ROHM BU4S66G2 Technical data

1
General-purpose CMOS Logic IC Series (BU4S,BU4000B Series)
Single Gate CMOS Logic ICs <Analog Switch>
Description
The BU4S66G2 is a 1ch analog switch IC encapsulated in an SSOP5 package, and can replace 1 circuit of the general-purpose CMOS two-way analog switch BU4066B IC.
Features
1) Low power consumption
2) Surface mount package (SSOP5)
3) Broad operating supply voltage range: 3V-16V
4) L-TTL2 and LS-TTL1 inputs can be driven directly
5) Function compatible with BU4066BC series (1ch).
6) Excellent linearity
Applications
Can be used as a digital/analog switch, ON/OFF switch, or changeover switch in a high speed line, with no deterioratio n of the analog signals. Connection to a low impedance circuit is possible, due to the low ON resistance.
Lineup
Single gate analog switch
circuit
Switch
BU4S66G2 (Single analog switch)
No. 09050JAT02
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1/7
2009.06 - Rev.A
BU4S66G2
A
Absolute Maximum Ratings
Parameter Symbol Limit Unit Power Supply Voltage VDD -0.3 to 18 V Supply Current Iin ±10 mA Operating Temperature Topr -40 to 85 Storage Temperature Tstg -55 to 150 Input Voltage VIN -0.3 to VDD+0.3 V Maximum Junction Temperature Tjmax 150
Recommended Operating Conditions
Parameter
Symbol Limit Unit
Operating Power Supply VDD 3 to 16 V Input Voltage VIN 0 to VDD V
Thermal Derating Curve
1400
1200
1000
800
600
400
Power Dissipation Pd [mW]
200
0
660[mW] BU4S66G2 (*1)
85
25 50 75 100 125 150
mbient Temperature Ta [℃]
(*1) Unit
5.3 mW/
Reduced per 1C at Ta>25. Power Dissipation measured when sample mounted on
175
a 70mm×70mm×1.6mm FR4 glass-epoxy PCB (copper area less than 3%)
Input / Output Equivalent Circuits
VDD
VDD VDD
GND
<Analog Switch Input/Output>
GND
<Control Input>
Technical Note
GND
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2/7
2009.06 - Rev.A
BU4S66G2
Technical Note
Electrical Characteristics (BU4S66G2)
DC Characteristics (Unless otherwise noted : VSS=0[V],Ta=25[℃])
Parameter Symbol
Control “H”input voltage VIH
Control “L”input voltage VIL
ON resistance RON
Channel-OFF Leakage current
LOFF
Static supply current IDD
Limits
Min Typ Max VDD[V]
Unit
3.5 V
11.0 15 1.5
V
4.0 15 290 950
- 85 160 15 - - 0.3 - - -0.3 15 VIN=0[V],VOUT=15[V]
μA
1.0
μA
5
Current between in and
Condition Fig.No
out=10[μA]
5
Current between in and out =10[μA]
5
0VINVDD RL=10[k]
15 VIN=15[V],VOUT=0[V]
5
VIN=VDD or GND - 2.0 10
4.0 15
Input capacitance(control input) CC 8 pF f=1[MHz] Input capacitance(switch input) CS 10 pF f=1[MHz]
Switching Characteristics (Unless otherwise noted : VSS=0[V],Ta=25[℃],CL=50[pF])
Parameter Symbol
Propagation delay time (I/OO/I)
Propagation delay time (CONTROLO/I)
Maximum control frequency
Maximum propagation frequency
tPLH
tPHL
tPHZ
tPLZ
tPZH
tPZL
fmax
(C)
Fmax (I-O)
Limits
Min Typ Max VDD[V]
Unit
15 - 8 - 10
ns
5 - 15 15 - 8 - 10
ns
5 - 15 100 - 70 - 10
ns
65 - 15 100 - 70 - 10
ns
65 - 15 80 - 35 - 10
ns
25 - 15 80 - 35 - 10
ns
25 - 15 10 - 12 - 10
MHz
12 - 15 30 - MHz 5
*1
5
RL=10[k] CL=50[pF]
5
RL=10[k] CL=50[pF]
5
RL=10[k] CL=50pF
5
RL=10[k] CL=50[pF]
5
RL=10[k] CL=50[pF]
5
RL=10[k] CL=50[pF]
5
RL=1[k] CL=50[pF]
VSS=-5[V],RL=1[k] CL=50[pF]
Condition Fig.No
Feedthrough attenuation FT*2 600 - kHz 5 VSS=-5[V],RL=1[kΩ] Sine wave distortion (1[kHz]) THD*3 0.05 % 5
200 - mV 5
Cross talk (CONTROLO/I) CTc
400 - mV 10 600 - mV 15
*1 Frequency where 20log(VOUT/VIN)=3[dB] *2 Frequency where 20log(VOUT/VIN)=50[dB] *1 *2 *3 Must be sine wave of VIN±2.5[Vp-p].
VSS=-5[V],RL=10[k] CL=50[pF]
RIN=1[k] ROUT=10[k] CL=15[pF]
7.0 - 10
- 3.0 10
1 120 250 10
2
3
4
5
6
7
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© 2009 ROHM Co., Ltd. All rights reserved.
3/7
2009.06 - Rev.A
BU4S66G2
]
[℃]
[℃]
[℃]
[℃]
[℃]
[℃]
[℃]
[℃]
[
]
A
[
]
Technical Note
Electrical Characteristics Curves
400
[BU4S66G2]
300
]
Ω
200
On Resistance [
100
Fig.1 Output current-voltage
VDD=5[V]
85
VDD=10[V]
25
-40
0
0 5 10 15
Input Voltage [V]
85
VDD=15[V]
25
-40
200
150
VDD=3[V]
VDD=5[V]
100
50
Propagation Delay Time[ns]
Operating T emp eratur e Range
0
-50 -25 0 25 50 75 100 Ambient Temperature [℃]
[BU4S66G2]
VDD=16[V]
VDD=10[V]
Fig.4 Propagation delay tPHZ
(CONT-OUT)
200
150
VDD=3[V]
[BU4S66G2]
85 25
-40[℃]
200
Operating T emp eratur e Range
150
100
BU4S66G2
VDD=3[V] VDD=5[V]
50
Propagation Delay Time[ns]
0
-50 -25 0 25 50 75 100 Ambient Temperature [℃]
VDD=10[V] VDD=16[V]
Fig.2 Propagation delay tPLH
(IN-OUT)
200
150
VDD=3[V]
[BU4S66G2]
200
Operating T emp eratur e Range
150
100
[BU4S66G2]
VDD=3[V] VDD=5[V]
50
Propagation Delay Time[ns
0
-50 -25 0 25 50 75 100 Ambient Temperature [℃]
Fig.3 Propagation delay tPHL
VDD=10[V]
VDD=16[V]
(IN-OUT)
200
Operating T emp eratur e Range
150
VDD=3[V]
BU4S66G2
VDD=5[V]
100
VDD=16[V]
100
VDD=5[V]
VDD=10[V]
Propagation Delay Time[ns]
50
VDD=10[V]
VDD=16[V]
0
-50 -25 0 25 50 75 100
mbient T emper ature [℃]
Fig.6 Propagation delay tPZH
(CONT-OUT)
50
Propagation Delay Time[ns]
Operating T emp eratur e Range
0
-50 -25 0 25 50 75 100 Ambient Temperature [℃]
Fig.5 Propagation delay tPLZ
(CONT-OUT)
Operating T emp eratur e Range
100
VDD=5[V]
Propagation Delay Time[ns]
50
VDD=10[V]
VDD=16[V]
0
-50 -25 0 25 50 75 100 Ambient Temperature [℃]
Fig.7 Propagation delay tPZL
(CONT-OUT)
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4/7
2009.06 - Rev.A
BU4S66G2
Technical Note
Pinout DiagramPin DescriptionInput / Output Table
Pinout Diagram Input / Output Table
VDD
54
CONT
CONT SW
L OFF
H ON
Pin Description
123
I/O
O/I VSS
Measurement Circuit
SW2SW1
VDD
SW3
SW4 SW 5 SW6
SW7
A
I/O
VIN
PG
RL
Pin No Symbol I/O Function
1 I/O I/O Analog Switch Input / Output 2 O/I I/O Analog Switch Input / Output 3 VSS ― Power supply(-) 4 CONT I Control Input 5 VDD ― Power supply(+)
20[ns] 20[ns]
90%
50%
10%
tpLH
50%
10%
tTLH tTHL
90%
tpHL
RL
SW12 SW13 SW14
O/I
SW15 SW16 SW 17
VDD
CL
Input
波形
Output
出力波形
Switching Characteristics
RL CL
入力波形
Input
SW8 SW9 SW10 SW11
A
CONT
VSS
50%
VIN
PG
Output
出力波形
tPLZ
10%
tPZL
Propagation delay
Switching Table
Parameter
Input voltage/current OFF ON OFF OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF OFF
ON resistance ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON OFF OFF Channel-OFF
Leakage current
Switching Characteristics Propagation time
CONTOUT
Sine wave distortion Feedthrough attenuation
Control OFF OFF OFF OFF OFF OFF ON OFF OFF OFF ON OFF OFF OFF ON ON OFF
SW 1 SW2 SW 3 SW 4 SW5 SW6 SW7 SW8 SW9 SW
10 SW11
OFF ON OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
ON OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF tPLZ OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF tPZL OFF ON OFF OFF OFF OFF OFF OFF OFF ON OFF ON ON OFF ON ON OFF
ON OFF OFF OFF OFF ON OFF OFF OFF ON OFF OFF OFF OFF ON ON OFF
OFF OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF ON ON OFF
SW
12
SW
SW
13
14 SW15 SW16 SW17
50%
50%
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5/7
2009.06 - Rev.A
BU4S66G2
Notes for use
1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider ad ding circuit protection devices, such as fuses.
2. Connecting the power supply connector backward Connecting of the power supply in reverse polarity can da mage IC. Take precautions when connecting the power supply lines. An external direction diode can be added.
3. Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital a nd analog bl ocks. F urthermore, for all p ower supply termina ls to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures.
4. GND voltage The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together.
7. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8. Testing on a pplication boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before conn ecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
9. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the t wo ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
Technical Note
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BU4S66G2
Ordering part number
B U 4 S 6 6 G 2 - T R
Technical Note
Part No. Part No.
Package
4S66
SSOP5
<Tape and Reel information>
Quantity
Direction of feed
2.8±0.2
1.25Max.
1.1±0.05
°
+0.05
0.04
+
6
°
4
°
4
+0.05
0.13
0.03
(Unit : mm)
0.2Min.
2.9±0.2
5
4
+0.2
0.1
1.6
12
3
0.95
0.05±0.05
0.42
0.1
Packaging and forming specification
G2: SSOP5
TR: Embossed tape and reel
Embossed carrier tapeTape 3000pcs
TR
The direction is the 1pin of product is at the upper right when you hold
()
reel on the left hand and you pull out the tape on the right hand
1pin
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
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Notes
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Notice
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