General-purpose CMOS Logic IC Series (BU4S,BU4000B Series)
Single Gate CMOS Logic ICs
<Analog Switch>
BU4S66G2
●Description
The BU4S66G2 is a 1ch analog switch IC encapsulated in an SSOP5 package, and can replace 1 circuit of the
general-purpose CMOS two-way analog switch BU4066B IC.
●Features
1) Low power consumption
2) Surface mount package (SSOP5)
3) Broad operating supply voltage range: 3V-16V
4) L-TTL2 and LS-TTL1 inputs can be driven directly
5) Function compatible with BU4066BC series (1ch).
6) Excellent linearity
●Applications
Can be used as a digital/analog switch, ON/OFF switch, or changeover switch in a high speed line, with no deterioratio n of
the analog signals. Connection to a low impedance circuit is possible, due to the low ON resistance.
ParameterSymbolLimit Unit
Power Supply Voltage VDD -0.3 to 18 V
Supply Current Iin ±10 mA
Operating Temperature Topr -40 to 85 ℃
Storage Temperature Tstg -55 to 150 ℃
Input Voltage VIN -0.3 to VDD+0.3 V
Maximum Junction Temperature Tjmax 150 ℃
●Recommended Operating Conditions
Parameter
SymbolLimit Unit
Operating Power Supply VDD 3 to 16 V
Input Voltage VIN 0 to VDD V
●Thermal Derating Curve
1400
1200
1000
800
600
400
Power Dissipation Pd [mW]
200
0
660[mW] BU4S66G2 (*1)
85
℃
255075100125150
mbient Temperature Ta [℃]
(*1)Unit
5.3 mW/℃
Reduced per 1C at Ta>25℃. Power Dissipation measured when sample mounted on
175
a 70mm×70mm×1.6mm FR4 glass-epoxy PCB (copper area less than 3%)
1 I/O I/O Analog Switch Input / Output
2 O/I I/O Analog Switch Input / Output
3 VSS ― Power supply(-)
4 CONT I Control Input
5 VDD ― Power supply(+)
20[ns]20[ns]
90%
50%
10%
tpLH
50%
10%
tTLHtTHL
90%
tpHL
RL
SW12 SW13 SW14
O/I
SW15 SW16 SW 17
VDD
CL
Input
入力波形
Output
出力波形
Switching Characteristics
RLCL
入力波形
Input
SW8 SW9 SW10 SW11
A
CONT
VSS
50%
~
VIN
PG
Output
出力波形
tPLZ
10%
tPZL
Propagation delay
●Switching Table
Parameter
Input voltage/current OFF ONOFF OFF OFF OFFOFFONOFFOFFOFFOFF OFF OFF ONOFFOFF
ON resistance ON OFFON OFF OFF OFFOFF OFF OFF OFF OFFOFF OFF OFF ONOFF OFF
Channel-OFF
Leakage current
Switching Characteristics
Propagation time
CONT→OUT
Sine wave distortion
Feedthrough attenuation
Control OFF OFFOFF OFF OFFOFFONOFF OFFOFFONOFF OFF OFF ONONOFF
SW 1 SW2 SW 3 SW 4 SW5 SW6 SW7 SW8 SW9 SW
10 SW11
OFF ONOFF OFF OFF OFFOFF OFFONOFF OFFOFF OFF ON OFF OFFON
OFF OFFOFF ON OFFOFFOFFOFFONOFF OFFOFF OFF OFF OFFOFF OFF
ON OFF OFF OFF ONOFF OFF OFF OFFOFF OFF OFF OFF OFF ONONOFF
tPLZ OFF OFFOFF OFF ONOFFOFFOFF OFFOFFOFF OFF OFF OFF OFFOFF OFF
tPZL OFF ONOFF OFF OFF OFFOFFOFF OFFONOFFON ON OFF ONONOFF
ON OFFOFF OFF OFFONOFF OFFOFFONOFFOFF OFF OFF ONONOFF
OFF OFFOFF OFF OFFONOFF OFFONOFF OFFOFF OFF OFF ONONOFF
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider ad ding circuit protection devices, such as
fuses.
2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can da mage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3. Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital a nd analog bl ocks. F urthermore, for all p ower supply termina ls
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. Testing on a pplication boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before conn ecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
9. Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the t wo ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the
GND wiring pattern of any external components, either.
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