Hi-performance Regulator IC Series for PCs
Termination Regulators
for DDR-SDRAMs
BD3539FVM,BD3539NUX
Description
BD3539FVM/NUX is a termination regulator compatible with JEDEC DDR1-SDRAM, DDR2-SDRAM, DDR3-SDRAM which
functions as a linear power supply incorporating an N-channel MOSFET and provides a sink/source current capability up to
1A respectively. A built-in high-speed OP-AMP specially designed offers an excellent transient response. Requires 3.3
volts (DDR2, DDR3) or 5.0 volts (DDR1, DDR2, DDR3) as a bias power supply to drive the N-channel MOSFET. Has an
independent reference voltage input pin (VDDQ) and an independent feedback pin (VTTS) to maintain the accuracy in
voltage required by JEDEC, and offers an excellent output voltage accuracy and load regulation. Also has a reference
power supply output pin (VREF) for DDR-SDRAM or a memory controller. When EN pin turns to “Low”, VTT output
becomes “Hi-Z” while VREF output is kept unchanged, compatible with “Self Refresh” state of DDR-SDRAM.
Features
1) Incorporates a push-pull power supply for termination (VTT)
2) Incorporates a reference voltage circuit (VREF)
3) Incorporates an enabler
4) Incorporates an under voltage lockout (UVLO)
5) Employs MSOP8 package : 2.9×4.0×0.9(mm) : BD3539FVM
6) Employs VSON008X2030 package : 2.0×3.0×0.6(mm) : BD3539NUX
7) Incorporates a thermal shutdown protector (TSD)
8) Operates with input voltage from 2.7 to 5.5 volts
9) Compatible with Dual Channel (DDR1, DDR2, DDR3)
10) Usable ceramic capacitor at output
Use
Power supply for DDR1- SDRAM (VCC=5V only)
Power supply for DDR2-SDRAM (VCC=3.3V or 5V)
Power supply for DDR3-SDRAM (VCC=3.3V or 5V)
●ABSOLUTE MAXIMUM RATINGS
Parameter Symbol
Input Voltage VCC 7
Enable Input Voltage VEN 7
Termination Input Voltage VTT_IN 7
VDDQ Reference Voltage VDDQ 7
Output Current ITT 1 A
Power Dissipation1 Pd1 387.4 *3 242.0 *4 mW
Power Dissipation2 Pd2 587.4 *4 515.0 *5 mW
Power Dissipation3 Pd3 - 877.2 *6 mW
Operating Temperature Range Topr -30~+100 ℃
Storage Temperature Range Tstg -55~+150 ℃
Maximum Junction Temperature Tjmax +150 ℃
*1 Should not exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 With Ta≧25℃ (With no heat sink) θja=322.6℃/W
*4 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate, with no heat sinkθja=212.8℃/W
*5 With Ta≧25℃ (With no heat sink) θja=516.5℃/W
*6 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 1-layer board, θja=242.7℃/W
*7 With Ta≧25℃ when mounting a 70mm×70mm×1.6mm glass-epoxy substrate 4-layer board
(copper foil density: 5505mm
2
(copper foil area in each layer) ), θja=142.5℃/W
BD3539FVM BD3539NUX
Limit
*1*2
V
*1*2
V
*1*2
V
*1*2
V
No.09030EAT24
Unit
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© 2009 ROHM Co., Ltd. All rights reserved.
1/11
2009.10 - Rev.
BD3539FVM,BD3539NUX
●Operating Conditions(Ta=25℃)
Parameter Symbol
Input Voltage VCC
Termination Input Voltage VTT_IN
VDDQ Reference Voltage VDDQ
Enable Input Voltage VEN
●Electrical Characteristics (Unless otherwise noted, Ta=25℃, VCC=3.3V, VEN=3V, VDDQ=1.5V, VTT_IN=1.5V)
Parameter Symbol
Standby Current IST - 0.5 1.0 mA VEN=0V
Bias Current ICC - 2 4 mA VEN=3V
[Enable]
High Level Enable Input Voltage VENHIGH 2.3 - 5.5 V
Low Level Enable Input Voltage VENLOW -0.3 - 0.8 V
Enable Pin Input Current IEN - 7 10 µA VEN=3V
[Termination]
Termination Output Voltage
(DDR3)
Termination Output Voltage
(DDR2)
Termination Output Voltage
(DDR1)
Source current ITT+ 1.0 - - A
VTT3
VTT2
VTT1
MIN TYP MAX
1/2×VDDQ
-15m
1/2×VDDQ
-30m
1/2×VDDQ
-30m
Limit
MIN MAX
2.7 5.5 V
1.0 5.5 V
1.0 2.75 V
-0.3 5.5 V
Limit
1/2×VDDQ
1/2×VDDQ
1/2×VDDQ
1/2×VDDQ
+15m
1/2×VDDQ
+30m
1/2×VDDQ
+30m
Unit
Unit Condition
ITT=-1.0A to 1.0A
V
Ta =0 ℃ to 100℃
VCC = 3.3V, VDDQ = 1.8V
VTT_IN = 1.8V
V
ITT=-1.0A to 1.0A
Ta =0 ℃ to 100℃
VCC = 5.0V, VDDQ = 2.5V
VTT_IN = 2.5V
V
ITT=-1.0A to 1.0A
Ta =0 ℃ to 100℃
Technical Note
Sink current ITT- - - -1.0 A
Load Regulation ⊿VTT - - 30 mV ITT=-1.0A to 1.0A
Upper Side ON Resistance HRON - 0.35 0.65 Ω
Lower Side ON Resistance LRON - 0.35 0.65 Ω
[VDDQ]
Input Impedance ZVDDQ 140 200 260 kΩ
[VREF]
Output Voltage VREF
[UVLO]
Threshold Voltage VUVLO 2.30 2.45 2.60 V VCC : sweep up
Hysteresis Voltage ⊿VUVLO 100 160 220 mV VCC : sweep down
1/2×VDDQ
-15m
1/2×VDDQ
1/2×VDDQ
+15m
IREF=-25mA to 25mA
V
Ta =0 ℃ to 100℃
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© 2009 ROHM Co., Ltd. All rights reserved.
2/11
2009.10 - Rev.
BD3539FVM,BD3539NUX
●Reference Data
VTT(50mV/div)
VREF(50mV/div)
sink
ITT(1A/div)
source
10µsec/Div
Fig.1 DDR3 (-1A→1A)
VCC
EN
VDDQ
VTT_IN
VTT
Fig.4 Input Sequence 2
2sec/Div
751.5
751.0
750.5
750.0
VREF [mV]
749.5
749.0
748.5
-20 -10 0 10 20
IREF[mA]
Fig.7 IREF-VREF (DDR3)
VCC
EN
VDDQ
VTT_IN
VTT
VTT
EN
VREF(50mV/div)
VTT(50mV/div)
sink
ITT(1A/div)
source
10µsec/Div
Fig.2 DDR3 (1A→-1A)
2sec/Div
Fig.5 Input Sequence 3
200µsec/Div
Fig.8 EN Soft Start
Technical Note
VCC
EN
VDDQ
VTT_IN
VTT
Fig.3 Input Sequence1
900
850
800
750
VTT [mV]
700
650
600
-2 -1.5 -1 -0.5 0 0.5 1 1.5 2
Fig.6 ITT-VTT (DDR3)
VDDQ
VREF
VTT
Fig.9 VDDQ Soft Start
ITT[A]
2sec/Div
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© 2009 ROHM Co., Ltd. All rights reserved.
3/11
2009.10 - Rev.
BD3539FVM,BD3539NUX
●Block Diagram
VCC
VCC
Reference
Block
VDDQ
C2 C3
VDDQ
VCC
UVLO
SOFT
TSD
EN
UVLO
2
Thermal
Protection
EN
TSD
1
VCC
UVLO
GND
Enable
EN
●PIN Configration ●PIN Function
○FVM
PIN No.
GND
1
EN
2
VTTS
3
4 5
VREF
8
7
6
VTT
VTT_IN
VCC
VDDQ
1 GND Ground Pin
2 EN Enable Input Pin
3 VTTS Detector Pin for Termination Voltage
4 VREF Reference Voltage Output Pin
5 VDDQ Reference Voltage Input Pin
6 VCC VCC Pin
7 VTT_IN Termination Input Pin
8 VTT Termination Output Pin
○NUX
PIN No.
VTT_IN
1
VCC
8
1 VTT_IN Termination Input Pin
2
VTT
GND
2
3
7
6
VDDQ
VREF
3 GND Ground Pin
4 EN Enable Input Pin
5 VTTS Detector Pin for Termination Voltage
4 5
EN
VTTS
6 VREF Reference Voltage Output Pin
7 VDDQ Reference Voltage Input Pin
8 VCC VCC Pin
Bottom FIN Substrate (Connected to GND)
Technical Note
VTT_IN
VTT_IN
756
VCC
TSD
EN
VCC
UVLO
TSD
EN
UVLO
PIN NAME PIN FUNCTION
PIN NAME PIN FUNCTION
VTT Termination Output Pin
VTT
8
3
VTTS
4
VREF
VTT
C4
½×
VDDQ
C1
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© 2009 ROHM Co., Ltd. All rights reserved.
4/11
2009.10 - Rev.