I
2
0
0 1 2 3 4 5
Drain - Source Voltage : VDS [V]
VGS= 4.5V
2012.01 - Rev.B
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Data Sheet
R6018ANX
8/13
Electrical characteri st ic curves
Fig.14 Transconductance vs. Drain Current
Fig.11 Breakdown Voltage vs. Junction Temperature
900
[V]
850
(BR)DSS
800
750
700
650
600
550
500
-50 0 50 100 150
Drain - Source Breakdown Voltage : V
Junction Temperature : Tj [°C]
Fig.12 Typical Transfer Characteristics
100
V
= 10V
DS
Pulsed
10
Ta = 125ºC Ta = 75ºC
= 25ºC
[A]
D
0.1
0.01
Drain Current : I
0.001
1
T
a
= -25ºC
T
a
0 1 2 3 4 5 6 7
Gate - Source Voltage : VGS [V]
Fig.13 Gate Threshold Voltage vs. Junction Temperature
6
V
= 10V
DS
ID = 1mA
5
[V]
GS(th)
4
3
2
1
0
Gate Threshold Voltage : V
-50 0 50 100 150
Junction Temperature : Tj [°C]
100
V
= 10V
DS
Pulsed
10
[S]
fs
1
0.1
Ta = -25ºC Ta = 25ºC
= 75ºC
T
a
= 125ºC
T
a
Transconductance : g
0.01
0.01 0.1 1 10 100
Drain Current : ID [A]
2012.01 - Rev.B
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Data Sheet
R6018ANX
9/13
Electrical characteri st ic curves
0 5 10 15
Pulsed
0.1 1 10 100
Fig.15 Static Drain - Source On - State Resistance vs. Gate Source Voltage
0.6 Ta = 25ºC
0.5
0.4
[Ω]
0.3
DS(on)
: R
0.2
0.1
0
Static Drain - Source On-State Resistance
ID = 9A
Gate - Source Voltage : VGS [V]
ID = 18A
Fig.16 Static Drain - Source On - State Resistance vs. Junction Temperature
0.6 V
= 10V
GS
0.5
0.4
[Ω]
0.3
DS(on)
: R
0.2
0.1
Static Drain - Source On-State Resistance
Pulsed
ID = 18A
ID = 9A
0
-50 0 50 100 150
Junction Temperature : Tj [ºC]
Fig.17 Static Drain - Source On - State Resistance vs. Drain Current
10
VGS= 10V Pulsed
1
[Ω]
DS(on)
0.1
: R
0.01
Static Drain - Source On-State Resistance
Drain Current : ID [A]
Ta = 125ºC Ta = 75ºC
= 25ºC
T
a
= -25ºC
T
a
2012.01 - Rev.B
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Data Sheet
R6018ANX
10/13
Electrical characteri st ic curves
iss
C
oss
rss
t
r
f
d(on)
t
d(off)
Fig.18 Typical Capacitance vs. Drain - Source Voltage
10000
1000
C
100
10
Capacitance : C [pF]
Ta = 25ºC f = 1MHz
= 0V
V
GS
1
0.1 1 10 100 1000
Drain - Source Voltage : VDS [V]
Fig.19 Coss Stored Energy
14
Ta = 25ºC
12
C
[uJ]
Coss Stored Energy : E
10
OSS
8
6
4
2
0
0 200 400 600
Drain - Source Voltage : VDS [V]
Fig.20 Switching Characteristics
10000
Ta = 25ºC
t
1000
100
10
Switching Time : t [ns]
t
1
0.01 0.1 1 10 100
Drain Current : ID [A]
V V RG = 10Ω Pulsed
300V
DD
= 10V
GS
Fig.21 Dynamic Input Characteristics
15
Ta = 25ºC V
300V
DD
[V]
Gate - Source Voltage : V
GS
10
ID = 18A Pulsed
5
0
0 10 20 30 40 50 60 70
Total Gate Charge : Qg [nC]
2012.01 - Rev.B
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Data Sheet
R6018ANX
11/13
Electrical characteri st ic curves
0.1 1 10 100
Fig.22 Inverse Diode Forward Current vs. Source - Drain Voltage
100
V
= 0V
[A]
S
Inverse Diode Forward Current : I
10
0.1
0.01
GS
Pulsed
1
0 0.5 1 1.5
Ta = 125ºC Ta = 75ºC
= 25ºC
T
a
= -25ºC
T
a
Source - Drain Voltage : VSD [V]
Fig.23 Reverse Recovery Time vs.Inverse Diode Forward Current
1000
[ns]
rr
100
Ta = 25ºC di / dt = 100A / us
= 0V
V
GS
Reverse Recovery Time : t
10
Inverse Diode Forward Current : IS [A]
Pulsed
2012.01 - Rev.B
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Data Sheet
R6018ANX
12/13
Measurement circuits
Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform
Fig.4-1 dv/dt Measurement Circuit Fig.4-2 dv/dt Waveform
Fig.5-1 di/dt Measurement Circuit Fig.5-2 di/dt Waveform
2012.01 - Rev.B
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Data Sheet
R6018ANX
13/13
Dimensions (Unit : mm)
Dimension in mm/inches
D
b1
E1
E
e
b
c
F
A2A1
AL
x A
A4
φp
Q
A
MIN MAX MIN MAX
A 16.60 17.60 0.654 0.693 A1 1.80 2.20 0.071 0.087 A2 14.80 15.40 0.583 0.606 A4 6.80 7.20 0.268 0.283
b 0.70 0.85 0.028 0.033
b1 1.10 1.50 0.043 0.059
c 0.70 0.85 0.028 0.033
D 9.90 10.30 0.39 0.406
E 4.40 4.80 0.173 0.189
e E1 2.70 3.00 0.106 0.118
F 2.80 3.20 0.11 0.126
L 11.50 12.50 0.453 0.492
p 3.00 3.40 0.118 0.134
Q 2.10 3.10 0.083 0.122
x - 0.381 - 0.015
2.54
0.10
DIM
MILIMETERS
INCHES
TO-220FM
2012.01 - Rev.B
Notes
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Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
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The Products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu­nication devices, electronic appliances and amusement devices).
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Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injur y, re or any other damage caused in the event of the failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
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