●Description
The Universal Standard family LM393 / LM339 / LM2903 / LM2901 monolithic ICs integrate two / four independent
comparators on a single chip and feature high gain, low power consumption, and an o perating voltage range from 2[V] to
36[V] (single power supply).
NOW
SERIES
LM393 family
LM393MX
Dual
LM2903 familyLM2901 family
LM2903MX
LM339 family
LM339MX
Quad
LM2901MX
●Features
1) Operating temperature range Commercial Grade
LM339/393 family: 0[℃] to +70[℃]
Extended Industrial Grade
LM2903/2901 family: -40[℃] to +85[℃]
2) Open collector output
3) Single / dual power supply compatible
4) Low supply current
0.8[mA] typ.(LM2901/339 family)
0.4[mA] typ.(LM2903/393 family)
5) Low input-bias current: 25[nA] typ.
16) Low input-offset current: 5[nA] typ.
7) Input common-mode voltage range, including ground
8) Differential input voltage range equal to maximum rated supply voltage
Supply Current ―OFF OFF OFF OFF OFF OFF OFF
Output Sink Current VOL=1.5[V] OFF ON ON OFF ON ON OFF
Saturation Voltage IOL=4[mA] OFF ON ON OFF OFF OFF ON
Output Leakage Current VOH=36[V] OFF ON ON OFF OFF OFF ON
●Description of electrical characterist ics
Described below are descriptions of the relevant electrical terms.
Please note that item names, symbols, and their meanings may differ from those on another manufacturer’s documents.
1. Absolute maximum ratings
The absolute maximum ratings are values that should never be exceeded, since d oing so may result in deterioration of
electrical characteristics or damage to the part itself as well as peripheral components.
1.1 Power supply voltage (V
Expresses the maximum voltage that can be supplied between the positive and negative power supply terminals without
causing deterioration of the electrical characteristics or destruction of the internal circuitry.
1.2 Differential input voltage (VID)
Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without damaging
the IC.
1.3 Input common-mode voltage range (VICR)
Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing deterioration
of the electrical characteristics or damage to the IC itself. Normal operation is not guaranteed within the input
common-mode voltage range of the maximum ratings – use within the input common-mode voltage range of the electric
characteristics instead.
1.4 Operating temperature range and storage temperature range (Topr,Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range of
temperatures the IC can be stored under without causing excessive deterioration of the e lectrical ch aracteristics.
1.5 Power dissipation (Pd)
Indicates the power that can be consumed by a particular mounted board at ambient temperature (25°C). For packaged
products, Pd is determined by maximum junction temperature and the thermal resistance.
2. Electrical characteristics
2.1 Input offset voltage (VIO)
Signifies the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input
voltage difference required for setting the output voltage to 0V.
2.2 Input offset current (IIO)
Indicates the difference of the input bias current between the non-inverting and inverting terminals.
2.3 Input bias current (IIB)
Denotes the current that flows into or out of the input terminal, it is defined by the average of the input bias current at the
non-inverting terminal and the input bias current at the inverting terminal.
2.4 Input common-mode voltage range (VICR)
Indicates the input voltage range under which the IC operates normally.
2.5 Large signal voltage gain (AVD)
The amplifying rate (gain) of the output voltage against the voltage difference between the non-inverting an d inverting
terminals, it is (normally) the amplifying rate (gain) with respect to DC voltage.
AVD = (output voltage fluctuation) / (input offset fluctuation)
2.6 Circuit current (ICC)
Indicates the current of the IC itself that flows under specific conditions and during no-load steady state.
2.7 Output sink current (IOL)
Denotes the maximum current that can be output under specific output conditions.
2.8 Output saturation voltage low level output voltage (VOL)
Signifies the voltage range that can be output under specific output conditions.
2.9 Output leakage current (ILeak)
Indicates the current that flows into the IC under specific input and output conditions.
2.10 Response time (tre)
The interval between the application of input and output conditions.
2.11 Common-mode rejection ratio (CMRR)
Denotes the ratio of fluctuation of the input offset voltage when the in-phase input voltage is changed (DC fluctuation).
CMRR = (change of input common-mode voltage) / (input offset fluctuation)
2.12 Power supply rejection ratio (PSRR)
Signifies the ratio of fluctuation of the input offset voltage when the supply voltage is changed (DC fluctuation).
PSRR = (change in power supply voltage) / (input offset fluctuation)
When there are unused circuits it is recommended that they be connected as in Fig. 103,
setting the non-inverting input terminal to a potential within the in-phase input voltage
range (VICR).
2) Input terminal voltage
Applying GND + 36V to the input terminal is possible without causing deterioration of
the electrical characteristics or destruction, irrespective of the supply voltage. However,
this does not ensure normal circuit operation. Please note that the circuit operates
normally only when the input voltage is within the common mode input voltage range of
the electric characteristics.
3) Power supply (single / dual)
The op-amp operates when the specified voltage supplied is between V
op-amp can be used as a dual supply op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise
in chip temperature, including reduced current capability. Therefore, please take into consideration the power
dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal
derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the pres ence of foreign particles between the outputs, the output
and the power supply, or the output and GND may result in IC destruction.
6) Terminal short-circuits
When the output and V+ terminals are shorted, excessive output current may flow, resulting in undue heat generation
and, subsequently, destruction.
7) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
8) Radiation
This IC is not designed to withstand radiation.
9) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezoelectric (piezo) effects.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection p hase, ensure that
the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the
assembly process as well as during transportation and storage.
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