The BH7884EFV is a low voltage, low noise, high output speaker and headphone amplifier drive, in which a Bi-CMOS
process is used. This IC supports: headphone amplifier gain adjustment, active/suspend switching, speaker amplifier
stereo/monaural switching, and amplifier mute switching. All functions are controllable from a microcontroller. Built-in digital
noise reduction circuits eliminate digital noise and BEEP sounds.
SP/ON mode V2H VCC-0.3- VCC V
SP/OFF mode V2L GND - 0.3 V
BASS-BOOST/ON mode V4H VCC-0.7- VCC V
BASS-BOOST/OFF mode V4L GND - 0.7 V
STEREO mode V3H VCC-0.7- VCC V
MONO mode V3L GND - 0.7 V
ACTIVE mode V
MUTE mode V
1) LINEIN (5,8PIN) ~ HPOUT (13,24PIN) voltage gain
The voltage gain at EVRMAX is generally calculated by the following equation:
G
HP = 20 × log
40k
R
5(or R8)
(dB)
The above gain attenuates according to the DC voltage of the VOL pin (9PIN).
By connecting multiple resistances (R), mixing input can be handled.
2) BEEPIN (7PIN) ~ HPOUT (13,24PIN)
When a pulse waveform is input at the BEEPIN pin, a pulse wave is output at HPOUT (24,13PIN).
The output level, determined by the resistance of 7PIN, has default values as follows:
HP OUT level Vcc=5V Vcc=4V Vcc=3.3V
1Vpp< <56k <91k <120k
0.5Vpp 68k 110k 160k
0.25Vpp 75k 130k 200k
*(Unit: )
To obtain the default setting output (approx. 1.2 Vpp output), make R7=10 k.
The variation in output levels is small.
Signals below a certain level are determined to be noise, by IC internals, and are not output at HPOUT.
3) SP IN (1,12PIN) ~ SP OUT (21, 20, 16,17PIN) voltage gain
The voltage gain in BASSBOOST is generally calculated by the following equation:
GSPB= 20×log
40k + R
21-20(or R16-15)
R1(or R12)
(dB)
The cut-off frequency in BASSBOOST is generally calculated by the following equation:
CB=
f
21~22(or C16~15)×R21~20(or R16~15)
2πC
1
The voltage gain in NONBOOST is generally calculated by the following equation:
GSP=20×log
40k
1(or R12)
R
(dB)
4) EVR control characteristic
HP AMP gain is controlled by the ratio of voltage to resistanc e between VCC and GND.
Note: A resistance (RN), shown above, is the resistance that is connected to pin N.
A capacitance (CN), shown above, is the capacitance that is connected to pin N.
The numeric values above are design reference values, whose values are not guaranteed.
1. Numbers and data in entries are representative design values and are not guarant eed values of the items.
2. Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure t o
verify circuit characteristics for your particular application. Modific ation of constants for other externall y connected circ uits
may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for
sufficient margins when determining circuit constants.
3. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the ap plied voltage or ope rating temperat ure range (Topr),
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the I C at times
where the absolute maximum ratings may be exceeded.
4. GND potential
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at
any time, regardless of whether it is a transient signal or not.
5. Thermal design
Perform thermal design, in which there are adequate marg ins, by taking into account the permissible dissipation (Pd) in
actual states of use.
6. Short circuit between terminals and erroneous mounting
Pay attention to the assembly direction of the ICs. Wrong mounti ng direction or shorts between termin als, GND, or other
components on the circuits, can damage the IC.
7. Operation in strong electromagnetic field
Using the ICs in a strong electromagnetic field can cause operation malfunction.
8. Pop noise when switching power ON/OFF
To prevent pop noise when switching VCC ON/OFF or switching SUSPEND ON/OFF, use SUSPEND (11PIN=L), HP
MUTE (10PIN=L), and SUSPEND (2PIN=L) for noise control, as sho wn belo w.
(VCC OFFON)
VCC SPND HPMT SPMT
1) OFF L L L
2) ON L L L
3) ON H L L
4) ON H H L
5) ON H H H
9. Power supply bypass capacitor
Place the bypass capacitor close to the VCC ~ GND pins.
10. Mode switching
Do not apply a voltage that exceeds VCC or a voltage that is less than GND, at a cont rol pin.
11. Power package
Ensure heat dissipation by connecting the heatsink to the back of the IC and to the GND board. Ensure that the GND area
is large.
12. HPOUT
Connect resistance (100 is recommended) to the output for SPAMP input level adjustment and to prevent HPAMP
oscillation.
13. Capacitive load
Do not connect a capacitive load to SPAMP or HPAMP output as it may cause oscillation.
14. Startup time at low temperature and reduced power
Use the following methods to eliminate longer start up time at lo w temperatures (less than about -10
power (less than about 3.0 V):
1) Start in SPMUTE state and then cancel SPMUTE.
2) Add to transistor and resistance, as shown in the application circuit diagram.
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
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The technical information specied herein is intended only to show the typical functions of and
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Notice
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
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