Datasheet R6012ANJ Datasheet (ROHM)

C
10V Drive Nch MOSFET
R6012ANJ
zStructure zDimensions (Unit : mm) Silicon N-channel MOSFET
zFeatures
1) Low on-resistance.
2) Fast switching speed.
3) Gate-source voltage (V
GSS) guaranteed to be ±30V.
4) Drive circuits can be simple.
5) Parallel use is easy.
zApplications
Switching
zPackaging specifications
LPTS LPTL
Taping
1000
TL
TLL
Package
Type
Code
Basic ordering unit (pieces)
zAbsolute maximum ratings (Ta=25°C) zInner circuit
Parameter Drain-source voltage Gate-source voltage
Drain current
Source current (Body Diode)
Continuous Pulsed Continuous
Pulsed Avalanche Current Avalanche Energy Total power dissipation (Tc=25°C) Channel temperature Range of storage temperature
1 Pw10µs, Duty cycle1%2 L 500µH, V3 Limited only by maximum temperature allowed
DD
=50V, RG=25, Starting, Tch=25°C
Symbol
V
DSS
V
GSS
I
D
I
DP
I
S
I
SP
AS
I
AS
E
P
D
Tch
Tstg °C
3131
2
2
55 to +150
Limits
600
±30 ±12 ±48
12 48
6
9.6 100 150
Unit
V V A A A A A
mJ
W
°C
zThermal resistance
Parameter
hannel to case 1.25
Symbol Limits Unit
Rth(ch-c)
°C/W
LPTS
7.25
13.1
1.0
3.0
(1) Gate (2) Drain (3) Source
LPTL
(1) Gate (2) Drain (3) Source
(1) (2) (3)
(1) Gate (2) Drain (3) Source
10.1
1.24
2.54
5.08
(1) (2) (3)
8.9
4.8
(1) (2) (3)
0.78
Each lead has same dimensions
Each lead has same dimensions
1
1 Body Diode
4.5
1.3
9.0
0.4
1.2
2.7
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1/5
2009.04 - Rev.A
R6012ANJ
zElectrical characteristics (Ta=25°C)
Parameter Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance
Symbol
I
V
(BR)DSS
I
V
R
| Y Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time
C
C
t Rise time Turn-off delay time
t Fall time Total gate charge Gate-source charge Gate-drain charge
Pulsed
Q
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter Symbol
Pulsed
V
SD
Min.
GSS
600
DSS
GS(th)
DS(on)
C
oss
rss
d(on)
t
d(off)
t
Q
Q
2.5
fs
|
3.5
iss
r
f
g
gs
gd
Min. Typ. Max.
−−1.5 V IS=12A, VGS=0VForward voltage
Max. Unit Conditions
Typ.
GS
0.32
1300
890
45 30 30 90 35 35
7
15
±100
100
0.42
4.5
nA V
V
µA
V
S
pF
pF
pF
ns
VGS=10Vns
RL=50ns
RG=10ns
nC
V
nC
nC
Unit
30V, VDS=0V
D
=1mA, VGS=0V
I
DS
=600V, VGS=0V
V V
DS
=10V, ID=1mA
I
D
=6A, VGS=10V
D
=6A, VDS=10V
I V
DS
=25V
GS
=0V
V f=1MHz
D
=6A, VDD 300V
I
DD
D
=12A
I
GS
=10V
V
L
=25 / RG=10
R
Conditions
300V
Data Sheet
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2009 ROHM Co., Ltd. All rights reserved.
2/5
2009.04 - Rev.A
R6012ANJ
zElectrical characteristics curves
Data Sheet
100
10
(A)
D
1
Operati on in this area i s l imited
0.1
by R
DRAIN CURRENT : I
0.01
100
10
(A)
D
0.1
DRAIN CURRENT : I
0.01
DS(ON)
Tc = 25°C Sing le Puls e
0.1 1 10 100 1000
DR AIN-SOUR CE VOLTAGE : V
Fi g.1 M aximum Saf e Oper ating Aera
VDS= 10V Pulsed
Ta= 125°C
Ta= 75°C
Ta= 25°C
1
Ta= -25°C
01 2345 67
GATE-SOURCE VOLTAGE : VGS (V)
Fi g.4 T ypi cal Tr ansfer Char acter isti cs
PW=100us
PW=1ms
DC operati on
DS
( V )
40
10V
9.0V
30
(A)
D
20
10
DRAIN CURRENT: I
0
0 1020304050
DRAIN-SOURCE VOLTAGE: VDS (V)
Fi g.2: T ypical Output Char acteri stics (Ⅰ)
6
VDS= 10V I
= 1mA
D
(V)
5
GS(th)
4
3
2
1
GATE TH RESHOLD VOLTAGE: V
0
-50 0 50 100 150
CHANNEL TEMPERATURE: Tch (°C)
Fig.5 Gate Threshold Voltage vs. Channel Temperatur e
6.5V
7.0V
5.0V
8.0V
VGS= 4. 5V6.0V
Ta= 25°C Pulsed
20
Ta= 25°C Pulsed
15
(A)
D
10
DRAIN CURRENT: I
10
(Ω)
DS(on)
0.1
RESISTANCE : R
STATIC DR AIN-SOURCE ON- STATE
0.01
7.0V
6.5V
6.0V
5
0
012 345
DRAIN-SOURCE VOLTAGE: VDS (V)
Fi g.3: Typical Output C haracter ist ics (Ⅱ)
VGS= 10V Pulsed
1
0.001 0.01 0. 1 1 10 100
DRAIN CURRENT : ID (A)
Fi g.6 St ati c D rain- Sourc e On-State Resi stance vs. Dr ain C urr ent
8.0V
10V
5.0V
VGS= 4.5V
Ta= 125°C Ta= 75°C Ta= 25°C Ta= -25°C
5.5V
0.8 Ta= 25°C
Pulsed
0.6
(Ω)
DS(on)
0.4
0.2
RESISTANCE : R
STATIC DR AIN-SOURCE ON- STATE
0
0 5 10 15
GATE- SOURCE VOLT AGE : VGS (V)
Fi g.7 Sta ti c D rain- Sourc e On-State Resi stance vs. Gate Source Voltage
ID=6A
ID=12A
0.8 VGS= 10V
Puls ed
0.6
) (Ω)
DS(on
0.4
0.2
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
0
-50 0 50 100 150
Fi g.8 Stati c Dr ain-Sour ce On-Stat e Resi stance vs. Channel Temperature
ID= 12A
ID= 6A
CHANNEL TEMPERATURE: Tch (°C)
100
VDS= 10V Puls ed
10
1
|Yfs| (S)
0.1
0.01
FOR WARD TRAN SFER ADMIT TANC E :
0.001
0.001 0.01 0.1 1 10 100
DRAIN CURRENT : ID (A)
Fi g.9 For ward T ransfer Admitt ance vs. Drai n Cur rent
Ta= -25°C Ta= 25°C Ta= 75°C Ta= 125°C
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3/5
2009.04 - Rev.A
R6012ANJ
100
VGS= 0V Pulsed
(A)
DR
10
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= -25°C
1
0.1
REVERSE DRAIN CURRENT : I
0.01
00.511.5
SOUR CE-D RAIN VOLT AGE : VSD (V)
Fi g.10 Revers e Drai n Curr ent vs.
Sourse-Drain Voltage
10000
1000
100
10
CAPACITANCE : C (pF)
Ta= 25°C f= 1MH z V
= 0V
GS
1
0.1 1 10 100 1000
DRAIN-SOURCE VOLTAGE : VDS (V)
Fi g.11 Typic al Capaci tance vs.
Drain- Source Voltage
C
oss
C
rss
(V)
GS
C
iss
GATE- SOURC E VOLTAGE : V
Data Sheet
15
Ta= 25°C V
= 300V
DD
I
= 12A
D
R
= 10
G
Pulsed
10
5
0
0 1020304050
TOTAL GATE CHARGE : Q
Fi g.12 Dynamic Input Character isti cs
(nC)
g
1000
(ns)
rr
100
Ta= 25°C di / dt= 100A / µs V
= 0V
REVERSE RECOVERY TIME: t
10
0.1 1 10 100
REVERSE DRAIN CURRENT : IDR (A)
Fi g.13 R everse R ecovery Time
vs.Reverse Drai n Curr ent
10
Ta = 25°C Sing le Pulse : 1Unit
Rth(ch-a)(t) = r(t)×Rth(ch-a
1
Rth(ch-a) = 53.0 °C/W
0.1
0.01
RESIST ANCE : r (t)
0.001
NOR MARIZ ED TR ANSIENT T HERM AL
0.0001
0.0001 0.001 0.01 0.1 1 10 100 1000
Fi g.15 N ormali zed Tr ansient Thermal Resi stance vs. Pulse Wi dth
GS
Pulsed
PULSE WID TH : Pw(s )
10000
1000
t
d( off)
100
10
SWITC HING TIME : t ( ns)
1
0.01 0.1 1 10 100
Fig.14 Switching Char acter is tics
t
f
t
t
r
DRAIN CURRENT : ID (A)
d(on)
Ta= 25°C V
= 300V
DD
= 10V
V
GS
R
= 10
G
Pulsed
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4/5
2009.04 - Rev.A
R6012ANJ
zMeasurement circuits
Fig.1 Switching time measurement circuit Fig.2 Switching waveforms
IG(Const.)
Fig.3 Gate charge measurement circuit Fig.4 Gate charge waveform
Fig.5 Avalanche measurement circuit Fig.6 Avalanche waveform
Data Sheet
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2009 ROHM Co., Ltd. All rights reserved.
5/5
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