ROHM EMF6 Technical data

查询EMF6供应商
Transistors
Power management (dual transistors)
EMF6
2SA2018 and 2SK3019 are housed independently in a EMT6 package.
EMF6
!!!!Application
Power management circuit
!!!!Features
1) Power switching circuit in a single package.
2) Mounting cost and area can be cut in half.
!!!!Structure
Silicon epitaxial planar transistor
!!!!Equivalent circuits
(1)(2)(3)
Tr2
(4) (5) (6)
Tr1
!!!!External dimensions (Units : mm)
(3)
ROHM : EMT6
Abbreviated symbolF6
0.22
0.13
(4)
(6)
0.5
1.0
(2)(5) (1)
1.2
1.6
1.6
0.5
0.5
Each lead has same dimensions
!!!!Packaging specifications
Type
Package
Marking
Code
Basic ordering unit (pieces)
EMF6 EMT6
F6
T2R
8000
1/5
Transistors
!!!!Absolute maximum ratings (Ta=25°C) Tr1
Parameter Symbol
CBO
Collector-base voltage Collector-emitter voltage Emitter-base voltage
Collector current Power dissipation
Junction temperature Range of storage temperature
1 Single pulse PW=1ms ∗2 120mW per element must not be exceeded. Each terminal mounted on a recommended land.
V V
CEO
V
EBO
I
I
CP
P
Tj
Tstg
C
C
Limits
15
12
6
500
1.0
150(TOTAL)
150
55~+150
Tr2
Parameter Drain-source voltage Gate-source voltage
Drain current Reverse drain
current
Continuous
Pulsed
Continuous
Pulsed
Total power dissipation Channel temperature Range of storage temperature
1 PW10ms Duty cycle50%2 120mW per element must not be exceeded. Each terminal mounted on a recommended land.
Symbol
DSS
V V
GSS
I
D
DP
I I
DR
I
DRP
P
Tch
Tstg
D
Limits
30 ±20 100 200 mA 100 mA 200
150(TOTAL)
150
55~+150
Unit
V V V
mA
A
mW
°C °C
Unit
V V
mA
mA
mW
°C °C
12
1
12
EMF6
!!!!
Electrical characteristics
(Ta=25°C)
Tr1
Parameter Symbol Min. Typ. Max. Unit Conditions Collector-emitter breakdown voltage Collector-base breakdown voltage Emitter-base breakdown voltage Collector cut-off current Emitter cut-off current Collector-emitter saturation voltage DC current gain Transition frequency Collector output capacitance
Tr2
Parameter Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate-threshold voltage
Static drain-source on-state resistance
Forward transfer admittance Input capacitance Output capacitance Reverce transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time
BV BV BV
I I
V
CE(sat)
CBO EBO
h
f
CEO CBO EBO
FE T
12
15
6
−−
−−
−−
−−
−−
−−100
270 680
260
Cob 6.5
Symbol
GSS
I
(BR)DSS
V
DSS
I
V
GS(th)
DS(on)
R
|Y
fs
C
iss
C
oss
C
rss
t
d(on)
r
t
t
d(off)
f
t
Min. Typ. Max. Unit Conditions
−−
30
−−
−−
0.8
|
20
58
713
−−ms V
13
9
4
15
35
80
80
100
100
nA VCB=−15V nA VEB=−6V
250 mV
MHz
pF
±1 µA
1.0 µA
1.5
pF
pF
pF
ns
ns
ns
ns
V
C
=−1mA
I
V
I
C
=−10µA
V
E
=−10µA
I
IC=−200mA, IB=−10mA
CE
V
=−2V, IC=−10mA
VCE=−2V, IE=10mA, f=100MHz V
CB
=−10V, IE=0mA, f=1MHz
VGS=±20V, VDS=0V
V
I
D
=10µA, VGS=0V
VDS=30V, VGS=0V
DS
VV
=3V, ID=100µA
ID=10mA, VGS=4V
D
=1mA, VGS=2.5V
I
DS
=3V, ID=10mA
V
DS
=5V, VGS=0V, f=1MHz
D
=10mA, VDD 5V,
I
GS
=5V, RL=500,
V
GS
=10
R
2/5
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