Datasheet BD25KA5WFP Datasheet (ROHM)

Page 1

500mA Variable/Fixed Output LDO Regulators

Datashee

BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

●General Description

The BDxxKA5 series are low-saturation regulators that are avail able for output currents up to 500mA. The output voltage precision is ±1%. These LDO regulators are offered in several output voltages and package lineups with or without ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in overcurrent protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown circuit.

●Features

 Output voltage precision: ±1%  Low-saturation voltage with PMOS output: 0.12V

Typ.(Io=200mA)

 Built-in over-current protection circuit  Built-in thermal shutdown circuit  Shutdown switch (BDxxKA5WFP and BDxxKA5WF

series)

 Ceramic capacitor compatible (recommended

capacitance: 1μF or greater)

●Key Specifications

 Input Power Supply Voltage: 5.5V (Max.)  Output voltage type: BA00KA5 Variable

BAxxKA5 Fixed

 Output current: 500mA (Max.)  Operating temperature range: -40℃ to +105℃

●Applications

Microcontrollers and all electronic devices that use logic circuit

●Packages W (Typ.) x D (Typ.) x H (Max.) SOP8 5.00mm x 6.20mm x 1.71mm TO252-3 6.50mm x 9.50mm x 2.50mm TO252-5 6.50mm x 9.50mm x 2.50mm

SOP8

TO252-3

TO252-5

●Lineup matrix

Part Number

1.0 1.2 1.5 1.8 2.5 3.0 3.3 Variable BDxxKA5WFP ○ ○ ○ ○ ○ ○ ○ ○ TO252-5 BDxxKA5WF ○ ○ ○ ○ ○ ○ ○ ○ SOP8 BDxxKA5FP ○ ○ ○ ○ ○ ○ ○ - TO252-3

●Ordering Information

Output Voltage (V)

Package

B D x x K A 5 W x x - E 2

Part Number

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. www.rohm.com

Output voltage 00:Variable

Other: Fixed

Current capacity KA5: 500mA

Shutdown Switch W: Include None:without

Package FP : TO252-3

TO252-5 F : SOP8

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Packaging and forming specification E2: Embossed tape and reel

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

●Lineup

Datasheet

Maximum output

current (Max.)

500mA

Shutdown

Switch

TO252-5 Reel of 2000

With Switch

No Switch TO252-3 Reel of 2000

Package

SOP8 Reel of 2500

Output

voltage (Typ.)

1.0V BD10KA5WFP-E2

1.2V BD12KA5WFP-E2

1.5V BD15KA5WFP-E2

1.8V BD18KA5WFP-E2

2.5V BD25KA5WFP-E2

3.0V BD30KA5WFP-E2

3.3V BD33KA5WFP-E2

Variable BD00KA5WFP-E2

1.0V BD10KA5WF-E2

1.2V BD12KA5WF-E2

1.5V BD15KA5WF-E2

1.8V BD18KA5WF-E2

2.5V BD25KA5WF-E2

3.0V BD30KA5WF-E2

3.3V BD33KA5WF-E2

Variable BD00KA5WF-E2

1.0V BD10KA5FP-E2

1.2V BD12KA5FP-E2

1.5V BD15KA5FP-E2

1.8V BD18KA5FP-E2

2.5V BD25KA5FP-E2

3.0V BD30KA5FP-E2

3.3V BD33KA5FP-E2

Orderable

Part Number

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions

Fig.1

Fig.4

Datasheet

[BDxxKA5FP]

Fig.2

Fig.3

GND(FIN)

N.C.(2PIN)

Fig.5

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Datasheet

●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Limits Unit.

Power Supply Voltage Vcc -0.3 to +7.0*1 V Output Control Terminal Voltage VCTL -0.3 to Vcc*1 V

1200

Power Dissipation

TO252-3 TO252-5 1300*3

SOP8 687.6*4 Operating Temperature Range Topr -40 to +105 ℃ Ambient Storage Temperature Tstg -55 to +150 ℃ Maximum Junction Temperature Tjmax 150 ℃

*1 Must not exceed Pd *2 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃ over 25℃. *3 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃ over 25℃. *4 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃ over 25℃.

●Recommended Operating Ratings (Ta=25℃) Parameter Symbol Min. Max. Unit.

Input Power Supply Voltage Vcc 2.3 5.5 V Output Current Io 0 500 mA

Output Voltage Configuration Range*5 Vo 1.0 4.0 V

Output Control Terminal Voltage VCTL 0 Vcc V

*5 Only BD00KA5WFP and BD00KA5WF

●Electrical Characteristics

BDxxKA5 Series BDxxKA5W Series

(Unless otherwise specified,Ta=25℃, VCTL =2V, Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V), Vcc=3.3V(Vo=2.5V), Vcc=5.0V(Vo=3.0V,3.3V))

Parameter Symbol

Output Voltage Vo

Min Typ Max Vo(T)-0.015 Vo(T) Vo(T)+0.015 Vo(T)×0.99 Vo(T) Vo(T)×1.01 Io=200mA (Vo≧1.5V)

Limit

Unit Conditions

Io=200mA (Vo=1.0V,1.2V)

Shut Down Current Isd － 0 1 μA VCTL=0V, Io=0mA (OFFmode) Bias Current Ib － 350 550 μA Io=0mA Dropout Voltage *6

ΔVd －

0.12 0.20 V

Io=200mA, Vcc=0.95×Vo

Peak Output Current Io 500 －－ mA

※

Ripple Rejection R.R. － 50 － dB

Line Regulation *7 Reg.I － 10 35 mV

f=120Hz, ein Io=100mA

Vcc=Vo+0.5V→5.5V, Io=200mA

=-10dBV,

Load Regulation Reg.L － 25 75 mV Io=0mA→500mA Temperature Coefficient

of Output Voltage

Tcvo － ±100 － ppm/℃ Io=5mA,Tj=0 to 125℃

CTL ON Mode Voltage VCTLON 2.0 －－ V ACTIVE MODE, Io=0mA CTL OFF Mode Voltage VCTLOFF －－ 0.8 V OFF MODE, Io=0mA CTL Input Current ICTL 20 40 60 μA Io=0mA

Vo(T) : Output Voltage

Vo≧2.5V

1.0≦Vo≦1.8V,Vcc=2.3V→5.5V

Not 100% tested

ein : Input Voltage Ripple

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●Electrical Characteristics – continued

BD00KA5W Series (Unless otherwise specified, Ta=25℃, Vcc=2.5V, V

Parameter Symbol

Min Typ Max

=2V ,Vo=1.5V)

CTL

Limit

Unit Conditions

Shut Down Current Isd － 0 1 μA VCTL=0V, Io=0mA (OFFmode) Bias Current Ib － 350 550 μA Io=0mA Reference Voltage VADJ 0.742 0.750 0.758 V Io=50mA Dropout Voltage

*10

ΔVd －

0.12 0.20 V

Io=200mA, Vcc=0.95×Vo

Peak Output Current Io 500 －－ mA

※

Ripple Rejection R.R. － 50 － dB

f=120Hz, ein

=-10dBV, Io=100mA Line Regulation Reg.I － 10 35 mV Vcc=Vo+0.5V→5.5V, Io=200mA Load Regulation Reg.L － 25 75 mV Io=0mA→500mA

Temperature Coefficient of Output Voltage

*11

Tcvo

CTL ON Mode Voltage VCTLON 2.0

－ ±100 － ppm/℃ Io=5mA,Tj=0 to 125℃

－－

V ACTIVE MODE, Io=0mA CTL OFF Mode Voltage VCTLOFF －－ 0.8 V OFF MODE, Io=0mA CTL Input Current ICTL 20 40 60 μA Io=0mA

Vo≧2.5V

Not 100% tested

ein : Input Voltage Ripple

Datasheet

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●Typical Performance Curves

(Unless specified otherwise, Vcc=25V,V

=2V,and Io=0mA)

CTL

[mA]

[V]

CIRCUIT CURRENT : I

OUTPUT VOLTAGE : V

SUPPLY VOLTAGE : Vcc[V]

Fig.6

Circuit current

[V]

OUTPUT VOLTAGE : V

SUPPLY VOLTAGE : Vcc[V]

Fig.8

Input Stability

（Io=500mA）

Datasheet

SUPPLY VOLTAGE : Vcc[V]

Fig.7

Input Stability（Io=0mA）

OUTPUT CURRENT : IO[A]

Fig.9

Load Stability

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●Typical Performance Curves - continued

[V]

OUTPUT VOLTAGE : V

Input/Output Voltage Difference

TEMPERATURE : Ta[℃]

Fig.10

（Vcc=3.135V）

Fig.12

Output Voltage

（Io=5mA）

Datasheet

Fig.11

Ripple Rejection

（ein=10dBV,Io=100mA）

TEMPERATURE : Ta[℃]

Fig.13

Circuit Current

Temperature Characteristics

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[mA]

BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

●Typical Performance Curves - continued

[mA]

[V]

CIRCUIT CURRENT : I

OUTPUT VOLTAGE : V

OUTPUT CURRENT : IO[A]

Circuit Current by load Level

Fig.14

[µA]

CTL

[V]

CONTROL CURRENT : I

OUTPUT VOLTAGE : V

CONTROL VOLTAGE : V

CTL

[V]

CTL Voltage vs. Output Current

Fig.16

CONTROL VOLTAGE : V

CTL

[V]

Fig.15

CTL Voltage vs. Output Voltage

TEMPERATURE : Ta[℃]

Fig.17

Thermal Shutdown

Circuit Characteristics (Io=5mA)

Datasheet

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Datasheet

●I/O equivalence circuit

Vcc

CTL

31.25kΩ 2kΩ

25kΩ

Fig.18 Fig.19

Vcc Vcc Vcc

※ With BD00KA5WFP/WF,R1and R2 are connected

OUT

ADJ

(BD00KA5WFP/WF)

outside the IC between ADJ and GND and between OUT and ADJ.

●Power Dissipation

2.0

1.6

1.30

Pd(W)

：

1.2

0.8

Power Dissipation

Power Dissipation：Pd(W)

0.4

Rohm standard board mounting Board size：70×70×1.6ｍｍ Copper foil area：7×7ｍｍ θja=96.2(℃/W)

TO252-5

2.0

1.6

1.20

1.2

0.8

許容損失：Pd(W)

Power Dissipation：Pd(W)

0.4

TO252-3

Rohm standard board mounting Board size：70×70×1.6ｍｍ Copper foil area：7×7ｍｍ θja=104.2(℃/W)

0.0 0 25 50 75 100 125 150

Ambient temperature：Ta(℃)

Fig.20 Power Dissipation heat reducing characteristics

0.0 0 25 50 75 100 125 150

Ambient temperature：Ta( ℃)

周囲温度：Ta(℃)

Fig.21 Power Dissipation heat reducing characteristics

1000

800

687.6mW

600

562.6mW

400

許容損失：Pd(W)

200

Power Dissipation：Pd(W)

0 25 50 75 100 125 150

Fig.22 Power Dissipation heat reducing characteristics

SOP8

(1)When using a standard board:

θj-c=181.8(℃/W)

(2) When using an IC alone

θj-a=222.2(℃/W)

(1)

(2)

Ambient temperature：Ta( ℃)

周囲温度：Ta(℃)

When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22. The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the maximum junction temperature Tj

MAX, the device may malfunction or be destroyed. The heat of the IC requires s ufficient

consideration regarding instantaneous destruction and long-term operation reliabi lity. In order to protect the IC from thermal damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX. Even when the ambient temperature Ta is a normal temperature (25 ℃), the chip(junction) temper ature Tj may be qu ite high, so please operate the IC at temperatures less than the acceptable loss Pd.

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The calculation method for power consumption Pc(W) is as follows : Pc = (Vcc-Vo)×Io+Vcc×Icca

Acceptable loss Pd≧Pc

Solving for the load current I

Io≦

It is then possible to fin d the maxi mu m load cu r rent Io Calculation Example

Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V

Io≦ θja=96.2℃/W → -10.4mW/℃ Io≦440mA (Icca : 6mA) 25℃=1300mW → 85℃=676mW

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :

*Ishort : Short circuit current

●Terminal Vicinity Settings and Cautions

・Vcc Terminal

・GND Terminal

・CTL Terminal

Pc – Vcc×Icca Vcc－Vo

0.676－2.5×Icca

2.5-1.0

Pc=Vcc×(Icca+Ishort)

Please attach a capacitor (greater than 1μF) between Vcc and GND. The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the operation on actual board.

Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns as wide as possible and reducing the distance between the set ground and the IC ground as much as possible.

31.25kΩ

CTL

Fig.23 Input equivalent circuit

in order to operate within the acceptable loss,

MAX with respect to the applied volt age Vcc at the ti me of therma l design .

BA10KA5WFP（TO252-5 packaging）

The CTL terminal is turned ON at 2.0V and higher, and OFF at

0.8V and lower, within the operating power supply voltage range. The power supply and the CTL terminal may be started up and

25kΩ

shut down in any order without problems.

Vcc：

Input voltage

Vo：

Output voltage

Io：

Load current

Icca：

Circuit current

Datasheet

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Datasheet

●Vo Terminal

Please be sure to attach an anti-oscillation capacitor between V

o and GND.

OUT

1μF

Fig.24 Output Equivalent Circuit

100

ESR (Ω)

Vcc

ESR(Ω)

0.1

0.01 0 100 200 300 400 500

1μF

CTL

Stable region

安定領域

Cin

Vcc

CTL

GND

Io(mA)

Io u t(m A )

Oscillation region

発振領域

ESR

1μF

OUT

ADJ

R1=30kΩ,R2=2kΩ

Fig.25 ESR-Io Characteristics

Io(R

OUT)

Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series resistance (ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally have favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high voltage capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R, is recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after sufficiently confirming its properties according to its specifications in the actual application.

120

100

静電容量変化率(%)

Rate of change in electrostatic capacitance (%)

01234

10V Max.Input

DC bypass Vdc(V)

直流バイアスVdc（V)

(a) Capacitance-bypass

characteristics (Y5V)

50V Max.Input

16V Max.Input

120

100

静電容量変化率(%)

Rate of change in electrostatic capacitance (%)

01234

DC bypass Vdc(V)

直流バイアスVdc（V)

50V Max.Input

16V Max.Input

10V Max.Input

120

100

静電容量変化率(%)

Rate of change in electrostatic capacitance (%)

（b）Capacitance-bypass

characteristics（X5R,X7R）

Fig.26 General characteristics of ceramic capacitors

X7R

Y5V

Vdc=0

-250 255075

Temp(℃)

X5R

（C）Capacitance-temperature

characteristics（X5R,X7R,Y5V）

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Datasheet

●Operational Notes

○Protection Circuits

Over-current Protection Circuit

A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such t hat the curr ent is restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance capacitor. However, while this protection circuit is effective for the prevention of destruction due to une xpected accid ents, it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the over-current protection circuit has negative current capacity characteristics with regard to temperature.

○Thermal Shutdown Circuit (Thermal Protection)

This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Fig.17 for the temperatures at which the temperature protection circuit operates). There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to avoid leaving the IC in the overloaded state.

○Reverse Current

In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode

be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).

Reverse current

Vcc

CTL

OUT

GND

Fig.27 Bypass diode

○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as sh own in Fig.28. A P-N

junction is formed between this P-layer and the N-layer of each element, and the P-N jun c tion operates as :

- a parasitic diode when the electric potential relationship is GND> Pin A, GND> Pin B, or

- a parasitic transistor when the electric potential relationship is Pin B > GND> Pin A. Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND (P-board) to the input terminal.

Transistor (NPN)

(Pin B)

P+

Parasitic element or transistor

GND

P+

(Pin A)

GND

Resistor

P+

Parasitic element

GND

(Pin B)

(Pin A)

GND

Parasitic element or transistor

Parasitic element

Fig.28 Basic structure example

Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority.

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

●Physical Dimension Tape and Reel Information

SOP8

5.0±0.2

(MAX 5.35 include BURR)

−4°

4.4±0.2

6.2±0.3

438251

0.595

1.5±0.1

0.11

1.27

0.42±0.1

0.17

+0.1

0.05

(Unit : mm)

0.3MIN

Quantity

Direction

0.9±0.15

of feed

Embossed carrier tapeTape 2500pcs

The direction is the 1pin of product is at the upper left when you hold

()

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

TO252-3

5.5±0.2 1.5±0.2

2.3±0.2

0.65

0.75

6.5±0.2 +0.2

5.1

FIN

0.8

0.1

21 3

0.65

2.3±0.2

C0.5

2.3±0.2

0.5±0.1

1.0±0.2

0.5±0.1

1.5

2.5

(Unit : mm)

9.5±0.5

Embossed carrier tapeTape

Quantity

Direction of feed

2000pcs E2

The direction is the 1pin of product is at the lower left when you hold

( )

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

TO252-5

5.5±0.2 1.5±0.2

6.5±0.2

+0.2

5.1

FIN

123 54

0.1

0.5

2.3±0.2

0.5±0.1

C0.5

9.5±0.5

1.5

0.8

1.27

2.5

0.5±0.1

1.0±0.2

(Unit : mm)

Embossed carrier tapeTape

Quantity

Direction of feed

2000pcs E2

The direction is the 1pin of product is at the lower left when you hold

( )

reel on the left hand and you pull out the tape on the right hand

Reel

1pin

Order quantity needs to be multiple of the minimum quantity.

∗

Datasheet

Direction of feed

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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series

●Marking Diagrams

SOP8(TOP VIEW)

TO252-3

(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

TO252-5

(TOP VIEW)

Part Number Marking

LOT Number

Datasheet

Part Number Marking

LOT Number

Orderable

Part Number

BD10KA5WFP-E2 BD12KA5WFP-E2 12KA5W BD15KA5WFP-E2 15KA5W BD18KA5WFP-E2 18KA5W BD25KA5WFP-E2 25KA5W BD30KA5WFP-E2 30KA5W BD33KA5WFP-E2 33KA5W BD00KA5WFP-E2 00KA5W BD10KA5WF-E2 BD12KA5WF-E2 12KA5W BD15KA5WF-E2 15KA5W BD18KA5WF-E2 18KA5W BD25KA5WF-E2 25KA5W BD30KA5WF-E2 30KA5W BD33KA5WF-E2 33KA5W BD00KA5WF-E2 00KA5W BD10KA5FP-E2 BD12KA5FP-E2 12KA5 BD15KA5FP-E2 15KA5 BD18KA5FP-E2 18KA5 BD25KA5FP-E2 25KA5 BD30KA5FP-E2 30KA5 BD33KA5FP-E2 33KA5

Package Part Number Marking

10KA5W

TO252-5

10KA5W

SOP8

10KA5

TO252-3

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●Revision History

Date Revision Changes

26.Jun.2012 001 New Release

Datasheet

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Datasheet

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way respons ible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any propert y, which a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl

2S, NH3, SO2, and NO2

H [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-solub le cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power ratin g under steady-state loading condition may negatively affect product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used i n sealed area, co nfirm the actual ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in an y way responsible or liable for failure induced under dev iant condition from what is defined in this document.

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●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability.

2) In princip le, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margi n considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics.

2) You agree that application notes, reference designs, and a ssociated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgmen t in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dr y condition (e.g. Gro unding of human bod y / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are expos ed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are expos ed to high Electrostatic

2) Even under ROHM recommended storage conditi on, solderabilit y of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderabilit y before using Products of which storage time is exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and F oreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Prop erty Rights

1) All information and data including but not limited to appl ication example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe an y intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.:

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

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●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reprod uced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical informatio n contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.

5) T he proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

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Notice - Rev.003