BD3811K1 and BD3818KS are 5.1ch sound processors, with built-in Mode Selector/Input Selector. Functions, including
6-ch Volume, Gain Amp, Bass, Treble, Mixing (BD3818KS), Dynamic Bass Boost (BD3818KS) and Bass Boost (BD3811K1)
are integrated into a single chip.
●Features
1) Independent 6 channels for Master Volume (0 to -103dB, 1dB/Step, MUTE, BD3811K1)
(0 to -95dB 1dB/Step, MUTE, BD3818KS)
Implementation of a resistance ladder type circuit reduces residual noise and a shock sound at switching.
2) Low current consumption design achieved by adopting the BiCMOS process
3) Maximum output voltage (BD3818KS): 4.3Vrms (Vcc=7V, VEE=-7V, RL=10kΩ) Maximum output voltage (BD3811K1): 4.2Vrms (Vcc=7V, VEE=-7V, RL=10kΩ)
4) Built-in Input Gain Amp useful for adjusting the output signal voltages
5) Built-in Operational Amplifier useful for filter construction (BD3818KS)
6) Built-in Dynamic Bass Boost circuit (BD3818KS)
7) 2-wire serial control (BD3818KS for 5V, BD3811K1 for both 3.3V and 5V)
8) Built-in Output Gain Amp useful for adjusting the output signal voltages (BD3811K1)
9) REC output terminal with a REC input/output switch useful for monitoring Equalizer Amp (BD3811K1)
10) Output mute controlled by either serial data or an external control terminal
●Applications
AV receivers, home theater systems and mini-audio systems.
●Line up matrix
No.10081EAT02
Parameter BD3811K1 BD3818KS
Input Selector 8 inputs 5 inputs
Input Gain 2Step 4 Step or 2 Step
Volume 0 to -103dB 1dB/Step 0 to -95dB 1dB/Step
Bass, Treble 14dB 2dB/Step 14dB 2dB/Step
Output Gain 0, 6 to 18dB 2dB/Step Variable depending on the external resistance
Input Signal Voltage VIN VCC+0.3 to VEE-0.3V
Power Dissipation Pd 1200 *2 mW
Operating Temperature range Topr -20 to 75 ℃
Storage Temperature range Tastg -55 to 125 ℃
*1 Even in the specified range of Power Supply Voltage, applying voltage only to the VCC side may cause an excessive current
to give a permanent damage to the IC.
When starting up power supplies, VEE and VCC should be powered on simultaneously or VEE first; then followed by VCC.
*2 Reduced by 12 mW/℃ over 25℃, when installed on the standard board (size: 70x70x1.6mm).
Standard values of R2, R3 (reference)
(R1=4.7KΩ, C1=C2=0.1µF)
Boost Amount
Cut Amount
+
-
R1
Resistance (KΩ)
*Typ.
R2 R3
=
f0
2π
R1
Q
=
C1+C2
When C1=C2
20log
G =
1
+ R3 R2
C1C2
1
G
R2+R3
R1
R3
R1
C1C2R2
R1
+2
+2
Technical Note
(Hz)
(dB)
0dB 0 41.0
3dB
2dB 10.8 30.2
G
4dB 19.3 21.7
6dB 26.0 15.0
fc
f
8dB 31.2 9.8
±10dB
35.4 5.6
12dB 38.4 2.6
14dB 41.0 0
*The actual boost/cut levels may deviate from the standard values in some degree.
3dB
Fig.7
G
To be able to set the f0 and Q factors of Bass
characteristics to desired values, part of the Bass
Filter is constructed of the external components
shown in the upper-left figure.
1. Numbers and data in entries are representative design values and are not guaranteed values of the items.
2. Although ROHM is confident that the example application circuit reflects the best possible recomme ndations, be sure to
verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits
may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for
sufficient margins when determining circuit constants.
3. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperat ure range (Topr),
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the IC at times
where the absolute maximum ratings may be exceeded.
4. VEE potential
Make the VEE pin voltage such that it is the lowest voltage even when operating below it. Actually confirm that the voltage
of each pin does not become a lower voltage than the VEE pin, including transient phenomena.
5. Thermal design
Perform thermal design, in which there are adequate margins, by taking into account the po wer dissipation (Pd) in actual
states of use.
6. Short circuit between terminals and erroneous mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
7. Operation in strong electromagnetic field
Using the ICs in a strong electromagnetic field can cause operation malfunction.
8. Serial control
For the CL and DA terminals, the patterned and other wirings should be routed not to cause interference with the
analog-signal-related lines.
9. Power ON/OFF
(a) At power ON/OFF, a shock sound will be generated. Therefore, use MUTE on the set.
(b) When turning on power supplies, VEE and VCC should be powered on simultaneously, or VEE first followed by
VCC. If the VCC side is started up first, an excessive current may flow from VCC to VEE.
10. Function switching
For the CL and DA terminals, the patterned and other wirings should be routed as not to cause interference with the
analog-signal-related lines.
11. Ground line
The ground pin: 47pin (BD3818KS) should be connected to the ground line with as low noise as the AGND pin.
12. Switching noise reduction at switching volume from -3dB to -4dB (BD3811K1 only)
In order to reduce a switching noise at the switching volume from -3dB to -4dB, the -4dB-step switch should be s witched
first, and then the -1dB-step switch by -1dB.
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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